| PART |
Description |
Maker |
| OPB16450UART |
This document provides the specification
DS433 August 18, 2004 Product Specification
|
Xilinx, Inc.
|
| 44A0212 |
This specification sheet forms a part of the latest issue of Raychem Specification 44 and MIL-W-81044 as applicable.
|
Tyco Electronics
|
| 55PC0114 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| CMLT6427E |
ENHANCED SPECIFICATION SURFACE MOUNT, PICOmini SILICON NPN DARLINGTON TRANSISTOR
From old datasheet system
an Enhanced Specification, PICOmini™, NPN Silicon
|
CENTRAL[Central Semiconductor Corp]
Central Semiconductor Corporation
|
| ST16-19RFRDCS 7759 ST16 ST19-RFRDCS ST16-RFRDCS |
ST16-19RFRDCS CHIP SET INTERFACE SPECIFICATION
CHIP SET INTERFACE SPECIFICATION
From old datasheet system
|
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| PXA255 GDPXA255A0E400 LUPXA255A0E400 LUPXA255A0C20 |
Electrical, Mechanical, and Thermal Specification
Intel? PXA255 Processor Electrical, Mechanical, and Thermal Specification
|
Intel Corporation
|
| SPM0204LE5H-QB |
Halogen Free Enhanced RF Protected Zero Height Mini隆卤 SiSonic垄芒 Microphone Specification
Halogen Free Enhanced RF Protected Zero Height Mini SiSonic Microphone Specification
|
Knowles Electronics
|
| MPC8308101 MPC8308 MPC8308CVMADDA MPC8308CVMAFDA M |
MPC8308 PowerQUICC II Pro Processor Hardware Specification
MPC8308 PowerQUICC II Pro Processor Hardware Specification
|
Freescale Semiconductor, Inc
|
| CL05A105KP5NNNC |
SPECIFICATION
|
Samsung semiconductor
|
| CL10B102KB8NNNC |
SPECIFICATION
|
Samsung semiconductor
|
