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PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L PACKAGE HSR412 HSR412L SCHEMATIC ANODE 1 6 DRAIN 6 6 1 1 CATHODE 2 5 N/C 3 4 DRAIN DESCRIPTION The HSR312 and HSR412 devices consist of a AlGaAs infrared emitting diode optically coupled to a power MOSFET detector which is driven by a photovoltaic generator. The devices are housed in a 6-pin dual-in-line package. The HSR312L and HSR412L employ an active current limit circuitry enabling the device to withstand current surge transients. FEATURES * 4,000 VRMS Isolation * Wide operating voltage range - 250 V (HSR312, HSR312L) - 400 V (HSR412, HSR412L) * Solid-State Reliability * Bounce-Free Operation * 4000 V ESD Rating (HBM) * UL, CSA and BABT approval pending APPLICATIONS * On/Off Hook Switch * Dial Out Relay * General Switching * * * Replacement for Mechanical Relays Ring Injection Relay Ground Start ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise noted) Parameters TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Isolation Surge Voltage Maximum Input/Output Capacitance Maximum Input/Output Resistance TSTG TOPR TSOL VISO CIO RIO All All All All All All -40 to +100 -40 to +85 260 for 10 sec 4000 1.0 1012 C C C Vac(RMS) pF Symbol Device Value Units (c) 2003 Fairchild Semiconductor Corporation Page 1 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 HSR412L ELECTRICAL CHARACTERISTICS (TA = -40C to +85C Unless otherwise specified) INPUT CHARACTERISTICS Parameters/Test Conditions Control Current Control Current for Off-State Resistance Control Current Range Reverse Voltage Forward Voltage (IF=10 mA) Connection Series or Parallel Series or Parallel Series or Parallel Series or Parallel Series or Parallel Symbol IF(ON) IF(OFF) IF VR VF Limit Max Min Min Max Min Max HSR312 2.0 0.4 2.0 25 7 1.6 HSR312L 2.0 0.4 2.0 25 7 1.6 HSR412 3.0 0.4 3.0 25 7 1.6 HSR412L 3.0 0.4 3.0 25 7 1.6 Units mA mA mA V V OUTPUT CHARACTERISTICS Parameters / Test Conditions Operating Voltage Range Connection Series or Parallel Symbol Limit HSR312 HSR312L HSR412 HSR412L VOPR IL Max Max Max Max RON Max Max Min Max Min Max Max 250 190 320 10 3 1.0 N/A N/A N/A N/A 3.0 250 170 300 15 4.25 1.0 190 300 330 560 3.0 400 140 210 27 7 1.0 N/A N/A N/A N/A 2.0 400 120 200 35 9 1.0 130 220 260 440 2.0 mA Units VDC or VAC(PEAK) Load Current Series TA = +40C, 5mA control Parallel (see fig. 1 & 2) On-State Resistance Series TA = 25C, 50mA pulsed load, Parallel 5mA control Off-State Leakage Current TA = 25C, 250V for HSR312/L, Series or Parallel 400V for HSR412/L Current Limit TA = +25C, 5mA control Turn-On Time TA = +25C for 50mA, 100VDC load, 5mA control Turn-Off Time TA = +25C for 50mA, 100VDC load, 5mA control Thermal Offset Voltage 5mA control Output Capacitance 5VDC Series -- A ILMT Parallel mA Series or Parallel TON mS Series or Parallel TOFF -- CO Max 0.5 0.5 0.5 0.5 mS Series or Parallel Series or Parallel Max Max N/A 50 N/A 50 0.5 12 0.5 12 mV pF ISOLATION CHARACTERISTICS Characteristics Input-Output Isolation Voltage Test Conditions Symbol VISO Limit Max HSR312 4000 HSR312L 4000 HSR412 4000 HSR412L 4000 Units V (c) 2003 Fairchild Semiconductor Corporation Page 2 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 20.0 17.5 HSR312L 2 HSR412 HSR412L Figure 1. Forward Current vs. Forward Voltage NORMALIZED ON RESISTANCE, R ON () Figure 2. Normalized on Resistance vs. Ambient Temperature Series Connection 5mA Control ID = 10mA Normalized at 25C HSR312L FORWARD CURRENT, IF (mA) 15.0 12.5 85C 10.0 7.5 5.0 2.5 0.0 1.0 1.1 1.2 1.3 1.4 1.5 25C -40C HSR312 1 0 -40 -20 0 20 40 60 80 100 FORWARD VOLTAGE, VF (V) AMBIENT TEMPERATURE, TA (C) Figure 3. Normalized on Resistance vs. Ambient Temperature 2 250 Figure 4. Load Current vs. Voltage Drop Series Connection 5mA Control @25C, pulsed NORMALIZED ON RESISTANCE, R ON () Series Connection 5mA Control ID = 10mA Normalized at 25C 200 LOAD CURRENT, IDD (mA) HSR412L HSR312 150 100 50 0 -50 -100 -150 -200 HSR312L HSR412 1 0 -40 -20 0 20 40 60 80 100 -250 -3 -2 -1 0 1 2 3 AMBIENT TEMPERATURE, TA (C) VOLTAGE DROP, VDD (V) Figure 5. Load Current vs. Voltage Drop 200 Series Connection 5mA Control @25C, pulsed Figure 6. Maximum Load Current Vs Ambient Temperature 202 200 Vdd = 4V Series Connection HSR312 Maximum Load Current, I dd (mA) 198 196 194 192 190 IF = 5mA 188 186 184 182 IF = 2mA LOAD CURRENT, IDD (mA) 100 0 HSR412L -100 HSR412 -200 -4 -2 0 2 4 0 20 40 60 80 VOLTAGE DROP, VDD (V) Ambient Temperature, TA (C) (c) 2003 Fairchild Semiconductor Corporation Page 3 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 200 HSR312L 145 140 135 130 125 HSR412 HSR412L Figure 7. Maximum Load Current Vs Ambient Temperature Vdd = 4V Series Connection HSR312L Figure 8. Maximum Load Current Vs Ambient Temperature Vdd = 4V Series Connection HSR412 Maximum Load Current, I dd (mA) 180 160 IF = 5mA Maximum Load Current, I dd (mA) 140 IF = 2mA IF = 5mA 120 115 IF = 3mA 110 120 100 0 20 40 60 80 100 105 0 20 40 60 80 Ambient Temperature, TA (C) Ambient Temperature, TA (C) Figure 9. Maximum Load Current Vs Ambient Temperature 125 Vdd = 4V 1000 Figure 10. Off State Current vs. Ambient Temperature Series Connection HSR412L Maximum Load Current, I dd (mA) 120 OFF STATE CURRENT, IOFF (nA) 115 100 110 IF = 5mA 105 IF = 3mA 100 HSR312/L 10 95 0 20 40 60 80 1 -40 -20 0 20 40 60 80 100 Ambient Temperature, TA (C) AMBIENT TEMPERATURE, TA (C) Figure 11. Off State Current vs. Ambient Temperature 1000 100 Figure 12. Normalized Off State Leakage vs. Ambient Temperature OFF STATE CURRENT, IOFF (nA) 100 ID-OFF/ID-OFF @25C HSR312/L 10 HSR412/L 10 1 1 -40 -20 0 20 40 60 80 100 0.1 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA (C) AMBIENT TEMPERATURE, TA (C) (c) 2003 Fairchild Semiconductor Corporation Page 4 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 HSR412L Figure 13. Normalized Off State Leakage vs. Ambient Temperature 100 ID-OFF/ID-OFF @25C 10 HSR412/L 1 0.1 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA (C) Series Connection 1 + 2 5 AC or DC 6 LOAD 3 4 Parallel Connection 1 + LOAD 2 5 6 + 3 4 (c) 2003 Fairchild Semiconductor Corporation Page 5 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 HSR412L Package Dimensions (Through Hole) 0.350 (8.89) 0.320 (8.13) Package Dimensions (Surface Mount) 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.260 (6.60) 0.240 (6.10) 0.390 (9.90) 0.332 (8.43) 0.070 (1.77) 0.040 (1.02) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.320 (8.13) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.200 (5.08) 0.115 (2.93) 0.012 (0.30) 0.008 (0.20) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15 0.012 (0.30) 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.035 (0.88) 0.006 (0.16) Recommended Pad Layout for Surface Mount Leadform 0.070 (1.78) 0.060 (1.52) 0.425 (10.79) 0.100 (2.54) 0.305 (7.75) 0.030 (0.76) NOTE All dimensions are in inches (millimeters) (c) 2003 Fairchild Semiconductor Corporation Page 6 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 HSR412L ORDERING INFORMATION Option S SR2 Order Entry Identifier S SR2 Description Surface Mount Lead Bend Surface Mount; Tape and reel Carrier Tape Specifications ("D" Tapin Orientation) 12.0 0.1 4.5 0.20 2.0 0.05 0.30 MAX 4.0 0.1 O1.5 MIN 1.75 0.10 11.5 1.0 21.0 0.1 9.1 0.20 24.0 0.3 0.1 MAX 10.1 0.20 O1.5 0.1/-0 User Direction of Feed NOTE All dimensions are in inches (millimeters) Reflow Profile 300 Temperature (C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 245C peak 230C, 10-30 s Time above 183C, 120-180 sec Ramp up = 2-10C/sec * Peak reflow temperature: 245C (package surface temperature) * Time of temperature higher than 183C for 120-180 seconds * One time soldering reflow is recommended 3.5 4 4.5 3 Time (Minute) (c) 2003 Fairchild Semiconductor Corporation Page 7 of 8 1/28/03 PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS HSR312 HSR312L HSR412 HSR412L DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. (c) 2003 Fairchild Semiconductor Corporation Page 8 of 8 1/28/03 |
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