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| ICX285AQ Diagonal 11mm (Type 2/3) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras Description The ICX285AQ is a diagonal 11mm (Type 2/3) interline CCD solid-state image sensor with a square pixel array. High sensitivity and low smear are achieved through the adoption of EXview HAD CCD technology. Progressive scan allows all pixels' signals to be output independently within approximately 1/15 second. Also, the adoption of high frame rate readout mode supports 60 frames per second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still images without a mechanical shutter. High resolution and high color reproductively are achieved through the use of R, G, B primary color mosaic filters. This chip is suitable for image input applications such as still cameras which requires high resolution, etc. 20 pin DIP (Ceramic) Features * Progressive scan allows individual readout of the image signals from all pixels. * High horizontal and vertical resolution (both approximately 800 TV-lines) still images without a mechanical shutter * Supports high frame rate readout mode (effective 256 lines output, 60 frames/s) Pin 1 * Square pixel 2 * Aspect ratio : 4:3 * Horizontal drive frequency: 28.64MHz V * R, G, B primary color mosaic filters on chip * High sensitivity, low smear * Low dark current, excellent anti-blooming characteristics 8 * Continuous variable-speed shutter function 2 * Horizontal register: 5.0V drive 40 Pin 11 H Device Structure * Interline CCD image sensor Optical black position * Image size: Diagonal 11mm (Type 2/3) (Top View) * Total number of pixels: 1434 (H) x 1050 (V) approx. 1.50M pixels * Number of effective pixels: 1392 (H) x 1040 (V) approx. 1.45M pixels * Number of active pixels: 1360 (H) x 1024 (V) approx. 1.40M pixels * Chip size: 10.2mm (H) x 8.3mm (V) * Unit cell size: 6.45m (H) x 6.45m (V) * Optical black: Horizontal (H) direction: Front 2 pixels, rear 40 pixels Vertical (V) direction: Front 8 pixels, rear 2 pixels * Number of dummy bits: Horizontal 20 Vertical 3 * Substrate material: Silicon TM EXview HAD CCD is a trademark of Sony Corporation. EXview HAD CCD is a CCD that drastically improves light efficiency by including near infrared light region as a basic structure of HAD (Hole-Accumulation-Diode) sensor. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E01420A27 ICX285AQ Block Diagram and Pin Configuration (Top View) GND GND V2B V2A V3 V4 10 9 8 7 6 5 4 3 2 G R Vertical register B G B G B G B G G R G R G R G R B G B G B G B G Note) G R G R G R Horizontal register Note) : Photo sensor 11 VOUT 12 VDD 13 RG 14 H2 15 H1 16 SUB 17 CSUB 18 VL 19 H1 20 H2 Pin Description Pin No. Symbol 1 2 3 4 5 6 7 8 9 10 V1 V2A NC V2B NC NC V4 V3 GND GND Vertical register transfer clock Vertical register transfer clock GND GND Vertical register transfer clock Description Vertical register transfer clock Vertical register transfer clock Pin No. 11 12 13 14 15 16 17 18 19 20 Symbol VOUT VDD RG H2 H1 SUB CSUB VL H1 H2 Description Signal output Supply voltage Reset gate clock Horizontal register transfer clock Horizontal register transfer clock Substrate clock Substrate bias1 Protective transistor bias Horizontal register transfer clock Horizontal register transfer clock 1 DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of 0.1F. -2- V1 NC NC NC 1 ICX285AQ Absolute Maximum Ratings Item VDD, VOUT, RG - SUB V2A, V2B - SUB Against SUB V1, V3, V4, VL - SUB H1, H2, GND - SUB CSUB - SUB VDD, VOUT, RG, CSUB - GND Against GND V1, V2A, V2B, V3, V4 - GND H1, H2 - GND Against VL V2A, V2B - VL V1, V3, V4, H1, H2, GND - VL Voltage difference between vertical clock input pins Between input clock pins H1 - H2 H1, H2 - V4 Storage temperature Guaranteed temperature of performance Operating temperature 1 +24V (Max.) when clock width < 10s, clock duty factor < 0.1%. +16V (Max.) is guaranteed for turning on or off power supply. Ratings -40 to +12 -50 to +15 -50 to +0.3 -40 to +0.3 -25 to -0.3 to +22 -10 to +18 -10 to +6.5 -0.3 to +28 -0.3 to +15 to +15 -6.5 to +6.5 -10 to +16 -30 to +80 -10 to +60 -10 to +75 Unit V V V V V V V V V V V V V C C C 1 Remarks Bias Conditions Item Supply voltage Protective transistor bias Substrate clock Reset gate clock Symbol VDD VL SUB RG Min. 14.55 Typ. 15.0 2 3 3 Max. 15.45 Unit V Remarks 2 VL setting is the VVL voltage of the vertical clock waveform, or the same voltage as the VL power supply for the V driver should be used. 3 Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Item Supply current Symbol IDD Min. Typ. 9 Max. 11 Unit mA Remarks -3- ICX285AQ Clock Voltage Conditions Item Readout clock voltage Symbol VVT VVH1, VVH2 VVH3, VVH4 VVL1, VVL2, VVL3, VVL4 VV Vertical transfer clock voltage VVH3 - VVH VVH4 - VVH VVHH VVHL VVLH VVLL VH Horizontal transfer clock voltage VHL VCR VRG Reset gate clock voltage VRGLH - VRGLL VRGL - VRGLm Substrate clock voltage VSUB 21.25 22.0 4.75 -0.05 VH/2 3.0 3.3 5.5 0.4 0.5 22.75 5.0 0 Min. 14.55 -0.05 -0.2 -7.3 6.5 -0.25 -0.25 Typ. 15.0 0 0 -7.0 7.0 Max. Unit 15.45 0.05 0.05 -6.7 7.35 0.1 0.1 1.4 1.3 1.4 0.8 5.25 0.05 V V V V V V V V V V V V V V V V V V Waveform Diagram 1 2 2 2 2 2 2 2 2 2 2 3 3 3 4 4 4 5 Low-level coupling Low-level coupling Cross-point voltage High-level coupling High-level coupling Low-level coupling Low-level coupling VVL = (VVL3 + VVL) /2 VV = VVHn - VVLn (n = 1 to 4) VVH = (VVH1 + VVH) /2 Remarks -4- ICX285AQ Clock Equivalent Circuit Constants Item Symbol CV1 CV2A Capacitance between vertical transfer clock and GND CV2B CV3 CV4 CV12A CV12B CV2A3 Capacitance between vertical transfer clocks CV2B3 CV14 CV34 CV2A4 CV2B4 Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND Vertical transfer clock series resistor Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock ground resistor V4 Min. Typ. 5600 6800 22000 8200 22000 150 390 270 470 2200 330 390 560 47 39 74 4 1300 30 32 20 60 7.5 24 Max. Unit Remarks pF pF pF pF pF pF pF pF pF pF pF pF pF pF pF pF pF pF RH H2 CH1 CH2 CHH CRG CSUB R1, R3 R2A, R2B R4 RGND RH RRG RH H1 CV4 CV12B CV41 V1 CV1 R1 R4 CV34 CV2B4 CV2B R2B RH H1 CH1 V2B CHH RH H2 CH2 Horizontal transfer clock equivalent circuit CV12A RGND CV2A4 R2A V2A CV2A CV2A3 R3 V3 CV2B3 RRG RG CV3 CRG Vertical transfer clock equivalent circuit -5- Reset gate clock equivalent circuit ICX285AQ Drive Clock Waveform Conditions (1) Readout clock waveform 100% 90% M VVT 10% 0% tr twh tf 0V M 2 (2) Vertical transfer clock waveform V1 V3 VVH VVHH VVHH VVHH VVHH VVH VVHL VVHL VVH1 VVHL VVH3 VVHL VVLH VVL3VVLH VVLL VVL1 V2A, V2B VVLL VVL V4 VVL VVH2 VVHH VVH VVHL VVHH VVHL VVHL VVHH VVHL VVHH VVH VVH4 VVL2 VVLH VVL4 VVLH VVLL VVL VVLL VVL VVH = (VVH1 + VVH2) /2 VVL = (VVL3 + VVL4) /2 VV = VVHn - VVLn (n = 1 to 4) -6- ICX285AQ (3) Horizontal transfer clock waveform tr H2 90% VCR VH VH 2 10% H1 two VHL twh tf twl Cross-point voltage for the H1 rising side of the horizontal transfer clocks H1 and H2 waveforms is VCR. The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two. (4) Reset gate clock waveform tr twh tf RG waveform VRGH twl VRG Point A VRGLH VRGLL VRGLm VRGL VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL) /2 Assuming VRGH is the minimum value during the interval with twh, then: VRG = VRGH - VRGL Negative overshoot level during the falling edge of RG is VRGLm. (5) Substrate clock waveform 100% 90% M VSUB 10% VSUB 0% (A bias generated within the CCD) M 2 tf tr twh -7- ICX285AQ Clock Switching Characteristics (Horizontal drive frequency: 28.64MHz) Item Readout clock Vertical transfer clock Horizontal transfer clock Symbol VT V1, V2, V3, V4 H1 H2 H1 H2 RG SUB twh twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 2.8 3.0 0.5 15 10 12.5 10 12.5 10 12.5 10 12.5 5 5 0.01 0.01 4 8 24 2 0.5 7.5 7.5 5 5 0.01 0.01 2 0.5 0.5 250 7.5 7.5 Unit s ns ns s ns s Remarks During readout When using CXD3400N tf tr - 2ns During imaging During parallel-serial conversion Reset gate clock Substrate clock 3.5 3.9 During drain charge Item Horizontal transfer clock Symbol H1, H2 two Min. Typ. Max. 8 10 Unit ns Remarks Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics) 1.0 R 0.9 0.8 0.7 Relative Response G B 0.6 0.5 0.4 0.3 0.2 0.1 0 400 450 500 550 Wave Length [nm] 600 650 700 -8- ICX285AQ Image Sensor Characteristics Item G Sensitivity Sensitivity comparison Saturation signal Smear R B Symbol Sg Rr Rb Vsat Sm 0.40 0.30 850 -110 -98 -100 -88 20 25 10 4 3.8 3.8 3.8 0.5 Min. Typ. 1240 0.60 0.53 0.70 0.60 mV dB % mV mV % % % % Max. Unit mV Measurement method 1 1 2 3 4 5 6 7 7 7 8 Ta = 60C (Ta = 25C) Remarks 1/30s accumulation Progressive scan mode High frame rate readout mode Zone 0 and I Zone 0 to II' Ta = 60C, 15 frames/s Ta = 60C, 15 frames/s, 1 Video signal shading SHg Dark signal Dark signal shading Line crawl G Line crawl R Line crawl B Lag Vdt Vdt Lcr Lcg Lcb Lag 1 Excludes vertical dark signal shading caused by vertical register high-speed transfer. Zone Definition of Video Signal Shading 1392 (H) 11 11 3 H 8 V 10 H 8 1040 (V) Zone 0, I Zone II, II' V 10 3 Ignored region Effective pixel region Measurement System CCD signal output [A] CCD C.D.S AMP S/H Gr/Gb channel signal output [B] S/H R/B channel signal output [C] -9- ICX285AQ Image Sensor Characteristics Measurement Method Color coding of this image sensor & Readout Gb R Gb R B Gr B Gr Gb R Gb R B Gr B Gr The primary color filters of this image sensor are arranged in the layout shown in the figure on the left (Bayer arrangement). Gr and Gb denote the G signals on the same line as the R signal and the B signal, respectively. Horizontal register Color Coding Diagram All pixels' signals are output successively in a 1/15s period. The R signal and Gr signal lines and the Gb signal and B signal lines are output successively. - 10 - ICX285AQ Readout modes The output methods for the following two readout modes are shown below. Progressive scan mode High frame rate readout mode 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 VOUT G R G R G R G R G R G R G R G R B G B G B G B G B G B G B G B G VOUT 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 G R G R G R G R G R G R G R G R B G B G B G B G B G B G B G B G Note) Blacked out portions in the diagram indicate pixels which are not read out. Output starts from line 1 in high frame readout modes. 1. Progressive scan mode In this mode, all pixels' signals are output in non-interlace format in 1/15s. All pixels' signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing. 2. High frame rate readout mode All effective areas are scanned in approximately 1/60s by reading out two out of eight lines (1st and 4th lines, 9th and 12th lines, and so on). The vertical resolution is approximately 256 TV-lines. This readout mode emphasizes processing speed over vertical resolution. - 11 - ICX285AQ Image Sensor Characteristics Measurement Method Measurement conditions (1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions, and the progressive scan mode is used. (2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of the Gr/Gb signal output or the R/B signal output of the measurement system. Definition of standard imaging conditions (1) Standard imaging condition I: Use a pattern box (luminance: 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. (2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. Sensitivity, sensitivity comparison Set to the standard imaging condition I. After setting the electronic shutter mode with a shutter speed of 1/100s, measure the signal outputs (VGR, VGb, VR and VB) at the center of each Gr, Gb, R and B channel screen, and substitute the values into the following formulas. VG = (VGr + VGb) /2 Sg = VG x 100 [mV] 30 Rr = VR/VG Rb = VB/VG 2. Saturation signal Set to the standard imaging condition II. After adjusting the luminous intensity to 20 times the intensity with the average value of the Gr signal output, 200mV, measure the minimum values of the Gr, Gb, R and B signal outputs. 3. Smear Set to the standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the average value of the Gr signal output to 200mV. Measure the average values of the Gr signal output, Gb signal output, R signal output and B signal output (Gra, Gba, Ra, Ba), and then adjust the luminous intensity to 500 times the intensity with the average value of the Gr signal output, 200mV. After the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (Vsm [mV]) independent of the Gr, Gb, R and B signal outputs, and substitute the values into the following formula. Sm = 20 x log (Vsm / Gra + Gba + Ra + Ba x 1 x 1 ) [dB] (1/10V method conversion value) 4 500 10 - 12 - ICX285AQ 4. Video signal shading Set to the standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjusting the luminous intensity so that the average value of the Gr signal output is 200mV. Then measure the maximum value (Grmax [mV]) and minimum value (Grmin [mV]) of the Gr signal output and substitute the values into the following formula. SHg = (Grmax - Grmin) /200 x 100 [%] 5. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature of 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 6. Dark signal shading After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. Vdt = Vdmax - Vdmin [mV] 7. Line crawl Set to the standard imaging condition II. Adjusting the luminous intensity so that the average value of the Gr signal output is 200mV, and then insert R, G and B filters and measure the difference between G signal lines (Glr, Glg, Glb [mV]) as well as the average value of the G signal output (Gar, Gag, Gab). Substitute the values into the following formula. Lci = Gli x 100 [%] (i = r, g, b) Gai 8. Lag Adjust the Gr signal output value generated by the strobe light to 200mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal amount (Vlag). Substitute the value into the following formula. Lag = (Vlag/20) x 100 [%] VD Light Strobe light timing Signal output 200mV Output Vlag (lag) - 13 - Drive Circuit 5.0V 15V 100k -7V 0.1 0.1 1/35V 20 19 0.1 1 2 3 4 5 6 7 8 9 10 18 1 XSUB 2 XV4 3 NC NC NC V1 V4 V2A V2B V3 GND VDD 5 ICX285 (BOTTOM VIEW) H2 H1 VL CSUB SUB H1 H2 RG XV3 12 11 0.1 9 XV1 10 20 19 18 17 16 15 14 13 12 11 3.3/20V 0.01 2SC4250 3.3/ 0.1 1M 16V 1/20V 4.7k XSUB VOUT - 14 - 14 13 0.1 XV2 6 CXD3400N 16 (TOP VIEW) 15 XSG2B 7 XSG2A 8 GND 4 17 H2 CCD OUT H1 RG ICX285AQ 1040 1 2 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 10 1031 1032 1040 1 2 1 2 - 15 - HD VD V2B V2A V4 V3 V1 CCD OUT 1063 Drive Timing Chart (Vertical Sync) Progressive Scan Mode "a" 1068 1 2 3 4 5 6 7 8 9 10 11 12 13 21 1044 1052 1063 1068 1 ICX285AQ Drive Timing Chart (Vertical Sync "a" Enlarged) Progressive Scan Mode H1 392 56 1790 1 392 1790 1 56 70ns (2 bits) HD 27.9s (800 bits) V1 3.5s (100 bits) 140 - 16 - 126 V2A 98 1 126 V2B 1 126 182 V3 1 1 210 V4 ICX285AQ Drive Timing Chart (Horizontal Sync) Progressive Scan Mode 1790 1 CLK H1 H2 RG SHP SHD 1 84 42 1 42 1 126 1 210 126 1 105 126 1 105 126 1 84 1 126 168 1 210 1 42 168 V1 56 1 1 V2A 1 V2B 1 V3 1 V4 SUB 392 412 430 - 17 - ICX285AQ 1020 1025 1028 1033 1036 Drive Timing Chart (Vertical Sync) High Frame Rate Readout Mode 1 4 1 4 9 12 17 20 25 1020 1025 1028 1033 1036 1 4 1 4 9 12 17 20 25 1020 1025 1028 1033 1036 1 4 1 4 9 12 17 - 18 - V2B V2A HD VD V4 V3 V1 CCD OUT "a" "a" 260 261 262 263 264 265 266 267 1 2 3 4 5 6 7 8 9 10 11 12 13 260 261 262 263 264 265 266 267 1 2 3 4 5 6 7 8 9 10 11 12 13 260 261 262 263 264 265 266 267 1 2 3 4 5 6 7 8 ICX285AQ Drive Timing Chart (Vertical Sync "a" Enlarged) High Frame Rate Readout Mode H1 392 1790 1 56 392 1790 1 56 70ns (2 bits) HD 27.9s (800 bits) 3.5s (100 bits) V1 - 19 - 84 1010101010101010 V2A V2B V3 V4 ICX285AQ Drive Timing Chart (Horizontal Sync) High Frame Rate Readout Mode 392 1790 1 CLK H1 H2 RG SHP SHD 1 1 1 30 1 30 50 1 30 1 1 1 1 1 50 1 1 105 30 1 30 30 1 50 1 50 1 126 1 30 30 1 30 1 50 1 50 1 50 30 30 1 1 1 1 50 30 50 30 50 1 1 1 30 1 30 30 50 50 1 30 50 50 50 1 50 1 30 30 1 1 50 V1 56 1 20 1 10 V2A 1 1 10 V2B 1 1 V3 1 V4 SUB 412 430 - 20 - ICX285AQ ICX285AQ Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensors. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering toll, use a thermal controller of the zero-cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operations as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply and load or impact to limited portions. (This may cause cracks in the package.) Upper ceramic 39N 29N 29N 0.9Nm Lower ceramic Low melting point glass Compressive strength Shearing strength Tensile strength Torsional strength b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use an elastic load, such as a spring plate, or an adhesive. - 21 - ICX285AQ c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to other locations as a precaution. d) The upper and lower ceramic are joined by low melting point glass. Therefore, care should be taken not to perform the following actions as this may cause cracks. * Applying repeated bending stress to the outer leads. * Heating the outer leads for an extended period with a soldering iron. * Rapidly cooling or heating the package. * Applying any load or impact to a limited portion of the low melting point glass using tweezers or other sharp tools. * Prying at the upper or lower ceramic using the low melting point glass as a fulcrum. Note that the same cautions also apply when removing soldered products from boards. e) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods, as color filters will be discolored. When high luminous objects are imaged with the exposure level controlled by the electronic iris, the luminance of the image-plane may become excessive and discoloring of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) This CCD image sensor has a device structure that is sensitive to near infrared light, so white spots during the subsequent dark signal occur at a higher probability compared to CCD image sensors with normal structures. Therefore, note that the white spot at dark signal specification cannot be guaranteed when used after storage for long periods. - 22 - Package Outline Unit: mm C 0 to 9 20 pin DIP (800mil) 31.0 0.4 27.0 0.3 11 A D 2-2.50 - 0 + 0.25 20 ~ ~ 2R 3. 0 26.0 5.0 20.2 0.3 B + 0.15 2.00 - 0 (Reference Hole) x2.5 2.00 - 0 (Elongated Hole) 0.25 0.35 1 + 0.15 13.15 10 0.5 26.0 0.25 3.2 0.3 1.0 5.5 0.2 - 23 - 1. "A" is the center of the effective image area. 0.46 1.27 1Pin Index 2. The straight line "B" which passes through the center of the reference hole and the elongated hole is the reference axis of vertical direction (V). 3. The straight line "C" which passes through the center of the reference hole at right angle to vertical reference line "B" is the reference axis of horizontal direction (H). 4. The bottom "D" is the height reference.(Two points are specified.) 5. The center of the effective image area specified relative to the reference hole is (H, V) = (13.15, 5.0) 0.15mm. 6. The angle of rotation relative to the reference line "B" is less than 1 7. The height from the bottom "D" to the effective image area is 1.46 0.15mm. 8. The tilt of the effective image area relative to the bottom "D" is less than 60m. 9. The thickness of the cover glass is 0.75mm and the refractive index is 1.5. ICX285AQ 2.54 0.3 M PACKAGE STRUCTURE PACKAGE MATERIAL Ceramic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY PACKAGE MASS 5.90g Sony Corporation DRAWING NUMBER AS-A11(E) 20.32 (AT STAND OFF) |
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