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 SI4818DY
Vishay Siliconix
Dual N-Channel 30-V (D-S) MOSFET with Schottky Diode
PRODUCT SUMMARY
VDS (V)
Channel-1 Channel 1 30 Channel-2 Channel 2
rDS(on) (W)
0.022 @ VGS = 10 V 0.030 @ VGS = 4.5 V 0.0155 @ VGS = 10 V 0.0205 @ VGS = 4.5 V
ID (A)
6.3 5.4 9.5 8.2
SCHOTTKY PRODUCT SUMMARY
VDS (V)
30
VSD (V) Diode Forward Voltage
0.50 V @ 1.0 A
IF (A)
2.0
D1
D2
D2
D2
SO-8
S1 G1 S2 G2 1 2 3 4 Top View Ordering Information: SI4818DY SI4818DY-T1 (with Tape and Reel) 8 7 6 5 D1 D2 D2 D2 S1 N-Channel 1 MOSFET S2 A Schottky Diode G1 G2
N-Channel 2 MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Channel-1 Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa TA = 25_C TA = 70_C TA = 25_C TA = 70_C
Channel-2 10 secs
30 20 V 9.5 7.6 40 7.0 5.6 A 1.15 1.25 0.80 W _C
Symbol
VDS VGS
10 secs
Steady State
Steady State
Unit
6.3 ID IDM IS PD TJ, Tstg 1.3 1.4 0.9 5.4 30
5.3 4.2
0.9 1.0 0.64 - 55 to 150
2.2 2.4 1.5
Operating Junction and Storage Temperature Range
THERMAL RESISTANCE RATINGS
Channel-1 Parameter
t v 10 sec Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Foot (Drain) Notes a. Surface Mounted on 1" x 1" FR4 Board. Document Number: 71122 S-31062--Rev. B, 26-May-03 www.vishay.com Steady-State Steady-State RthJA RthJC
Channel-2 Typ
43 82 25
Schottky Typ
48 80 28
Symbol
Typ
72 100 51
Max
90 125 63
Max
53 100 30
Max
60 100 35
Unit
_C/W C/W
1
SI4818DY
Vishay Siliconix
MOSFET SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED).
Parameter Static
Gate Threshold Voltage VGS(th) IGSS VDS = VGS, ID = 250 mA VDS = 0 V, VGS = 20 V V VDS = 24 V, VGS = 0 V V Zero Gate Voltage Drain Current IDSS VDS = 24 V, VGS = 0 V TJ = 85_C V V, On-State On State Drain Currentb ID( ) D(on) VDS = 5 V, VGS = 10 V V VGS = 10 V, ID = 6.3 A Drain-Source On-State Drain Source On State Resistanceb rDS( ) DS(on) VGS = 10 V, ID = 9.5 A VGS = 4.5 V, ID = 5.4 A VGS = 4.5 V, ID = 8.2 A Forward Transconductanceb Diode Forward Voltageb gf fs VSD VDS = 15 V, ID = 6.3 A VDS = 15 V, ID = 9.5 A IS = 1.3 A, VGS = 0 V IS = 1 A, VGS = 0 V Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 20 30 0.018 0.0125 0.024 0.0165 17 28 0.7 0.47 1.1 0.5 V S 0.022 0.0155 0.030 0.0205 W A 0.8 1.0 100 100 1 100 15 2000 mA nA V
Symbol
Test Condition
Min
Typa
Max
Unit
Gate-Body Gate Body Leakage
Dynamica
Total Gate Charge Qg Channel 1 Channel-1 VDS = 15 V, VGS = 5 V, ID = 6.3 A Gate-Source Gate Source Charge Gate-Drain Gate Drain Charge Gate Resistance Turn-On Turn On Delay Time Rise Time Turn-Off Turn Off Delay Time Fall Time Source-Drain Source Drain Reverse Recovery Time Qgs Qgd d Rg td( ) d(on) tr td( ff) d(off) tf trr IF = 1.3 A, di/dt = 100 A/ms IF = 2.2 A, di/dt = 100 mA/ms Channel-1 Channel 1 VDD = 15 V, RL = 15 W ID ^ 1 A, VGEN = 10 V, RG = 6 W Channel-2 VDD = 15 V, RL = 15 W ID ^ 1 A VGEN = 10 V RG = 6 W A, V, Channel 2 Channel-2 VDS = 15 V, VGS = 5 V, ID = - 9.5 A Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 Ch 1 Ch-1 Ch-2 1.5 0.5 10 15 5 5 26 44 8 12 30 32 8.0 15 1.75 5.3 3.2 4.6 6.1 2.6 20 30 10 10 50 80 16 24 60 70 ns W 12 23 nC
Notes a. Guaranteed by design, not subject to production testing. b. Pulse test; pulse width v 300 ms, duty cycle v 2%.
SCHOTTKY SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Forward Voltage Drop
Symbol
VF
Test Condition
IF = 1.0 A IF = 1.0 A, TJ = 125_C Vr = 30 V Vr = 30 V, TJ = 100_C Vr = - 30 V, TJ = 125_C Vr = 10 V
Min
Typ
0.47 0.36 0.004 0.7 3.0 50
Max
0.50 0.42 0.100 10 20
Unit
V
Maximum Reverse Leakage Current g
Irm
mA
Junction Capacitance
CT
pF
www.vishay.com
2
Document Number: 71122 S-31062--Rev. B, 26-May-03
SI4818DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
30 VGS = 10 thru 4 V 24 I D - Drain Current (A) I D - Drain Current (A) 24 30
CHANNEL-1
Transfer Characteristics
18
3V
18
12
12 TC = 125_C 6 25_C
6 1V 0 0 2 4 6 8 10 2V
- 55_C 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.05 1000
Capacitance
DS(on) - On-Resistance ( W )
C - Capacitance (pF)
0.04
800 Ciss 600
0.03 VGS = 4.5 V 0.02 VGS = 10 V
400 Coss 200 Crss
r
0.01
0.00 0 6 12 18 24 30
0 0 6 12 18 24 30
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Gate Charge
10 V GS - Gate-to-Source Voltage (V) VDS = 15 V ID = 6.3 A 8 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0 0 3 6 9 12 15 Qg - Total Gate Charge (nC) Document Number: 71122 S-31062--Rev. B, 26-May-03 0.4 - 50
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 6.3 A
6
4
2
r DS(on) - On-Resistance (W) (Normalized)
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C) www.vishay.com
3
SI4818DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
40 0.10
CHANNEL-1
On-Resistance vs. Gate-to-Source Voltage
DS(on) - On-Resistance ( W )
0.08
I S - Source Current (A)
TJ = 150_C 10
0.06
TJ = 25_C
0.04 ID = 6.3 A 0.02
r
1 0.0
0.00 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 2 4 6 8 10
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
0.6 0.4 V GS(th) Variance (V) 0.2 - 0.0 - 0.2 - 0.4 - 0.6 20 - 0.8 - 1.0 - 50 0 - 25 0 25 50 75 100 TJ - Temperature (_C) 125 150 ID = 250 mA Power (W) 80 100
Single Pulse Power, Junction-to-Ambient
60
40
0.001
0.01
0.1 Time (sec)
1
10
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2
Notes:
0.1 0.1 0.05
t1 PDM
0.02
t2 1. Duty Cycle, D =
2. Per Unit Base = RthJA = 100_C/W
t1 t2
Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 Square Wave Pulse Duration (sec) 10
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
100
600
www.vishay.com
4
Document Number: 71122 S-31062--Rev. B, 26-May-03
SI4818DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
CHANNEL-1
Normalized Thermal Transient Impedance, Junction-to-Foot
0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 Square Wave Pulse Duration (sec) 1 10
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
40 VGS = 10 thru 4 V 32 I D - Drain Current (A) I D - Drain Current (A) 32 40
CHANNEL-2
Transfer Characteristics
24
24 TC = 125_C
16
16
8
3V 2V
8
25_C - 55_C
0 0 2 4 6 8 10
0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.030 2500
Capacitance
r DS(on) - On-Resistance ( W )
0.024 VGS = 4.5 V 0.018 VGS = 10 V 0.012 C - Capacitance (pF)
2000
Ciss
1500
1000 Coss
0.006
500 Crss
0.000 0 8 16 24 32 40
0 0 6 12 18 24 30
ID - Drain Current (A) Document Number: 71122 S-31062--Rev. B, 26-May-03
VDS - Drain-to-Source Voltage (V)
www.vishay.com
5
SI4818DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Gate Charge
10 V GS - Gate-to-Source Voltage (V) VDS = 15 V ID = 9.5 A 1.8 1.6 r DS(on) - On-Resistance (W) (Normalized) 1.4 1.2 1.0 0.8 0.6 0 0 6 12 18 24 30 0.4 - 50 VGS = 10 V ID = 9.5 A
CHANNEL-2
On-Resistance vs. Junction Temperature
8
6
4
2
- 25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
40 0.05
On-Resistance vs. Gate-to-Source Voltage
DS(on) - On-Resistance ( W )
0.04
I S - Source Current (A)
TJ = 150_C 10
0.03
TJ = 25_C
0.02 ID = 9.5 A 0.01
r
1 0.0
0.00 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 2 4 6 8 10
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
0.6 0.4 V GS(th) Variance (V) 0.2 - 0.0 - 0.2 - 0.4 - 0.6 20 - 0.8 - 1.0 - 50 0 - 25 0 25 50 75 100 TJ - Temperature (_C) 125 150 ID = 250 mA Power (W) 80 100
Single Pulse Power, Junction-to-Ambient
60
40
0.001
0.01
0.1 Time (sec)
1
10
www.vishay.com
6
Document Number: 71122 S-31062--Rev. B, 26-May-03
SI4818DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance
CHANNEL-2
0.2 0.1 0.1 0.05
Notes: PDM t1 t2 1. Duty Cycle, D = t1 t2
2. Per Unit Base = RthJA = 82_C/W
0.02 Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
Square Wave Pulse Duration (sec)
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
Normalized Thermal Transient Impedance, Junction-to-Foot
0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 Square Wave Pulse Duration (sec) 1 10
Document Number: 71122 S-31062--Rev. B, 26-May-03
www.vishay.com
7
SI4818DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Reverse Current vs. Junction Temperature
10 TJ = 150_C 1 I F - Forward Current (A)
SCHOTTKY
Forward Voltage Drop
20 10 I R - Reverse Current (mA)
0.1
30 V 24 V
TJ = 25_C
0.01
0.001
0.0001 0 25 50 75 100 125 150 TJ - Temperature (_C)
1 0.0
0.3
0.6
0.9
1.2
1.5
VF - Forward Voltage Drop (V)
Capacitance
200
160 C - Capacitance (pF)
120
80 Coss 40
0 0 6 12 18 24 30
VDS - Drain-to-Source Voltage (V)
www.vishay.com
8
Document Number: 71122 S-31062--Rev. B, 26-May-03


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