| PART |
Description |
Maker |
| SOT765-1 |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| 21-0181 |
PACKAGE OUTLINE, 43L THIN QFN, 3.5*9*0.8MM
|
Maxim Integrated Products
|
| 21-0136F |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm 封装外形12,16蜇薄QFN3x3x0.8mm
|
Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
|
| HCPL-M452 HCPL-M453 HCPL-4502 HCPL-0452 HCPL-0453 |
HCPL-M453 · Small Outline, 5 Lead, High Speed Optocouplers
HCPL-M452 · Small Outline, 5 Lead, High Speed Optocouplers
|
Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
|
| MOCD207 |
Super Small Outline
|
ISOCOM COMPONENTS
|
| AP1333GU-HF-14 |
Small Package Outline
|
Advanced Power Electron...
|
| SES3V3D923-2U |
Small Body Outline Dimensions
|
Surge Components
|
| LCQT-TSSOP20 LCQT-TSSOP28 LCQT-TSSOP16 LCQT-TSOP32 |
Small Outline Prototyping Adapters
|
Aries Electronics, Inc.
|
| MT16LSDF3264LHY-10E MT16LSDF6464LHY-10E MT16LSDF32 |
SMALL-OUTLINE SDRAM MODULE
|
Micron Technology
|
| MT4LDT464HX |
SMALL-OUTLINE DRAM MODULE
|
Micron Technology, Inc.
|
| MT4LSDT464HG-10E MT8LSDT864HG-10C MT8LSDT864HG-10E |
SMALL-OUTLINE SDRAM MODULE 小外形内存模
|
Micron Technology, Inc.
|
