| PART |
Description |
Maker |
| APHB1608ZGSYKC |
Compatible with reflow soldering
|
Kingbright Corporation
|
| FR1101C-M-TR |
Lead-free soldering compatible
|
STANLEY ELECTRIC CO.,LT...
|
| HAN1102W-1-TR |
Lead?free soldering compatible
|
STANLEY ELECTRIC CO.,LT...
|
| VFHD1111CS-3B83A-TR |
Lead-free soldering compatible
|
STANLEY ELECTRIC CO.,LT...
|
| EBW1444US-E |
High Flux , Power LED Lead-free soldering compatible
|
STANLEY ELECTRIC CO.,LTD.
|
| 0533132065 53313-2065 |
2.00mm (.079) Pitch Mi ll System Wire-to-Board Header, Dual Row, Vertical, Leadfree Leadfree,
MOLEX Connector
|
Molex Electronics Ltd.
|
| K9F1G08U0M-FIB0 K9F1G08U0M-YCB0 K9F1G16Q0M-YCB0 K9 |
DSUB
DBM25PK
1Gb Gb 1.8V NAND Flash Errata 1Gb的NAND闪存千兆1.8V的勘误表
Industrial Mid-Range Soldering Iron; Power Rating:60W; Tip Temperature:850 F; Features:Incls.: One 67D 1/4" Dia., 3-3/8" L Long-Tapered Diamond-Style Paragon Soldering Tip RoHS Compliant: Yes
|
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
|
| FX-888 |
Soldering Station
|
Hakko
|
| FI-NX40CL |
WIRE SIDE SOLDERING TYPE
|
Japan Aviation Electronics Industry, Ltd.
|
| AN4211 |
Guidelines for soldering MEMS microphones
|
STMicroelectronics
|
| AN10365 |
Surface mount reflow soldering
|
NXP Semiconductors
|
| FYLS-3528URC12 |
Suitable for all SMT assembly and soldering method
|
Ningbo Foryard Optoelectronics Co., Ltd.
|
