 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| $GYDQFHG 3RZHU 026)(7 FEATURES Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current: 10A (Max.) @ VDS = 400V Low RDS(ON): 0.254 (Typ.) 1 IRFP350A BVDSS = 400 V RDS(on) = 0.3 ID = 17 A TO-3P 2 3 1.Gate 2. Drain 3. Source Absolute Maximum Ratings Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt PD TJ , TSTG TL Characteristic Drain-to-Source Voltage Continuous Drain Current (TC=25C) Continuous Drain Current (TC=100C) Drain Current-Pulsed Gate-to-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (TC=25C) Linear Derating Factor Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8 from case for 5-seconds (2) (1) (1) (3) (1) Value 400 17 10.8 68 30 1156 17 20.2 4.0 202 1.61 - 55 to +150 Units V A A V mJ A mJ V/ns W W/C C 300 Thermal Resistance Symbol RJC RCS RJA Characteristic Junction-to-Case Case-to-Sink Junction-to-Ambient Typ. -0.24 -Max. 0.62 -40 C/W Units Rev. B (c)1999 Fairchild Semiconductor Corporation IRFP350A Electrical Characteristics (TC=25C unless otherwise specified) Symbol BVDSS BV/TJ VGS(th) IGSS IDSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd Characteristic Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coeff. Gate Threshold Voltage Gate-Source Leakage , Forward Gate-Source Leakage , Reverse Drain-to-Source Leakage Current Static Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain ( Miller ) Charge Min. Typ. Max. Units 400 -2.0 -----------------0.46 ------11.65 305 134 20 22 100 32 101 14 51.5 --4.0 100 -100 10 100 0.3 -350 155 50 55 210 75 131 --nC ns A V V nA 1&+$11(/ 32:(5 026)(7 Test Condition VGS=0V,ID=250A V/C ID=250A VGS=30V VGS=-30V VDS=400V See Fig 7 VDS=5V,ID=250A VDS=320V,TC=125C VGS=10V,ID=8.5A VDS=50V,ID=8.5A (4) (4) 2140 2780 pF VGS=0V,VDS=25V,f =1MHz See Fig 5 VDD=200V,ID=17A, RG=6.2 See Fig 13 VDS=320V,VGS=10V, ID=17A (4) (5) See Fig 6 & Fig 12 (4) (5) Source-Drain Diode Ratings and Characteristics Symbol IS ISM VSD trr Qrr Characteristic Continuous Source Current Pulsed-Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge (1) (4) Min. Typ. Max. Units --------385 4.85 17 68 1.5 --A V ns C Test Condition Integral reverse pn-diode in the MOSFET TJ=25C,IS=17A,VGS=0V TJ=25C,IF=17A diF/dt=100A/s (4) Notes; (1) Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature (2) L=7mH, IAS=17A, VDD=50V, RG=27, Starting TJ =25C (3) ISD 17A, di/dt 250A/s, VDD BV DSS , Starting TJ =25C (4) Pulse Test: Pulse Width = 250s, Duty Cycle 2% (5) Essentially Independent of Operating Temperature 1&+$11(/ 32:(5 026)(7 Fig 1. Output Characteristics VGS 15 V 10 V 8.0 V 7.0 V 6.0 V 5.5 V 5.0 V Bottom : 4.5 V Top : IRFP350A Fig 2. Transfer Characteristics ID , Drain Current [A] 11 0 ID , Drain Current [A] 11 0 1 0 oC 5 10 0 2 oC 5 @N ts : oe 1 V =0 V . GS 2 V =5 V . DS 0 us et 3 2 0 s P l e T s .5 6 8 1 0 10 0 @ Nt s: oe 1 2 0 s P l e T s .5 us et 2 T = 2 oC .C 5 1 -1 -1 0 1 0 10 0 11 0 - 5 oC 5 1 -1 0 2 4 VDS , Drain-Source Voltage [V] VGS , Gate-Source Voltage [V] Fig 3. On-Resistance vs. Drain Current 06 .0 Fig 4. Source-Drain Diode Forward Voltage RDS(on) , [ ] Dr Sour O sis e ain- ce n-Re tanc 04 .5 IDR , R rs D in Cu ent [A] eve e ra rr V =1 V 0 GS 11 0 03 .0 V =2 V 0 GS 01 .5 @ Nt :T =2 C oe J 5 00 .0 0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 o 10 0 @N ts : oe 1 V =0 V . GS 2 2 0 s P l e T s .5 us et 08 . 10 . 12 . 14 . 16 . 18 . 1 0 oC 5 2 oC 5 1 -1 0 02 . 04 . 06 . I , Dra C nt [A] in urre D Fig 5. Capacitance vs. Drain-Source Voltage 40 00 C = C + C (C = so td ) iss gs gd ds h r e C =C +C oss ds gd C =C rss gd 30 00 C iss 20 00 @ Nt s: oe 1 V =0 V . GS 2 f =1 M z . H VSD , S ce ai Vol ge [ our -Dr n ta V] Fig 6. Gate Charge vs. Gate-Source Voltage V =8 V 0 DS V =2 0V 0 DS V =3 0V 2 DS 1 0 VGS , Gate-Source Voltage [V] Capacitance [pF] 5 10 00 C oss C rss @N ts :I =1 . A oe 70 D 0 0 2 0 4 0 6 0 8 0 10 0 10 2 00 1 0 1 0 1 VDS , Drain-Source Voltage [V] QG , Total Gate Charge [nC] IRFP350A Fig 7. Breakdown Voltage vs. Temperature 12 . 30 . 1&+$11(/ 32:(5 026)(7 Fig 8. On-Resistance vs. Temperature BVDSS , (Normalized) Drain-Source Breakdown Voltage 11 . RDS(on) , (Normalized) Drain-Source On-Resistance 25 . 20 . 10 . 15 . 10 . @N ts : oe 1 V =1 V . GS 0 2 I =8 5A .D . -0 5 -5 2 0 2 5 5 0 7 5 10 0 15 2 10 5 15 7 09 . @ Nt s: oe 1 V =0 V . GS 2 I = 2 0 A .D 5 -0 5 -5 2 0 2 5 5 0 7 5 10 0 o 05 . 08 . -5 7 15 2 10 5 15 7 00 . -5 7 TJ , Junction Temperature [ C] TJ , Junction Temperature [oC] Fig 9. Max. Safe Operating Area O ea in i T i Ae pr to n hs ra i L m t d b R DS(on) s i ie y Fig 10. Max. Drain Current vs. Case Temperature 2 0 ID , Drain Current [A] ID , Drain Current [A] 13 0 12 0 1 0 s 0 1m s 11 0 D C 1m 0s 1 s 0 1 5 1 0 10 0 @ Nt s: oe 1 T = 2 oC .C 5 2 T = 1 0 oC .J 5 3 Sn l P le . ig e u s 5 1 -1 0 0 1 0 11 0 12 0 0 2 5 5 0 7 5 10 0 15 2 10 5 VDS , Drain-Source Voltage [V] Tc , Case Temperature [oC] Fig 11. Thermal Response Thermal Response 100 D=0.5 0.2 10- 1 0.1 0.05 @ Notes : 1. Z J C (t)=0.62 o C/W Max. 2. Duty Factor, D=t1 /t2 3. TJ M -TC =PD M *Z J C (t) PDM Z JC(t) , 0.02 0.01 10- 2 10- 5 10- 4 10- 3 10- 2 10- 1 single pulse t1 t2 100 101 t1 , Square Wave Pulse Duration [sec] 1&+$11(/ 32:(5 026)(7 Fig 12. Gate Charge Test Circuit & Waveform IRFP350A Current Regulator 50k 12V 200nF 300nF Same Type as DUT VGS Qg 10V VDS VGS DUT 3mA Qgs Qgd R1 Current Sampling (IG) Resistor R2 Current Sampling (ID) Resistor Charge Fig 13. Resistive Switching Test Circuit & Waveforms RL Vout Vin RG DUT Vin 10V td(on) t on tr td(off) t off tf 10% Vout VDD ( 0.5 rated VDS ) 90% Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms LL VDS Vary tp to obtain required peak ID BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD BVDSS IAS C VDD VDD tp ID RG DUT 10V tp ID (t) VDS (t) Time IRFP350A Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms 1&+$11(/ 32:(5 026)(7 DUT + VDS -- IS L Driver RG VGS Same Type as DUT VGS VDD dv/dt controlled by RG IS controlled by Duty Factor D VGS ( Driver ) Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current IS ( DUT ) IRM di/dt Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt Vf VDD Body Diode Forward Voltage Drop TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM DISCLAIMER ISOPLANARTM MICROWIRETM POPTM PowerTrenchTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 TinyLogicTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. |
Price & Availability of IRFP350A
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |