Part Number Hot Search : 
SMAJ10 B80N0 LXOM10 CA1041 AEFTAE20 U1242 8302A01 1N6320
Product Description
Full Text Search
 

To Download BSS83P Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 Preliminary data
BSS 83 P
SIPMOS (R) Small-Signal-Transistor
Features * P-Channel
*
Product Summary Drain source voltage Continuous drain current
VDS ID
3
-60 2 -0.33
V A
Enhancement mode
Drain-Source on-state resistance RDS(on)
* Avalanche rated * Logic Level * dv/dt rated
2 1
VPS05161
Type BSS 83 P
Package SOT-23
Ordering Code Q67041-S1416
Marking YAs
Pin 1 G
PIN 2 S
PIN 3 D
Maximum Ratings,at T j = 25 C, unless otherwise specified Parameter Symbol Continuous drain current
Value -0.33 -0.27
Unit A
ID
T A = 25 C T A = 70 C
Pulsed drain current
ID puls EAS EAR
dv/dt
-1.32 9.5 0.036 6 kV/s mJ
T A = 25 C
Avalanche energy, single pulse
I D = -0.33 A , V DD = -25 V, RGS = 25
Avalanche energy, periodic limited by Tjmax Reverse diode dv/dt
I S = -0.33 A, V DS = -48 V, di/dt = 200 A/s, T jmax = 150 C
Gate source voltage Power dissipation
VGS Ptot Tj , Tstg
20 0.36 -55...+150 55/150/56
V W C
T A = 25 C
Operating and storage temperature IEC climatic category; DIN IEC 68-1
Page 1
1999-09-16
Preliminary data
Thermal Characteristics Parameter Characteristics Thermal resistance, junction - soldering point ( Pin 3 ) SMD version, device on PCB: @ min. footprint @ 6 cm 2 cooling area 1) Symbol min. Values typ. -
BSS 83 P
Unit max. 150 K/W K/W
RthJS RthJA
-
-
-
350 300
Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Static Characteristics Drain- source breakdown voltage Symbol min. Values typ. -1.5 max. -2 A -0.1 -10 -10 2 1.4 -1 -100 -100 3 2 nA V Unit
V(BR)DSS VGS(th) IDSS
-60 -1
VGS = 0 V, I D = -250 A
Gate threshold voltage, VGS = VDS I D = -80 A Zero gate voltage drain current
VDS = -60 V, V GS = 0 V, T j = 25 C VDS = -60 V, V GS = 0 V, T j = 125 C
Gate-source leakage current
IGSS RDS(on) RDS(on)
-
VGS = -20 V, VDS = 0 V
Drain-Source on-state resistance
VGS = -4.5 V, I D = -0.27 A
Drain-Source on-state resistance
VGS = -10 V, I D = -0.33 A
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Page 2
1999-09-16
Preliminary data
Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Symbol Values min. Dynamic Characteristics Transconductance typ.
BSS 83 P
Unit max.
gfs Ciss Coss Crss td(on)
0.24 -
0.47 62 19 7 23
78 24 9 35
S pF
VDS2*I D*RDS(on)max , ID = -0.27 A
Input capacitance
VGS = 0 V, V DS = -25 V, f = 1 MHz
Output capacitance
VGS = 0 V, V DS = -25 V, f = 1 MHz
Reverse transfer capacitance
VGS = 0 V, V DS = -25 V, f = 1 MHz
Turn-on delay time ns
VDD = -30 V, V GS = -4.5 V, I D = -0.27 A, RG = 43
Rise time
tr
-
71
106
VDD = -30 V, V GS = -4.5 V, I D = -0.27 A, RG = 43
Turn-off delay time
td(off)
-
56
70
VDD = -30 V, V GS = -4.5 V, I D = -0.27 A, RG = 43
Fall time
tf
-
61
76
VDD = -30 V, V GS = -4.5 V, I D = -0.27 A, RG = 43
Page 3
1999-09-16
Preliminary data
Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Symbol Values min. Dynamic Characteristics Gate to source charge typ.
BSS 83 P
Unit max.
Qgs Qgd Qg V(plateau)
-
0.12 1.1 2.38 -2.94
0.18 1.65 3.57 -
nC
VDD = -48 V, ID = -0.33 A
Gate to drain charge
VDD = -48 , ID = -0.33 A
Gate charge total
VDD = -48 V, ID = -0.33 A, V GS = 0 to -10 V
Gate plateau voltage V
VDD = -48 V , I D = -0.33 A
Parameter Reverse Diode Inverse diode continuous forward current
Symbol min.
Values typ. -0.84 59.4 37.5 max. -0.33 -1.32 -1.1 89 56
Unit
IS ISM VSD trr Qrr
-
A
T A = 25 C
Inverse diode direct current,pulsed
T A = 25 C
Inverse diode forward voltage V ns C
VGS = 0 V, I F = -0.33
Reverse recovery time
VR = -30 V, IF=I S , di F/dt = 80 A/s
Reverse recovery charge
VR = -30 V, IF=l S , diF/dt = 80 A/s
Page 4
1999-09-16
Preliminary data
Power Dissipation Drain current
BSS 83 P
Ptot = f (TA)
BSS 83 P
ID = f (TA )
parameter: VGS 10 V
BSS 83 P
0.38
-0.36
W A
0.32 -0.28 0.28 -0.24
Ptot
ID
-0.20 -0.16 -0.12 -0.08 -0.04 0.00 0
0.24 0.20 0.16 0.12 0.08 0.04 0.00 0
20
40
60
80
100
120
C
160
20
40
60
80
100
120
C
160
TA
TA
Safe operating area
Transient thermal impedance
I D = f ( VDS )
parameter : D = 0 , T A = 25 C
-10
1
ZthJC = f (tp )
parameter : D = tp /T
10 3
BSS 83 P
BSS 83 P
A
tp = 88.0s
100 s
K/W
-10
0
/I D =
10 2
ID
RD
-10
-1
S(
) on
1 ms
Z thJC
10 1 D = 0.50
10 ms
VD
S
0.20 0.10 -10 -2 DC 10 0 0.05 single pulse 0.02 0.01
-10 -3 -1 -10
-10
0
-10
1
V
-10
2
10 -1 -5 -4 -3 -2 -1 0 1 2 10 10 10 10 10 10 10 10
s 10 4
VDS
Page 5
tp
1999-09-16
Preliminary data
Typ. output characteristics
BSS 83 P
Typ. drain-source-on-resistance
I D = f (VDS)
parameter: tp = 80 s
BSS 83 P
RDS(on) = f (ID )
parameter: VGS
BSS 83 P
-0.80
Ptot = 0W
jk i hlf e d g
VGS [V] a -2.5
b -3.0 -3.5 -4.0 -4.5 -5.0 -5.5 -6.0 -6.5 -7.0 -8.0 -10.0
6.5
5.5 5.0
a
b
c
A
c
RDS(on)
-0.60
c
d e f g
4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0
d e lfg i j hk
ID
-0.50
-0.40
h i
-0.30
j
bk
l
-0.20
-0.10
a
VGS [V] =
a b c d e f -2.5 -3.0 -3.5 -4.0 -4.5 -5.0 g h i j -5.5 -6.0 -6.5 -7.0 k l -8.0 -10.0
0.5 0.00 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 V -5.0 0.0 0.00
-0.10
-0.20
-0.30
-0.40
-0.50 A
-0.65
VDS
ID
Typ. transfer characteristics I D= f ( V GS )
Typ. forward transconductance
VDS 2 x I D x RDS(on)max
parameter: tp = 80 s
-1.2
A
gfs = f(ID); Tj=25C
parameter: gfs
0.70
S
-1.0 -0.9 -0.8
0.60 0.55 0.50
ID
0.45
gfs V
-0.7 -0.6 -0.5 -0.4 -0.3
0.40 0.35 0.30 0.25 0.20 0.15
-0.2 -0.1 0.0 0.0 -1.0 -2.0 -3.0 -4.0 -6.0
0.10 0.05 0.00 0.00 -0.10 -0.20 -0.30 -0.40 -0.50
A ID
-0.70
VGS
Page 6
1999-09-16
Preliminary data
Drain-source on-resistance Gate threshold voltage
BSS 83 P
RDS(on) = f (Tj)
parameter : I D = -0.33 A, VGS = -10 V
BSS 83 P
VGS(th) = f (Tj)
parameter: VGS = VDS , ID = -80 A
-3.0
5.5
V
4.5
RDS(on)
4.0 3.5 3.0
V GS(th)
98%
-2.0
typ
-1.5 2.5 2.0 1.5 1.0 0.5 0.0 -60 -20 20 60 100
C
98%
2%
typ
-1.0
-0.5
180
0.0 -60
-20
20
60
100
Tj
160 C Tj
Typ. capacitances C = f(V DS) parameter: VGS=0 V, f=1 MHz
10
3
Forward characteristics of reverse diode
IF = f (VSD )
parameter: Tj , tp = 80 s
-10 1
BSS 83 P
pF
A
10 2
-10 0
Ciss
C
Coss
10 1 -10 -1
Crss
IF
Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%)
10 0 0
-5
-10
-15
-20
-25
V
-35
-10 -2 0.0
-0.4
-0.8
-1.2
-1.6
-2.0
-2.4 V
-3.0
VDS
VSD
Page 7
1999-09-16
Preliminary data
Avalanche Energy EAS = f (Tj) parameter: ID = -0.33 A , V DD = -25 V RGS = 25
10
BSS 83 P
Typ. gate charge
VGS = f (QGate )
parameter: ID = -0.33 A pulsed
BSS 83 P
-16
mJ
V
8 -12 7
E AS
VGS
6 5 4 3
-10
-8 0,2 VDS max 0,8 VDS max
-6
-4 2 1 0 25 -2
45
65
85
105
125
C
165
0 0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8 nC
3.4
Tj
QGate
Drain-source breakdown voltage
V(BR)DSS = f (Tj)
BSS 83 P
-72
V
-68 -66 -64 -62 -60 -58 -56 -54 -60
V(BR)DSS
-20
20
60
100
C
180
Tj
Page 8
1999-09-16
Preliminary data
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer.
BSS 83 P
Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Page 9
1999-09-16


▲Up To Search▲   

 
Price & Availability of BSS83P

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X