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TELEFUNKEN Semiconductors
U2794B
1000 MHz Quadrature Demodulator
Description
U2794B silicon monolithic integrated circuit is a quadrature demodulator that is manufactured using TELEFUNKEN's advanced UHF technology. This demodulator features a frequency range from 70 - 1000 MHz, low current consumption, selectable gain, power down mode and is adjustment free. The IC is suitable for direct conversion and image rejection applications in digital radio systems up to 1 GHz such as cellular radio, cordless telephone, cable TV and satellite TV systems.
Features
D Supply voltage 5 V (typ.) D Very low power consumption 125 mW (typ.) D Very good image rejection by means of phase control
loop for precise 90 phase shifting
D Low LO input level -10 dBm (typ.) D LO - frequency from 70 MHz to 1 GHz D Power down mode D 25 dB gain control D Very low I/Q output dc offset voltage typ. < 5 mV
D Duty cycle regeneration for single ended LO input
signal
Block Diagram
VS 5,6 Power down PD 14 IIX 4 II 3 1 IX OUTPUT 2I 7 RFin 8 90Control loop 0 90 Frequency doubler Duty cycle regenerator 15 17 LO 13 PC 12 PCX Q 19 OUTPUT
20 QX 11 GC 16,18 GND 10 QQX 9 QQ
95 9778
Ordering Information
Extended Type Number U2794B-AFS U2794B-AFSG3 Package SSO 20 SSO 20 Remarks Rail, MOQ 830 pcs. Tape and reel, MOQ 4000 pcs.
Rev. A3: 23.08.1995
1 (11)
U2794B
Pin Description
IX I II IIX VS VS RFin RFXin QQ QQX 1 2 3 4 5 6 7 8 9 10
95 10711
TELEFUNKEN Semiconductors
20 QX 19 Q 18 17 GND LOin
16 GND 15 LOXin 14 PD 13 PC
12 PCX 11 GC
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Symbol IX I II IIX VS VS RFin RFXin QQ QQX GC PCX PC PD LOXin GND LOin GND Q QX
Function IX output I output II low pass filter I IIX low pass filter I Supply voltage Supply voltage RF input RFX input QQ low pass filter Q QQX low pass filter Q GC gain control PCX phase control PC phase control PD power down LOX input Ground LO input Ground Q output QX output
Electrostatic sensitive device, observe precautions for handling!
Absolute Maximum Ratings
Parameters Supply voltage Pins 5 and 6 Input voltage Pins 7, 8 and 17 Junction temperature Storage temperature range Symbol VS Vi Tj Tstg Value 6 0 to VS 125 -40 to 125 Unit V V C C
Operating Range
Parameters Supply voltage range Pins 5 and 6 Ambient temperature range Symbol VS Tamb Value 4.75 to 5.25 -40 to 85 Unit V C
Thermal Resistance
Junction ambient Parameters SSO 20 Symbol RthJA Value 140 Unit K/W
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Rev. A3: 23.08.1995
TELEFUNKEN Semiconductors
U2794B
Electrical Characteristics
Test conditions (unless otherwise specified); VS = 5 V, Tamb = 25C, referred to test circuit System impedance ZO = 50 W, fiLO = 950 MHz, PiLO = -10 dBm Parameters Supply voltage range Supply current Power down mode, PD "OFF"mode supply current Switch voltage "Power ON" "Power DOWN" LO input, LOin Frequency range Input level Input impedance Voltage standing wave ratio Duty cycle range RF input, RFin Noise figure (DSB) symmetrical output Frequency range -1 dB input compression point Second order IIP Third order IIP Test Conditions / Pins Pins 5 and 6 Pins 5 and 6 VPD 0.5 V VPD = 1.0 V Note 1 Pins 5 and 6 Pin 14 Pin 14 VPON VPOFF Pin 17 Note 2 See figure 6 See figure 2 fiLO PiLO ZiLO VSWRLO LODCR @ 950 MHz Note 3 @ 100 MHz Pins 7 and 8 Pins 7 and 8 Pins 7 and 8 High gain Low gain Note 4 High gain Low gain LO leakage Pins 7 and 8 Symmetric input Asymmetric input Pins 7 and 8 see figure 6 NF 70 -12 -10 50 1.2 0.4 12 10 >fiLO -8 +3.5 35 +3 +13 -60 -55 500Wo 0.8pF dBm dBm dBm 1000 -5 MHz dBm 4 1 V V Symbol VS IS IsPD Min. 4.75 Typ. 30 1 20 Max. 5.25 Unit V mA
mA
W
2 0.6 dB
fiRF ICPHG ICPLG IIP2HG IIP3HG IIP3LG LOL
Pins 7 and 8 Pins 7 and 8
dBm
Input impedance
ZiRF
Note 1: During power down status a load circuitry with dc-isolation to GND is assumed otherwise a current of I (VS -0.8 V) /RI has to be added to the above power down current for each output I, IX, Q, QX. Note 2: The required LO-Level is a function of the LO-frequency (see figure 3). Note 3: Measured with input matching. For 950 MHz the optional transmission line T3 at the RF input may be used for this purpose. Noise figure measurements without using the differential output signal result in a worse noise figure. Note 4: Using Pins 7 and 8 as a symmetric RF input, the second order IIP can be improved.
Rev. A3: 23.08.1995
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U2794B
Electrical Characteristics
TELEFUNKEN Semiconductors
Test conditions (unless otherwise specified); VS = 5 V, Tamb = 25C, referred to test circuit System impedance ZO = 50 W, fiLO = 950 MHz, PiLO = -10 dBm Parameters I/O outputs Test Conditions / Pins Emitter follower I = 0.6 mA Note 5 Pins 1, 2, 19 and 20 Symbol I, IX / Q, QX BWI/Q AII/Q QEI/Q Max I/Q VOUT VOFSI/Q I/IX Q/QX Zout Min. Typ. Max. Unit
3 dB-bandwidth w/o external C I/Q amplitude Pins 1, 2, 19 and 20 imbalance I/Q quadrature error Pins 1, 2, 19 and 20 I/Q maximum output Pins 1, 2, 19 and 20 swing Symm. output RL > 5 kW DC output voltage Pins 1, 2, 19 and 20 DC output offset voltage Note 6 Pins 1, 2, 19 and 20 Output impedance Gain control, GC Control range power gain, gain high/gain low Switch voltage "Gain high" "Gain low" Settling time, ST Power "OFF " - "ON " Power "ON " - "OFF " Pins 1, 2, 19 and 20 see figure 6 Pin 11 Note 7 Pin 11 Pin 11
30 0.2 1.5 2 2.8 <5
MHz dB Deg VPP V mV
50
W
dB
GCR PGH/GGL GCVHigh GCVLow STON STOFF
25 23/-2 1
Note 8
V V
<4 <4
ms ms
Note 5: Due to test board parasitics this bandwidth is reduced and not equal for I, IX, Q, QX. If symmetry and full bandwidth is required the lowpass Pins 3, 4 and 9, 10 should be isolated from the board. The bandwidth of the I/Q outputs can be increased further by using a resistor between the Pins 3, 4, 9 and 10. This resistors shunt the internal loads of RI 5.4 kW The decrease in gain here has to be considered. Note 6: Output emitter follower internal acurrent I = 0.6 mA allows only small voltage swing with a 50 W load. For low signal distortion the load impedance should be RI 5 kW Note 7: Referred to the level of the output vector I 2 Q 2. Note 8: The low gain status is achieved with an open or high ohmic Pin 11. A recommended application circuit for switching between high and low gain status is shown in figure 1.
)
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Rev. A3: 23.08.1995
TELEFUNKEN Semiconductors
U2794B
95 9842
Test Circuit
1n
* optional for single ended tests (notice 3 dB bandwidth of AD620) T1, T2 = transmission line ZO = 50 W. If no GC function is required, connect pin 11 to GND. For high and low gain status GC' is to be switched to GND respectively to VS.
Figure 1.
Rev. A3: 23.08.1995
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U2794B
6 18 16 NF ( dB ) 14 12 10 8 50
95 9919
TELEFUNKEN Semiconductors
5
VSWR
4
3 2 1 250 450 650 850 1050
95 9856
o
0
200
400
600
800
1000
LO Frequency ( MHz )
LO frequency ( MHz )
Figure 2. Typical VSWR frequency response of the LO input
10 0 PLO ( dBm )
Figure 4. Noise figure vs. LO frequency; o: value at 950 MHz with RF input matching with T3
30 26 Gain ( dB ) x 22 18 14 10
-10 -20 -30 -40 -50 0 200 400 600 800 1000
0
95 10069
200
400
600
800
1000
95 10070
LO frequency ( MHz )
LO frequency ( MHz )
Figure 3. Typical suitable LO power range vs. frequency
Figure 5. Gain vs. LO frequency; x: value at 950 MHz with RF input matching with T3
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Rev. A3: 23.08.1995
TELEFUNKEN Semiconductors
j
U2794B
0.5j
2j
0.2j
5j
0
0.2
0.5
2
-0.2j
95 9977
-0.5j
-2j
-j
Figure 6. Typical S11 frequency response of the a: LO input, LO frequency from 100 MHz to 1100 MHz, marker: 950 MHz b: RF input, RF frequency from 100 MHz to 1100 MHz, marker: 950 MHz c: I/Q outputs, baseband frequency from 5 MHz to 55 MHz, marker: 25 MHz
Rev. A3: 23.08.1995
A
5 b -5j
A
A AA
a1
c
1
AA
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U2794B
Board Layout
TELEFUNKEN Semiconductors
95 9854
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Rev. A3: 23.08.1995
TELEFUNKEN Semiconductors
U2794B
Board Layout
95 9853
External Components
CUCC 100 nF CRFX 1 nF CLO 100 pF CNLO 1 nF CRF 100 pF CII, CQQ optional external lowpass filters T3 transmission line for RF-input matching, to connect optionally CI, CIX, optional for ac-coupling at CQ, CQX baseband outputs CPDN 100 pF CGC 100 pF CPC 100 pF CNPC 100 pF GSW gain switch Rev. A3: 23.08.1995
Calibration Part
CO, CS, CL 100 pF RL 50 W
Conversion to Single Ended Output
OP1, OP2 RG1, RG2 AD620 prog. gain, see datasheet, for 5.6 kW a gain of 1 at 50 W is achieved together with RD1 and RD2. 450 W 100 nF 100 nF
RD1, RD2 CS1, CS2 CS3, CS4,
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U2794B
Description of Evaluation Board
Board material: The board offers the following functions epoxy; ar = 4.8, thickness = 0.5 mm transmission lines: ZO = 50 W
TELEFUNKEN Semiconductors
D The test circuit for the U2794B:
- The supply voltage and the control inputs GC, PC and PD are connected via a plug strip. The control input voltages can be generated via external potentiometers; then the inputs should be ac-grounded (time requirements in burst-mode for power up have to be considered). - The outputs I, IX, Q, QX are dc coupled via an plug strip or can be ac-connected via SMB plugs for high frequency tests e.g. noise figure or s-parameter measurement. The pins II, IIX, QQ, QQX allow user definable filtering with 2 external capacitors CII, CQQ. - Also the offsets of both channels can be adjusted with two potis or resistors.
- The LO- and the RF-inputs are ac-coupled and connected via SMB plugs. If transmission line T3 is connected to the RF-input and ac-grounded at the other end, gain and noise performance can be improved (input matching to 50 W). - The complementary RF-input is ac-coupled to GND (CRFX = 1 nF), the same appears to the complementary LO-input (CNLO = 1 nF).
D A calibration part, which allows to calibrate an
s-parameter analyzer directly to the in- and outputsignal ports of the U2794B.
D For single-ended measurements at the demodulator
outputs, two OP's (e.g., AD620 or other) can be configured with programmable gain; together with an output-divider network RD = 450 W to RL = 50 W, direct measurements with 50 W load-impedances are possible at frequencies 100 kHz.
t
Dimensions in mm
Package: SSO 20
94 8872
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Rev. A3: 23.08.1995
TELEFUNKEN Semiconductors
U2794B
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
Rev. A3: 23.08.1995
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