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Wideband, 40 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, SPST Switches ADG901/ADG902
FEATURES Wideband Switch: -3 dB @ 4.5 GHz Absorptive/Reflective Switches High Off Isolation (40 dB @ 1 GHz) Low Insertion Loss (0.8 dB @1 GHz) Single 1.65 V to 2.75 V Power Supply CMOS/LVTTL Control Logic 8-Lead MSOP and Tiny 3 mm 3 mm LFCSP Packages Low Power Consumption (<1 A) APPLICATIONS Wireless Communications General-Purpose RF Switching Dual-Band Applications High Speed Filter Selection Digital Transceiver Front End Switch IF Switching Tuner Modules Antenna Diversity Switching FUNCTIONAL BLOCK DIAGRAMS
ADG901
RF1 RF2
50
50
CTRL
ADG902
RF1 RF2
CTRL
GENERAL DESCRIPTION
The ADG901/ADG902 are wideband switches that use a CMOS process to provide high isolation and low insertion loss to 1 GHz. The ADG901 is an absorptive (matched) switch with 50 terminated shunt legs, while the ADG902 is a reflective switch. These devices are designed such that the isolation is high over the dc to 1 GHz frequency range. They have on-board CMOS control logic, thus eliminating the need for external controlling circuitry. The control inputs are both CMOS and
0 -10 TA = 25 C
LVTTL compatible. The low power consumption of these CMOS devices makes them ideally suited to wireless applications and general-purpose high frequency switching.
PRODUCT HIGHLIGHTS
1. -40 dB Off Isolation @ 1 GHz 2. 0.8 dB Insertion Loss @ 1 GHz 3. Tiny 8-Lead MSOP/LFCSP Packages
-0.4 -0.6
-20
INSERTION LOSS (dB)
-0.8
-1.0
-30
ISOLATION (dB)
-1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 -2.6 VDD = 2.5V TA = 25 C 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G
-40 -50 -60 -70 -80 -90 VDD = 1.8 V VDD = 2.5 V
-2.8
10G
-100 10k
100k
1M
10M 100M FREQUENCY (Hz)
1G
-3.0 10k
Figure 1. Off Isolation vs. Frequency
Figure 2. Insertion Loss vs. Frequency
REV. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 (c) 2004 Analog Devices, Inc. All rights reserved.
= 1.65 V to 0 V, input power all T T, noted.) ADG901/ADG902-SPECIFICATIONS1 (V specifications2.75 V,toGND =unless otherwise = 0 dBm,
DD MIN MAX
Parameter AC ELECTRICAL CHARACTERISTICS Operating Frequency3 -3 dB Frequency4 Input Power4 Insertion Loss
Symbol
Conditions
Min DC
B Version Typ2 Max 2.5 4.5 7 16 0.7 0.8 1.25
Unit GHz GHz dBm dBm dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB ns ns ns ns dBm dBm mV p-p V V V V A pF pF
S21, S12 S21, S12 S21, S12 S11, S22 S11, S22 tON tOFF tRISE tFALL P-1 dB IP3
Isolation--RF1 to RF2 (CP Package) Isolation--RF1 to RF2 (RM Package) Return Loss (On Channel)4 Return Loss (Off Channel)4 On Switching Time4 Off Switching Time4 Rise Time4 Fall Time4 1 dB Compression4 Third Order Intermodulation Intercept Video Feedthrough5
0 V dc Bias +0.5 V dc Bias DC to 100 MHz; VDD = 2.5 V 10% 500 MHz; VDD = 2.5 V 10% 1000 MHz; VDD = 2.5 V 10% 100 MHz 60 500 MHz 43 1000 MHz 34 100 MHz 51 500 MHz 37.5 1000 MHz 31 DC to 100 MHz 20 500 MHz 23 1000 MHz 25 DC to 100 MHz 18 500 MHz 17 1000 MHz 15 50% CTRL to 90% RF 50% CTRL to 10% RF 10% to 90% RF 90% to 10% RF 1000 MHz 900 MHz/901 MHz, 4 dBm 30
0.4 0.5 0.8 61 45 40 60 47 37 28 29 28 23 21 19 3.6 5.8 3.1 6.0 17 36 2.5
6 9.5 5.5 8.5
DC ELECTRICAL CHARACTERISTICS Input High Voltage VINH VINH Input Low Voltage VINL VINL Input Leakage Current II CAPACITANCE4 RF1/RF2, RF Port On Capacitance CTRL Input Capacitance POWER REQUIREMENTS VDD Quiescent Power Supply Current CRF ON CCTRL
VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V 0 VIN 2.75 V f = 1 MHz f = 1 MHz
1.7 0.65 VCC 0.1 1.2 2.1 1.65 2.75 1 0.7 0.35 VCC 1
IDD
Digital inputs = 0 V or VDD
0.1
V A
NOTES 1 Temperature range B Version: -40C to +85C. 2 Typical values are at V DD = 2.5 V and 25C, unless otherwise stated. 3 Point at which insertion loss degrades by 1 dB. 4 Guaranteed by design, not subject to production test. 5 The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 test setup, measured with 1 ns rise time pulses and 500 MHz bandwidth. Specifications subject to change without notice.
-2-
REV. A
ADG901/ADG902
ABSOLUTE MAXIMUM RATINGS 1
(TA = 25C, unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to +4 V Inputs to GND . . . . . . . . . . . . . . . . . . -0.5 V to VDD + 0.3 V2 Continuous Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 dBm Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . -40C to +85C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150C MSOP Package JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206C/W
LFCSP Package JA Thermal Impedance (2-layer board) . . . . . . . . . . 84C/W JA Thermal Impedance (4-layer board) . . . . . . . . . . 48C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300C IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235C ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV
NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 RF1/2 Off Port Inputs to Ground ................................... -0.5 V to VDD - 0.5 V
ORDERING GUIDE
Model ADG901BRM ADG901BRM-500RL7 ADG901BRM-REEL7 ADG901BCP-500RL7 ADG901BCP-REEL7 ADG902BRM ADG902BRM-500RL7 ADG902BRM-REEL7 ADG902BCP-500RL7 ADG902BCP-REEL7 EVAL-ADG901EB EVAL-ADG902EB
Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Package Description Mini Small Outline Package (MSOP) Mini Small Outline Package (MSOP) Mini Small Outline Package (MSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Mini Small Outline Package (MSOP) Mini Small Outline Package (MSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Evaluation Board Evaluation Board
Package Option RM-8 RM-8 RM-8 CP-8 CP-8 RM-8 RM-8 RM-8 CP-8 CP-8
Branding W6B W6B W6B W6B W6B W7B W7B W7B W7B W7B
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG901/ADG902 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATION 8-Lead MSOP (RM-8) 8-Lead 3 mm 3 mm LFCSP (CP-8)
PIN FUNCTION DESCRIPTIONS
Pin No. 1
Mnemonic VDD
Function Power Supply Input. These parts can be operated from 1.65 V to 2.75 V; VDD should be decoupled to GND. CMOS or TTL Logic Level. 0 RF1 Isolated from RF2 1 RF1 to RF2 Ground Reference Point for All Circuitry on the Part. RF1 Port. RF2 Port.
VDD
1
8
RF2 GND
CTRL 2 GND 3
ADG901/ ADG902
7
6 GND TOP VIEW (Not to Scale) 5 4 GND RF1
2
CTRL
3, 5, 6, 7
Table I. Truth Table
GND RF1 RF2
4 8
CTRL 0 1
Signal Path RF1 isolated from RF2 RF1 to RF2
REV. A
-3-
ADG901/ADG902
TERMINOLOGY
Parameter VDD IDD GND CTRL VINL VINH IINL (IINH) CIN tON tOFF tRISE tFALL Off Isolation
Description
Most positive power supply potential. Positive supply current. Ground (0 V) reference. Logic control input. Maximum input voltage for Logic 0. Minimum input voltage for Logic 1. Input current of the digital input. Digital input capacitance. Delay between applying the digital control input and the output switching on. Delay between applying the digital control input and the output switching off. Rise time. Time for the RF signal to rise from 10% to 90% of the ON level. Fall time. Time for the RF signal to fall from 90% to 10% of the ON level. The attenuation between input and output ports of the switch when the switch control voltage is in the OFF condition. Insertion Loss The attenuation between input and output ports of the switch when the switch control voltage is in the ON condition. 1 dB compression point. The RF input power level at which the switch insertion loss increases by 1 dB over its P-1 dB low level value. It is a measure of how much power the ON switch can handle before the insertion loss increases by 1 dB. Third order intermodulation intercept. This is a measure of the power in false tones that occur when closely spaced IP3 tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated. Return Loss The amount of reflected power relative to the incident power at a port. Large return loss indicates good matching. By measuring Return Loss the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio) indicates degree of matching present at a switch RF port. Video Feedthrough Spurious signals present at the RF ports of the switch when the control voltage is switched from high to low or low to high without an RF signal present.
-4-
REV. A
Typical Performance Characteristics-ADG901/ADG902
-0.4 -0.6 -0.40 -0.45 VDD = 2.5V -0.4 -0.6
INSERTION LOSS (dB)
-0.8
-1.0 -1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 -2.6 -2.8
-0.50
INSERTION LOSS (dB)
-0.8
VDD = 2.25V
-0.55 -0.60 VDD = 2.5V -0.65 -0.70 -0.75 -0.80 -0.85 -0.90 TA = 25 C 100k
INSERTION LOSS (dB)
VDD = 2.25V VDD = 2.75V
-1.0 VDD = 1.8V -1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 -2.6 -2.8 TA = 25 C 100k -3.0 10k
VDD = 1.95V
VDD = 2.75V
VDD = 1.65V
TA = 25 C 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G
-0.95 -1.00 10k
-3.0 10k
1M 10M 100M FREQUENCY (Hz)
1G
10G
1M 10M 100M FREQUENCY (Hz)
1G
10G
TPC 1. Insertion Loss vs. Frequency over Supplies (S12 and S21)
TPC 2. Insertion Loss vs. Frequency over Supplies (S12 and S21) (Zoomed TPC 1 Plot)
TPC 3. Insertion Loss vs. Frequency over Supplies (S12 and S21)
-0.4 -0.6 -0.8 +25 C
-40 C +85 C
ISOLATION (dB)
INSERTION LOSS (dB)
-1.0 -1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 -2.6 -2.8 -3.0 10k VDD = 2.5V 100k
1M 10M 100M FREQUENCY (Hz)
1G
10G
0 -5 TA = 25 C -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 VDD = 2.5V -60 -65 -70 -75 -80 -85 VDD = 1.8V -90 -95 -100 10k 100k 1M 10M 100M 1G FREQUENCY (Hz)
10G
0 -5 VDD = 2.5V -10 -15 -20 -25 -30 -35 -40 -45 +85 C -50 -55 -60 +25 C -65 -70 -75 -80 -40 C -85 -90 10k 100k 1M 10M 100M FREQUENCY (Hz)
ISOLATION (dB)
1G
10G
TPC 4. Insertion Loss vs. Frequency over Temperature (S12 and S21)
TPC 5. OFF Isolation vs. Frequency over Supplies (S12 and S21)
TPC 6. OFF Isolation vs. Frequency over Temperature (S12 and S21)
0 TA = 25 C -5 VDD = 2.5V
CH1
-10
RETURN LOSS (dB)
-15 OFF SWITCH -20
CH2
CTRL
RFx -25 -30 -35 10k ON SWITCH
CH1 = CTRL = 1V/DIV CH2 = RFx = 100mV/DIV tRISE = 2.8ns tFALL = 5.1ns
100k
1M 10M 100M FREQUENCY (Hz)
1G
10G
CH2 pk-pk 2.016mV CH1 500mV CH2 1mV 10.0ns
TPC 7. Return Loss vs. Frequency (S11)
TPC 8. Switch Timing
TPC 9. Video Feedthrough
REV. A
-5-
ADG901/ADG902
40 35 30
P-1dB (dBm)
20 18 16 14
IP3 (dBm)
25 20 15 10 5 0 250 VDD = 2.5V TA = 25 C 350 450 550 650 750 FREQUENCY (MHz) 850
12 10 8 6 4 2 0 0 250 500 750 1000 1250 1500 FREQUENCY (MHz) VDD = 2.5V TA = 25 C
TPC 10. IP3 vs. Frequency
TPC 11. P-1dB vs. Frequency
-6-
REV. A
ADG901/ADG902 Test Circuits*
0.1 F VDD
VDD 0.1 F
VDD RL 50 VOUT
ADG901
VDD RF1 VS RF2 VOUT 50% RL 50 GND VCTRL VOUT 90% 10%
CTRL RF1
RF2 50 50
50 VS
50%
CTRL
NETWORK ANALYZER GND VOUT VS
tON
tOFF
VCTRL
INSERTION LOSS = 20 LOG
Test Circuit 1. Switching Timing: tON, tOFF
Test Circuit 4. Insertion Loss
VDD 0.1 F
VDD 0.1 F
VDD RF1 VS RF2 VOUT 50% RL 50 GND VCTRL VOUT 10% 90% 90% 50%
ADG901
OSCILLOSCOPE RF1
VDD NC
RF2 50
CTRL
50
10%
CTRL GND VCTRL
tRISE
tFALL
Test Circuit 2. Switch Timing: tRISE, tFALL
VDD 0.1 F
Test Circuit 5. Video Feedthrough
ADG901
RF1 50 CTRL
VDD
RL 50
VOUT
RF2 50
50 VS
NETWORK ANALYZER GND VOUT VS
VCTRL
OFF ISOLATION = 20 LOG
Test Circuit 3. Off Isolation
*Similiar setups for ADG902.
REV. A
-7-
ADG901/ADG902
VDD 0.1 F
VDD 0.1 F
RF SOURCE
ADG901
SPECTRUM ANALYZER RF1
VDD COMBINER RF2
ADG901
SPECTRUM ANALYZER RF1 50 CTRL
VDD RF SOURCE VS
RF2 50
50 CTRL GND VCTRL
50
RF SOURCE
GND VCTRL
Test Circuit 6. IP3
Test Circuit 7. P-1dB
-8-
REV. A
ADG901/ADG902
APPLICATIONS ADG9xx EVALUATION BOARD
The ADG901/ADG902 are ideal solutions for low power, high frequency applications. The low insertion loss, high isolation between ports, low distortion, and low current consumption of these parts make them excellent solutions for many high frequency switching applications. Applications include switching between high frequency filters, ASK generator, and FSK generator.
Absorptive vs. Reflective Switches
The ADG9xx evaluation board allows designers to evaluate the high performance wideband switches with a minimum of effort. To prove that these devices meet user requirements, the user requires only a power supply and a network analyzer along with the evaluation board. An application note is available with the evaluation board and provides complete information on operating the evaluation board. The RF1 port (see Figure 3) is connected through a 50 transmission line to the top left SMA connector J1. RF2 is connected through a 50 transmission line to the top SMA connector J2. J3 is connected to GND. A through transmission line connects J4 and J5 and this transmission line is used to estimate the loss of the PCB over the environmental conditions being evaluated. The board is constructed of a 4-layer, FR4 material with a dielectric constant of 4.3 and an overall thickness of 0.062 inches. Two ground layers with grounded planes provide ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 0.052 inches, clearance to ground plane of 0.030 inches, dielectric thickness of 0.029 inches, and a metal thickness of 0.014 inches.
The ADG901 is an absorptive (matched) switch with 50 terminated shunt legs, and the ADG902 is a reflective switch with 0 terminated shunts to ground. The ADG901 absorptive switch has a good VSWR on each port, regardless of the switch mode. An absorptive switch should be used when there is a need for a good VSWR that is looking into the port but not passing the through signal to the common port. The ADG901 is therefore ideal for applications that require minimum reflections back to the RF source. It also ensures that the maximum power is transferred to the load. The ADG902 reflective switch is suitable for applications where high off port VSWR does not matter and the switch has some other desired performance feature. It can be used in many applications, including high speed filter selection. In most cases, an absorptive switch can be used instead of a reflective switch, but not vice versa.
Figure 3. ADG9xx Evaluation Board Top View
REV. A
-9-
ADG901/ADG902
OUTLINE DIMENSIONS 8-Lead Mini Small Outline Package [MSOP] (RM-8)
Dimensions shown in millimeters
3.00 BSC
8
5
3.00 BSC
1 4
4.90 BSC
PIN 1 0.65 BSC 0.15 0.00 0.38 0.22 COPLANARITY 0.10 1.10 MAX 8 0 0.80 0.60 0.40
0.23 0.08 SEATING PLANE
COMPLIANT TO JEDEC STANDARDS MO-187AA
8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm 3 mm Body (CP-8)
Dimensions shown in millimeters
0.50 0.40 0.30 PIN 1 INDICATOR 0.45 PIN 1 INDICATOR
8 1
3.00 BSC SQ
0.60 MAX
TOP VIEW
2.75 BSC SQ 0.50 BSC 0.25 MIN 0.05 MAX 0.02 NOM
5
BOTTOM VIEW
4
1.50 REF
1.90 1.75 1.60
0.90 0.85 0.80
12 MAX
0.80 MAX 0.65 TYP
1.60 1.45 1.30
SEATING PLANE
0.30 0.23 0.18
0.20 REF
-10-
REV. A
ADG901/ADG902 Revision History
Location 10/04--Data Sheet changed from REV. 0 to REV. A. Page
Changes to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Changes to PRODUCT HIGHLIGHTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Change to ADG9xx EVALUATION BOARD section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
REV. A
-11-
-12-
C03336-0-10/04(A)

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