PART |
Description |
Maker |
2SHD-C-XX-MTR-087 |
DOUBLE ROW SHROUDED HEADER
|
Adam Technologies, Inc.
|
802-10-072-30-001000 |
Interconnect Header .100 Grid; Surface Mount Pin Header Double Row Gull Wing Double Row Surface Mount
|
Mill-Max Mfg. Corp.
|
MD20-0016-S |
0.5 MHz - 500 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 7 dB CONVERSION LOSS-MAX .54mm (.100") Pitch SL(TM) Fibre Channel Wire-to-Board Header, Single Row, Vertical, 3.40mm (.134") Pocket, Shrouded, 3 Circuits, 0.38??m (15??") Gold (Au) Selective Plating Double Balanced Mixer 0.5 - 500 MHz
|
MACOM[Tyco Electronics]
|
2-1123309-2 2-1123309-3 |
DOUBLE RW HEADER ASSY 4P DOUBLE ROW HEADER ASSY 4P(H TYPE) <DYNAMIC D-5200 D>
|
Tyco Electronics
|
0554012619 55401-2619 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Vertical Shrouded Header with Eject Levers, 26 Circuits, Lead-free MOLEX Connector
|
Molex Electronics Ltd.
|
15-80-0101 70567-0003 A-70567-0003 0015800101 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
0015800281 70567-0012 15-80-0281 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating MOLEX Connector
|
Molex Electronics Ltd.
|
A-70567-0363 15-80-1501 0015801501 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
|
Molex Electronics Ltd.
|
15-47-7736 0015477736 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76渭m (30渭) Gold (Au) Selective Platin 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
A-70567-0358 15-80-1401 0015801401 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
|
Molex Electronics Ltd.
|
A-70567-0348 15-80-1201 0015801201 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
|
Molex Electronics Ltd.
|
|