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STM1645-30
RF POWER MODULE SATELLITE COMMUNICATION APPLICATIONS
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CLASS C SATELLITE COMMUNICATIONS AMPLIFIER 1625- 1665 MHz 12/28 VOLTS INPUT/OUTPUT 50 OHMS Pout = 30 W MIN. GAIN = 34.8 dB MIN.
DESCRIPTION The STM1645-30 hybrid RF Power Module is designed for high power satellite communication applications in the 1.6 GHz frequency range. High fT, gold metallized silicon microwave power devices, optimized for use in STM1645-30, are employed to provide high gain and efficiency while ensuring excellent reliability.
ORDER CODE : STM1645-30
BRANDING: STM1645-30
PIN CONNECTIONS
1. RF Input 5. V C3 28V
2. G round 3. V C1 12V 4. V C2 28V 6. Gr ound 7. RF Output
ABSOLUTE MAXIMUM RATINGS (Tcase = 25 oC)
Symb ol V PI N T STG TC DC Supply Voltage RF Input Power (P OUT 30 W ) Parameter Value 30 20 - 40 to + 100 -35 to + 70 Un it Vdc mW
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Storage Temperature Range O perating Case Temperature
C C
October 1999
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ELECTRICAL SPECIFICATION (Tcase = 25 oC, VC1* = 12 V; VC2, VC3 = 28 V)
Symbo l BW P OUT GP Z IN H Parameter Frequency Range Power O utput Power G ain Efficiency Input Impedance Harmonics P OUT vs T CASE P OUT vs F requency Load Mismatch P OUT Control Range Stability
Note : * VC1 = 12 V regulated 1% ** POUT adjusted by varying VC3 REF. 1015506I
T est Con ditio ns P IN 10 W P OUT = 30 W P OUT = 30 W P OUT = 30 W
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Min. 1625 30 34.8 35
T yp.
Max 1665
Unit MHz W dB %
35 35.5
40
Z G, Z L = 50
1.5:1 -45
2:1 -40 2 1
VSW R dB dB dB
P OUT = 30 W reference T C = -35 C to +70 C @ P I N = 10mW f = 1625 - 1665 MHz VSW R = 10:1 P OUT = 30 W P OUT = 30 W P OUT = 5 to 30 W** Load VSWR = 3:1 any phase V = 28 Vdc
No Degradation in O utput Power 8 10 dB
All Spurious Outputs More Than 60 dB Below Carrier
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TYPICAL PERFORMANCE Power Output vs Frequency and Power Input Power Gain vs Frequency and Power Input
VCONTROL vs Collector Efficiency
VCONTROL vs Power Output and IC3 (Typical)
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APPLICATIONS RECOMMENDATIONS OPERATION LIMITS The STM1645-30 power module should never be operated under any condition which exceeds the Absolute Maximum Ratings presented on this data sheet. Nor should the module be operated continuously at any of the specified maximum ratings. If the module is to be subjected to one or more of the maximum rating conditions, care must be taken to monitor other parameters which may be affected. MODULE MOUNTING To insure adequate thermal transfer from the module to the heatsink, it is recommended that a satisfactory thermal compound such as Dow Corning 340, Wakefield 120-2 or equivalent be applied between the module flange and the heatsink. The heatsink mounting surface under the module should be flat to within 0.05 mm ( 0.002 Inch). The module should be mounted to the heatsink using 3.5 mm (or 6-32) or equivalent screws torqued to 5-6 Kg-cm (4-6 in-lb). The module leads should be attached to equipment PC board using 180oC solder applied to leads with a properly grounded soldering iron tip, not to exceed 195 oC, applied a minimum of 2 mm (0.080 inch) from the body of the module for a duration not to exceed 15 seconds per lead. It is imperative that no other portion of the module, other than the leads, be subjected to temperature in excess of 100 oC (maximum storage temperature), for any period of time, as the plastic moulded cover, internal components and sealing adhesives may be advertisely affected by such conditions. Due to the construction techniques and materials used within the module, reflow soldering of the flange heatsink or leads, is not recommended.
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H160 MECHANICAL DATA
1016819C
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com .
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