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| (R) SP2209E High ESD Dual Port RS-232 Transceiver s Meets True EIA/TIA-232-F Standards s Complies with 89/336/EEC EMC Directive s Single +12V Power Supply s <5mA Low Power CMOS Operation s 100A Low Standby Current s Operates With +3V Or +5V Logic s Allows +3.3V to +5V Standby Supply s Two Complete Serial Ports, 6 Drivers and 10 Receivers s One Receiver On Each Port Active In Standby s Failsafe Receiver Outputs s 460kbps Minimum Data Rate s Guaranteed LapLink(R) - Compatible s Ideal For High Speed RS-232 Applications s 0.1F Charge Pump Capacitors s Low EMI Emissions (EN55022) s Pin Compatible To ADM2209E device s Enhanced ESD Specifications: +15KV Human Body Model +15KV EN61000-4-2 Air Discharge +8KV EN61000-4-2 Contact Discharge s Fast Transient Burst (EFT) Immunity (EN61000-4-2) DESCRIPTION The rugged, high ESD SP2209E device is a complete dual RS-232 port integrated onto a single integrated circuit. Six drivers and ten receivers provide designers a dual port solution fully meeting the EIA/TIA-232 and ITU-T V.28/V.24 communication protocols and can be implemented in applications such as personal desktop computers and workstations. Features include high transmission rates, low power consumption, an internal charge-pump power supply that requires only two capacitors, space saving 38-pin TSSOP package dimensions, and compatibility with the EU directive on electromagnetic compatibility. This device is ideal for operation in electrically harsh environments or where RS-232 cables are frequently being plugged and unplugged. This device is also immune to high RF field strengths without special shielding precautions. SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 1 ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. VDD......................................................-0.3V to +14.0V VSTBY........................................................-0.3V to +7V Input Voltages TXINA........................................-0.3V to (VSTBY + 0.3V) TXINB........................................-0.3V to (VSTBY + 0.3V) RXINA..................................................................+15V RXINB..................................................................+15V Output Voltages TXOUTA..............................................................+15V TXOUTB..............................................................+15V RXOUTA...................................-0.3V to (VSTBY + 0.3V) RXOUTB...................................-0.3V to (VSTBY + 0.3V) Short-Circuit Duration TXOUTA....................................................Continuous TXOUTB....................................................Continuous Storage Temperature........................-65C to +150C Power Dissipation per package 38-pin TSSOP (derate 14.3mW/oC above +70oC).....1200mW SPECIFICATIONS Unless otherwise noted, the following specifications apply for VDD = +12.0V + 10%, VSTBY = +3.3V + 5% or +5V + 10%, C1 = C2 = 0.1F, and TAMB = TMIN to TMAX. PARAMETER DC CHARACTERISTICS Supply Current Standby Supply Current, VSTBY 100 5 200 mA A no load, all driver inputs at 0.4V or 2.1V, all receiver inputs at +15V or -15V no load, all driver inputs at VSTBY or open MIN. TYP. MAX. UNITS CONDITIONS CMOS LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Voltage LOW HIGH Input Leakage Current Output Voltage LOW Output Voltage HIGH Output Leakage Current 0.4 2.1 10 0.2 2.4 +0.05 +5 25 0.4 V A V V A TAMB = 25oC Driver input at 0V IOL = +1.6mA IOH = -40A VDD = 0V, (except R5OUTA and R5OUTB) SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 2 SPECIFICATIONS (continued) Unless otherwise noted, the following specifications apply for VDD = +12.0V + 10%, VSTBY = +3.3V + 5% or +5V + 10%, C1 = C2 = 0.1F, and TAMB = TMIN to TMAX. PARAMETER DRIVER OUTPUTS Output Voltage Swing Output Resistance Output Short-Circuit Current RECEIVER INPUTS Input Voltage Range Input Threshold LOW Input Threshold HIGH Input Hysteresis Input Resistance TIMING CHARACTERISTICS Driver Maximum Data Rate 460 460 kbps 920 Driver Propagation Delay tPHL tPLH Driver Transition-Region Slew Rate 6 4 RL = 3k to 7k, CL = 50pF to 470pF RL = 3k to 7k, CL = 50pF to 1000pF TAMB = 0oC to +85oC, VSTBY = 5V + 10% only RL = 3k to 7k, CL = 50pF to 470pF, VSTBY = 5V + 5%, VDD = 12V + 5% RL = 3k, CL = 1000pF, refer to Figures 3 and 5 RL = 3k, CL = 1000pF, refer to Figures 3 and 5 RL = 3k to 7k, CL = 50pF to 470pF RL = 3k to 7k, CL = 50pF to 1000pF VSTBY = 5V + 10% only, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V CL = 150pF CL = 150pF, VSTBY = 5V + 5% only CL = 150pF, refer to Figures 4 and 6 CL = 150pF, refer to Figures 4 and 6 CL = 150pF, refer to Figures 4 and 6 CL = 150pF, refer to Figures 4 and 6 refer to Figures 4 and 6 refer to Figures 4 and 6 3 -15 0.4 1.45 1.7 0.25 5 7 2.4 +15 V V V V k VIN = +15V +5.0 300 +5 +15 +30 +9.0 V mA all driver outputs loaded with 3K to GND VDD = VSTBY = 0V, VOUT = +2V one driver output shorted, VIN = 0.8V, VOUT = 0V MIN. TYP. MAX. UNITS CONDITIONS 1.0 1.0 16 16 s V/s Receiver Maximum Data Rate Receiver Propagation Delay tPHL (R1x - R4x) tPLH (R1x -R4x) 460 920 0.4 0.4 0.75 0.75 kbps s tPHL (R5x) tPLH (R5x) 1.0 1.0 30 30 2.0 2.0 ns ns Receiver Output Rise Time Receiver Output Fall Time OPERATING CHARACTERISTICS Operating Voltage Range, VDD Standby Voltage Range, VSTBY Operating Temperature, TAMB +10.8 +3.15 -40 +12.0 +13.2 +5.5 +85 V V oC SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 3 NAME R5OUTA R4OUTA R3OUTA R2OUTA R1OUTA T3INA T2INA T1INA STBY V DD C+ T1INB T2INB T3INB R1OUTB R2OUTB R3OUTB R4OUTB R5OUTB R5INB R4INB R3INB R2INB R1INB T3OUTB T2OUTB T1OUTB GND CV- FUNCTION +3.3V to +5V TTL/CMOS logic level receiver output for port A. +3.3V to +5V TTL/CMOS logic level receiver output for port A. +3.3V to +5V TTL/CMOS logic level receiver output for port A. +3.3V to +5V TTL/CMOS logic level receiver output for port A. +3.3V to +5V TTL/CMOS logic level receiver output for port A. +3.3V to +5V TTL/CMOS logic level driver input for port A. +3.3V to +5V TTL/CMOS logic level driver input for port A. +3.3V to +5V TTL/CMOS logic level driver input for port A. +3.3V to +5V standby power supply for receivers R5OUTA and R5OUTB. +12V power supply Positive terminal for the polarized C1 charge-pump capacitor. +3.3V to +5V TTL/CMOS logic level driver input for port B. +3.3V to +5V TTL/CMOS logic level driver input for port B. +3.3V to +5V TTL/CMOS logic level driver input for port B. +3.3V to +5V TTL/CMOS logic level receiver output for port B. +3.3V to +5V TTL/CMOS logic level receiver output for port B. +3.3V to +5V TTL/CMOS logic level receiver output for port B. +3.3V to +5V TTL/CMOS logic level receiver output for port B. +3.3V to +5V TTL/CMOS logic level receiver output for port B. RS-232 receiver input for port B. RS-232 receiver input for port B. RS-232 receiver input for port B. RS-232 receiver input for port B. RS-232 receiver input for port B. RS-232 driver output for port B. RS-232 driver output for port B. RS-232 driver output for port B. Ground. Negative terminal for the polarized C1 charge-pump capacitor. -12V output generated by the charge pump at the negative terminal of the polarized C2 charge-pump capacitor. PIN NUMBER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Table 1. Device Pin Description SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 4 NAME T1OUTA T2OUTA T3OUTA R1INA R2INA R3INA R4INA R5INA RS-232 driver output for port A. RS-232 driver output for port A. RS-232 driver output for port A. RS-232 receiver input for port A. RS-232 receiver input for port A. RS-232 receiver input for port A. RS-232 receiver input for port A. RS-232 receiver input for port A. FUNCTION PIN NUMBER 31 32 33 34 35 36 37 38 Table 1. Device Pin Description (continued) R5OUTA R4OUTA R3OUTA R2OUTA R1OUTA T3INA T2INA T1INA STBY 1 2 3 4 5 6 SP2209E 7 8 9 38 37 36 R5INA R4INA R3INA 35 R2INA 34 R1INA 33 T3OUTA 32 T2OUTA 31 T1OUTA 30 V29 28 27 CGND T1OUTB VDD 10 C+ 11 T1INB 12 T2INB 13 T3INB 14 R1OUTB 15 R2OUTB R3OUTB 16 17 26 T2OUTB 25 T3OUTB 24 R1INB 23 R2INB 22 R3INB 21 R4INB 20 R5INB R4OUTB 18 R5OUTB 19 Figure 1. SP2209E Pinout Configuration SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 5 +12V 0.1F + 10 VDD STBY 9 + 30 28 31 RS-232 OUTPUTS + C2 0.1F +3.3V 0.1F 11 C+ 0.1F + C1 SP2209E VGND 29 C8 T1INA 400K T1OUTA TTL/CMOS INPUTS 7 T2INA 400K 6 T3INA 400K 5 R1OUTA T2OUTA 32 T3OUTA R1INA 5K 33 34 35 36 37 38 RS-232 INPUTS 4 R2OUTA 5K R2INA R3INA 5K TTL/CMOS OUTPUTS 3 R3OUTA 2 R4OUTA 5K R4INA R5INA 5K 1 R5OUTA 12 T1INB TTL/CMOS INPUTS 400K T1OUTB 27 RS-232 OUTPUTS 13 T2INB 400K 14 T3INB 400K 15 R1OUTB T2OUTB 26 T3OUTB 25 R1INB 5K 24 23 22 21 20 RS-232 INPUTS 16 R2OUTB 5K R2INB R3INB 5K TTL/CMOS OUTPUTS 17 R3OUTB 18 R4OUTB 5K R4INB R5INB 5K 19 R5OUTB Figure 2. SP2209E Typical Operating Circuit SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 6 DESCRIPTION The SP2209E device is a rugged, high ESD, complete dual RS-232 port integrated onto a single integrated circuit. Six drivers and ten receivers provide a dual port solution fully meeting the EIA/TIA-232 and ITU-T V.28/V.24 communication protocols and can be implemented in applications such as personal desktop computers and workstations. Refer to Figure 2 for a typical operating circuit. Features include high transmission rates, low power consumption, space saving package dimensions, and compatibility with the EU directive on electromagnetic compatibility. EM compatibility includes protection against radiated and conducted interference including high levels of electrostatic discharge. This device is ideal for operation in electrically harsh environments or where RS-232 cables are frequently being plugged and unplugged. This device is also immune to high RF field strengths without special shielding precautions. Emissions are also controlled to within very strict limits. The SP2209E device features the inverter portion of Sipex's proprietary and patented (U.S. 5,306,954) on-board charge pump circuitry that generates a -9V voltage level from a single +12V power supply. The SP2209E device can operate at data rates of at least 460kbps fully loaded. Its low power CMOS operation makes the SP2209E device an ideal choice for power sensitive designs. The SP2209E device has two receivers, one for each RS-232 port, that remains active in the standby mode to allow the monitoring of peripheral devices while the rest of the system is in a power-saving standby mode. This allows the SP2209E device to wake up the entire system when any communication is initiated in peripheral devices. The SP2209E device has a low standby current of 100A. THEORY OF OPERATION The SP2209E device is made up of four basic circuit blocks: 1. Drivers, 2. Receivers, 3. the Sipex proprietary charge pump, and 4. Standby circuitry. Drivers The drivers are inverting level transmitters that convert TTL or CMOS logic levels to EIA/TIA-232 levels with an inverted sense relative to the input logic levels. With VDD = +12V, the typical RS-232 output voltage swing is +9V with no load and +5V minimum fully loaded. Unused driver input may be left unconnected with an internal pull-up resistor pulling the inputs high forcing the driver outputs into a low state. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. These drivers comply with the EIA-TIA-232F and all previous RS-232 versions. The drivers typically can operate at a minimum data rate of 460kbps fully loaded with 3K in parallel with 1000pF, ensuring compatibility with PC-to-PC communication software. The SP2209E device is ideal for the new generation modem standards which require data rates greater than 460kbps. Refer to Figures 3 and 5 for driver propagation delay test circuit and waveforms, respectively. Receivers The receivers convert EIA/TIA-232 levels to TTL or CMOS logic output levels. Should an unused receiver input be left unconnected, an internal 5k pulldown resistor to ground will commit the output of the receiver to a HIGH state. Receiver inputs are also protected against overvoltages of up to +15V. Refer to Figures 4 and 6 for receiver propagation delay test circuit and waveforms, respectively. SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 7 VIN A TX VOUT VIN A RX VOUT 3k 1000pF 150pF C C Figure 3. Driver Propagation Delay and Transition Time Test Circuit Figure 4. Receiver Propagation Delay and Transition Time Test Circuit Data Transmission Rate > 460kbps, tF<5ns, tR<5ns DRIVER INPUT +3V 1.5V 0V 0V +3V -3V tF -3V tR tPHL tPLH +3V 1.5V V DRIVER OH OUTPUT VOL tSKEW = | tPHL - tPLH | Figure 5. Driver Propagation Delays Data Transmission Rate > 460kbps, tF<200ns, tR<200ns +3V RECEIVER INPUT -3V V RECEIVER OH OUTPUT VOL 50% 0V tPHL 80% 20% tF 20% tR tPLH 80% 0V tSKEW = | tPHL - tPLH | Figure 6. Receiver Propagation Delays SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 8 One receiver in each RS-232 port can be kept active by a low current, +3.3V to +5V power supply while the rest of the channels are powered down. This allows the SP2209E device to monitor peripheral devices while the rest of the system is in a power-saving standby mode. The SP2209E device can be implemented as a power management device to wake up the entire system when any communication is initiated in peripheral devices. The SP2209E device has a low standby current of 100A. Since receiver input is usually from a transmission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mV. This ensures that the receiver is virtually immune to noisy transmission lines and inputs with slow transition times. Charge Pump The charge pump is a Sipex-patented design (U.S. 5,306,954) and uses a unique approach compared to older less-efficient designs. The charge pump requires two external capacitors using a two-phase voltage shifting technique with a 200kHz internal oscillator to attain a -9V power supply. Refer to Figure 7 for the internal charge pump circuit. The internal power supply consists of a charge pump that provides output voltages of at least +5V regardless of the input voltage (VDD). This is important to maintain compliant RS-232 levels regardless of power supply fluctuations. A description of each phase follows. VC2- = -VDD VDD S1 C1 S2 S3 C2 C2- S4 Figure 7. Charge Pump Circuit Figure 8. Charge Pump Waveforms SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 9 Phase 1 -- VDD charge storage -- S1 and S2 are closed. S3 and S4 are open. During this phase of the clock cycle, the positive side of capacitor, C1, is connected to VDD. The negative side of C1 is connected to GND. C1 is charged to +VDD. Phase 2 -- VDD transfer -- S1 and S2 are open. S3 and S4 are closed. The negative side of the capacitor, C2, is connected to C2-. The positive side of C2 is connected to GND. This transfers a negative generated voltage to C2. A negative voltage is built up on the negative side of C2 with each cycle of the oscillator. If the current drawn is small, the output voltage at C2- will be close to -VDD. As the current drawn at C2- increases, the output voltage will decrease in magnitude. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. Refer to Figure 8 for the internal charge pump waveforms. Standby Circuitry The SP2209E device incorporates power saving, on board standby circuitry. The standby current is typically less than 100A. The SP2209E device automatically enters a standby mode when the VDD power supply is removed. An internal comparator generates an internal shutdown signal that disables the internal oscillator disengaging the charge pump. Refer to Figure 9 for the internal standby detection circuit. The inverted output V- goes to ground. All driver outputs are disabled. The inputs of receivers 1 through 4 for both ports A and B are at high impedance. Receiver 5 for both ports A and B remain fully active as power management receiver lines to system peripherals that may come online during the standby mode. ESD Tolerance The SP2209E device incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static SP2209E DS/06 VDD VSTBY Internal Shutdown Signal Figure 9. Internal Standby Detection Circuit discharges and associated transients. The improved ESD tolerance is at least +15kV without damage nor latch-up. There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b) EN61000-4-2 Air-Discharge c) EN61000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body's potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 10. This method will test the IC's capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. The EN61000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with EN61000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the (c) Copyright 2000 Sipex Corporation SP2209E High ESD Dual Port RS-232 Transceivers 10 equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for EN61000-4-2 is shown on Figure 11. There are two methods within EN61000-4-2, the Air Discharge method and the Contact Discharge method. With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already RC RC SW1 SW1 DC Power Source holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC. The circuit model in Figures 10 and 11 represent the typical ESD testing circuit used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage. For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are 1.5k an 100pF, respectively. For EN61000-4-2, the current limiting resistor (RS) and the source capacitor (CS) are 330 an 150pF, respectively. The higher CS value and lower RS value in the EN61000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point. APPLICATIONS With six drivers and ten receivers, the SP2209E device is ideal for applications requiring two RS-232 ports such as in desktop or portable computers. Refer to Figure 13. For typical DB9 serial ports for Data Terminal Equipment (DTE) RS S SW2 SW2 CS S Device Under Test Figure 10. ESD Test Circuit for Human Body Model SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 11 Contact-Discharge Module RC C SW1 SW1 DC Power Source RS RS RV SW2 SW2 CS S Device Under Test RS and RV add up to 330 for IEC1000-4-2. 330 for Figure 11. ESD Test Circuit for EN61000-4-2 to Data Circuit Terminating Equipment (DCE) interface implementation, 2 data lines, TxD and RxD, and 6 control lines, RTS, DTR, DSR, CTS, and RI, are required. The straight-through pinout for data lines in the SP2209E device allows a simplified PCB layout allowing ground lines to separate the signal lines and ground planes to be placed beneath the IC without the complication of a multi-layer PCB layout. A receiver from each port, R5INA and R5INB, are active while the rest of the channels are powered down. This allows the SP2209E device to monitor peripheral devices while the rest of the system is in a power-saving standby mode. Fail-Safe receiver outputs are pulled high if the receiver inputs are left unconnected or at zero input. The SP2209E device can be implemented as a power management device to wake up the entire system when any communication is initiated in peripheral devices. The SP2209E device has a low standby current of 100A. A standard serial mouse can be powered from the SP2209E drivers. Two driver outputs connected in parallel and set to VOH can be used to supply power to the V+ pin of the mouse. The third driver is set to VOL to link current from the V- terminal. Typical mouse specifications are 10mA at +6V and 5mA at -6V. LapLink Compatibility The SP2209E can operate up to 460kbps data rate under maximum driveload conditions of CL = 1000pF and RL = 3K at minimum power supply voltages. i 30A 15A 0A t=0ns t Figure 12. ESD Test Waveform for EN61000-4-2 t=30ns DEVICE PIN TESTED Driver Outputs Receiver Inputs HUMAN BODY MODEL +15kV +15kV Air Discharge +15kV +15kV IEC1000-4-2 Direct Contact +8kV +8kV Level 4 4 Table 2. Transceiver ESD Tolerance Levels SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 12 +3.3V to +5V 11 0.1F + 29 VGND C- 28 0.1F DCD DSR 5 R1OUTA 5K R1INA R2INA 5K 34 DCD DSR RXD 4 R2OUTA R3OUTA 5K 35 Super I/O Chip RXD 3 R3INA 36 RTS TXD CTS 8 7 2 T1INA T2INA 400K 400K T1OUTA T2OUTA R4INA 5K 31 32 37 RTS TXD CTS R4OUTA DTR RI 6 T3INA 1 400K T3OUTA R5INA 5K 33 38 DTR RI R5OUTA DCD DSR RXD 15 R1OUTB 5K R1INB R2INB 5K 24 DCD DSR RXD 16 R2OUTB R3OUTB 5K 23 17 R3INB 22 RTS TXD CTS 12 13 18 T1INB T2INB R4OUTB 400K 400K T1OUTB 27 T2OUTB 26 R4INB 5K 21 RTS TXD CTS DTR RI 14 19 T3INB R5OUTB 400K T3OUTB 25 R5INB 5K 20 DTR RI Figure 13. Dual Serial Port Application with Two DB9 Connectors SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers 13 + C+ SP2209E VDD 10 30 + 0.1F STBY 9 +12V 0.1F + DB-9 Connector COM1 6 7 8 9 1 2 3 4 5 DB-9 Connector COM2 6 7 8 9 1 2 3 4 5 (c) Copyright 2000 Sipex Corporation PACKAGE: PLASTIC THIN SMALL OUTLINE (TSSOP) E2 E D A O e B A1 L DIMENSIONS (mm) Minimum/Maximum A A1 B D E e E2 L O 38-PIN (- /1.10) (0.05/0.15) (0.17/0.27) (9.60/9.80) (4.30/4.50) (0.50 BSC) (3.20 BSC) (0.50/0.75) 0/8 SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 14 ORDERING INFORMATION Please consult the factory for pricing and availability on a Tape-On-Reel option. Model SP2209EEY Temperature Range -40C to +85C Package Types 38-pin TSSOP Corporation SIGNAL PROCESSING EXCELLENCE Sipex Corporation Headquarters and Sales Office 22 Linnell Circle Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: sales@sipex.com Sales Office 233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600 Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others. SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers (c) Copyright 2000 Sipex Corporation 15 |
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