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| SG5768, SG5770, SG5772, SG5774 SG6506/SG6507/SG6508/SG6509 DIODE ARRAY CIRCUITS DESCRIPTION The Linfinity series of diode arrays feature high breakdown, high speed diodes in a variety of configurations. Each array configuration consists of either common anode diodes, common cathode diodes, or a combination of common anode and common cathode diodes. Individual diodes within the array have 60V minimum breakdown voltage, can handle 500mA of current and typically switch in less than 10 nanoseconds. Each of the array configurations is available in ceramic DIP or ceramic flatpack and can be processed to JANTXV, JANTX, or JAN flows at Linfinity's MIL-S-19500 facility. FEATURES * 60V minimum breakdown voltage * 500mA current capability per diode * Fast switching speeds: typically less than 10ns * Low leakage current HIGH RELIABILITY FEATURES MIL-S-19500/474 QPL - 1N5768 - 1N5770 - 1N5772 - 1N5774 JANTXV, JANTX & JAN available LMI level "S" processing available 1N6506 1N6507 1N6508 1N6509 CIRCUIT DIAGRAMS COMMON CATHODE SG5768/SG6506 COMMON ANODE SG5770/SG6507 COMMON ANODE / COMMON CATHODE SG5772/SG6508 DUAL COMMON ANODE / COMMON CATHODE SG5774/SG6509 6/90 Rev 1.1 2/94 Copyright (c) 1994 1 11861 Western Avenue Garden Grove, CA 92841 (714) 898-8121 FAX: (714) 893-2570 LINFINITY Microelectronics Inc. DIODE ARRAY SERIES ABSOLUTE MAXIMUM RATINGS (Note 1 & 2) Breakdown Voltage (VBR) ................................................... 60V Output Current (IO), TC = 25C Continuous ................................................................ 500mA Note 1. Exceeding these ratings could cause damage to the device. Note 2. Applicable for each diode. Operating Junction Temperature Hermetic (J, F Packages) ............................................ 150C Storage Temperature Range ............................ -65C to 200C THERMAL DATA J Package: Thermal Resistance-Junction to Case, JC .................. 30C/W Thermal Resistance-Junction to Ambient, JA .............. 80C/W F Package (10 Pin): Thermal Resistance-Junction to Case, JC .................. 80C/W Thermal Resistance-Junction to Ambient, JA ............ 145C/W F Package (14 Pin): Thermal Resistance-Junction to Case, JC .................. 80C/W Thermal Resistance-Junction to Ambient, JA ............ 140C/W Note A. Junction Temperature Calculation: TJ = TA + (PD x JA). Note B. The above numbers for JC are maximums for the limiting thermal resistance of the package in a standard mounting configuration. The JA numbers are meant to be guidelines for the thermal performance of the device/pcboard system. All of the above assume no ambient airflow. RECOMMENDED OPERATING CONDITIONS (Note 3) Operating Ambient Temperature Range SG5768 .......................................................... -55C to 150C SG5770 .......................................................... -55C to 150C SG5772 .......................................................... -55C to 150C Operating Ambient Temperature Range SG5774 .......................................................... -55C SG6506 .......................................................... -55C SG6507 .......................................................... -55C SG6508 .......................................................... -55C SG6509 .......................................................... -55C to to to to to 150C 150C 150C 150C 150C Note 3. Range over which the device is functional. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply for the operating temperature of TA = 25C for each diode. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) Parameter Breakdown Voltage (VBR) Forward Voltage (VF) Test Conditions IR = 10A Duty Cycle 2%, 300 s pulse IF = 100mA IF = 200mA IF = 500mA IF = 10mA, TA = -55C VR = 40V VR = 40V, TA = 150C VR = 0V, f = 1MHz, Pin-to-pin IF = 500mA, tr 15ns, Vfr = 1.8V, RS = 50 IF = IR = 200mA, irr = 20mA, RL = 100 SG5768/SG6506 Min. Typ. Max. 60 1.0 1.1 1.5 1.0 100 50 4 40 20 Units V V V V V nA A pf ns Reverse Current (IR) Capacitance (C) (Note 4) Forward Recovery Time (tfr ) (Note 4) Reverse Recovery Time (trr) (Note 4) Note 4. The parameters, although guaranteed, are not 100% tested in production. 6/90 Rev 1.1 2/94 Copyright (c) 1994 2 11861 Western Avenue Garden Grove, CA 92841 (714) 898-8121 FAX: (714) 893-2570 LINFINITY Microelectronics Inc. DIODE ARRAY SERIES ELECTRICAL CHARACTERISTICS Parameter Breakdown Voltage (VBR ) Forward Voltage (VF ) (continued) Test Conditions IR = 10A, 100ms pulse, 20% Duty Cycle Duty Cycle 2%, 300 s pulse IF = 100mA IF = 200mA IF = 500mA IF = 10mA, TA = -55C VR = 40V VR = 40V, TA = 150C VR = 0V, f = 1MHz, Pin-to-pin IF = 500mA, tr 15ns, Vfr = 1.8V, RS = 50 IF = IR = 200mA, irr = 20mA, RL = 100 SG5770/SG6507 Min. Typ. Max. 60 1.0 1.1 1.5 1.0 100 50 8 40 7 20 Units V V V V V nA A pf ns ns Reverse Current (I R) Capacitance (C) (Note 4) Forward Recovery Time (t fr) (Note 4) Reverse Recovery Time (t rr) (Note 4) Parameter Breakdown Voltage (VBR) Forward Voltage (VF) Test Conditions IR = 10A, 100ms pulse, 20% Duty Cycle Duty Cycle 2%, 300s pulse IF = 100mA IF = 200mA IF = 500mA IF = 10mA, TA = -55C VR = 40V VR = 40V, TA = 150C VR = 0V, f = 1MHz, Pin-to-pin IF = 500mA, tr 15ns, Vfr = 1.8V, RS = 50 SG5772/SG6508 SG5774/SG6509 Min. Typ. Max. 60 1.0 1.1 1.5 1.0 100 50 8 40 7 20 Units V V V V V nA A pf ns ns Reverse Current (IR) Capacitance (C) (Note 4) Forward Recovery Time (tfr ) (Note 4) Reverse Recovery Time (trr) (Note 4) 6/90 Rev 1.1 2/94 Copyright (c) 1994 3 11861 Western Avenue Garden Grove, CA 92841 (714) 898-8121 FAX: (714) 893-2570 LINFINITY Microelectronics Inc. DIODE ARRAY SERIES CONNECTION DIAGRAMS & ORDERING INFORMATION Package 14-PIN CERAMIC DIP J - PACKAGE (See Notes Below) Part No. SG6506J (1N6506) Ambient Temperature Range -55C to 150C -55C to 150C Connection Diagram 1 2 3 4 5 6 7 14 13 12 11 10 9 8 10-PIN CERAMIC FLATPACK F - PACKAGE SG5768F (1N5768) -55C to 150C -55C to 150C 1 2 3 4 5 10 9 8 7 6 14-PIN CERAMIC DIP J - PACKAGE SG6507J (1N6507) -55C to 150C -55C to 150C 1 2 3 4 5 6 7 14 13 12 11 10 9 8 10-PIN CERAMIC FLATPACK F - PACKAGE SG5770F (1N5770) -55C to 150C -55C to 150C 1 2 3 4 5 10 9 8 7 6 14-PIN CERAMIC DIP J - PACKAGE SG6508J (1N6508) -55C to 150C -55C to 150C 1 2 3 4 5 6 7 14 13 12 11 10 9 8 10-PIN CERAMIC FLATPACK F - PACKAGE SG5772F (1N5772) -55C to 150C -55C to 150C 1 2 3 4 5 10 9 8 7 6 Note 1. Consult factory for other packages available. 2. All packages are viewed from the top. 3. Consult factory for JAN, JAN TX, and JAN TXV product availability. 6/90 Rev 1.1 2/94 Copyright (c) 1994 4 11861 Western Avenue Garden Grove, CA 92841 (714) 898-8121 FAX: (714) 893-2570 LINFINITY Microelectronics Inc. DIODE ARRAY SERIES CONNECTION DIAGRAMS & ORDERING INFORMATION Package 14-PIN CERAMIC DIP J - PACKAGE (continued) Part No. SG6509J (1N6509) Ambient Temperature Range -55C to 150C -55C to 150C Connection Diagram 1 2 3 4 5 6 7 14 13 12 11 10 9 8 14-PIN CERAMIC FLATPACK F - PACKAGE SG5774F (1N5774) -55C to 150C -55C to 150C 1 2 3 4 5 6 7 14 13 12 11 10 9 8 6/90 Rev 1.1 2/94 Copyright (c) 1994 5 11861 Western Avenue Garden Grove, CA 92841 (714) 898-8121 FAX: (714) 893-2570 LINFINITY Microelectronics Inc. |
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