| PART |
Description |
Maker |
| 15SH-A-XX-TR-SMT |
WAFER SMT
|
Adam Technologies, Inc.
|
| 53398-0310 53398-0810 53398-0710 53398-0690 53398- |
1.24 WIRE To BOARD CONN. WAFER ASSY FOR SMT
|
Molex Electronics Ltd.
|
| 053307-4071 |
0.8 B-TO-B WAFER ASSY SMT EMBSTP PKG -LEAD FREE-
|
Molex Electronics Ltd.
|
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| 99-99-0995 99-99-0990 99-99-0994 99-99-0996 |
11CKT 2.5MM L/P WAFER ASY 526711AX 11 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
6CKT 2.5MM L/P WAFER ASY 526706AX 6 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
10CKT 2.5MM L/P WAFER ASY 526710AX 10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
12CKT 2.5MM L/P WAFER ASY 526712AX 12 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
|
Molex, Inc.
|
| IRLC1304 2299 |
HEXFET Power MOSFET Die in Wafer Form(晶圆形式的HEXFET 功率MOS场效应管)
From old datasheet system
HEXFET? Power MOSFET Die in Wafer Form
|
International Rectifier
|
| 5289-5A 10311028 0010311028 0010311048 0010311068 |
KK 5/7.5 WAFER ASSY WITH LOCK
|
Molex Electronics Ltd.
|
| SWR25X-NRTC-SXX-RX-BA |
WAFER 2.54MM CC, 1 ROW, RA/RB
|
List of Unclassifed Manufacturers
|
| 080501MS |
3.96mm CENTER WAFER
|
SUYIN USA, INC.
|
| HFA04SD60S |
Hexfred Die in Wafer Form
|
International Rectifier
|
| FD060U02A5B |
Fred Die in Wafer Form
|
International Rectifier
|
