View TDA8050_4586.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TDA8050 QPSK transmitter
Product specification Supersedes data of 1999 Jun 21 File under Integrated Circuits, IC02 1999 Dec 14
Philips Semiconductors
Product specification
QPSK transmitter
FEATURES * Programmable gain * PLL controlled carrier frequency * 3-wire transmission bus * 5 V supply voltage. APPLICATIONS * QPSK modulation. GENERAL DESCRIPTION The Quadrature Phase Shift Keying (QPSK) transmitter is a monolithic bipolar IC dedicated for quadrature modulation of the I and Q signals. It includes: * Two double-balanced mixers * Symmetrical Voltage Controlled Oscillator (VCO) with 0 to 90 degree signal generation for modulation * Phase-Locked Loop (PLL) for IF frequency control * Conversion mixer QUICK REFERENCE DATA SYMBOL VCC fc Vo(max) fxtal fref(MOD) fstep Tamb supply voltage output centre frequency maximum output level crystal frequency reference frequency for modulator synthesizer frequency step size for convertor synthesizer operating ambient temperature PARAMETER MIN. 4.75 5 - 1 - 50 0 TYP. 5.00 - 55 - 250 - - * PLL for RF frequency control * Gain controlled output amplifier * 3-wire bus and an output buffer.
TDA8050
Two PLLs are incorporated, the first PLL includes: * Fixed main divider * Crystal oscillator and its programmable reference divider * Phase/frequency detector combined with a fixed charge pump. The second PLL includes: * Divide-by-four preamplifier * 12-bit programmable divider * Crystal oscillator and its programmable reference divider * Phase/frequency detector combined with a `clever' charge pump which drives the tuning amplifier, including 9 V output.
MAX. 5.25 40 - 4 - 500 70
UNIT V MHz dBmV MHz kHz kHz C
ORDERING INFORMATION TYPE NUMBER TDA8050T PACKAGE NAME SO32 DESCRIPTION plastic small outline package; 32 leads; body width 7.5 mm VERSION SOT287-1
1999 Dec 14
2
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 1999 Dec 14
IF_FILTC DVCC 13 DGND 18 AVCC1 26 AGND1 9 IF_FILT 24 25 RF_OUTC RF_INC SW_CAP 32 AVCC2 29 AGND2 4 RF_OUT RF_IN 28 27 30 31
BLOCK DIAGRAM
Philips Semiconductors
QPSK transmitter
MODULATOR
I_IN I_INC 5 6
CONVERTER
x
1
OUTEN BUF_OUTC BUF_OUT
Q_IN Q_INC
7 8 90 3-WIRE BUS TRANCEIVER 1/2
x
3 2
x
0 DAC
CLK DATA EN
14 15 16
TDA8050
23
handbook, full pagewidth
3
LOCK
CHARGE PUMP
DIGITAL PHASE COMPARATOR
FIXED MAIN DIVIDER
PROGRAMMABLE MAIN DIVIDER
PROGRAMMABLE REF DIVIDER
PROGRAMMABLE REF DIVIDER
DIGITAL PHASE COMPARATOR
PROGRAMMABLE CHARGE PUMP
12
10 TKAMOD
11
17 OSC_IN
22
21
20
19
FCE181
CP_MOD
TKBCONV TKACONV
TUNECONV
CP_CONV
TKBMOD
Product specification
TDA8050
Fig.1 Block diagram.
Philips Semiconductors
Product specification
QPSK transmitter
PINNING SYMBOL OUTEN BUF_OUT BUF_OUTC AGND2 I_IN I_INC Q_IN Q_INC AGND1 TKAMOD TKBMOD CP_MOD DVCC CLK DATA EN OSC_IN DGND CP_CONV TUNECONV TKBCONV TKACONV LOCK IF_FILT IF_FILTC AVCC1 RF_OUTC RF_OUT AVCC2 RF_IN RF_INC SW_CAP PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 DESCRIPTION output enable output amplifier balanced output output amplifier balanced output converter analog ground 2 I balanced input I balanced input Q balanced input Q balanced input modulator analog ground 1 modulator VCO tank circuit input 2 modulator VCO tank circuit input 1 modulator charge pump output for PLL loop filter digital supply voltage 3-wire bus serial control clock 3-wire bus serial control data input 3-wire bus serial control enable crystal oscillator input digital ground converter charge pump output for PLL loop filter tuning voltage output for converter VCO converter VCO tank circuit input 1 converter VCO tank circuit input 2 lock detect signal IF balanced output to filter IF balanced output to filter modulator analog supply voltage RF balanced output to filter RF balanced output to filter converter analog supply voltage RF balanced input to programmable amplifier RF balanced input to programmable amplifier switch capacitor Fig.2 Pin configuration.
AGND1 9 TKAMOD 10 TKBMOD 11 CP_MOD 12 DVCC 13 CLK 14 DATA 15 EN 16
FCE182
TDA8050
handbook, halfpage
OUTEN 1 BUF_OUT 2 BUF_OUTC 3 AGND2 4 I_IN 5 I_INC 6 Q_IN 7 Q_INC 8
32 SW_CAP 31 RF_INC 30 RF_IN 29 AVCC2 28 RF_OUT 27 RF_OUTC 26 AVCC1 25 IF_FILTC
TDA8050
24 IF_FILT 23 LOCK 22 TKACONV 21 TKBCONV 20 TUNECONV 19 CP_CONV 18 DGND 17 OSC_IN
1999 Dec 14
4
Philips Semiconductors
Product specification
QPSK transmitter
FUNCTIONAL DESCRIPTION The I and Q are balanced analog signals at a level of 400 mV (p-p). These are mixed by two double balanced mixers with the output signal generated by a first local oscillator providing the modulated signal. The modulated signal is then filtered by an IF filter. This filtered signal together with a signal generated by a second local oscillator is converted by a balanced mixer to produce the QPSK signal. The QPSK signal is amplified by a gain controlled amplifier to a level suitable for transmission. The gain of the controlled amplifier is bus controlled and this amplifier can be disabled when not transmitting to provide signal attenuation. The amplified signal is applied to an on-chip amplifier having two balanced outputs (open collector) linked to two chip resistors (values 150 ), and 9 V. The balanced outputs are designed to drive a 2 : 1 transformer (Siemens V944) with a 75 load giving an output level of 55 dBmV. The output frequency range of the transmitter is 5 to 40 MHz. The frequency of the first local oscillator operates at twice the frequency (i.e. 280 MHz) fixed by a Phase-Locked Loop (PLL) implemented in the circuit. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC tsc Vmax Vo(tune) Vo(buf) Ptot Tamb Tstg Tj(max) supply voltage short-circuit time (every pin to VCC or GND) voltage on all pins except BUF_OUT, BUF_OUTC and TUNECONV output tuning voltage output buffer voltage on pins BUF_OUT and BUF_OUTC maximum power dissipation operating ambient temperature storage temperature junction temperature PARAMETER - -0.3 -0.3 - - 0 -40 - MIN. -0.3
TDA8050
The frequency of the second local oscillator operates in the bandwidth 145 to 180 MHz and programmable due to a PLL implemented in the circuit. The VCO of both first and second local oscillators requires an external LC tank circuit with two varicap diodes. The data to the PLL is loaded in bursts framed by the signal EN. Programming rising clock edges and their appropriate data bits are ignored until EN goes active (LOW). The internal latches are updated with the latest programming data when EN returns inactive (HIGH). The last 14 bits are stored in the programming register. No check is made on the number of clock pulses received during the time programming is enabled. A wrong active clock edge will be generated causing a shift of data bits, if EN goes HIGH while CLK is still LOW. At power up, EN should be HIGH. The lock detector output LOCK is HIGH when both PLLs are in lock. The main divider ratio and the reference divider ratios are provided via the serial bus. A control register controls the Digital-to-Analog Converter (DAC), the output amplifier and the charge pump currents (Tables 1, 2 and 3).
MAX. +6.0 10 VCC +30 10 800 70 +150 150 V s V V V
UNIT
mW C C C
1999 Dec 14
5
Philips Semiconductors
Product specification
QPSK transmitter
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) HANDLING Human Body Model (HBM): The IC pins withstand 2 kV except pins 27 and 28 (1750 V). Machine Model (MM): The IC pins withstand 100 V. PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 63
TDA8050
UNIT K/W
CHARACTERISTICS Measured in application circuit (see Fig.9) with the following conditions: VCC = 5 V; Tamb = 25 C; all AC units are RMS values; unless otherwise specified. SYMBOL Supply VCCA(mod) ICCA(mod) VCCA(conv) ICCA(conv) ICC(buf) VCCD ICCD VCC(tune) VI(DC) Vi(p-p) fi(max) Zi(dif) B(1dB) MODULATOR fc A LO(sup) Zo(dif) fosc(mod) output centre frequency amplitude imbalance phase imbalance LO suppression differential output impedance see Fig.3 see Fig.3 - - - - - - - - - -28 1.8 - 140 1 2 - - 280 MHz dB deg dBc k modulator analog supply voltage modulator analog supply current converter analog supply voltage converter analog supply current buffer output supply current digital supply voltage digital supply current tuning supply voltage 4.75 - 4.75 - - 4.75 - - over the complete range of temperature indicative indicative indicative - - - - - 5 41 5 48 44 5 22 - 5.25 - 5.25 - - 5.25 - 9 V mA V mA mA V mA V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Quadrature modulator I and Q inputs input DC level signal input level (balanced) (peak-to-peak value) I and Q maximum input frequency differential input impedance 1 dB amplifier bandwidth 0.5VCC - 400 10 4.4 10 500 - - - V mV MHz k MHz
MODULATOR VOLTAGE CONTROLLED OSCILLATOR oscillation frequency VCO MHz
1999 Dec 14
6
Philips Semiconductors
Product specification
QPSK transmitter
TDA8050
SYMBOL Converter output Vo Vo
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
output level output flatness
fi = 30 MHz; Vi(dif) = 100 mV at I and Q inputs fi = 5 to 40 MHz; Vi(dif) = 100 mV at I and Q inputs
37.5 -
40 -
42.5 2
dBmV dB
fc Zo(dif) IM3 H2
output centre frequency differential output impedance 3rd-order intermodulation distortion see Fig.4 2nd-order harmonic of 5 to 40 MHz fi = 10 to 80 MHz; signal Vi(dif) = 100 mV at I and Q inputs 3rd-order harmonic of 5 to 40 MHz signal mixer spurious outputs of 5 to 40 MHz signal fi = 15 to 120 MHz; Vi(dif) = 100 mV at I and Q inputs fi = 5 to 40 MHz; Vi(dif) = 100 mV at I and Q inputs
5 - - -
- 150 - -
40 - -35 -45
MHz dBc dBc
H3
-
-
-45
dBc
So
-
-
-50
dBc
Converter voltage controlled oscillator fosc(min) fosc(max) Zi(dif) G Bufo minimum oscillation frequency maximum oscillation frequency - 180 - - Vi = 30 dBmV sine wave; 40 MHz at pin RF_IN and RF_INC; DAC = 0 to 31 fi = 5 to 40 MHz; Vi = 30 dBmV sine wave; DAC = 28 output buffer on output buffer off Vi(dif) = 100 mV; Vo = 55 dBmV; DAC = 28; fi = 40 MHz; OE = 0.5 see Fig.5 see Fig.5 32 - - 5.6 - - 145 - - 2 - MHz MHz
Programmable gain and output buffer; note 1 differential input impedance output level step size output level adjust range k dB dB
Vo Vo
output level output flatness
- -
55 -
- 2
dBmV dB
VO(ENL) VO(ENH) ISO
output controlled enable LOW output controlled enable HIGH disable isolation
- 2.4 -35
- - -
0.8 - -
V V dBc
G(max) Vo(1dB) H2
maximum gain 1 dB compression point
- 60 - -
22 - - -
- - -45 -35
dB dBmV dBc dBc
2nd-order harmonic of 5 to 40 MHz see Fig.6 signal fi = 10 to 40 MHz fi= 54 to 120 MHz
1999 Dec 14
7
Philips Semiconductors
Product specification
QPSK transmitter
TDA8050
SYMBOL H3
PARAMETER 3rd-order harmonic of 5 to 40 MHz signal Fig.6
CONDITIONS fi = 15 to 40 MHz fi = 54 to 120 MHz - -
MIN. - -
TYP.
MAX. -45 -35
UNIT dBc dBc
Overall; note 1 osc phase noise note 2; at 10 kHz at 100 kHz So spurious signals of 5 to 40 MHz signal total isolation at I/Q mid-range carrier to noise ratio at final output at 2 MHz from carrier fi = 5 to 40 MHz; Vi(dif) = 100 mV at I and Q inputs; Vo = 30 to 55 dBmV see Fig.7 Vi(dif) = 100 mV Vo = 35 to 55 dBmV; fi = 26.5 MHz note 3 fxtal = 4 MHz - - - -70 -90 - - - -50 dBc/Hz dBc/Hz dBc
ISOtot C/N
- -
- 113
-65 -
dBc dBc/Hz
Crystal oscillator fxtal Zi VI(DC) fref(mod) RDR1 ND1 Icp fstep RD2 RDR2 ND2 NDR2 crystal frequency input impedance DC input level 1 600 - - 4 - fixed - 50 - see Table 4 4 - see Table 4 290 - 2.4 - - - 1200 2.9 4 - - - 16 - - 500 - 160 - 3600 mA MHz V
Modulator synthesizer reference frequency reference divider ratio programmable fixed main divider ratio charge-pump current 250 - 1120 0.30 - 2 - 4 - - - 5 0.02 kHz
Converter synthesizer frequency step size fixed reference divider ratio reference divider ratio programmable fixed main divider ratio programmable main divider ratio kHz
Three wire bus VIL VIH Vo(lock) Vo(unlock) LOW-level input voltage HIGH-level input voltage 0.8 - - - V V
Lock detect pin output voltage (lock) output voltage (unlock) V V
1999 Dec 14
8
Philips Semiconductors
Product specification
QPSK transmitter
TDA8050
SYMBOL Serial control clock fclk tsu th(CLK) td(strt) td(stp) Notes
PARAMETER
CONDITIONS - see Fig.3 see Fig.3 see Fig.3 see Fig.3 - - - -
MIN.
TYP.
MAX. - - - - -
UNIT
clock frequency input data to CLK set-up time input data to CLK hold time delay to rising clock edge delay from last clock edge
330 2 1 3 3
kHz s s s s
1. All specification points of the output section and the overall circuit are measured after the 2 : 1 transformer (siemens V944) connected with a load of 75 . 2. Overall phase noise converter: Icp = 0.36 mA; fref = 12.5 kHz; VI(diff) = 100 mV; VO(diff) = 100 mV; VO = 55 dBmV; DAC = 28; fi = 26.5 MHz. 3. Crystal oscillator; the crystal oscillator uses a 4, 2 or 1 MHz crystal in series with a capacitor. The crystal is serial resonant with load a capacitance of 18 to 20 pF. The connection to VCC is preferred but can also be to GND. Notes to the characteristics
handbook, full pagewidth
FCE183
IF_FILT imbalance LO(sup)
measure 2 f i(Q)
measure 1 f i(I) frequency
The amplitude imbalance and the LO suppression are measured in the spectrum of the signal measured at the output IF_FILT and are defined in the following conditions: Measure 1: I input frequency = 500 kHz. I input level = 400 mV (p-p) sine wave. Unused input as 0 V differential. Measure 2: Q input frequency = 500 kHz. Q input level = 400 mV (p-p) sine wave. Unused input as 0 V differential.
Fig.3 Imbalance and LO suppression.
1999 Dec 14
9
Philips Semiconductors
Product specification
QPSK transmitter
TDA8050
handbook, full pagewidth
I_IN 50 50 500 kHz 300 kHz I_INC Q_IN Q_INC
RF_OUT RF_OUTC
39.1
39.5
39.7
39.9
40
40.1
40.3
40.5 40.7 f (MHz)
FCE184
3rd-order intermodulation distortion; Two tones of 260 mV (p-p) at each I and Q input:
----400 20 V ( av ) = --------- x 10 = 128 mV ( RMS ) 2 -4
2 sine waves with a total RMS values of 128 mV give: 2 x x = 128 128 x = --------- = 90 mV (RMS) = 260 mV (p-p) and f1 = 300 kHz, 2 f2 = 500 kHz and fRF = 40 MHz.
2
Fig.4 3rd-order intermodulation distortion in I and Q channels (IM3).
1999 Dec 14
10
Philips Semiconductors
Product specification
QPSK transmitter
TDA8050
handbook, full pagewidth
Siemens V944 Vo2 50 RF_IN RF_INC BUF_OUTC 150 BUF_OUT 150 9V 75
gain (dB) Gmax Gmax - 1
Vo(-1 dB)
Vo
FCE185
DAC = 31. f = 26.5 MHz. Vi is variable to have a variable output voltage.
Fig.5 Maximum gain and compression point.
handbook, full pagewidth
Siemens V944 RF_IN RF_INC BUF_OUTC 150 BUF_OUT 150 9V 75
FCE186
DAC = 28. fi = 5 to 40 MHz. Vi = 200 mV sine wave. Vo = 55 dBmV (RMS value).
Fig.6 Harmonics of output section H2 and H3.
1999 Dec 14
11
Philips Semiconductors
Product specification
QPSK transmitter
TDA8050
handbook, full pagewidth
OUTEN = 0 V BUF_OUT 150
Siemens V944 Vo1 I_IN
Vi(dif) = 100 mV
I_INC BUF_OUTC Q_IN 150
9V
75
Vi(dif) = 100 mV
Q_INC
DAC = 28
OUTEN = 5 V BUF_OUT 150
Siemens V944 Vo2 I_IN
0V I_INC BUF_OUTC Q_IN 0V Q_INC DAC = 28 150
9V
75
FCE187
ISOtot = Vo1 (dB) - Vo2 (dB).
Fig.7 Isolation total.
1999 Dec 14
12
Philips Semiconductors
Product specification
QPSK transmitter
APPLICATION INFORMATION
TDA8050
handbook, full pagewidth
t su
t h(CLK)
T cy
CLK
DATA
EN
t d(strt)
t d(stp)
MBL113
Fig.8 3-wire bus timing.
Table 1
Data format; note 1 DATA ADDRESS D4 D3 D2 D1 D0 AD1 AD0 last in
D11 first in
D10
D9
D8
D7
D6
D5
Modulator reference divider ratio X X MP1(2) MP0(2)
Converter reference divider ratio R7 R6 R5 R4 R3 R2 R1 R0 0 1
Control register X X X OEN(3) CR2(4) CR1 CR0(4) DAC4(5) DAC3 DAC2 DAC1 DAC0 1 0
Main divider ratio P11 Notes 1. X = don't care. 2. MP1 and MP0: modulator reference divider ratio (see Table 2). 3. When OEN (output enable) is at logic 0, output is disabled, at logic 1 output is enabled. 4. CR2 to CR0: converter synthesizer charge pump current (see Table 3). 5. When DAC4 to DAC0 is at logic 0 minimum gain is programmed, at logic 1 maximum gain is programmed. P10 P9 P8 P7 P6 P5 P4 P3 P2 P1 P0 1 1
1999 Dec 14
13
Philips Semiconductors
Product specification
QPSK transmitter
Table 2 Modulator reference divider ratio MP1 1 1 0 Table 3 MP0 1 0 1
TDA8050
PROGRAMMED RATIO 4 8 16
Converter synthesizer charge pump current CR2 0 0 0 0 0 0 1 CR1 0 0 0 0 1 1 0 CR0 0 0 1 1 0 1 0 LOCK_CONV(1) 0 1 0 1 - - - Icp (mA) 1.2 0.36 0.36 0.1 0.1 0.36 1.2
Note 1. LOCK_CONV is an internal signal. When at logic 0 converter PLL is out-of-lock. When at logic 1 converter PLL is in-lock. Table 4 Converter synthesizer: fcomp = fosc/RD 12.5 kHz 80 320 25 kHz 40 160 50 kHz 20 80 125 kHz 8 32
fosc\fcomp 1 MHz 4 MHz Table 5
Converter synthesizer; ND = 4; flo = ND x NDR x fcomp = NDR x step flo\step 50 kHz 2900 3600 100 kHz 1450 1800 200 kHz 725 900 500 kHz 290 360
145 MHz 180 MHz
1999 Dec 14
14
Philips Semiconductors
Product specification
QPSK transmitter
TDA8050
handbook, full pagewidth
+5 V Siemens V944 150 +9 V 150
OUTEN
1
32
SW_CAP 100 pF
BUF_OUT
2
31
RF_INC 100 nF 680
BUF_OUTC
3
30
RF_IN 100 nF 47 pF 390 nH 390 nH
AGND2
4
29
AVCC2
+5 V
100 nF
I_IN
5
28
RF_OUT 100 nF 27 pF
100 100 nF I_INC 6 27 RF_OUTC
100 nF 100 nF Q_IN AVCC1 +5 V
7
26
100 100 nF Q_INC 8 25 IF_FILTC 68 nH 24 IF_FILT 140 MHz TKAMOD LOCK BB132 10 k (2x) 11 22 TKACONV 56 nH CP_MOD 18 k 8.2 nF DVCC 13 20 TUNECONV 10 k 330 pF CLK 14 19 CP_CONV +9 V 100 nF 27 k 10 nF 12 21 TKBCONV 39 pF 8.2 pF 39 pF 22 k 820 pF 18 pF
TDA8050
AGND1 BB133 (2x) 10 k 15 pF 22 k 10 pF 10 23 9
22 nH TKBMOD
10 k 15 pF 22 k
10 k
22 k
330 pF
370 pF
DATA
15
18
DGND
EN
16
17
OSC_IN
4 MHz 18 pF
MBK982
Fig.9 Application diagram.
1999 Dec 14
15
Philips Semiconductors
Product specification
QPSK transmitter
INTERNAL PIN CONFIGURATION SYMBOL OUTEN SW_CAP PIN 1 32 DESCRIPTION - 1.7 V
TDA8050
DC VOLTAGE
1
32
FCE004
BUF_OUT BUF_OUTC
2 3
2 3
5.8 V 5.8 V
FCE005
AGND2
4
0
4
FCE023
I_IN I_INC
5 6
5 6
2.5 V 2.5 V
FCE006
1999 Dec 14
16
Philips Semiconductors
Product specification
QPSK transmitter
TDA8050
SYMBOL Q_IN Q_INC
PIN 7 8
7
DESCRIPTION 2.5 V 2.5 V
8
DC VOLTAGE
FCE007
AGND1
9
0V
9
FCE008
TKAMOD TKBMOD
10 11
3.1 V 3.1 V
10
FCE009
11
CP_MOD
12
2.1 V
12
FCE010
DVCC
13
supply voltage
5V
1999 Dec 14
17
Philips Semiconductors
Product specification
QPSK transmitter
TDA8050
SYMBOL CLK
PIN 14
DESCRIPTION -
DC VOLTAGE
14
FCE011
DATA
15
-
15
FCE012
EN
16
-
16
FCE013
OSC_IN
17
2.9 V
VCC
17
FCE014
DGND
18
18
0
FCE015
1999 Dec 14
18
Philips Semiconductors
Product specification
QPSK transmitter
TDA8050
SYMBOL CP_CONV
PIN 19
DESCRIPTION 2.1 V
down VCC
DC VOLTAGE
19 up
FCE016
TUNECONV
20
20
VVT
FCE017
TKBCONV TKACONV
21 22
3.1 V 3.1 V
21
FCE018
22
LOCK
23
0V 5V
23
FCE019
1999 Dec 14
19
Philips Semiconductors
Product specification
QPSK transmitter
TDA8050
SYMBOL IF_FILT IF_FILTC
PIN 24 25
DESCRIPTION 2.1 V 2.1 V
DC VOLTAGE
24
25
FCE020
AVCC1 RF_OUTC RF_OUT
26 27 28
supply voltage
5V 3.7 V 3.7 V
27
28
FCE021
AVCC2 RF_IN RF_INC
29 30 31
supply voltage
5V 2.1 V 2.1 V
30
31
FCE022
1999 Dec 14
20
Philips Semiconductors
Product specification
QPSK transmitter
PACKAGE OUTLINE SO32: plastic small outline package; 32 leads; body width 7.5 mm
TDA8050
SOT287-1
D
E
A X
c y HE vM A
Z 32 17
Q A2 A1 pin 1 index Lp 1 e bp 16 wM L detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 0.02 0.01 c 0.27 0.18 0.011 0.007 D (1) 20.7 20.3 0.81 0.80 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.419 0.394 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.2 1.0 0.047 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.95 0.55 0.037 0.022
0.012 0.096 0.004 0.086
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT287-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-25 97-05-22
1999 Dec 14
21
Philips Semiconductors
Product specification
QPSK transmitter
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
TDA8050
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Dec 14
22
Philips Semiconductors
Product specification
QPSK transmitter
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not
TDA8050
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Dec 14
23
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/25/04/pp24
Date of release: 1999
Dec 14
Document order number:
9397 750 06555

▲Up To Search▲

Price & Availability of TDA8050

	To Download TDA8050 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .