| PART |
Description |
Maker |
| PDZ16B PDZ3.6B PDZ3.0B PDZ3.3B |
Small plastic package suitable for surface mounted design
|
TY Semiconductor Co., Ltd
|
| YG104-IC112 |
Surface-mounted chip LED device
Small size suitable for compact
|
Seoul Semiconductor
|
| HVD350B |
Super small Flat Lead Package (SFP) is suitable for surface mount design
|
TY Semiconductor Co., Ltd
|
| HVD355B |
Super small Flat Lead Package (SFP) is suitable for surface mount design
|
TY Semiconductor Co., Ltd
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| CPSM-5 CPSM CPSM-3 |
Commercial Power, Fireproof Inorganic Construction, High Wattage Capabilities, Low Board Temperatures, Suitable for Pick and Place Equipment, Meets or Exceeds EIA RS-344 Spec, High Thermal Conductivity and Humidity Resistance
Wirewound Resistors, Commercial Power, Surface Mount
|
VISAY[Vishay Siliconix]
|
| STP25N06 STP25N06FI |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STP15N05LFI |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| ART923X1015YZ10-IC |
Suitable for non-metal surfaces
|
Abracon Corporation
|
| STW9NA80 |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| MTP3N60FI |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STP20N06FI |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
