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 Device Features
! Fully Qualified Bluetooth system ! Bluetooth v1.2 Specification Compliant ! Kalimba DSP Open Platform Co-Processor ! Full Speed Bluetooth Operation with Full
Piconet Support
_aiEceEPJjiaiaaECa~= bniEea~a
Single Chip Bluetooth(R) v1.2 System
Production Information Data Sheet For BC352239A November 2004
! Scatternet Support ! Low Power 1.8V Operation ! 7 x 7mm 120-ball VFBGA Package ! Minimum External Components ! Integrated 1.8V regulator ! Dual UART Ports ! 16-bit Stereo Audio CODEC ! I2S and SPDIF Interfaces ! RoHS Compliant
General Description
BlueCore3-Multimedia External is a single chip radio and baseband IC for Bluetooth 2.4GHz systems. BC352239A interfaces to 8Mbit of external Flash memory. When used with the CSR Bluetooth software stack, it provides a fully compliant Bluetooth system to v1.2 of the specification for data and voice communications.
Applications
! ! ! ! ! !
Stereo Headphones Automotive Hands-Free Kits Echo Cancellation High Performance Telephony Headsets Enhanced Audio Applications A/V Profile Support
RAM
External Memory
FLASH
BlueCore3-Multimedia External contains the Kalimba DSP, an open platform digital signal processor (DSP) coprocessor supporting enhanced audio applications. BlueCore3-Multimedia External has been designed to reduce the number of external components required, ensuring that production costs are minimised. The device incorporates auto-calibration and built-in self-test (BIST) routines to simplify development, type approval and production test. All hardware and device firmware is fully compliant with the Bluetooth v1.2 Specification.
SPI Baseband DSP UART/USB RF IN RF OUT MCU 2.4 GHz Radio I/O PIO
Audio In/Out
Kalimba DSP
PCM / I2S / SPDIF
XTAL
BlueCore3-Multimedia External System Architecture
BC352239A-ds-001Pc
(c) Cambridge Silicon Radio Limited 2004 Production Information
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Contents
Contents
Status Information ................................................................................................................................................ 7 Advance Information ............................................................................................................................................ 7 Pre-Production Information.................................................................................................................................. 7 Production Information ........................................................................................................................................ 7 Life Support Policy and Use in Safety-Critical Applications ............................................................................. 7 RoHS Compliance ................................................................................................................................................. 7 Trademarks, Patents and Licenses ..................................................................................................................... 7 1 2 Key Features .................................................................................................................................................. 8 7 x 7 VFBGA Package Information ............................................................................................................... 9 2.1 2.2 3 4 BlueCore3-Multimedia External Pinout Diagram................................................................................ 9 Device Terminal Functions .............................................................................................................. 10
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Electrical Characteristics ............................................................................................................................ 15 Radio Characteristics .................................................................................................................................. 22 4.1 Temperature +20C ......................................................................................................................... 22 4.1.1 Transmitter ................................................................................................................................. 22 4.1.2 Receiver ..................................................................................................................................... 23 Temperature -40C .......................................................................................................................... 24 4.2.1 Transmitter ................................................................................................................................. 24 4.2.2 Receiver ..................................................................................................................................... 24 Temperature -25C .......................................................................................................................... 25 4.3.1 Transmitter ................................................................................................................................. 25 4.3.2 Receiver ..................................................................................................................................... 25 Temperature +85C ......................................................................................................................... 26 4.4.1 Transmitter ................................................................................................................................. 26 4.4.2 Receiver ..................................................................................................................................... 26 Temperature +105C ....................................................................................................................... 27 4.5.1 Transmitter ................................................................................................................................. 27 4.5.2 Receiver ..................................................................................................................................... 27 Power Consumption ........................................................................................................................ 28
4.2
4.3
4.4
4.5
4.6 5 6
Device Diagram ............................................................................................................................................ 29 Description of Functional Blocks ............................................................................................................... 30 6.1 RF Receiver..................................................................................................................................... 30 6.1.1 Low Noise Amplifier ................................................................................................................... 30 6.1.2 Analogue to Digital Converter .................................................................................................... 30 RF Transmitter................................................................................................................................. 30 6.2.1 IQ Modulator .............................................................................................................................. 30 6.2.2 Power Amplifier .......................................................................................................................... 30 6.2.3 Auxiliary DAC ............................................................................................................................. 30 RF Synthesiser ................................................................................................................................ 30 Clock Input and Generation ............................................................................................................. 30 Baseband and Logic ........................................................................................................................ 31 6.5.1 Memory Management Unit ......................................................................................................... 31 6.5.2 Burst Mode Controller ................................................................................................................ 31 6.5.3 Physical Layer Hardware Engine DSP....................................................................................... 31 6.5.4 RAM ........................................................................................................................................... 31 6.5.5 Kalimba DSP RAM..................................................................................................................... 31 6.5.6 External Memory Driver ............................................................................................................. 32 6.5.7 USB............................................................................................................................................ 32 6.5.8 Synchronous Serial Interface ..................................................................................................... 32 6.5.9 UART ......................................................................................................................................... 32 Microcontroller ................................................................................................................................. 32 6.6.1 Programmable I/O...................................................................................................................... 32
(c) Cambridge Silicon Radio Limited 2004 Production Information Page 2 of 116
6.2
6.3 6.4 6.5
6.6
BC352239A-ds-001Pc
Contents
6.7 6.8
Kalimba DSP ................................................................................................................................... 33
7
Audio Interface................................................................................................................................. 34 6.8.1 Audio Input and Output .............................................................................................................. 34 6.8.2 Digital Audio Interface ................................................................................................................ 34 CSR Bluetooth Software Stacks ................................................................................................................. 35 7.1 BlueCore HCI Stack ........................................................................................................................ 35 7.1.1 Key Features of the HCI Stack - Standard Bluetooth Functionality ............................................ 36 7.1.2 Key Features of the HCI Stack - Extra Functionality .................................................................. 37 Stand-Alone BlueCore3-Multimedia External and Kalimba DSP Applications ................................. 38 Host-Side Software.......................................................................................................................... 39 Device Firmware Upgrade ............................................................................................................... 39 BCHS Software................................................................................................................................ 39 Additional Software for Other Embedded Applications .................................................................... 39 CSR Development Systems ............................................................................................................ 39 RF Ports .......................................................................................................................................... 40 8.1.1 TX_A and TX_B ......................................................................................................................... 40 8.1.2 Transmit Port Impedances for 7 x 7 VFBGA Package (2.4-2.5GHz vs. Temperature)............... 41 8.1.3 Receive Port Impedances for 7 x 7 VFBGA Package (2.4-2.5GHz vs. Temperature)................ 44 8.1.4 Transmit S Parameters .............................................................................................................. 45 8.1.5 Balanced Receive S Parameters ............................................................................................... 46 8.1.6 Single-Ended Input (RF_IN) ....................................................................................................... 47 8.1.7 Transmit RF Power Control for Class 1 Applications (TX_PWR) ............................................... 47 8.1.8 Control of External RF Components .......................................................................................... 48 External Reference Clock Input (XTAL_IN) ..................................................................................... 49 8.2.1 External Mode ............................................................................................................................ 49 8.2.2 XTAL_IN Impedance in External Mode ...................................................................................... 49 8.2.3 Clock Timing Accuracy............................................................................................................... 49 8.2.4 Clock Start-Up Delay.................................................................................................................. 50 8.2.5 Input Frequencies and PS Key Settings..................................................................................... 51 Crystal Oscillator (XTAL_IN, XTAL_OUT) ....................................................................................... 52 8.3.1 XTAL Mode ................................................................................................................................ 52 8.3.2 Load Capacitance ...................................................................................................................... 53 8.3.3 Frequency Trim .......................................................................................................................... 53 8.3.4 Transconductance Driver Model ................................................................................................ 54 8.3.5 Negative Resistance Model ....................................................................................................... 54 8.3.6 Crystal PS Key Settings ............................................................................................................. 54 8.3.7 Crystal Oscillator Characteristics ............................................................................................... 55 Off-Chip Program Memory............................................................................................................... 58 8.4.1 Minimum Flash Specification ..................................................................................................... 59 8.4.2 Common Flash Interface............................................................................................................ 60 8.4.3 Memory Timing .......................................................................................................................... 61 UART Interface ................................................................................................................................ 63 8.5.1 UART Bypass............................................................................................................................. 65 8.5.2 UART Configuration While RESET is Active.............................................................................. 65 8.5.3 UART Bypass Mode................................................................................................................... 65 8.5.4 Current Consumption in UART Bypass Mode ............................................................................ 65 USB Interface .................................................................................................................................. 66 8.6.1 USB Data Connections .............................................................................................................. 66 8.6.2 USB Pull-Up Resistor................................................................................................................. 66 8.6.3 Power Supply ............................................................................................................................. 66 8.6.4 Self-Powered Mode.................................................................................................................... 67 8.6.5 Bus-Powered Mode.................................................................................................................... 68 8.6.6 Suspend Current ........................................................................................................................ 69 8.6.7 Detach and Wake_Up Signalling................................................................................................ 69 8.6.8 USB Driver ................................................................................................................................. 69 8.6.9 USB 1.1 Compliance.................................................................................................................. 70 8.6.10 USB 2.0 Compatibility ................................................................................................................ 70 Serial Peripheral Interface ............................................................................................................... 70
(c) Cambridge Silicon Radio Limited 2004 Production Information
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
7.2 7.3 7.4 7.5 7.6 7.7 8 8.1
Device Terminal Descriptions..................................................................................................................... 40
8.2
8.3
8.4
8.5
8.6
8.7
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Contents
8.7.1 Instruction Cycle......................................................................................................................... 70 8.7.2 Writing to BlueCore3-Multimedia External ................................................................................. 71 8.7.3 Reading from BlueCore 3-Multimedia External .......................................................................... 71 8.7.4 Multi Slave Operation................................................................................................................. 71 8.8 Stereo Audio Interface ..................................................................................................................... 72 8.8.1 Stereo CODEC Setup ................................................................................................................ 73 8.8.2 ADC ........................................................................................................................................... 73 8.8.3 ADC Sample Rate Selection and Warping................................................................................. 73 8.8.4 ADC Gain ................................................................................................................................... 73 8.8.5 DAC ........................................................................................................................................... 75 8.8.6 DAC Sample Rate Selection and Warping................................................................................. 75 8.8.7 DAC Gain ................................................................................................................................... 75 8.8.8 Mono Operation ......................................................................................................................... 76 8.8.9 PCM CODEC Interface .............................................................................................................. 77 8.8.10 PCM Interface Master/Slave ...................................................................................................... 78 8.8.11 Long Frame Sync....................................................................................................................... 79 8.8.12 Short Frame Sync ...................................................................................................................... 79 8.8.13 Multi Slot Operation.................................................................................................................... 80 8.8.14 GCI Interface.............................................................................................................................. 80 8.8.15 Slots and Sample Formats ......................................................................................................... 81 8.8.16 Additional Features .................................................................................................................... 81 8.8.17 PCM Timing Information ............................................................................................................ 82 8.8.18 PCM Slave Timing ..................................................................................................................... 84 8.8.19 PCM_CLK and PCM_SYNC Generation.................................................................................... 86 8.8.20 PCM Configuration..................................................................................................................... 87 8.8.21 Digital Audio Bus........................................................................................................................ 89 8.8.22 IEC 60958 Interface ................................................................................................................... 92 8.8.23 Audio Input Stage....................................................................................................................... 93 8.8.24 Microphone Input ....................................................................................................................... 94 8.8.25 Line Input ................................................................................................................................... 94 8.8.26 Output Stage .............................................................................................................................. 95 8.9 I/O Parallel Ports.............................................................................................................................. 95 8.9.1 PIO Defaults for BTv1.2 HCI Level Bluetooth Stack................................................................... 96 8.10 I2C Interface..................................................................................................................................... 96 8.11 8.12 TCXO Enable OR Function ............................................................................................................. 97 RESET and RESETB ...................................................................................................................... 97 8.12.1 Pin States on Reset ................................................................................................................... 98 8.12.2 Status after Reset ...................................................................................................................... 98 8.13 Power Supply................................................................................................................................... 99 8.13.1 Voltage Regulator ...................................................................................................................... 99 8.13.2 Sequencing ................................................................................................................................ 99 8.13.3 Sensitivity to Disturbances ......................................................................................................... 99 Typical Audio CODEC Performance......................................................................................................... 100 9.1 Output............................................................................................................................................ 100
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9
10 Application Schematic............................................................................................................................... 108 11 Package Dimensions ................................................................................................................................. 109 11.1 12.1 13.1 7 x 7 VFBGA 120-Ball Package .................................................................................................... 109 Solder Re-flow Profile for Devices with Lead-Free Solder Balls .................................................... 110 BlueCore3-Multimedia External ..................................................................................................... 111 12 Solder Profiles............................................................................................................................................ 110 13 Ordering Information ................................................................................................................................. 111 14 Contact Information ................................................................................................................................... 112 15 Document References ............................................................................................................................... 113 Acronyms and Definitions................................................................................................................................ 114 Record of Changes ........................................................................................................................................... 116
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Contents
List of Figures Figure 2.1: BlueCore3-Multimedia External Device Pinout ..................................................................................... 9 Figure 5.1: BlueCore3-Multimedia External Device Diagram ................................................................................ 29 Figure 6.1: Kalimba DSP Interface to Internal Functions ...................................................................................... 33 Figure 6.2: Audio Interface .................................................................................................................................... 34 Figure 7.1: BlueCore HCI Stack ............................................................................................................................ 35 Figure 7.2: Kalimba DSP Stack............................................................................................................................. 38 Figure 8.1: Circuit TX/RX_A and TX/RX_B ........................................................................................................... 40 Figure 8.2: TX_A Output at Power Setting 35 ....................................................................................................... 41 Figure 8.3: TX_A Output at Power Setting 50 ....................................................................................................... 41 Figure 8.4: TX_A Output at Power Setting 63 ....................................................................................................... 42 Figure 8.5: TX_B Output at Power Setting 35 ....................................................................................................... 42 Figure 8.6: TX_B Output at Power Setting 50 ....................................................................................................... 43 Figure 8.7: TX_B Output at Power Setting 63 ....................................................................................................... 43 Figure 8.8: RX_A Balanced Receive Input Impedance ......................................................................................... 44 Figure 8.9: RX_B Balanced Receive Input Impedance ......................................................................................... 44 Figure 8.10: First Stage of ADC Analogue Amplifier Block Diagram ..................................................................... 74 Figure 8.11: BlueCore3-Multimedia External as PCM Interface Master ................................................................ 78 Figure 8.12: BlueCore3-Multimedia External as PCM Interface Slave .................................................................. 78 Figure 8.13: Long Frame Sync (Shown with 8-bit Companded Sample)............................................................... 79 Figure 8.14: Short Frame Sync (Shown with 16-bit Sample) ................................................................................ 79 Figure 8.15: Multi Slot Operation with Two Slots and 8-bit Companded Samples ................................................ 80 Figure 8.16: GCI Interface..................................................................................................................................... 80 Figure 8.17: 16-Bit Slot Length and Sample Formats ........................................................................................... 81 Figure 8.18: PCM Master Timing Long Frame Sync ............................................................................................. 83 Figure 8.19: PCM Master Timing Short Frame Sync............................................................................................. 83 Figure 8.20: PCM Slave Timing Long Frame Sync ............................................................................................... 85 Figure 8.21: PCM Slave Timing Short Frame Sync .............................................................................................. 85 Figure 8.22: Digital Audio Interface Modes ........................................................................................................... 89 Figure 8.23: Digital Audio Interface Slave Timing ................................................................................................. 90 Figure 8.24: Digital Audio Interface Master Timing ............................................................................................... 91 Figure 8.25: Example Circuit for SPDIF Interface with Coaxial Output ................................................................. 92 Figure 8.26: Example Circuit for SPDIF Interface with Coaxial Input .................................................................... 92 Figure 8.27: Example Circuit for SPDIF Interface with Optical Output .................................................................. 93 Figure 8.28: Example Circuit for SPDIF Interface with Optical Input ..................................................................... 93 Figure 8.29: Microphone Biasing (Left Channel Shown) ....................................................................................... 94 Figure 8.30: Differential Input (Left Channel Shown) ............................................................................................ 94 Figure 8.31: Single Ended Input (Left Channel Shown) ........................................................................................ 94 Figure 8.32: Speaker Output (Left Channel Shown) ............................................................................................. 95 Figure 8.33: Example EEPROM Connection ........................................................................................................ 96 Figure 8.34: Example TXCO Enable OR Function ................................................................................................ 97 Figure 10.10.1: Relative Level of 2nd Harmonic to Fundamental, PL = 600....................................................... 100 Figure 10.10.2: Relative Level of 3rd Harmonic to Fundamental, PL = 600 ...................................................... 101 Figure 10.10.3: Relative Level of 2nd Harmonic to Fundamental, PL = 32......................................................... 102 Figure 10.10.4: Relative Level of 3rd Harmonic to Fundamental, PL = 32 ......................................................... 103 Figure 10.10.5: Relative Level of 2nd Harmonic to Fundamental, PL = 22......................................................... 104
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BC352239A-ds-001Pc
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Contents
Figure 10.10.6: Relative Level of 3rd Harmonic to Fundamental, PL = 22 ......................................................... 105 Figure 10.10.7: Noise Floor................................................................................................................................. 106 Figure 10.10.8: THD+N ....................................................................................................................................... 107 Figure 11.11.1: Application Circuit for Radio Characteristics Specification with 7 x 7 VFBGA Package ............. 108 Figure 12.12.1: BlueCore3-Multimedia External 120-Ball VFBGA Package Dimensions.................................... 109 Figure 13.13.1: Typical Lead-Free Re-flow Solder Profile................................................................................... 110
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
List of Tables Table 6.1: Alternative Functions of the Digital Audio Bus Interface on the PCM Interface .................................... 34 Table 8.1: Transmit S Parameters ........................................................................................................................ 45 Table 8.2: Balanced Receiver S Parameters ........................................................................................................ 46 Table 8.3: DAC Digital Gain Rate Selection.......................................................................................................... 75 Table 8.4: DAC Analogue Gain Settings ............................................................................................................... 76 Table 8.5: PCM Master Timing.............................................................................................................................. 82 Table 8.6: PCM Slave Timing................................................................................................................................ 84 Table 8.7: PSKEY_PCM_CONFIG32 Description................................................................................................. 87 Table 8.8: PSKEY_PCM_LOW_JITTER_CONFIG Description ............................................................................ 88 Table 8.9: Digital Audio Interface Slave Timing .................................................................................................... 90 Table 8.10: Digital Audio Interface Master Timing................................................................................................. 91 Table 8.11: PIO Defaults....................................................................................................................................... 96 Table 8.12: Pin States of BlueCore3-Multimedia External on Reset ..................................................................... 98
List of Equations Equation 8.1: Output Voltage with Load Current 10mA...................................................................................... 47 Equation 8.2: Output Voltage with No Load Current ............................................................................................. 47 Equation 8.3: Load Capacitance ........................................................................................................................... 53 Equation 8.4: Trim Capacitance ............................................................................................................................ 53 Equation 8.5: Frequency Trim ............................................................................................................................... 53 Equation 8.6: Pullability......................................................................................................................................... 53 Equation 8.7: Transconductance Required for Oscillation .................................................................................... 54 Equation 8.8: Equivalent Negative Resistance ..................................................................................................... 54 Equation 8.9: Baud Rate ....................................................................................................................................... 64 Equation 8.10: PCM_CLK Frequency When Being Generated Using the Internal 48MHz clock .......................... 86 Equation 8.11: PCM_SYNC Frequency Relative to PCM_CLK ............................................................................ 86
BC352239A-ds-001Pc
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Status Information
Status Information
The status of this Data Sheet is Production Information. CSR Product Data Sheets progress according to the following format:
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Advance Information Information for designers concerning CSR product in development. All values specified are the target values of the design. Minimum and maximum values specified are only given as guidance to the final specification limits and must not be considered as the final values. All detailed specifications including pinouts and electrical specifications may be changed by CSR without notice. Pre-Production Information Pinout and mechanical dimension specifications finalised. All values specified are the target values of the design. Minimum and maximum values specified are only given as guidance to the final specification limits and must not be considered as the final values. All electrical specifications may be changed by CSR without notice. Production Information Final Data Sheet including the guaranteed minimum and maximum limits for the electrical specifications. Production Data Sheets supersede all previous document versions. Life Support Policy and Use in Safety-Critical Applications CSR's products are not authorised for use in life-support or safety-critical applications. Use in such applications is done at the sole discretion of the customer. CSR will not warrant the use of its devices in such applications. RoHS Compliance BlueCore3-Multimedia External devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS). Trademarks, Patents and Licenses BlueCoreTM, BlueLabTM, CasiraTM, CompactSiraTM and MicroSiraTM are trademarks of CSR. Bluetooth(R) and the Bluetooth logos are trademarks owned by Bluetooth SIG Inc, USA and are licensed to CSR. Windows(R), Windows 98TM, Windows 2000TM, Windows XPTM and Windows NTTM are registered trademarks of the Microsoft Corporation. I2CTM and I2S are registered trademarks of the Philips Corporation and SPDIF is the registered trademark of the Sony Corporation and Philips Corporation. All other product, service and company names are trademarks, registered trademarks or service marks of their respective owners. The publication of this information does not imply that any license is granted under any patent or other rights owned by CSR Ltd. CSR reserves the right to make technical changes to its products as part of its development programme. While every care has been taken to ensure the accuracy of the contents of this document, CSR cannot accept responsibility for any errors.
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Key Features
1
Key Features
Kalimba DSP
! DSP co-processor, 32MIPs, 24-bit fixed point DSP
core matching; eliminates external antenna switch
Radio
! Common TX/RX terminal simplifies external ! BIST minimises production test time. No external
trimming is required in production
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
! Single cycle MAC; 24 x 24-bit multiply and 56-bit
accumulator
! Full RF reference designs available ! Bluetooth v1.2 Specification compliant
! 32-bit instruction word, dual 24-bit data memory ! 4Kword program memory, 2 x 8Kword data
memory
Transmitter
! +6dBm RF transmit power with level control from
on-chip 6-bit DAC over a dynamic range >30dB
! Flexible interfaces to BlueCore3 subsystem
Baseband and Software
! External 8Mbit Flash for complete system solution ! Internal 32Kbyte RAM, allows full speed data
transfer, mixed voice and data, and full piconet operation
! Class 2 and Class 3 support without the need for
an external power amplifier or TX/RX switch
! Class1 support using external power amplifier, with
RF power controlled by an internal 8-bit DAC
Receiver
! Integrated channel filters ! Digital demodulator for improved sensitivity and
co-channel rejection
! Logic for forward error correction, header error
control, access code correlation, CRC, demodulation, encryption bit stream generation, whitening and transmit pulse shaping
! Transcoders for A-law, -law and linear voice from
host and A-law, -law and CVSD voice over air
! Real time digitised RSSI available on HCI interface ! Fast AGC for enhanced dynamic range
Physical Interfaces
! Synchronous serial interface up to 4Mbaud for
system debugging
Synthesiser
! Fully integrated synthesiser requires no external
VCO, varactor diode, resonator or loop filter
! UART interface with programmable baud rate up to
1.5Mbaud with an optional bypass mode
! Compatible with crystals between 8 and 32MHz (in
multiples of 250kHz) or an external clock
! Full speed USB v1.1 interface supports OHCI and
UHCI host interfaces
! Accepts 7.68, 14.44, 15.36, 16.2, 16.8, 19.2, 19.44,
19.68, 19.8 and 38.4MHz TCXO frequencies for GSM and CDMA devices with sinusoidal or logic level signals
! Bi-directional serial programmable audio interface
supporting PCM, I2S and SPDIF formats
! Optional I2CTM compatible interface
Auxiliary Features
! Crystal oscillator with built-in digital trimming ! Power management includes digital shut down and
wake up commands with an integrated low power oscillator for ultra-low power Park/Sniff/Hold mode
Stereo Audio CODEC
! 16-bit resolution, standard sample rates of 8kHz,
11.025kHz, 16kHz, 22.05kHz, 32kHz, 44.1kHz and 48kHz (DAC only)
! Dual ADC and DAC for stereo audio ! Integrated amplifiers for driving microphone and
speakers with minimum external components
! `Clock request' output to control an external clock ! On-chip linear regulator; 1.8V output from a
2.2-4.2V input
! Compatible with Kalimba DSP
! Power-on-reset cell detects low supply voltage ! Arbitrary power supply sequencing permitted ! 8-bit ADC and DAC available to applications
Bluetooth Stack
CSR's Bluetooth Protocol Stack runs on the on-chip MCU in a variety of configurations:
Package Options
! 120-ball VFBGA, 7 x 7 x 1mm, 0.5mm pitch
! Standard HCI (UART or USB) ! Fully embedded RFCOMM ! Customised builds with embedded application code
BC352239A-ds-001Pc
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7 x 7 VFBGA Package Information
2
2.1
7 x 7 VFBGA Package Information
BlueCore3-Multimedia External Pinout Diagram
Orientation from top of device
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
1
2
3
4
5
6
7
8
9
10
11
12
13
A B C D E F G H J K L M N
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
D1
D2
D3
D11
D12
D13
E1
E2
E3
E11
E12
E13
F1
F2
F3
F11
F12
F13
G1
G2
G3
G11
G12
G13
H1
H2
H3
H11
H12
H13
J1
J2
J3
J11
J12
J13
K1
K2
K3
K11
K12
K13
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
L12
L13
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
M11
M12
M13
N1
N2
N3
N4
N5
N6
N7
N8
N9
N10
N11
N12
N13
Figure 2.1: BlueCore3-Multimedia External Device Pinout
BC352239A-ds-001Pc
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7 x 7 VFBGA Package Information
2.2
Radio AUX_DAC
Device Terminal Functions
Ball D2 C1 Pad Type Analogue Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Analogue Analogue Analogue Description Voltage DAC output Control output for external Tx/Rx switch (if fitted) Control output for external PA (If fitted) Single ended receiver input Transmitter output/switched receiver input Complement of TX_A
PIO[0]/RXEN
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
PIO[1]/TXEN
B1
RF_IN TX_A TX_B Synthesiser and Oscillator XTAL_IN XTAL_OUT USB and UART UART_TX UART_RX UART_RTS UART_CTS USB_DP USB_DN PCM Interface PCM_OUT PCM_IN PCM_SYNC PCM_CLK
Note:
(1) (1)
E1 G1 F1
Ball N1 N2 Ball J12 K11 L12 K12 L13 K13 Ball G13 J11 H11 H13
Pad Type Analogue Analogue Pad Type CMOS output, tri-state, with weak internal pull-up CMOS input with weak internal pull-down CMOS output, tri-state, with weak internal pull-up CMOS input with weak internal pull-down Bi-directional Bi-directional Pad Type CMOS output, tri-state, with weak internal pull-down CMOS input, with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down
Description For crystal or external clock input Drive for crystal Description UART data output UART data input UART request to send active low UART clear to send active low USB data plus with selectable internal 1.5k pull-up resistor USB data minus Description Synchronous data output Synchronous data input Synchronous data sync Synchronous data clock
Pin names may be redefined dependent on chosen interface; see Table 6.1.
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7 x 7 VFBGA Package Information
PIO Port PIO[11]
Ball A3
Pad Type Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional Bi-directional Bi-directional Bi-directional Pad Type CMOS input with weak internal pull-down CMOS input with weak internal pull-up CMOS input with weak internal pull-up CMOS input with weak internal pull-down CMOS input with weak internal pull-down CMOS output, tri-state, with weak internal pull-down CMOS input with strong internal pull-down
Description Programmable input/output line
PIO[10]
B3
Programmable input/output line
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
PIO[9]
C3
Programmable input/output line
PIO[8] PIO[7]/UART_RX(1)/ CLK_OUT PIO[6]/CLK_REQ/ UART_CTS
(1)
D3
Programmable input/output line Programmable input/output line or programmable frequency clock output PIO line or clock request output to enable external clock for external clock line PIO line or chip detaches from USB when this input is high PIO or USB on (input senses when VBUS is high, wakes BlueCore3-Multimedia External) PIO or output goes high to wake up PC when in USB mode or clock request input from host controller PIO or external clock request Programmable input/output line Programmable input/output line Programmable input/output line Programmable input/output line Description Reset if high. Input debounced so must be high for >5ms to cause a reset Reset if low. Input debounced so must be low for >5ms to cause a reset Chip select for Synchronous Serial Interface active low Serial Peripheral Interface clock Serial Peripheral Interface data input Serial Peripheral Interface data output For test purposes only (leave unconnected)
G11
F13
PIO[5]/USB_DETACH/ UART_RTS
(1)
F11
PIO[4]/USB_ON/ UART_TX
(1)
F12
PIO[3]/USB_WAKE_UP/ HOST_CLK_REQ PIO[2]/CLK_REQ AIO[0] AIO[1] AIO[2] AIO[3] Test and Debug RESET RESETB SPI_CSB SPI_CLK SPI_MOSI SPI_MISO TEST_EN
B2
C2 N3 L4 M4 N4 Ball B12 E12 C11 C13 D12 B13 B11
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7 x 7 VFBGA Package Information
CODEC AUDIO_IN_P_RIGHT AUDIO_IN_N_RIGHT AUDIO_IN_P_LEFT AUDIO_IN_N_LEFT AUDIO_OUT_N_RIGHT AUDIO_OUT_P_RIGHT AUDIO_OUT_N_LEFT AUDIO_OUT_P_LEFT External Memory Address Interface A[18] A[17] A[16] A[15] A[14] A[13] A[12] A[11] A[10] A[9] A[8] A[7] A[6] A[5] A[4] A[3] A[2] A[1] A[0]
Ball L3 M3 J3 K3 L2 M2 L1 M1 Ball N9 M8 A11 M12 N12 L11 M11 N11 L10 M10 N10 N8 L7 M7 M6 L5 M5 N5 C4
Pad Type Analogue Analogue Analogue Analogue Analogue Analogue Analogue Analogue Pad Type CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state CMOS output, tri-state
Description Microphone input positive (right side) Microphone input negative (right side) Microphone input positive (left side) Microphone input negative (left side) Speaker output negative (right side) Speaker output positive (right side) Speaker output negative (left side) Speaker output positive (left side) Description Address line Address line Address line Address line Address line Address line Address line Address line Address line Address line Address line Address line Address line Address line Address line Address line Address line Address line Address line
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
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7 x 7 VFBGA Package Information
External Memory Data Interface D[15] D[14] D[13] D[12] D[11] D[10] D[9] D[8] D[7] D[6] D[5] D[4] D[3] D[2] D[1] D[0]
Ball A10 C10 B9 A8 C8 B7 A6 B5 B10 A9 C9 B8 A7 B6 A5 C5
Pad Type Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Bi-directional with weak internal pull-down Pad Type CMOS output, tri-state with internal weak pull-up CMOS output, tri-state with internal weak pull-up CMOS output, tri-state with internal weak pull-up
Description
Data line Data line Data line Data line Data line Data line Data line Data line Data line Data line Data line Data line Data line Data line Data line Data line
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
External Memory Interface REB WEB CSB
Ball A4 L9 B4
Description Read enable for external memory (active low) Write enable for external memory (active low) Chip select for external memory (active low)
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7 x 7 VFBGA Package Information
Power Supplies and Control VREG_IN VDD_RADIO VDD_LO VDD_CORE
Ball N7 H2 D1 J2 C7 E13 L8 K2
Pad Type VDD/Regulator input VDD/Regulator sense VDD VDD
Description Linear regulator input Positive supply for RF circuitry
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Positive supply for local oscillator circuitry Positive supply for internal digital circuitry Positive supply for analogue circuitry and 1.8V regulated output. For optimum performance, regulator decoupling and loads should be connected to this ball Positive supply for analogue circuitry and 1.8V regulated output Positive supply for external memory, AIO and extended PIO ports Positive supply for all other digital Input/Output ports (3) Positive supply for PIO and AUX DAC(2) Positive supply for UART/USB ports
VDD_ANA
VDD/Regulator output
VDD_ANA VDD_MEM VDD_PADS VDD_PIO VDD_USB
N6 A13 N13 D11 A2 M13 E2 F2 E3 H1 G2 G3 J1 C6 E11 M9 H3 K1 L6 A1 A12 J13 F3
VDD/Regulator output VDD VDD VDD VDD
VSS_RADIO
VSS
Ground connections for RF circuitry
VSS_LO VSS_CORE VSS_ANA VSS_PADS VSS
Notes:
(1) (2) (3)
VSS VSS VSS VSS VSS
Ground connection for local oscillator Ground connections for internal digital circuitry Ground connections for analogue circuitry Ground connections for digital Input/Output ports Ground connection for internal package shield
Transparent UART port maps directly to main UART port. Positive supply for PIO[3:0] and PIO[11:8]. Positive supply for SPI/PCM ports and PIO[7:4]. Ball C12, D13, G12, H12 Description Leave unconnected
Unconnected Terminals
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Electrical Characteristics
3
Electrical Characteristics
Minimum -40C -0.4V -0.4V -0.4V VSS-0.4V Maximum +150C 2.2V 3.7V 5.6V VDD+0.4V
Absolute Maximum Ratings Rating Storage Temperature Supply Voltage: VDD_RADIO, VDD_LO, VDD_ANA and VDD_CORE Supply Voltage: VDD_MEM, VDD_PADS, VDD_PIO and VDD_USB Supply Voltage: VREG_IN Other Terminal Voltages Recommended Operating Conditions Operating Condition Operating Temperature Range Guaranteed RF performance range
(1)
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Minimum -40C -25C 1.7V 1.7V 2.2V
Maximum +105C +85C 1.9V 3.6V 4.2V(2)
Supply Voltage: VDD_RADIO, VDD_LO, VDD_ANA and VDD_CORE Supply Voltage: VDD_MEM, VDD_PADS, VDD_PIO and VDD_USB Supply Voltage: VREG_IN
Notes:
(1) (2)
Typical figures are given for RF performance between -40C and +105C. The device will operate without damage with VREG_IN as high as 5.6V, however the RF performance is not guaranteed above 4.2V.
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Electrical Characteristics
Input/Output Terminal Characteristics Linear Regulator Normal Operation Output Voltage (Iload = 70 mA) Temperature Coefficient Output Noise(1)(2) Load Regulation (Iload < 100 mA) Settling Time
(1)(3)
Minimum
Typical
Maximum
Unit
1.70 -250 140 5 25
1.78 35
1.85 +250 1 50 50 4.2(6) 350 50
V ppm/C mV rms mV/A s mA A V mV A
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Maximum Output Current Minimum Load Current Input Voltage Dropout Voltage (Iload = 70 mA) Quiescent Current (excluding Ioad, Iload < 1mA) Low Power Mode(4) Quiescent Current (excluding Ioad, Iload < 100A) Disabled Mode
(5)
4
7
10
A
Quiescent Current
Notes:
1.5
2.5
3.5
A
For optimum performance the VDD_ANA ball adjacent to VREG_IN should be used for regulator ouput.
(1) (2) (3) (4) (5) (6)
Regulator output connected to 47nF pure and 4.7F 2.2 ESR capacitors. Frequency range 100Hz to 100kHz. 1mA to 70mA pulsed load. Low power mode is entered and exited automatically when the chip enters/leaves Deep Sleep mode. Regulator is disabled when VREG_IN is either open circuit or driven to the same voltage as VDD_ANA. Operation up to 5.6V is permissible without damage and without the output voltage rising sufficiently to damage the rest of BlueCore3, but output regulation and other specifications are no longer guaranteed at input voltages in excess of 4.2V.
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Electrical Characteristics
Input/Output Terminal Characteristics (Continued) Digital Terminals Input Voltage Levels Minimum Typical Maximum Unit
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
VIL input logic level low VIH input logic level high Output Voltage Levels VOL output logic level low, (lo = 4.0mA), 2.7V VDD 3.0V VOL output logic level low, (lo = 4.0mA), 1.7V VDD 1.9V VOH output logic level high, (lo = -4.0mA), 2.7V VDD 3.0V VOH output logic level high, (lo = -4.0mA), 1.7V VDD 1.9V Input and Tri-state Current with: Strong pull-up Strong pull-down Weak pull-up Weak pull-down I/O pad leakage current CI Input Capacitance
2.7V VDD 3.0V 1.7V VDD 1.9V
-0.4 -0.4 0.7VDD
-
+0.8 +0.4 VDD+0.4
V V V
VDD-0.2 VDD-0.4
-
0.2 0.4 -
V V V V
-100 +10 -5.0 +0.2 -1 1.0
-40 +40 -1.0 +1.0 0 -
-10 +100 -0.2 +5.0 +1 5.0
A A A A A pF
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Electrical Characteristics
Input/Output Terminal Characteristics (Continued) USB Terminals VDD_USB for correct USB operation Input threshold VIL input logic level low VIH input logic level high Input leakage current VSS_PADS < VIN < VDD_USB(1) CI Input capacitance Output Voltage levels To correctly terminated USB Cable VOL output logic level low VOH output logic level high Input/Output Terminal Characteristics (Continued) Power-on reset VDD_CORE falling threshold VDD_CORE rising threshold Hysteresis Input/Output Terminal Characteristics (Continued) Crystal Oscillator Crystal frequency Digital trim range Trim step size
(5) (4) (5)
Minimum 3.1 0.7VDD_USB -1 2.5
Typical
Maximum 3.6
Unit V
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
1 -
0.3VDD_USB 5 10.0
V V A pF
0.0 2.8
-
0.2 VDD_USB
V V
Minimum 1.40 1.50 0.05
Typical 1.50 1.60 0.10
Maximum 1.60 1.70 0.15
Unit V V V
Minimum 8.0 5.0 2.0 870
Typical 6.2 0.1 1500
Maximum 32.0 8.0 2400
Unit MHz pF pF mS
Transconductance Negative resistance(6) External Clock Input frequency(7) Clock input level Allowable jitter XTAL_IN input impedance XTAL_IN input capacitance
(8)
7.5 0.2 -
7
40.0 VDD_ANA 15 -
MHz V pk-pk ps rms k pF
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Electrical Characteristics
Input/Output Terminal Characteristics (Continued) Auxiliary ADC Resolution Input voltage range (LSB size = VDD_ANA/255) Accuracy (Guaranteed monotonic) Offset Gain Error Input Bandwidth Conversion time Sample rate
(2)
Minimum 0 INL DNL -1 0 -1 -0.8 -
Typical 100 2.5 -
Maximum 8 VDD_ANA 1 1 1 0.8 700
Unit Bits V LSB LSB LSB % kHz s Samples/s
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Input/Output Terminal Characteristics (Continued) Auxiliary DAC Resolution Average output step size(3) Output Voltage Voltage range (IO=0mA) Current range Minimum output voltage (IO=100mA) Maximum output voltage (IO=10mA) High Impedance leakage current Offset Integral non-linearity(3) Settling time (50pF load) VSS_PADS -10.0 0.0 VDD_PIO-0.3 -1 -220 -2 Minimum 12.5 Typical 14.5 monotonic (3)
Maximum 8 17.0 VDD_PIO +0.1 0.2 VDD_PIO +1 +120 +2 10
Unit Bits mV V mA V V A mV LSB s
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Electrical Characteristics
Input/Output Terminal Characteristics (Continued) Stereo Audio CODEC Input Stage/Microphone Amplifier Input full scale at maximum gain Input full scale at minimum gain Gain resolution Distortion at 1kHz Input referenced rms noise in 15kHz bandwidth 3dB Bandwidth Input impedance THD+N (microphone input) @ 30mV rms input Analogue to Digital Converter Resolution Input sample rate Signal / (Noise + Distortion), 0 - Fsample /2, with full scale 1kHz tone Fsample = 8kHz Fsample = 11.025kHz Fsample = 16kHz Fsample = 22.050kHz Fsample = 32kHz Fsample = 44.1kHz Digital Gain Digital to Analogue Converter Resolution Output sample rate Gain Resolution Signal / (Noise + Distortion), 0 - 20 kHz, with full scale 1kHz tone Fsample = 8kHz Fsample = 11.025kHz Fsample = 16kHz Fsample = 22.050kHz Fsample = 32kHz Fsample = 44.1kHz Fsample = 48kHz Digital Gain -24 79 78 79 88 90 90 89 21.5 dB dB dB dB dB dB dB dB 8 3 16 48 bits kHz dB -24 84 83 84 83 80 74 21.5 dB dB dB dB dB dB dB 8 16 44.1 bits kHz 8 17 20 -66 4 400 3 -74 mV rms mV rms dB dB V rms kHz k dB Minimum Typical Maximum Unit
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
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Electrical Characteristics
Input/Output Terminal Characteristics (Continued) Output Stage/Loudspeaker Driver Output power into 32 Output voltage full scale swing Output current drive (at full scale swing)
(9) (9)
Minimum 10 16 -
Typical 30 2.0 20 75 -75 -
Maximum 40 O.C. 500
Unit mW pk V pk-pk mA mA dBc pF
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Output full scale current (at reduced swing) Allowed Load: resistive Allowed Load: capacitive
Notes:
Distortion and noise (relative to full scale), THD
VDD_CORE, VDD_RADIO, VDD_LO and VDD_ANA are at 1.8V unless shown otherwise. VDD_PADS, VDD_PIO and VDD_USB are at 3.0V unless shown otherwise. The same setting of the digital trim is applied to both XTAL_IN and XTAL_OUT. Current drawn into a pin is defined as positive, current supplied out of a pin is defined as negative.
(1) (2)
Internal USB pull-up disabled. Access of ADC is through VM function and therefore sample rate given is achieved as part of this function. Specified for an output voltage between 0.2V and VDD_PIO -0.2V. Integer multiple of 250kHz. The difference between the internal capacitance at minimum and maximum settings of the internal digital trim. XTAL frequency = 16MHz; XTAL C0 = 0.75pF; XTAL load capacitance = 8.5pF. Clock input can be any frequency between 8 and 40MHz in steps of 250kHz plus CDMA/3G TCXO frequencies of 7.68, 14.44, 15.36, 16.2, 16.8, 19.2, 19.44, 19.68, 19.8 and 38.4MHz. Clock input can either be sinusoidal or square wave. If the peaks of the signal are below VSS_ANA or above VDD_ANA a DC blocking capacitor is required between the signal and XTAL_IN. For specified THD. Much greater current can be supplied by the loudspeaker driver with compromised THD.
(3) (4) (5)
(6) (7)
(8)
(9)
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Radio Characteristics
4
4.1 4.1.1
Radio Characteristics
Temperature +20C Transmitter
VDD = 1.8V Temperature = +20C Min Typ 6.5 35 0.5 800 -40 -45 165 145 0.9 10 8 9 10 Typ -143 -138 -131 -135 -135 -137 -132 -135 Max Max Bluetooth Specification -6 to +4(4) 16 1000 -20 -40 140_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Radio Characteristics
Maximum RF transmit power(1)(2)(3) RF power control range
(1)(2)
(5)
RF power range control resolution 20dB bandwidth for modulated carrier Adjacent channel transmit power F=F0 2MHz(5) Adjacent channel transmit power F=F0 3MHz f1avg "Maximum Modulation" f2max "Minimum Modulation" f1avg/f2avg Initial carrier frequency tolerance Drift Rate Drift (single slot packet) Drift (five slot packet) Emissions Emitted power in cellular bands measured at chip terminals Output power 4dBm Frequency (GHz) 0.925-0.960 1.570-1.580 1.805-1.880 1.930-1.990 1.930-1.990 1.930-1.990 2.110-2.170 2.110-2.170
Notes:
(1) (2) (3) (4) (5)
Min -
Results are referenced to the single ended port of the baun. Measured according to the Bluetooth v1.2 specification. The firmware maintains the transmit power to be within the Bluetooth v1.2 specification limits. Class 2 RF transmit power range, Bluetooth v1.2 specification. Measured at F0 = 2441MHz.
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Radio Characteristics
4.1.2
Receiver
VDD = 1.8V Temperature = +20C Min (1)(2)
Radio Characteristics
Frequency (GHz) Sensitivity at 0.1% BER for all packet types 2.402 2.441 2.480
Typ -83 -85 -83 3 8 -4 -3 -38 -21 -45 -45 -20 -30 -140 Typ 2 7 6 5 -6 -5 -4 -3 -4 -14
Max Max -
Bluetooth Specification
Unit
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
dBm -70 -20 11 0 0 -30 -20 -40 -40 -9 -39 Modulation GSM GSM GSM GSM W_CDMA GSM GSM GSM GSM W_CDMA dBm dBm dBm dB dB dB dB dB dB dB dB dBm dBm/Hz Units dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm
Maximum received signal at 0.1% BER C/I co-channel Adjacent channel selectivity C/I F=F0 +1MHz Adjacent channel selectivity C/I F=F0 -1MHz
(1)(2) (1)(2)
-
Adjacent channel selectivity C/I F=F0 +2MHz
Adjacent channel selectivity C/I F=F0 -2MHz(1)(2) Adjacent channel selectivity C/I FF0 +3MHz(1)(2) Adjacent channel selectivity C/I FF0 -5MHz Adjacent channel selectivity C/I F=FImage Spurious output level Blocking Continuous power in cellular bands required to block Bluetooth reception (for Bluetooth sensitivity of -67dBm with 0.1% BER) Measured at chip terminals Continuous power in cellular bands required to block Bluetooth reception (for sensitivity of -80dBm with 0.1% BER) measured at chip terminals
Notes:
(4) (1)(2) (3) (1)(2)
Maximum level of intermodulation interferers
Frequency (GHz) 0.824-0.849(5) 0.880-0.915 1.710-1.785 1.850-1.910 1.920-1.980 0.824-0.849
(5)
Min -
0.880-0.915 1.710-1.785 1.850-1.910 1.920-1.980
Results shown are referenced to the single ended port of the RF balun.
(1)
Up to five exceptions are allowed in v1.2 of the Bluetooth specification. BlueCore3-Multimedia External is guaranteed to meet the C/I performance as specified by the Bluetooth specification v1.2. Measured at F = 2441MHz. Measured at f1-f2 = 5MHz. Measurement is performed in accordance with Bluetooth RF test RCV/CA/05/c. i.e. wanted signal at -64dBm. Actual figure is below -140dBm/Hz except for discrete tones at multiples of 800MHz. | 3fBlocking - fBluetooth | > 4MHz.
(2) (3)
(4) (5)
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Radio Characteristics
4.2 4.2.1
Temperature -40C Transmitter
VDD = 1.8V Temperature = -40C
Radio Characteristics
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Min Maximum RF transmit power(1) RF power control range RF power range control resolution 20dB bandwidth for modulated carrier Adjacent channel transmit power F=F0 2MHz(3) (4) Adjacent channel transmit power F=F0 3MHz f1avg "Maximum Modulation" f2max "Minimum Modulation" f2avg / f1avg Initial carrier frequency tolerance Drift Rate Drift (single slot packet) Drift (five slot packet)
Notes:
(1) (3) (4)
Typ 8 35 0.5 800 -40 -45 165 145 0.9 10 8 9 10
Max -
Bluetooth Specification -6 to +4(2) 16 1000 -20 -40 140Unit dBm dB dB kHz dBm dBm kHz kHz kHz kHz/50s kHz kHz
-
BlueCore3-Multimedia External firmware maintains the transmit power to be within the Bluetooth specification v1.2 limits. Class 2 RF transmit power range, Bluetooth specification v1.2. Measured at F0 = 2441MHz. Up to three exceptions are allowed in v1.2 of the Bluetooth specification.
(2) (3) (4)
4.2.2
Receiver
VDD = 1.8V Temperature = -40C Frequency (GHz) Min Typ -85.0 -88.0 -85 1 Max -20 dBm -70 dBm Bluetooth Specification Unit
Radio Characteristics
Sensitivity at 0.1% BER for all packet types Maximum received signal at 0.1% BER
2.402 2.441 2.480
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Radio Characteristics
4.3 4.3.1
Temperature -25C Transmitter
VDD = 1.8V Temperature = -25C
Radio Characteristics
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Min Maximum RF transmit power(1) RF power control range RF power range control resolution 20dB bandwidth for modulated carrier Adjacent channel transmit power F=F0 2MHz(3) (4) Adjacent channel transmit power F=F0 3MHz f1avg "Maximum Modulation" f2max "Minimum Modulation" f2avg / f1avg Initial carrier frequency tolerance Drift Rate Drift (single slot packet) Drift (five slot packet)
Notes:
(1) (3) (4)
Typ 7 35 0.5 800 -40 -45 165 145 0.9 10 8 9 10
Max -
Bluetooth Specification -6 to +4(2) 16 1000 -20 -40 140Unit dBm dB dB kHz dBm dBm kHz kHz kHz kHz/50s kHz kHz
-
BlueCore-Multimedia External firmware maintains the transmit power to be within the Bluetooth specification v1.2 limits. Class 2 RF transmit power range, Bluetooth specification v1.2. Measured at F0 = 2441MHz. Up to three exceptions are allowed in v1.2 of the Bluetooth specification.
(2) (3) (4)
4.3.2
Receiver
VDD = 1.8V Temperature = -25C Frequency (GHz) Min Typ -84.5 -86.5 -84.5 1 Max -20 dBm -70 dBm Bluetooth Specification Unit
Radio Characteristics
Sensitivity at 0.1% BER for all packet types Maximum received signal at 0.1% BER
2.402 2.441 2.480
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Radio Characteristics
4.4 4.4.1
Temperature +85C Transmitter
VDD = 1.8V Temperature = +85C
Radio Characteristics
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Min Maximum RF transmit power(1) RF power control range RF power range control resolution 20dB bandwidth for modulated carrier Adjacent channel transmit power F=F0 2MHz(3) (4) Adjacent channel transmit power F=F0 3MHz f1avg "Maximum Modulation" f2max "Minimum Modulation" f2avg / f1avg Initial carrier frequency tolerance Drift Rate Drift (single slot packet) Drift (five slot packet)
Notes:
(1) (3) (4)
Typ 3 35 0.5 800 -40 -45 165 140 0.9 10 8 9 10
Max -
Bluetooth Specification -6 to +4(2) 16 1000 -20 -40 140Unit dBm dB dB kHz dBm dBm kHz kHz kHz kHz/50s kHz kHz
-
BlueCore3-Multimedia External firmware maintains the transmit power to be within the Bluetooth specification v1.2 limits. Class 2 RF transmit power range, Bluetooth specification v1.2. Measured at F0 = 2441MHz. Up to three exceptions are allowed in v1.2 of the Bluetooth specification.
(2) (3) (4)
4.4.2
Receiver
VDD = 1.8V Temperature = +85C Frequency (GHz) Min Typ -80 -83 -80 5 Max -20 dBm -70 dBm Bluetooth Specification Unit
Radio Characteristics
Sensitivity at 0.1% BER for all packet types Maximum received signal at 0.1% BER
2.402 2.441 2.480
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Radio Characteristics
4.5 4.5.1
Temperature +105C Transmitter
VDD = 1.8V Temperature = +105C
Radio Characteristics
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Min Maximum RF transmit power(1) RF power control range RF power range control resolution 20dB bandwidth for modulated carrier Adjacent channel transmit power F=F0 2MHz(3) (4) Adjacent channel transmit power F=F0 3MHz f1avg "Maximum Modulation" f2max "Minimum Modulation" f2avg / f1avg Initial carrier frequency tolerance Drift Rate Drift (single slot packet) Drift (five slot packet)
Notes:
(1) (3) (4)
Typ 1 35 0.5 800 -403 -45 165 135 0.9 10 8 9 10
Max -
Bluetooth Specification -6 to +4(2) 16 1000 -20 -40 140Unit dBm dB dB kHz dBm dBm kHz kHz kHz kHz/50s kHz kHz
-
BlueCore3-Multimedia External firmware maintains the transmit power to be within the Bluetooth specification v1.2 limits. Class 2 RF transmit power range, Bluetooth specification v1.2. Measured at F0 = 2441MHz. Up to three exceptions are allowed in v1.2 of the Bluetooth specification.
(2) (3) (4)
4.5.2
Receiver
VDD = 1.8V Temperature = +105C Frequency (GHz) Min Typ -80 -82 -80 5 Max -20 dBm -70 dBm Bluetooth Specification Unit
Radio Characteristics
Sensitivity at 0.1% BER for all packet types Maximum received signal at 0.1% BER
2.402 2.441 2.480
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Page 27 of 116
Radio Characteristics
4.6
Power Consumption
Typical Average Current Consumption VDD=1.8V Mode SCO connection HV3 (30ms interval Sniff Mode) (Slave) SCO connection HV3 (30ms interval Sniff Mode) (Master) SCO connection HV3 (No Sniff Mode) (Slave) SCO connection HV1 (Slave) SCO connection HV1 (Master) ACL data transfer 115.2kbps UART no traffic (Master) ACL data transfer 115.2kbps UART no traffic (Slave) ACL data transfer 720kbps UART (Master or Slave) ACL data transfer 720kbps USB (Master or Slave) ACL connection, Sniff Mode 40ms interval, 38.4kbps UART ACL connection, Sniff Mode 1.28s interval, 38.4kbps UART Parked Slave, 1.28s beacon interval, 38.4kbps UART Standby Mode (Connected to host, no RF activity) Reset (RESET high or RESETB low) DSP DSP core (including PM memory access) Minimum (NOP) Maximum (MAC) DSP memory access (DM1 or DM2) CODEC Microphone inputs and ADC / channel DAC and loudspeaker driver, no signal / channel Digital audio processing subsystem
Note:
(1) (1)
Temperature = +20C
Output Power = +4dBm
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Average 21 21 28 42 42 5 22 45 45 3.2 0.45 0.55 47.0 15.0
Unit mA mA mA mA mA mA mA mA mA mA mA mA A A
0.25 0.65 0.15
mA/MIPS mA/MIPS mA/MIPS
0.85 1.4 8
mA mA mA
Power consumption increase is >5% for maximum signal.
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5
RESETB
VDD_PIO
VDD_PADS
RESET
VDD_MEM1
VDD_ANA2 VDD_USB D[15:0] A[18:0] CSB REB
VDD_ANA1
TEST_EN
VREG_IN VDD_RADIO
VDD_CORE
XTAL_OUT WEB VDD_LO In Out Sense Burst Mode Controller External Memory I nterface Mem ory Mapped Control Status USB Dem odulator Memory Management Unit VREG
XTAL_IN
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
BC352239A-ds-001Pc
Baseband and Logic
IQ DEMOD USB_DP USB_DN
PIO[0]/RXEN
Clock G ener ation
RF_IN
LNA
Device Diagram
RSSI ADC Physical Layer Hardware Engine RAM
Synchronous Serial Interface
RF Receiver
SPI_CSB SPI_CLK SPI_MOSI SPI_MISO
IQ MOD
UART
TX_B DAC
RF_B
UART_TX UART_RX UART_RTS UART_CTS
PA
TX_A
RF_A
RF Transmitter
Digital Signal Processor
+45
-45 / N/N+1 Kalimba DSP Fref
RF Synthesiser
S/PDIF Interface
AUX_DAC
AUX DAC Tune Loop Filter
PIO[1]/TXEN
RF Synthesiser Microcontroller
Interrupt Controller RISC Microcontroller Event Timer
Audio Port Interface
PCM & Digital Audio Interface
PCM_OUT / SPDIF_O UT / SD_O UT PCM_IN / SPDIF_IN / SD_IN PCM_SYNC / WS PCM_CLK / SCK
Figure 5.1: BlueCore3-Multimedia External Device Diagram
Stereo Audio CODEC Registers
(c) Cambridge Silicon Radio Limited 2004 Production Information
Programmable I/O
AUDIO_IN_P_LEFT AUDIO_IN_N_LEFT AUDIO_IN_P_RIGHT AUDIO_IN_N_RIG HT AUDIO_OUT_P_LEFT AUDIO_OUT_N_LEFT AUDIO_OUT_P_RIGHT AUDIO_OUT_N_RIG HT
Audio Interface
VSS
AIO[0] AIO[1] AIO[2] AIO[3]
VSS_LO
VSS_PIO
VSS_ANA
VSS_PADS
VSS_CORE
VSS_RADIO
PIO [7]/UART_RX/ CLK_OUT PIO [8] PIO [9] PIO [10] PIO [11]
PIO [2]/CLK_REQ PIO [3]/USB_WAKE_UP/HOST_CLK_REQ PIO [4]/USB_ON/UART_TX PIO [5]/USB_DETACH/UART_RTS PIO [6]/CLK_REQ /UART_CTS
Device Diagram
Page 29 of 116
Description of Functional Blocks
6
6.1
Description of Functional Blocks
RF Receiver
The receiver features a near-zero Intermediate Frequency (IF) architecture that allows the channel filters to be integrated on to the die. Sufficient out-of-band blocking specification at the Low Noise Amplifier (LNA) input allows the radio to be used in close proximity to Global System for Mobile Communications (GSM) and Wideband Code Division Multiple Access (W-CDMA) cellular phone transmitters without being desensitised. The use of a digital Frequency Shift Keying (FSK) discriminator means that no discriminator tank is needed and its excellent performance in the presence of noise allows BlueCore3-Multimedia External to exceed the Bluetooth requirements for co-channel and adjacent channel rejection.
_aiEceEPJjiaiaaECa~ Product Data Sheet _aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
6.1.1
Low Noise Amplifier
The Low Noise Amplifier (LNA) can be configured to operate in single-ended or differential mode. Single-ended mode is used for Class 1 Bluetooth operation; differential mode is used for Class 2 operation.
6.1.2
Analogue to Digital Converter
The Analogue to Digital Converter (ADC) is used to implement fast Automatic Gain Control (AGC). The ADC samples the Received Signal Strength Indicator (RSSI) voltage on a slot-by-slot basis. The front-end LNA gain is changed according to the measured RSSI value, keeping the first mixer input signal within a limited range. This improves the dynamic range of the receiver, improving performance in interference limited environments.
6.2 6.2.1
RF Transmitter IQ Modulator
The transmitter features a direct IQ modulator to minimise the frequency drift during a transmit timeslot, which results in a controlled modulation index. Digital baseband transmit circuitry provides the required spectral shaping.
6.2.2
Power Amplifier
The internal Power Amplifier (PA) has a maximum output power of +6dBm allowing BlueCore3-Multimedia External to be used in Class 2 and Class 3 radios without an external RF PA. Support for transmit power control allows a simple implementation for Class 1 with an external RF PA.
6.2.3
Auxiliary DAC
An 8-bit voltage Auxiliary DAC is provided for power control of an external PA for Class 1 operation.
6.3
RF Synthesiser
The radio synthesiser is fully integrated onto the die with no requirement for an external Voltage Controlled Oscillator (VCO) screening can, varactor tuning diodes, LC resonators or loop filter. The synthesiser is guaranteed to lock in sufficient time across the guaranteed temperature range to meet the Bluetooth v1.2 specification.
6.4
Clock Input and Generation
The reference clock for the system is generated from a TCXO or crystal input between 8 and 40MHz. All internal reference clocks are generated using a phase locked loop, which is locked to the external reference frequency.
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Description of Functional Blocks
6.5 6.5.1
Baseband and Logic Memory Management Unit
The Memory Management Unit (MMU) provides a number of dynamically allocated ring buffers that hold the data which is in transit between the host, the air or Kalimba DSP. The dynamic allocation of memory ensures efficient use of the available Random Access Memory (RAM) and is performed by a hardware MMU to minimise the overheads on the processor during data/voice transfers.
_aiEceEPJjiaiaaECa~ Product Data Sheet _aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
6.5.2
Burst Mode Controller
During radio transmission the Burst Mode Controller (BMC) constructs a packet from header information previously loaded into memory-mapped registers by the software and payload data/voice taken from the appropriate ring buffer in the RAM. During radio reception, the BMC stores the packet header in memory-mapped registers and the payload data in the appropriate ring buffer in RAM. This architecture minimises the intervention required by the processor during transmission and reception.
6.5.3
Physical Layer Hardware Engine DSP
Dedicated logic is used to perform the following:
! ! ! ! ! ! !
Forward error correction Header error control Cyclic redundancy check Encryption Data whitening Access code correlation Audio transcoding
The following voice data translations and operations are performed by the firmware:
! ! ! !
A-law/-law/linear voice data (from host) A-law/-law/Continuously Variable Slope Delta (CVSD) (over the air) Voice interpolation for lost packets Rate mismatches
The hardware supports all optional and mandatory features of Bluetooth v1.2, including AFH and eSCO.
6.5.4
RAM
32Kbytes of on-chip RAM is provided to support the RISC MCU and is shared between the ring buffers used to hold voice/data for each active connection and the general purpose memory required by the Bluetooth stack.
6.5.5
Kalimba DSP RAM
Further on-chip RAM is provided to support the Kalimba DSP as follows:
! ! !
8K x 24-bit for data memory 1 (DM1) 8K x 24-bit for data memory 2 (DM2) 4K x 32-bit for program memory (PM)
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Description of Functional Blocks
6.5.6
External Memory Driver
The External Memory Driver interface can be used to connect to the external Flash memory and also to the optional external RAM for memory-intensive applications.
6.5.7
USB
_aiEceEPJjiaiaaECa~ Product Data Sheet _aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
This is a full speed Universal Serial Bus (USB) interface for communicating with other compatible digital devices. BlueCore3-Multimedia External acts as a USB peripheral, responding to requests from a Master host controller such as a PC.
6.5.8
Synchronous Serial Interface
This is a synchronous serial port interface (SPI) for interfacing with other digital devices. The SPI port can be used for system debugging. It can also be used for programming the Flash memory.
6.5.9
UART
This is a standard Universal Asynchronous Receiver Transmitter (UART) interface for communicating with other serial devices.
6.6
Microcontroller
The microcontroller (MCU), interrupt controller and event timer run the Bluetooth software stack and control the radio and host interfaces. A 16-bit reduced instruction set computer (RISC) microcontroller is used for low power consumption and efficient use of memory.
6.6.1
Programmable I/O
BlueCore3-Multimedia External has a total of 16 (12 digital and 4 analogue) programmable I/O terminals. These are controlled by firmware running on the device.
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Description of Functional Blocks
6.7
Kalimba DSP
The Kalimba DSP is an open platform Kalimba DSP allowing signal processing functions to be performed on over-air data or CODEC data in order to enhance audio applications. Figure 6.1 shows how the Kalimba DSP interfaces to other functional blocks within BlueCore3-Multimedia External.
_aiEceEPJjiaiaaECa~ Product Data Sheet _aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Kalimba DSP Core
MCU Register Interface (including Debug)
Memory Management Unit Of BlueCore3 Subsystem
DSP MMU Port
Registers Data Memory Interface Address Generators ALU
DSP's MCU and FLASH Window Control
Instruction Decode Program Flow Clock Select DEBUG PIO
PIO In/Out IRQ to BlueCore3 Subsystem
DSP Program Control
Programmable Clock < 32MHz
Internal Control Registers MMU Interface Interrupt Controller Timer MCU Window Flash Window
IRQ from BlueCore3 Subsystem 1s Timer Clock
DSP RAMs
DM2 (8K x 24-bit)
DSP Data Memory 2 Interface (DM2)
DM1 (8K x 24-bit)
DSP Data Memory 1 Interface (DM1)
PM (4K x 32-bit)
DSP Program Memory Interface (PM)
Figure 6.1: Kalimba DSP Interface to Internal Functions The key features of the DSP include:
! ! ! ! ! ! ! ! ! ! !
32MIPS performance, 24-bit fixed point DSP Core Single cycle MAC of 24 x 24-bit multiply and 56-bit accumulate 32-bit instruction word Separate program memory and dual data memory, allowing an ALU operation and up to two memory accesses in a single cycle Zero overhead looping and branching Zero overhead circular buffer indexing Single cycle barrel shifter with up to 56-bit input and 24-bit output Multiple cycle divide (performed in the background) Bit reversed addressing Orthogonal instruction set Low overhead interrupt
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Description of Functional Blocks
6.8
Audio Interface
The audio interface circuit consists of a stereo audio CODEC, dual audio inputs and outputs, and a PCM, I2S or SPDIF configurable interface. Figure 6.2 outlines the functional blocks of the interface. The CODEC supports stereo playback and recording of audio signals at multiple sample rates with a resolution of 16-bit. The ADC and the DAC of the CODEC each contain two independent channels. Any ADC or DAC channel can be run at its own independent sample rate.
_aiEceEPJjiaiaaECa~ Product Data Sheet _aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
PCM
PCM Interface
MMU Voice Port
Memory Management Unit
Voice Port
Digital Audio
Digital Audio Interface
MCU Register Interface
Registers
Stereo Audio CODEC Driver
Left DAC Right DAC Left ADC Right ADC
Figure 6.2: Audio Interface The interface for the digital audio bus shares the same pins as the PCM CODEC Interface described in Section 8.8.9. This means that each of the audio busses are mutually exclusive in their usage. The pin out for the PCM interface with alternative pin descriptions can be seen in the device diagram shown in Figure 5.1 and Table 6.1 lists these alternative functions. PCM Interface PCM_OUT PCM_IN PCM_SYNC PCM_CLK SPDIF Interface SPDIF_OUT SPDIF_IN I2S Interface SD_OUT SD_IN WS SCK
Table 6.1: Alternative Functions of the Digital Audio Bus Interface on the PCM Interface
6.8.1
Audio Input and Output
The audio input circuitry consists of a dual audio input that can be configured to be either single ended or fully differential and programmed for either microphone or line input. It has a programmable gain stage for optimisation of different microphones. The audio output circuitry consists of a dual differential class A-B output stage.
6.8.2
Digital Audio Interface
The digital audio interface supports various digital audio bus standard, which include I2S, and the interfaces contained within the IEC 60958 specification such as SPDIF and AES3(1).
Note:
(1)
Subject to firmware support; contact CSR for current status.
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CSR Bluetooth Software Stacks
7
CSR Bluetooth Software Stacks
BlueCore3-Multimedia External is supplied with stack firmware which is compliant with the Bluetooth v1.2 specification and runs on the internal RISC microcontroller.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
The BlueCore3-Multimedia External software architecture allows Bluetooth processing and the application program to be shared in different ways between the internal RISC microcontroller and an external host processor (if any). The upper layers of the Bluetooth stack (above HCI) can be run either on-chip or on the host processor.
7.1
BlueCore HCI Stack
External FLASH HCI LM LC
32KB RAM
Baseband MCU
USB
Host
UART
Host I/O Radio
PCM / SPDIF / I2S 2
Digital Audio Analogue Audio
Microphone or Speaker
Figure 7.1: BlueCore HCI Stack In the implementation shown in Figure 7.1 the internal processor runs the Bluetooth stack up to the Host Controller Interface (HCI). The Host processor must provide all upper layers, including the application.
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CSR Bluetooth Software Stacks
7.1.1
Key Features of the HCI Stack - Standard Bluetooth Functionality
New Bluetooth v1.2 Mandatory Functionality:
! ! ! !
Adaptive Frequency Hopping (AFH), including classifier Faster connection LMP improvements Parameter ranges
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Optional v1.2 functionality supported:
! ! ! !
Extended SCO (eSCO), eV3 +CRC, eV4, eV5 Scatter mode SCO handle Synchronisation
The firmware has been written against the Bluetooth Core Specification v1.2.
!
Bluetooth components: ! ! ! Baseband (including LC) LM HCI
! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! !
Standard USB v1.1 and UART HCI Transport Layers All standard radio packet types Full Bluetooth data rate, up to 723.2kbps asymmetric(1) Operation with up to 7 active slaves(1) Operation as slave to one master while master of several slaves (Scatternet "2.0") Page and Inquiry scanning while slave and master (Scatternet "2.5") Maximum number of simultaneous active ACL connections: 7(2) Maximum number of simultaneous active SCO connections: 3(2) Operation with up to 3 SCO links, routed to one or more slaves All standard SCO voice coding, plus "transparent SCO" Standard operating modes: page, inquiry, page-scan and inquiry-scan All standard pairing, authentication, link key and encryption operations Standard Bluetooth power saving mechanisms: Hold, Sniff and Park modes, including "Forced Hold" Dynamic control of peers' transmit power via LMP Master/Slave switch Broadcast Channel quality driven data rate All standard Bluetooth Test Modes Standard firmware upgrade via USB (DFU)
The firmware's supported Bluetooth features are detailed in the standard Protocol Implementation Conformance Statement (PICS) documents, available from http://www.csr.com.
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CSR Bluetooth Software Stacks
Notes:
(1) (2)
Maximum allowed by Bluetooth v1.2 specification. BlueCore3-Multimedia External supports all combinations of active ACL and SCO channels for both Master and Slave operation, as specified by the Bluetooth v1.2 specification.
7.1.2
Key Features of the HCI Stack - Extra Functionality
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
The firmware extends the standard Bluetooth functionality with the following features:
! !
Supports BlueCore Serial Protocol (BCSP) - a proprietary, reliable alternative to the standard Bluetooth UART Host Transport Provides a set of approximately 50 manufacturer-specific HCI extension commands. This command set (called BCCMD - "BlueCore Command"), provides: ! ! ! ! ! ! Access to the chip's general-purpose PIO port The negotiated effective encryption key length on established Bluetooth links Access to the firmware's random number generator Controls to set the default and maximum transmit powers - these can help minimise interference between overlapping, fixed-location piconets Dynamic UART configuration Radio transmitter enable/disable - a simple command connects to a dedicated hardware switch that determines whether the radio can transmit
! !
The firmware can read the voltage on a pair of the chip's external pins. This is normally used to build a battery monitor, using either VM or host code A block of BCCMD commands provides access to the chip's "persistent store" configuration database (PS). The database sets the device's Bluetooth address, Class of Device, radio (transmit class) configuration, SCO routing, LM, USB and DFU constants, etc. A UART "break" condition can be used in three ways: Presenting a UART break condition to the chip can force the chip to perform a hardware reboot Presenting a break condition at boot time can hold the chip in a low power state, preventing normal initialisation while the condition exists With BCSP, the firmware can be configured to send a break to the host before sending data - normally used to wake the host from a deep sleep state The DFU standard has been extended with public/private key authentication, allowing manufacturers to control the firmware that can be loaded onto their Bluetooth modules A modified version of the DFU protocol allows firmware upgrade via the chip's UART A block of "radio test" or BIST commands allows direct control of the chip's radio. This aids the development of modules' radio designs, and can be used to support Bluetooth qualification. Virtual Machine (VM). The firmware provides the VM environment in which to run application-specific code. Although the VM is mainly used with BlueLab and "RFCOMM builds" (alternative firmware builds providing L2CAP, SDP and RFCOMM), the VM can be used with this build to perform simple tasks such as flashing LED's via the chip's PIO port. Hardware low power modes: shallow sleep and deep sleep. The chip drops into modes that significantly reduce power consumption when the software goes idle. SCO channels are normally routed via HCI (over BCSP). However, up to three SCO channels can be routed over the chip's single PCM port (at the same time as routing any remaining SCO channels over HCI).
!
1. 2. 3.
! ! ! !
! !
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CSR Bluetooth Software Stacks
7.2
Stand-Alone BlueCore3-Multimedia External and Kalimba DSP Applications
Internal RISC Processor Kalimba DSP
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
VM Application Software External FLASH RFCOMM HCI LM LC DM1 8K x 24-bit SDP
DSP Application
DSP Control DM2 8K x 24-bit PM 4K x 32-bit
32KB RAM
Baseband MCU
USB Host UART Host I/O Radio
PCM / SPDIF / I2S 2
Digital Audio Analogue Audio
Microphone or Speaker
Figure 7.2: Kalimba DSP Stack In Figure 7.2, this version of the stack firmware requires no host processor (but can use a host processor for debugging etc. as shown). The software layers for the application software runs on the internal RISC processor in a protected user software execution environment known as a Virtual Machine (VM) and the DSP application code runs from the DSP program memory RAM. The user may write custom application code to run on the BlueCore VM using BlueLabTM software development kit (SDK) supplied with the BlueLab Multimedia and Casira development kits, available separately from CSR. This code will then execute alongside the main BlueCore firmware. The user is able to make calls to the BlueCore firmware for various operations. The execution environment is structured so the user application does not adversely affect the main software routines, thus ensuring that the Bluetooth stack software component does not need re-qualification when the application is changed. Using the VM and the BlueLab SDK the user is able to develop applications such as a cordless headset or other profiles without the requirement of a host controller. BlueLab is supplied with example code including a full implementation of the headset profile.
Note:
Sample applications to control PIO lines can also be written with BlueLab SDK and the VM for the HCI stack.
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CSR Bluetooth Software Stacks
7.3
Host-Side Software
BlueCore3-Multimedia External can be ordered with companion host-side software:
! !
BlueCore3-PC includes software for a full Windows(R)98/ME, Windows 2000 or Windows XP Bluetooth host-side stack together with IC hardware described in this document. BlueCore3-Mobile includes software for a full host-side stack designed for modern ARM based mobile handsets together with IC hardware described in this document.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
7.4
Device Firmware Upgrade
BlueCore3-Multimedia External is supplied with boot loader software, which implements a Device Firmware Upgrade (DFU) capability. This allows new firmware to be uploaded to the Flash memory through BlueCore3-Multimedia External UART or USB ports.
7.5
BCHS Software
BlueCore Embedded Host Software is designed to enable CSR customers to implement Bluetooth functionality into embedded products quickly, cheaply and with low risk. BCHS is developed to work with CSR's family of BlueCore IC's. BCHS is intended for embedded products that have a host processor for running BCHS and the Bluetooth application e.g. a mobile phone or a PDA. BCHS together with the BlueCore IC with embedded Bluetooth core stack (L2CAP, RFCOMM and SDP) is a complete Bluetooth system solution from RF to profiles. BCHS includes most of the Bluetooth intelligence and gives the user a simple API. This makes it possible to develop a Bluetooth product without in-depth Bluetooth knowledge. The BlueCore Embedded Host Software contains 3 elements:
! ! !
Example Drivers (BCSP and proxies) Bluetooth Profile Managers Example Applications
The profiles are qualified which makes the qualification of the final product very easy. BCHS is delivered with source code (ANSI C). With BCHS also come example applications in ANSI C, which makes the process of writing the application easier.
7.6
Additional Software for Other Embedded Applications
When the upper layers of the Bluetooth protocol stack are run as firmware on BlueCore3-Multimedia External, a UART software driver is supplied that presents the L2CAP, RFCOMM and Service Discovery (SDP) APIs to higher Bluetooth stack layers running on the host. The code is provided as `C' source or object code.
7.7
CSR Development Systems
CSR's BlueLab Multimedia and Casira development kits are available to allow the evaluation of the BlueCore3-Multimedia External hardware and software, and as toolkits for developing on-chip and host software.
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Device Terminal Descriptions
8
8.1
Device Terminal Descriptions
RF Ports
The BlueCore3-Multimedia External RF_IN terminal can be configured as either a single ended or differential input. The operational mode is determined by the setting the PS Key PSKEY_TXRX_PIO_CONTROL (0x20).
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
8.1.1 TX_A and TX_B
TX_A and TX_B form a complementary balanced pair. On transmit, their outputs are combined using a balun into the single-ended output required for the antenna. Similarly, on receive, their input signals are combined internally. Both terminals present similar complex impedances that require matching networks between them and the balun. Starting from the substrate (chip side), the outputs can each be modelled as an ideal current source in parallel with a lossy resistance and a capacitor. The bond wire can be represented as series inductance.
BlueCore3-Multimedia External
PA
_
PA
L2 1.5nH
+
RF Switch
R2 10
0.9pF
L3 1.5nH
RF Switch
R3 10
+
LNA
0.9pF
_
Figure 8.1: Circuit TX/RX_A and TX/RX_B
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Device Terminal Descriptions
8.1.2 Transmit Port Impedances for 7 x 7 VFBGA Package (2.4-2.5GHz vs. Temperature)
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Figure 8.2: TX_A Output at Power Setting 35
Figure 8.3: TX_A Output at Power Setting 50
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Device Terminal Descriptions
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Figure 8.4: TX_A Output at Power Setting 63
Figure 8.5: TX_B Output at Power Setting 35
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Device Terminal Descriptions
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Figure 8.6: TX_B Output at Power Setting 50
Figure 8.7: TX_B Output at Power Setting 63
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Device Terminal Descriptions
8.1.3
Receive Port Impedances for 7 x 7 VFBGA Package (2.4-2.5GHz vs. Temperature)
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Figure 8.8: RX_A Balanced Receive Input Impedance
Figure 8.9: RX_B Balanced Receive Input Impedance
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Device Terminal Descriptions
8.1.4
Port 1: Port 2:
Transmit S Parameters
TX_A TX_B
Temperature: +20C Power Level: 50
(1)
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Normalised impedance: 50 Frequency (MHz) 2402 2408 2414 2420 2426 2432 2438 2444 2450 2456 2462 2468 2474 2480 S11
Real Imaginary Real
S21
Imaginary Real
S12
Imaginary Real
S22
Imaginary
-7.99E-02 -8.97E-02 -9.33E-02 -9.76E-02 -1.01E-01 -1.05E-01 -1.09E-01 -1.13E-01 -1.18E-01 -1.21E-01 -1.26E-01 -1.29E-01 -1.33E-01 -1.37E-01
-6.71E-01 -6.82E-01 -6.82E-01 -6.83E-01 -6.83E-01 -6.83E-01 -6.84E-01 -6.85E-01 -6.85E-01 -6.85E-01 -6.85E-01 -6.86E-01 -6.86E-01 -6.86E-01
2.06E-03 -5.02E-03 -5.33E-03 -5.32E-03 -5.89E-03 -6.23E-03 -6.66E-03 -6.90E-03 -7.34E-03 -7.83E-03 -8.27E-03 -8.75E-03 -9.32E-03 -9.80E-03
6.19E-02 5.85E-02 5.83E-02 5.83E-02 5.81E-02 5.80E-02 5.80E-02 5.79E-02 5.80E-02 5.80E-02 5.81E-02 5.81E-02 5.81E-02 5.82E-02
1.03E-02 7.25E-04 5.53E-04 2.06E-04 -1.03E-04 -4.01E-04 -8.28E-04 -1.38E-03 -1.76E-03 -2.25E-03 -2.74E-03 -3.22E-03 -3.80E-03 -4.33E-03
6.30E-02 6.25E-02 6.24E-02 6.22E-02 6.21E-02 6.22E-02 6.19E-02 6.19E-02 6.19E-02 6.19E-02 6.20E-02 6.21E-02 6.22E-02 6.25E-02
-2.44E-02 -2.80E-02 -3.13E-02 -3.48E-02 -3.86E-02 -4.24E-02 -4.63E-02 -5.02E-02 -5.44E-02 -5.80E-02 -6.20E-02 -6.67E-02 -7.00E-02 -7.44E-02
-6.89E-01 -6.85E-01 -6.86E-01 -6.86E-01 -6.87E-01 -6.87E-01 -6.88E-01 -6.89E-01 -6.89E-01 -6.89E-01 -6.90E-01 -6.90E-01 -6.90E-01 -6.92E-01
Table 8.1: Transmit S Parameters
Notes:
(1)
Value assigned to PSKEY_LC_DEFAULT_TX_POWER. S-Parameter data files available upon request.
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8.1.5
Port 1: Port 2:
Balanced Receive S Parameters
RX_A RX_B
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Temperature: +20C Rx in balanced mode Normalised impedance: 50 Frequency (MHz) 2402 2408 2414 2420 2426 2432 2438 2444 2450 2456 2462 2468 2474 2480 S11
Real Imaginary Real
S21
Imaginary Real
S12
Imaginary Real
S22
Imaginary
-5.37E-02 -5.75E-02 -6.11E-02 -6.55E-02 -6.87E-02 -7.33E-02 -7.62E-02 -8.01E-02 -8.45E-02 -8.77E-02 -9.16E-02 -9.48E-02 -9.88E-02 -1.02E-01
-7.53E-01 -7.54E-01 -7.54E-01 -7.55E-01 -7.55E-01 -7.55E-01 -7.56E-01 -7.56E-01 -7.57E-01 -7.57E-01 -7.57E-01 -7.58E-01 -7.59E-01 -7.59E-01
1.57E-02 1.57E-02 1.55E-02 1.56E-02 1.53E-02 1.52E-02 1.50E-02 1.49E-02 1.47E-02 1.44E-02 1.42E-02 1.41E-02 1.39E-02 1.38E-02
3.95E-02 3.94E-02 3.94E-02 3.94E-02 3.95E-02 3.96E-02 3.97E-02 3.96E-02 3.97E-02 3.97E-02 3.99E-02 4.00E-02 4.02E-02 4.02E-02
2.11E-02 2.04E-02 1.97E-02 1.89E-02 1.83E-02 1.77E-02 1.70E-02 1.65E-02 1.60E-02 1.54E-02 1.49E-02 1.42E-02 1.37E-02 1.32E-02
1.75E-02 1.77E-02 1.80E-02 1.84E-02 1.88E-02 1.92E-02 1.95E-02 1.99E-02 2.01E-02 2.04E-02 2.08E-02 2.11E-02 2.17E-02 2.22E-02
2.08E-02 1.74E-02 1.36E-02 9.98E-03 5.80E-03 1.74E-03 -2.01E-03 -5.52E-03 -1.00E-02 -1.37E-02 -1.79E-02 -2.29E-02 -2.62E-02 -3.04E-02
-7.76E-01 -7.78E-01 -7.78E-01 -7.78E-01 -7.79E-01 -7.80E-01 -7.80E-01 -7.80E-01 -7.81E-01 -7.81E-01 -7.82E-01 -7.82E-01 -7.83E-01 -7.85E-01
Table 8.2: Balanced Receiver S Parameters
Note:
S-Parameter data files available upon request
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8.1.6
Single-Ended Input (RF_IN)
This is the single ended RF input from the antenna. The input presents a complex impedance that requires a matching network between the terminal and the antenna. Starting from the substrate (chip) side, the input can be modelled as a lossy capacitor with the bond wire to the ball grid represented as a series inductance.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
The terminal is DC blocked. The DC level must not exceed (VSS_RADIO -0.3V to VDD_RADIO + 0.3V).
BlueCore3-Multimedia External
L1 1.5nH R1 6.8 C1 0.68pF
RF_IN
Figure 8.10: Circuit RF_IN
Note:
Both terminals must be externally DC biased to VDD_RADIO.
8.1.7
Transmit RF Power Control for Class 1 Applications (TX_PWR)
An 8-bit voltage DAC (AUX_DAC) is used to control the amplification level of the external PA for Class 1 operation. The DAC output is derived from the on chip band gap and is virtually independent of temperature and supply voltage. The output voltage is given by: CNTRL _ WORD VDAC = MIN 3.3v x , (VDD _ PIO - 0.3v ) 255 Equation 8.1: Output Voltage with Load Current 10mA for a load current 10mA (sourced from the device). or CNTRL _ WORD VDAC = MIN 3.3v x , VDD _ PIO 255 Equation 8.2: Output Voltage with No Load Current for no load current. BlueCore3-Multimedia External enables the external PA only when transmitting. Before transmitting, the chip normally ramps up the power to the internal PA, then it ramps it down again afterwards. However, if a suitable external PA is used, it may be possible to ramp the power externally by driving the TX_PWR pin on the PA from AUX_DAC.
TX Power
tcarrier Modulation
Figure 8.11: Internal Power Ramping
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The persistent store key (PS Key) PSKEY_TX_GAINRAMP (0x1d), is used to control the delay (in units of s) between the end of the transmit power ramp and the start of modulation. In this period the carrier is transmitted, which gives the transmit circuitry time to fully settle to the correct frequency. Bits[15:8] define a delay, tcarrier, (in units of s) between the end of the transmit power ramp and the start of modulation. In this period the carrier is transmitted, which aids interoperability with some other vendor equipment which is not strictly Bluetooth compliant.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
8.1.8
Control of External RF Components
A PS Key TXRX_PIO_CONTROL (0x209) is used to control external RF components such as a switch, an external PA or an external LNA. PIO[0], PIO[1] and the AUX_DAC can be used for this purpose, as indicated in Table 8.3. TXRX_PIO_CONTROL Value 0 1 2 3 4 AUX_DAC Use PIO[0], PIO[1], AUX_DAC not used to control RF. Power ramping is internal. PIO[0] is high during RX, PIO[1] is high during TX. AUX_DAC not used. Power ramping is internal. PIO[0] is high during RX, PIO[1] is high during TX. AUX_DAC used to set gain of external PA. Power ramping is external. PIO[0] is low during RX, PIO[1] is low during TX. AUX_DAC used to set gain of external PA. Power ramping is external. PIO[0] is high during RX, PIO[1] is high during TX. AUX_DAC used to set gain of external PA. Power ramping is internal. Table 8.3: TXRX_PIO_CONTROL Values
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8.2
External Reference Clock Input (XTAL_IN)
The BlueCore3-Multimedia External RF local oscillator and internal digital clocks are derived from the reference clock at the BlueCore3-Multimedia External XTAL_IN input. This reference may be either an external clock or from a crystal connected between XTAL_IN and XTAL_OUT. The crystal mode is described in Section 8.3.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
8.2.1
External Mode
BlueCore3-Multimedia External can be configured to accept an external reference clock (from another device, such as TCXO) at XTAL_IN by connecting XTAL_OUT to ground. The external clock can either be a digital level square wave or sinusoidal and this may be directly coupled to XTAL_IN without the need for additional components. If the peaks of the reference clock are below VSS_ANA or above VDD_ANA, it must be driven through a DC blocking capacitor (~33pF) connected to XTAL_IN. A digital level reference clock gives superior noise immunity as the high slew rate clock edges have lower voltage to phase conversion. The external clock signal should meet the specifications in Table 8.4. Minimum Frequency Duty cycle Edge Jitter (At Zero Crossing) Signal Level
(1)
Typical 16MHz 50:50 -
Maximum 40MHz 80:20 15ps rms VDD_ANA(2)(3)
7.5MHz 20:80 400mV pk-pk
Table 8.4: External Clock Specifications
Notes:
(1) (2) (3)
The frequency should be an integer multiple of 250kHz except for the CDMA/3G frequencies. VDD_ANA is 1.8V nominal. If the external clock driven through a DC blocking capacitor then maximum allowable amplitude is reduced from VDD_ANA to 800mV pk-pk.
8.2.2
XTAL_IN Impedance in External Mode
The impedance of the XTAL_IN will not change significantly between operating modes, typically 10fF. When transitioning from deep sleep to an active state a spike of up to 1pC may be measured. For this reason it is recommended that a buffered clock input be used.
8.2.3
Clock Timing Accuracy
As Figure 8. indicates, the 250ppm timing accuracy on the external clock is required 7ms after the assertion of the system clock request line. This is to guarantee that the firmware can maintain timing accuracy in accordance with the Bluetooth v1.2 specification. Radio activity may occur after 11ms, therefore at this point, the timing accuracy of the external clock source must be within 20ppm.
Figure 8.11: TCXO Clock Accuracy
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8.2.4
Clock Start-Up Delay
BlueCore3-Multimedia External hardware incorporates an automatic 5ms delay after the assertion of the system clock request signal before running firmware. This is suitable for most applications using an external clock source. However, there may be scenarios where the clock cannot be guaranteed to either exist or be stable after this period. Under these conditions, BlueCore3-Multimedia External firmware provides a software function which will extend the system clock request signal by a period stored in PSKEY_CLOCK_STARTUP_DELAY. This value is set in milliseconds from 5-31ms. This PS Key allows the designer to optimise a system where clock latencies may be longer than 5ms while still keeping the current consumption of BlueCore3-Multimedia External as low as possible. BlueCore3-Multimedia External will consume about 2mA of current for the duration of PSKEY_CLOCK_STARTUP_DELAY before activating the firmware.
Actual Allowable Clock Presence Delay on XTAL_IN vs. PSKey Setting
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
30.0
25.0
20.0
D elay (m s)
15.0
10.0
5.0
0.0 0.0 5.0 10.0 15.0 PSKEY_CLOCK_STARTUP_DELAY 20.0 25.0 30.0
Figure 8.12: Actual Allowable Clock Presence Delay on XTAL_IN vs. PS Key Setting
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8.2.5
Input Frequencies and PS Key Settings
BlueCore3-Multimedia External should be configured to operate with the chosen reference frequency. This is accomplished by setting the PS Key PSKEY_ANA_FREQ (0x1fe) for all frequencies with an integer multiple of 250KHz. The input frequency default setting in BlueCore3-Multimedia External is 26MHz.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
The following CDMA/3G TCXO frequencies are also catered for: 7.68, 14.4, 15.36, 16.2, 16.8, 19.2, 19.44, 19.68, 19.8 and 38.4MHz. This is accomplished by also changing PSKEY PLLX_FREQ_REF (0xabc). Reference Crystal Frequency (MHz) 7.68 14.40 15.36 16.20 16.80 19.20 19.44 19.68 19.80 38.40 n x 250kHz +26.00 Default PSKEY_ANA_FREQ (0x1fe) (Units of 1kHz) 7680 14400 15360 16200 16800 19200 19440 19680 19800 38400 26000
Table 8.5: PS Key Values for CDMA/3G phone TCXO Frequencies
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Device Terminal Descriptions
8.3
Crystal Oscillator (XTAL_IN, XTAL_OUT)
The BlueCore3-Multimedia External RF local oscillator and internal digital clocks are derived from the reference clock at the BlueCore3-Multimedia External XTAL_IN input. This reference may be either an external clock or from a crystal connected between XTAL_IN and XTAL_OUT. The external reference clock mode is described in Section 8.2.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
8.3.1
XTAL Mode
BlueCore3-Multimedia External contains a crystal driver circuit. This operates with an external crystal and capacitors to form a Pierce oscillator.
BlueCore3-Multimedia External gm -
Ctrim
Cint
C trim
Ct2
Ct1
Figure 8.13: Crystal Driver Circuit Figure 8. shows an electrical equivalent circuit for a crystal. The crystal appears inductive near its resonant frequency. It forms a resonant circuit with its load capacitors.
Cm Lm Rm
Co
Figure 8.14: Crystal Equivalent Circuit The resonant frequency may be trimmed with the crystal load capacitance. BlueCore3-Multimedia External contains variable internal capacitors to provide a fine trim. The BlueCore3-Multimedia External driver circuit is a transconductance amplifier. A voltage at XTAL_IN generates a current at XTAL_OUT. The value of transconductance is variable and may be set for optimum performance.
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XTAL_OUT
XTAL_IN
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Device Terminal Descriptions
8.3.2
Load Capacitance
For resonance at the correct frequency the crystal should be loaded with its specified load capacitance, which is defined for the crystal. This is the total capacitance across the crystal viewed from its terminals. BlueCore3-Multimedia External provides some of this load with the capacitors Ctrim and Cint. The remainder should be from the external capacitors labelled Ct1 and Ct2. Ct1 should be three times the value of Ct2 for best noise performance. This maximises the signal swing, hence slew rate at XTAL_IN, to which all on chip clocks are referred. Crystal load capacitance, Cl is calculated with the following equation: Cl = Cint + C trim C C + t1 t 2 2 C t1 + C t 2
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Equation 8.3: Load Capacitance Where: Ctrim = 3.4pF nominal (Mid range setting) Cint = 1.5pF
Note:
Cint does not include the crystal internal self capacitance, it is the driver self capacitance.
8.3.3
Frequency Trim
BlueCore3-Multimedia External enables frequency adjustments to be made. This feature is typically used to remove initial tolerance frequency errors associated with the crystal. Frequency trim is achieved by adjusting the crystal load capacitance with on chip trim capacitors, Ctrim. The value of Ctrim is set by a 6-bit word in the Persistent Store Key PSKEY_ANA_FTRIM (0x1f6). Its value is calculated thus: Ctrim = 110 fF x PSKEY_ANA_FTRIM Equation 8.4: Trim Capacitance There are two Ctrim capacitors, which are both connected to ground. When viewed from the crystal terminals, they appear in series so each least significant bit (LSB) increment of frequency trim presents a load across the crystal of 55fF. The frequency trim is described by Equation 8.5: (Fx ) = pullability x 55 x 10 -3 (ppm / LSB ) Fx Equation 8.5: Frequency Trim Where Fx is the crystal frequency and pullability is a crystal parameter with units of ppm/pF. Total trim range is 63 times the value above. If not specified, the pullability of a crystal may be calculated from its motional capacitance with Equation 8.6:
Cm (Fx ) = Fx (C) 4(Cl + C0 )2
Equation 8.6: Pullability Where: C0 = Crystal self capacitance (shunt capacitance) Cm = Crystal motional capacitance (series branch capacitance in crystal model). See Figure 8..
Note:
It is a Bluetooth requirement that the frequency is always within 20ppm. The trim range should be sufficient to pull the crystal within 5ppm of the exact frequency. This leaves a margin of 15ppm for frequency drift
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Device Terminal Descriptions
with ageing and temperature. A crystal with an ageing and temperature drift specification of better than 15ppm is required.
8.3.4
Transconductance Driver Model
The crystal and its load capacitors should be viewed as a transimpedance element, whereby a current applied to one terminal generates a voltage at the other. The transconductance amplifier in BlueCore3-Multimedia External uses the voltage at its input, XTAL_IN, to generate a current at its output, XTAL_OUT. Therefore, the circuit will oscillate if the transconductance, transimpedance product is greater than unity. For sufficient oscillation amplitude, the product should be greater than 3. The transconductance required for oscillation is defined by the following relationship:
gm >
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
(2Fx ) Rm ((C0 + Cint )(Ct1 + Ct 2 + 2Ctrim ) + (Ct1 + Ctrim )(Ct 2 + Ctrim ))2
2
3(Ct1 +Ctrim )(Ct 2 + Ctrim )
Equation 8.7: Transconductance Required for Oscillation BlueCore3-Multimedia External guarantees a transconductance value of at least 2mA/V at maximum drive level.
Notes:
More drive strength is required for higher frequency crystals, higher loss crystals (larger Rm) or higher capacitance loading. Optimum drive level is attained when the level at XTAL_IN is approximately 1V pk-pk. The drive level is determined by the crystal driver transconductance, by setting the Persistent Store KEY_XTAL_LVL (0x241).
8.3.5
Negative Resistance Model
An alternative representation of the crystal and its load capacitors is a frequency dependent resistive element. The driver amplifier may be considered as a circuit that provides negative resistance. For oscillation, the value of the negative resistance must be greater than that of the crystal circuit equivalent resistance. Although the BlueCore3-Multimedia External crystal driver circuit is based on a transimpedance amplifier, an equivalent negative resistance may be calculated for it with the following formula in Equation 8.8:
Rneg > gm (2Fx )2 (C0 + Cint )((Ct1 + Ct 2 + 2Ctrim ) + (Ct1 + Ctrim )(Ct 2 + Ctrim ))2 3(Ct1 +Ctrim )(Ct 2 + Ctrim )
Equation 8.8: Equivalent Negative Resistance This formula shows the negative resistance of the BlueCore3-Multimedia External driver as a function of its drive strength. The value of the driver negative resistance may be easily measured by placing an additional resistance in series with the crystal. The maximum value of this resistor (oscillation occurs) is the equivalent negative resistance of the oscillator. Minimum Frequency Initial Tolerance Pullability 8MHz Typical 16MHz 25ppm 20ppm/pF Maximum 32MHz -
Table 8.6: Crystal Oscillator Specification
8.3.6
Crystal PS Key Settings
See Table 8.5.
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8.3.7
Crystal Oscillator Characteristics
Crystal Load Capacitance and Series Resistance Limits with Crystal Frequency
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
1000.0
Max Xtal Rm Value (ESR), (Ohm)
100.0
10.0 2.5 3.5 4.5 5.5 6.5 7.5 Load Capacitance (pF) 8.5 9.5 10.5 11.5 12.5
8 MHz 20 MHz 32 MHz
12 MHz 24 MHz
16 MHz 28 MHz
Figure 8.15: Crystal Load Capacitance and Series Resistance Limits with Crystal Frequency
Note:
Graph shows results for BlueCore3-Multimedia External crystal driver at maximum drive level. Conditions: Ctrim = 3.4pF centre value Crystal Co = 2pF Transconductance setting = 2mA/V Loop gain = 3 Ct1/Ct2 = 3
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Device Terminal Descriptions
BlueCore3-Multimedia External XTAL Driver Characteristics
0.007
0.006
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
0.005 Transconductance (S)
0.004
0.003
0.002
0.001
0.000 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PSKEY_XTAL_LVL
Gm Typical Gm Minimum Gm Maximum
Figure 8.16: Crystal Driver Transconductance vs. Driver Level Register Setting
Note:
Drive level is set by Persistent Store Key PSKEY_XTAL_LVL (0x241).
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Negative Resistance for 16 MHz Xtal
10000
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Max -ve Resistance ()
1000
100
10 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 Drive Level Setting
Typical Minimum Maximum
Figure 8.17: Crystal Driver Negative Resistance as a Function of Drive Level Setting Crystal parameters:
! !
Crystal frequency 16MHz (Please refer to your software build release note for frequencies supported); Crystal C0 = 0.75pF
Circuit parameters:
! ! !
Note:
Ctrim = 8pF, maximum value Ct1,Ct2 = 5pF (3.9pF plus 1.1 pF stray) (Crystal total load capacitance 8.5pF)
This is for a specific crystal and load capacitance.
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8.4
Off-Chip Program Memory
The external memory port provides a facility to interface up to 8Mbits of 16-bit external memory. This off-chip storage is used to store BlueCore3-Multimedia External settings and program code. Flash is the storage mechanism typically used by BlueCore3-Multimedia External modules, however external masked-ROM may also be used if the host takes over responsibility for storing configuration data.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
The external memory port consists of 16 bi-directional data lines, D[15:0]; 19 output address lines, A[18:0] and three active low output control signals (WEB, CEB, REB). WEB is asserted when data is written to external memory. REB is asserted when data is read from external memory and the chip select line. CSB is asserted when any data transfer (read or write) is required. All of the external memory port connections are implemented using CMOS technology and use standard 0V and VDD_MEM (1.8-3.6V) signalling levels. Parameter Data width Minimum total capacity Maximum access time Value 16-bit 4Mbit (256kWord) 50ns @85C 10pF load Table 8.7: Flash Device Hardware Requirements In addition to these hardware requirements, particular care should be taken to ensure that the sector organisation of the extended memory has the correct format. A sector is defined as an individually erasable area of external Flash. It is important to make sure that external memory devices meet certain minimum specifications. In addition particular care should be taken to ensure that the sector organisation of the extended memory has the correct format.
Note:
The document "Selection of Flash Memory for Use with BlueCore", (bcore-an-001Pd), provides guidance on the selection of suitable flash devices for all BlueCore devices and should be read in conjuction with this section.
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8.4.1
Minimum Flash Specification
The flash device used with BlueCore3-Multimedia External must meet the following criteria:
! ! ! ! ! ! ! !
Either standard or extended form of the JEDEC (AMD/Fujitsu/SST) or Intel command set. Access time must be 50ns @85C 10pF load. Write strobe of 100ns. Accessible in word mode, i.e., via a 16-bit data bus. Support changing different bits within each word from 1 to 0 in at least two separate programming operations. Programming and erase times must have fixed upper limits. Must be bottom boot or uniform sector. Must have independently erasable sectors with at least the following boundaries (see Memory Map for more information). Word Address Size (kWords) 8 4 4 16 32 32 Don't care
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
0x00000 - 0x01FFF 0x02000 - 0x02FFF 0x03000 - 0x03FFF 0x04000 - 0x07FFF 0x08000 - 0x0FFFF 0x10000 - 0x17FFF 0x18000 - ...
Table 8.8: Flash Sector Boundaries
Important Note:
Satisfaction of these criteria is not sufficient for a particular device to be used; it must also support the Common Flash Interface described in Section 8.4.2 or be supported in the BlueCore3-Multimedia External firmware and host-side tools.
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8.4.2
Common Flash Interface
Many modern flash devices support the Common Flash Interface (CFI) that enables device information to be interrogated in a standard manner. HCIStack1.1v13.2 and later versions of the BlueCore firmware can query this interface to adapt automatically to work with a wide variety of additional flash devices, without requiring explicit support for each device type.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
For a flash device to be compatible, it must satisfy both the minimum requirements detailed in Section 8.4.1, Minimum Requirements, and the following additional requirements:
! !
The device must support the CFI, as defined by JEDEC standard JESD68. The device must return one of the following codes for either the Primary or Alternative Algorithm Command Set (offset 0x13b or 0x17 of the Query Structure Output respectively): Code Description Intel/Sharp Extended Command Set AMD/Fujitsu Standard Command Set Intel Standard Command Set AMD/Fujitsu Extended Command Set Table 8.9: Common Flash Interface Algorithm Command Set Codes
0x0001 0x0002 0x0003 0x0701
!
The device must return one of the following patterns of Erase Block Region Information (beginning at offset 0x2d of the Query Structure Output): Number of Erase Blocks 128, 256, 512 or 1024 Block Size 4kbytes
Erase Block Region 1
Table 8.10: Erase Block Region Information for Uniform 2kword Sectors Erase Block Region 1 Number of Erase Blocks 256, 512, 1024 or 2048 Block Size 2kbytes
Table 8.11: Erase Block Region Information for Uniform 1kword Sectors Erase Block Region 1 2 Number of Erase Blocks 8 7, 15, 31 or 63 Block Size 8kbytes 64kbytes
Table 8.12: Erase Block Region Information for 8 x 4kword, n x 32kword Sectors Erase Block Region 1 2 3 4 Number of Erase Blocks 1 2 1 7, 15, 31 or 63 Block Size 16kbytes 8kbytes 32kbytes 64kbytes
Table 8.13: Erase Block Region Information for 1 x 8kword, 2 x 4kword, 1 x 16kword, n x 32kword Sectors If any of these criteria is not met, then the device will not work unless the device is supported by the BlueCore3-Multimedia External firmware.
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8.4.3
Memory Timing
Memory Write Cycle Symbol twc tdat:su tdat:hd taddr:su twe:low Parameter Write cycle time Data set-up time Data hold time Address set-up time WEB low Minimum(1) 300 150 150 150 100 Table 8.14: Memory Write Cycle
Note:
(1)
Typical -
Maximum(1) -
Unit
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
ns ns ns ns ns
Valid for temperatures between -40C and +105C.
twc A[18:0] Address Valid
CSB
tdat:hd
t addr:su WEB
twe:low
REB
t dat:su D[15:0] Data Valid
Figure 8.18: Memory Write Cycle
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Memory Read Cycle Symbol trc taa tre tdat:hd Parameter Read cycle time Address access time Read enable access time Data hold time from address line Minimum(1) 114 0 Table 8.15: Memory Read Cycle
Note:
(1)
Typical 125 -
Maximum(1) 110 110 -
Unit ns ns
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
ns ns
Valid for temperatures between -40C and +105C.
trc A[18:0] taa
CSB
REB
tre WEB
tdat:hd D[15:0] Data Valid Data Valid
Figure 8.19: Memory Read Cycle
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8.5
UART Interface
BlueCore3-Multimedia External Universal Asynchronous Receiver Transmitter (UART) interface provides a (1) simple mechanism for communicating with other serial devices using the RS232 protocol .
BlueCore3-Multimedia External
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
UART_TX UART_RX UART_RTS UART_CTS
Figure 8.20: Universal Asynchronous Receiver Four signals are used to implement the UART function, as shown in Figure 8.. When BlueCore3-Multimedia External is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The remaining two signals, UART_CTS and UART_RTS, can be used to implement RS232 hardware flow control where both are active low indicators. All UART connections are implemented using CMOS technology and have signalling levels of 0V and VDD_PADS. UART configuration parameters, such as Baud rate and packet format, are set using BlueCore3-Multimedia External software.
Notes:
In order to communicate with the UART at its maximum data rate using a standard PC, an accelerated serial port adapter card is required for the PC.
(1)
Uses RS232 protocol but voltage levels are 0V to VDD_USB, (requires external RS232 transceiver chip). Possible Values Minimum Maximum 1200 Baud (2%Error) 9600 Baud (1%Error) 1.5MBaud (1%Error) RTS/CTS or None None, Odd or Even 1 or 2 8 Table 8.16: Possible UART Settings
Parameter
Baud Rate Flow Control Parity Number of Stop Bits Bits per channel
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The UART interface is capable of resetting BlueCore3-Multimedia External upon reception of a break signal. A Break is identified by a continuous logic low (0V) on the UART_RX terminal, as shown in Figure 8.. If tBRK is longer than the value, defined by the PS Key PSKEY_HOST_IO_UART_RESET_TIMEOUT, (0x1a4), a reset will occur. This feature allows a host to initialise the system to a known state. Also, BlueCore3-Multimedia External can emit a Break character that may be used to wake the Host.
t UART RX
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
BRK
Figure 8.21: Break Signal
Note:
The DFU boot loader must be loaded into the Flash device before the UART or USB interfaces can be used. This initial flash programming can be done via the SPI. Table 8. shows a list of commonly used Baud rates and their associated values for the Persistent Store Key PSKEY_UART_BAUD_RATE (0x204). There is no requirement to use these standard values. Any Baud rate within the supported range can be set in the Persistent Store Key according to the formula in Equation 8.9.
Baud Rate = PSKEY_UART _BAUD_RATE 0.004096
Equation 8.9: Baud Rate
Persistent Store Value Baud Rate Hex 1200 2400 4800 9600 19200 38400 57600 76800 115200 230400 460800 921600 1382400 0x0005 0x000a 0x0014 0x0027 0x004f 0x009d 0x00ec 0x013b 0x01d8 0x03b0 0x075f 0x0ebf 0x161e Dec 5 10 20 39 79 157 236 315 472 944 1887 3775 5662 1.73% 1.73% 1.73% -0.82% 0.45% -0.18% 0.03% 0.14% 0.03% 0.03% -0.02% 0.00% -0.01% Error
Table 8.17: Standard Baud Rates
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8.5.1
UART Bypass
RESET RXD CTS RTS TXD UART_TX UART_RTS UART_CTS UART_RX PIO4 PIO5 PIO6 PIO7 TX RTS CTS RX
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Host Processor
UART
Another Device
BlueCore3-Multimedia External
Test Interface
Figure 8.22: UART Bypass Architecture
8.5.2
UART Configuration While RESET is Active
The UART interface for BlueCore3-Multimedia External while the chip is being held in reset is tri-state. This will allow the user to daisy chain devices onto the physical UART bus. The constraint on this method is that any devices connected to this bus must tri-state when BlueCore3-Multimedia External reset is de-asserted and the firmware begins to run.
8.5.3
UART Bypass Mode
Alternatively, for devices that do not tri-state the UART bus, the UART bypass mode on BlueCore3-Multimedia External can be used. The default state of BlueCore3-Multimedia External after reset is de-asserted, this is for the host UART bus to be connected to the BlueCore3-Multimedia External UART, thereby allowing communication to BlueCore3-Multimedia External via the UART. In order to apply the UART bypass mode, a BCCMD command will be issued to BlueCore3-Multimedia External upon this, it will switch the bypass to PIO[7:4] as shown in Figure 8.. Once the bypass mode has been invoked, BlueCore3-Multimedia External will enter the deep sleep state indefinitely. In order to re-establish communication with BlueCore3-Multimedia External, the chip must be reset so that the default configuration takes affect. It is important for the host to ensure a clean Bluetooth disconnection of any active links before the bypass mode is invoked. Therefore it is not possible to have active Bluetooth links while operating the bypass mode.
8.5.4
Current Consumption in UART Bypass Mode
The current consumption for a device in UART Bypass Mode is equal to the values quoted for a device in standby mode.
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8.6
USB Interface
BlueCore3-Multimedia External devices contain a full speed (12Mbits/s) USB interface that is capable of driving a USB cable directly. No external USB transceiver is required. The device operates as a USB peripheral, responding to requests from a master host controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of USB endpoints implemented can behave as specified in the USB section of the Bluetooth specification v1.2 or alternatively can appear as a set of endpoints appropriate to USB audio devices such as speakers. As USB is a Master/Slave oriented system (in common with other USB peripherals), BlueCore3-Multimedia External only supports USB Slave operation.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
8.6.1
USB Data Connections
The USB data lines emerge as pins USB_DP and USB_DN. These terminals are connected to the internal USB I/O buffers of the BlueCore3-Multimedia External and therefore have a low output impedance. To match the connection to the characteristic impedance of the USB cable, resistors must be placed in series with USB_DP / USB_DN and the cable.
8.6.2
USB Pull-Up Resistor
BlueCore3-Multimedia External features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when BlueCore3-Multimedia External is ready to enumerate. It signals to the PC that it is a full speed (12Mbit/s) USB device. The USB internal pull-up is implemented as a current source, and is compliant with Section 7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loaded with a 15k 5% pull-down resistor (in the hub/host) when VDD_PADS=3.1V. This presents a Thevenin resistance to the host of at least 900. Alternatively, an external 1.5k pull-up resistor can be placed between a PIO line and D+ on the USB cable. The firmware must be alerted to which mode is used by setting PS Key PSKEY_USB_PIO_PULLUP appropriately. The default setting uses the internal pull-up resistor.
8.6.3
Power Supply
The USB specification dictates that the minimum output high voltage for USB data lines is 2.8V. To safely meet the USB specification, the voltage on the VDD_USB supply terminals must be an absolute minimum of 3.1V. CSR recommends 3.3V for optimal USB signal quality.
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8.6.4
Self-Powered Mode
In self-powered mode, the circuit is powered from its own power supply and not from the VBUS (5V) line of the USB cable. It draws only a small leakage current (below 0.5mA) from VBUS on the USB cable. This is the easier mode for which to design for, as the design is not limited by the power that can be drawn from the USB hub or root port. However, it requires that VBUS be connected to BlueCore3-Multimedia External via a resistor network (Rvb1 and Rvb2), so BlueCore3-Multimedia External can detect when VBUS is powered up. BlueCore3-Multimedia External will not pull USB_DP high when VBUS is off. Self-powered USB designs (powered from a battery or PSU) must ensure that a PIO line is allocated for USB pull-up purposes. A 1.5K 5% pull-up resistor between USB_DP and the selected PIO line should be fitted to the design. Failure to fit this resistor may result in the design failing to be USB compliant in self-powered mode. The internal pull-up in BlueCore is only suitable for bus-powered USB devices i.e. dongles.
BlueCore3-Multimedia External
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
PIO USB_DP
1.5K 5% Rs D+ Rs DR vb1 VBUS R vb2 GND
USB_DN USB_ON
Figure 8.23: USB Connections for Self-Powered Mode The terminal marked USB_ON can be any free PIO pin. The PIO pin selected must be registered by setting PSKEY_USB_PIO_VBUS to the corresponding pin number.
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8.6.5
Bus-Powered Mode
In bus-powered mode the application circuit draws its current from the 5V VBUS supply on the USB cable. BlueCore3-Multimedia External negotiates with the PC during the USB enumeration stage about how much current it is allowed to consume.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
For Class 2 Bluetooth applications, CSR recommends that the regulator used to derive 3.3V from VBUS is rated at 100mA average current and should be able to handle peaks of 120mA without foldback or limiting. In buspowered mode, BlueCore3-Multimedia External requests 100mA during enumeration. For Class 1 Bluetooth applications, the USB power descriptor should be altered to reflect the amount of power required. This is accomplished by setting the PS Key PSKEY_USB_MAX_POWER (0x2c6). This is higher than for a Class 2 application due to the extra current drawn by the Transmit RF PA. When selecting a regulator, be aware that VBUS may go as low as 4.4V. The inrush current (when charging reservoir and supply decoupling capacitors) is limited by the USB specification (see USB specification v1.1, Section 7.2.4.1). Some applications may require soft start circuitry to limit inrush current if more than 10F is present between VBUS and GND. The 5V VBUS line emerging from a PC is often electrically noisy. As well as regulation down to 3.3V and 1.8V, applications should include careful filtering of the 5V line to attenuate noise that is above the voltage regulator bandwidth. Excessive noise on the 1.8V supply to the analogue supply pins of BlueCore3-Multimedia External will result in reduced receive sensitivity and a distorted RF transmit signal.
BlueCore3-Multimedia External Rs USB_DP Rs USB_DN R vb1 USB_ON VBUS DD+
GND
Voltage Regulator
Figure 8.24: USB Connections for Bus-Powered Mode
Note:
USB_ON is shared with BlueCore3-Multimedia External PIO terminals. Identifier Rs Rvb1 Rvb2 Value 27 nominal 22k 5% 47k 5% Function Impedance matching to USB cable VBUS ON sense divider VBUS ON sense divider
Table 8.18: USB Interface Component Values
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8.6.6
Suspend Current
All USB devices must permit the USB controller to place them in a USB Suspend mode. While in USB Suspend, bus-powered devices must not draw more than 0.5mA from USB VBUS (self-powered devices may draw more than 0.5mA from their own supply). This current draw requirement prevents operation of the radio by buspowered devices during USB Suspend.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
The voltage regulator circuit itself should draw only a small quiescent current (typically less than 100A) to ensure adherence to the suspend current requirement of the USB specification. This is not normally a problem with modern regulators. Ensure that external LEDs and/or amplifiers can be turned off by BlueCore3-Multimedia External. The entire circuit must be able to enter the suspend mode. (For more details on USB Suspend, see separate CSR documentation).
8.6.7
Detach and Wake_Up Signalling
BlueCore3-Multimedia External can provide out-of-band signalling to a host controller by using the control lines called `USB_DETACH' and `USB_WAKE_UP'. These are outside the USB specification (no wires exist for them inside the USB cable), but can be useful when embedding BlueCore3-Multimedia External into a circuit where no external USB is visible to the user. Both control lines are shared with PIO pins and can be assigned to any PIO pin by setting the PS Keys PSKEY_USB_PIO_DETACH and PSKEY_USB_PIO_WAKEUP to the selected PIO number. USB_DETACH is an input which, when asserted high, causes BlueCore3-Multimedia External to put USB_DN and USB_DP in a high impedance state and turned off the pull-up resistor on DP. This detaches the device from the bus and is logically equivalent to unplugging the device. When USB_DETACH is taken low, BlueCore3-Multimedia External will connect back to USB and await enumeration by the USB host. USB_WAKE_UP is an active high output (used only when USB_DETACH is active) to wake up the host and allow USB communication to recommence. It replaces the function of the software USB WAKE_UP message (which runs over the USB cable), and cannot be sent while BlueCore3-Multimedia External is effectively disconnected from the bus.
10ms max 10ms max
USB_DETACH 10ms max No max
USB_WAKE_UP
Port_Impedance USB_DP USB_DN USB_PULL_UP Disconnected
Figure 8.25: USB_DETACH and USB_WAKE_UP Signal
8.6.8
USB Driver
A USB Bluetooth device driver is required to provide a software interface between BlueCore3-Multimedia External and Bluetooth software running on the host computer. Suitable drivers are available from http://www.csrsupport.com.
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8.6.9
USB 1.1 Compliance
BlueCore3-Multimedia External is qualified to the USB specification v1.1, details of which are available from http://www.usb.org. The specification contains valuable information on aspects such as PCB track impedance, supply inrush current and product labelling.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Although BlueCore3-Multimedia External meets the USB specification, CSR cannot guarantee that an application circuit designed around the chip is USB compliant. The choice of application circuit, component choice and PCB layout all affect USB signal quality and electrical characteristics. The information in this document is intended as a guide and should be read in association with the USB specification, with particular attention being given to Chapter 7. Independent USB qualification must be sought before an application is deemed USB compliant and can bear the USB logo. Such qualification can be obtained from a USB plugfest or from an independent USB test house. Terminals USB_DP and USB_DN adhere to the USB specification 2.0 (Chapter 7) electrical requirements.
8.6.10 USB 2.0 Compatibility
BlueCore3-Multimedia External is compatible with USB v2.0 host controllers; under these circumstances the two ends agree the mutually acceptable rate of 12Mbits/s according to the USB v2.0 specification.
8.7
Serial Peripheral Interface
BlueCore3-Multimedia External uses 16-bit data and 16-bit address serial peripheral interface, where transactions may occur when the internal processor is running or is stopped. This section details the considerations required when interfacing to BlueCore3-Multimedia External via the four dedicated serial peripheral interface terminals. Data may be written or read one word at a time or the auto increment feature may be used to access blocks.
8.7.1
Instruction Cycle
The BlueCore3-Multimedia External is the slave and receives commands on SPI_MOSI and outputs data on SPI_MISO. The instruction cycle for a SPI transaction is shown in Table 8.. 1 2 3 4 5 Reset the SPI interface Write the command word Write the address Write or read data words Termination Hold SPI_CSB high for two SPI_CLK cycles Take SPI_CSB low and clock in the 8 bit command Clock in the 16-bit address word Clock in or out 16-bit data word(s) Take SPI_CSB high Table 8.19: Instruction Cycle for an SPI Transaction With the exception of reset, SPI_CSB must be held low during the transaction. Data on SPI_MOSI is clocked into the BlueCore3-Multimedia External on the rising edge of the clock line SPI_CLK. When reading, BlueCore3-Multimedia External will reply to the master on SPI_MISO with the data changing on the falling edge of the SPI_CLK. The master provides the clock on SPI_CLK. The transaction is teminated by taking SPI_CSB high. Sending a command word and the address of a register for every time it is to be read or written is a significant overhead, especially when large amounts of data are to be transferred. To overcome this BlueCore3-Multimedia External offers increased data transfer efficiency via an auto increment operation. To invoke auto increment, SPI_CSB is kept low, which auto increments the address, while providing an extra 16 clock cycles for each extra word to be written or read.
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8.7.2
Writing to BlueCore3-Multimedia External
To write to BlueCore3-Multimedia External, the 8-bit write command (00000010) is sent first (C[7:0]) followed by a 16-bit address (A[15:0]). The next 16-bits (D[15:0]) clocked in on SPI_MOSI are written to the location set by the address (A). Thereafter for each subsequent 16-bits clocked in, the address (A) is incremented and the data written to consecutive locations until the transaction terminates when SPI_CSB is taken high.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Reset Write_Command SPI_CSB Address(A) Data(A) Data(A+1) etc
End of Cycle
SPI_CLK
SPI_MOSI
C7
C6
C1
C0
A15
A14
A1
A0
D15
D14
D1
D0
D15
D14
D1
D0
D15
D14
D1
D0
Don't Care
SPI_MISO
Processor State
MISO Not Defined During Write
Processor State
Figure 8.26: Write Operation
8.7.3
Reading from BlueCore 3-Multimedia External
Reading from BlueCore3-Multimedia External is similar to writing to it. An 8-bit read command (00000011) is sent first (C[7:0]), followed by the address of the location to be read (A[15:0]). BlueCore3-Multimedia External then outputs on SPI_MISO a check word during T[15:0] followed by the 16-bit contents of the addressed location during bits D[15:0]. The check word is composed of {command, address [15:8]}. The check word may be used to confirm a read operation to a memory location. This overcomes the problems encountered with typical serial peripheral interface slaves, whereby it is impossible to determine whether the data returned by a read operation is valid data or the result of the slave device not responding. If SPI_CSB is kept low, data from consecutive locations is read out on SPI_MISO for each subsequent 16 clocks, until the transaction terminates when SPI_CSB is taken high.
Reset Read_Command SPI_CSB Address(A) Check_Word Data(A) Data(A+1) etc End of Cycle
SPI_CLK
SPI_MOSI
C7
C6
C1
C0 A15 A14
A1
A0
Don't Care
SPI_MISO
Processor State
MISO Not Defined During Address
T15 T14
T1
T0
D15 D14
D1
D0 D15 D14
D1
D0
D15 D14
D1
D0
Processor State
Figure 8.27: Read Operation
8.7.4
Multi Slave Operation
BlueCore3-Multimedia External should not be connected in a multi slave arrangement by simple parallel connection of slave MISO lines. When BlueCore3-Multimedia External is deselected (SPI_CSB = 1), the SPI_MISO line does not float, instead, BlueCore3-Multimedia External outputs 0 if the processor is running or 1 if it is stopped.
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8.8
Stereo Audio Interface
The main features of the interface are:
! ! ! ! !
Stereo and mono analogue input for voice band and audio band Stereo and mono analogue output for voice band and audio band Support for stereo digital audio bus standards such as I2S Support for IEC-60958 standard stereo digital audio bus standards i.e. S/PDIF and AES3/EBU Support for PCM interfaces including PCM master CODECs that require an external system clock
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
AUDIO_IN_P_LEFT Input Amplifier AUDIO_IN_N_LEFT -ADC
LP Filter AUDIO_OUT_P_LEFT AUDIO_OUT_N_LEFT Output Amplifier DAC
Digital Circuitry AUDIO_IN_P_RIGHT Input Amplifier AUDIO_IN_N_RIGHT -ADC
LP Filter AUDIO_OUT_P_RIGHT AUDIO_OUT_N_RIGHT Output Amplifier DAC
Figure 8.28: Stereo CODEC Audio Input and Output Stages The stereo audio CODEC uses a fully differential architecture in the analogue signal path, which results in low noise sensitivity and good power supply rejection while effectively doubling the signal amplitude. It operates from a single power-supply of 1.8V and uses a minimum of external components.
Important Notes:
To avoid any confusion with respect to stereo operation this data sheet explicitly states which is the left and right channel for audio input and output. With respect to software and any registers, channel 0 or channel A represents the left channel and channel 1 or channel B represents the right channel for both input and output. For mono operation this data sheet uses the left channel for standard mono operation for audio input and output and with respect to software and any registers, channel 0 or channel A represents the standard mono channel for audio input and output. In mono operation the second channel which is the right channel, channel 1 or channel B could be used as a second mono channel if required and this channel will be known as the auxilliary mono channel for audio input and output.
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8.8.1
Stereo CODEC Setup
The configuration and control of the ADC is through VM functions which are described in appropriate BlueLab Multimedia documentation. This section covers an overview of the parameters that can be set up using the VM functions.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
The Kalimba DSP can communicate its requirements of the CODEC to the MCU and hence the VM by exchange of messages. The messages used between the Kalimba DSP and the embedded MCU are based on interrupts: one interrupt between the MCU and Kalimba DSP and one interrupt between the Kalimba DSP and the MCU. Message content is transmitted using shared memory. There are VM and DSP library functions to send and receive messages; for further details refer to BlueLab Multimedia documentation.
8.8.2
ADC
The ADC consists of two second order Sigma Delta converters allowing two separate channels that are identical in functionality, as shown in Figure 8..
8.8.3
ADC Sample Rate Selection and Warping
Each ADC supports the following sample rates:
! ! ! ! ! ! !
8kHz 11.025kHz 16kHz 22.05kHz 24kHz 32kHz 44.1kHz
One of the main concerns for stereo wireless music applications is the ability to keep sample rates for the CODECs at both ends of the wireless link in synchronisation. A VM function adjusts the sample rate using a `warping' function to tune the sample rate to the required value. The ADC warp function allows the sample rate to 17 be changed by 3%, in steps of 1/2 , or 7.6 ppm. The warp function preserves the signal quality - the distortion introduced when warping the sample rate is negligible.
8.8.4
ADC Gain
The ADC contains two gain stages for each channel, an analogue and a digital gain stage. The digital gain stage has a programmable selection value in the range of 0 to 15 with the associated ADC gain settings summarised in Table 8.20.
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Gain Selection Value 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
ADC Digital Gain Setting (dB) 0 3.5 6 9.5 12 15.5 18 21.5 -24 -20.5 -18 -14.5 -12 -8.5 -6 -2.5 Table 8.20: ADC Digital Gain Rate Selection
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
The ADC analogue amplifier is a two stage amplifier. The first stage of the analogue amplifier is responsible for selecting the correct gain for either microphone input or line input and therefore has two gain settings, one for the microphone and one for the line input, see Section 8.8.24 and Section 8.8.25 for details on the microphone and line inputs respectively. In simple terms the first stage amplifier has a selectable 20dB gain stage for the microphone and this creates the dual programmable gain required for the microphone or the line input. The equivalent block diagram for the two stage is shown in Figure 8.10.
2 Differential
20dB Gain Selection. Note: Input Impedance Function of Mode Selection
Microphone
Line
3dB x 7 Steps 2
A
2 Differential
Ref (0.66V)
Differential
First Stage
Second Stage
Figure 8.10: First Stage of ADC Analogue Amplifier Block Diagram The second stage of the analogue amplifier shown in Figure 8.10 has a programmable gain with seven individual 3dB steps. In simple terms, by combining the 20dB gain selection of the microphone input with the seven individual 3dB gain steps, the overall range of the analogue amplifier is approximately -4dB to 40dB. The overall gain control of the ADC is controlled by the a VM function and this setting is a combined function of the digital and analogue amplifier settings, so that the fullscale range of the input to the ADC is kept to approximately 400mV rms
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8.8.5
DAC
The DAC consists of two second order Sigma Delta converters allowing two separate channels that are identical in functionality as shown in Figure 8..
8.8.6
DAC Sample Rate Selection and Warping
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Each DAC supports the following samples rates:
! ! ! ! ! ! ! !
48kHz 44.1kHz 32kHz 24kHz 22.050kHz 16kHz 11.025kHz 8kHz
Like the ADC, one of the main concerns for the DAC used in stereo wireless music applications is, the ability to keep sample rates for the CODECs at both ends of the wireless link in synchronisation. A VM function adjusts the sample rate using a `warping' function to tune the sample rate to the required value. The DAC warp function allows the sample rate to be changed by 3%, in steps of 1/217, or 7.6 ppm. The warp function preserves the signal quality - the distortion introduced when warping the sample rate is negligible.
8.8.7
DAC Gain
The DAC contains two gain stages for each channel, a digital and an analogue gain stage. The digital gain stage has a programmable selection value in the range of 0 to 15 with associated DAC gain settings summarised by Table 8.3. Gain Selection Value 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DAC Digital Gain Setting (dB) 0 3.5 6 9.5 12 15.5 18 21.5 -24 -20.5 -18 -14.5 -12 -8.5 -6 -2.5 Table 8.3: DAC Digital Gain Rate Selection
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The DAC analogue amplifier unlike the ADC is a single stage amplifier with the same structure as the second stage of the ADC analogue amplifier as shown in Figure 8.10. The structure of the DAC analogue amplifier is similar to the second stage of the ADC analogue amplifier, consisting of programmable gain with seven individual 3dB steps. The overall gain control of the DAC is controlled by the a VM function and this setting is a combined function of the digital and analogue amplifier settings, therefore for a 1V rms nominal digital output signal from the digital gain stage of the DAC, the following approximate output values of the analogue amplifier of the DAC can be expected: Analogue Gain Setting +3dB 0dB -3dB -6dB -9dB -12dB -15dB -18dB Output Voltage 1.40V 1.00V 0.72V 0.50V 0.36V 0.25V 0.18V 0.13V Table 8.4: DAC Analogue Gain Settings
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
8.8.8
Mono Operation
Mono operation is single channel operation of the stereo CODEC. The left channel represents the single mono channel for audio in and audio out. In mono operation the right channel is auxilliary mono channel that may be used in dual mono channel operation. See Section 8.8 for an important note on stereo and mono definitions.
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8.8.9
PCM CODEC Interface
Pulse Code Modulation (PCM) is a standard method used to digitise audio (particularly voice) for transmission over digital communication channels. Through its PCM interface, BlueCore3-Multimedia External has hardware support for continual transmission and reception of PCM data, thus reducing processor overhead for wireless headset applications. BlueCore3-Multimedia External offers a bi directional digital audio interface that routes directly into the baseband layer of the on chip firmware. It does not pass through the HCI protocol layer. Hardware on BlueCore3-Multimedia External allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any one time. BlueCore3-Multimedia External can operate as the PCM interface Master generating an output clock of 128, 256 or 512kHz. When configured as PCM interface slave it can operate with an input clock up to 2048kHz. BlueCore3-Multimedia External is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments. It supports 13 or 16-bit linear, 8-bit -law or A-law companded sample formats at 8ksamples/s and can receive and transmit on any selection of three of the first four slots following PCM_SYNC. The PCM configuration options are enabled by setting the PS Key PS KEY_PCM_CONFIG32 (0x1b3). BlueCore3-Multimedia External interfaces directly to PCM audio devices including the following:
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
! ! ! ! ! !
Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices OKI MSM7705 four channel A-law and -law CODEC Motorola MC145481 8-bit A-law and -law CODEC Motorola MC145483 13-bit linear CODEC STW 5093 and 5094 14-bit linear CODECs BlueCore3-Multimedia External is also compatible with the Motorola SSITM interface
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8.8.10 PCM Interface Master/Slave
When configured as the Master of the PCM interface, BlueCore3-Multimedia External generates PCM_CLK and PCM_SYNC.
BlueCore3-Multimedia External
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
PCM_OUT
PCM_IN
PCM_CLK
128/256/512kHz
PCM_SYNC
8kHz
Figure 8.11: BlueCore3-Multimedia External as PCM Interface Master When configured as the Slave of the PCM interface, BlueCore3-Multimedia External accepts PCM_CLK rates up to 2048kHz.
BlueCore3-Multimedia External
PCM_OUT
PCM_IN
PCM_CLK
Upto 2048kHz
PCM_SYNC
8kHz
Figure 8.12: BlueCore3-Multimedia External as PCM Interface Slave
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Device Terminal Descriptions
8.8.11 Long Frame Sync
Long Frame Sync is the name given to a clocking format that controls the transfer of PCM data words or samples. In Long Frame Sync, the rising edge of PCM_SYNC indicates the start of the PCM word. When BlueCore3-Multimedia External is configured as PCM Master, generating PCM_SYNC and PCM_CLK, then PCM_SYNC is 8-bits long. When BlueCore3-Multimedia External is configured as PCM Slave, PCM_SYNC may be from two consecutive falling edges of PCM_CLK to half the PCM_SYNC rate, i.e. 62.5s long.
PCM_SYNC
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
PCM_CLK
PCM_OUT
1
2
3
4
5
6
7
8
PCM_IN
Undefined
1
2
3
4
5
6
7
8
Undefined
Figure 8.13: Long Frame Sync (Shown with 8-bit Companded Sample) BlueCore3-Multimedia External samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT may be configured to be high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge.
8.8.12 Short Frame Sync
In Short Frame Sync the falling edge of PCM_SYNC indicates the start of the PCM word. PCM_SYNC is always one clock cycle long.
PCM_SYNC
PCM_CLK
PCM_OUT
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
PCM_IN
Undefined
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
Undefined
Figure 8.14: Short Frame Sync (Shown with 16-bit Sample) As with Long Frame Sync, BlueCore3-Multimedia External samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT may be configured to be high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge.
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Device Terminal Descriptions
8.8.13 Multi Slot Operation
More than one SCO connection over the PCM interface is supported using multiple slots. Up to three SCO connections can be carried over any of the first four slots.
LONG_PCM_SYNC
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Or SHORT_PCM_SYNC
PCM_CLK
PCM_OUT
1
2
3
4
5
6
78
1
2
3
4
5
6
7
8
PCM_IN
Do Not Care 1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8 Do Not Care
Figure 8.15: Multi Slot Operation with Two Slots and 8-bit Companded Samples
8.8.14 GCI Interface
BlueCore3-Multimedia External is compatible with the General Circuit Interface, a standard synchronous 2B+D ISDN timing interface. The two 64Kbps B channels can be accessed when this mode is configured.
PCM_SYNC
PCM_CLK
PCM_OUT
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
PCM_IN
Do Not C a re
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
Do Not C a re
B1 Channel
B2 Channel
Figure 8.16: GCI Interface The start of frame is indicated by the rising edge of PCM_SYNC and runs at 8kHz. With BlueCore3-Multimedia External in Slave mode, the frequency of PCM_CLK can be up to 4.096MHz.
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Device Terminal Descriptions
8.8.15 Slots and Sample Formats
BlueCore3-Multimedia External can receive and transmit on any selection of the first four slots following each sync pulse. Slot durations can be either 8 or 16 clock cycles. Duration's of 8 clock cycles may only be used with 8-bit sample formats. Durations of 16 clocks may be used with 8, 13 or 16-bit sample formats.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
BlueCore3-Multimedia External supports 13-bit linear, 16-bit linear and 8-bit -law or A-law sample formats. The sample rate is 8ksamples/s. The bit order may be little or big endian. When 16-bit slots are used, the 3 or 8 unused bits in each slot may be filled with sign extension, padded with zeros or a programmable 3-bit audio attenuation compatible with some Motorola CODECs.
Sign Extension PCM_OUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
8-Bit Sample A 16-bit slot with 8-bit companded sample and sign extension selected.
8-Bit Sample PCM_OUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Zeros Padding A 16-bit slot with 8-bit companded sample and zeros padding selected.
Sign Extension PCM_OUT 1 2 3 4 5 6 7 8 9 10 13-Bit Sample A 16-bit slot with 13-bit linear sample and sign extension selected. 11 12 13 14 15 16
13-Bit Sample PCM_OUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Audio Gain A 16-bit slot with 13-bit linear sample and audio gain selected. 16
Figure 8.17: 16-Bit Slot Length and Sample Formats
8.8.16 Additional Features
BlueCore3-Multimedia External has a mute facility that forces PCM_OUT to be 0. In Master mode, PCM_SYNC may also be forced to 0 while keeping PCM_CLK running which some CODECS use to control power down.
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Device Terminal Descriptions
8.8.17 PCM Timing Information
Symbol Parameter 4MHz DDS generation. Selection of frequency is programmable, see Table 8.7 fmclk PCM_CLK frequency 48MHz DDS generation. Selection of frequency is programmable, see Table 8.8 and Section 8.8.19 4MHz DDS generation 4MHz DDS generation 48MHz DDS generation 30 10 Min Typ 128 256 512 kHz Max Unit
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
2.9
-
kHz
tmclkh tmclkl tdmclksynch tdmclkpout tdmclklsyncl tdmclkhsyncl tdmclklpoutz tdmclkhpoutz tsupinclkl thpinclkl
(1) (1)
PCM_SYNC frequency PCM_CLK high PCM_CLK low PCM_CLK jitter
980 730
8 21 20 20 20 20 20 20 -
kHz ns ns ns pk-pk ns ns ns ns ns ns ns ns
Delay time from PCM_CLK high to PCM_SYNC high Delay time from PCM_CLK high to valid PCM_OUT Delay time from PCM_CLK low to PCM_SYNC low (Long Frame Sync only) Delay time from PCM_CLK high to PCM_SYNC low Delay time from PCM_CLK low to PCM_OUT high impedance Delay time from PCM_CLK high to PCM_OUT high impedance Set-up time for PCM_IN valid to PCM_CLK low Hold time for PCM_CLK low to PCM_IN invalid Table 8.5: PCM Master Timing
Note:
(1)
Assumes normal system clock operation. Figures will vary during low power modes, when system clock speeds are reduced.
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Device Terminal Descriptions
t t PCM_SYNC
dmclksynch
dmclklsyncl
t
dmclkhsyncl
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
f t PCM_CLK
mclkh
mlk
t
mclkl
t t PCM_OUT
dmclkpout
dmclklpoutz
t ,t
r
f
t LSB (MSB)
dmclkhpoutz
MSB (LSB)
t PCM_IN
supinclkl
t
hpinclkl
MSB (LSB)
LSB (MSB)
Figure 8.18: PCM Master Timing Long Frame Sync
t dmclksynch PCM_SYNC t dmclkhsyncl
fmlk t mclkh PCM_CLK t mclkl
t dmclklpoutz t dmclkpout PCM_OUT MSB (LSB) tr ,t f LSB (MSB) t dmclkhpoutz
t supinclkl PCM_IN
t hpinclkl LSB (MSB)
MSB (LSB)
Figure 8.19: PCM Master Timing Short Frame Sync
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8.8.18 PCM Slave Timing
Symbol fsclk fsclk tsclkl tsclkh thsclksynch tsusclksynch tdpout tdsclkhpout tdpoutz tsupinsclkl thpinsclkl Parameter PCM clock frequency (Slave mode: input) PCM clock frequency (GCI mode) PCM_CLK low time PCM_CLK high time Hold time from PCM_CLK low to PCM_SYNC high Set-up time for PCM_SYNC high to PCM_CLK low Delay time from PCM_SYNC or PCM_CLK whichever is later, to valid PCM_OUT data (Long Frame Sync only) Delay time from CLK high to PCM_OUT valid data Delay time from PCM_SYNC or PCM_CLK low, whichever is later, to PCM_OUT data line high impedance Set-up time for PCM_IN valid to CLK low Hold time for PCM_CLK low to PCM_IN invalid Table 8.6: PCM Slave Timing Min 64 128 200 200 30 30 30 30 Typ Max 2048 4096 20 20 20 Unit kHz kHz ns ns ns ns ns ns ns ns ns
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Device Terminal Descriptions
f t PCM_CLK
sclkh
sclk
t
tsclkl
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
t PCM_SYNC
hsclksynch
t
susclksynch
t t PCM_OUT
dpout
dpoutz
t
dsclkhpout
t ,t
r
f
t
dpoutz
MSB (LSB)
LSB (MSB)
t PCM_IN
supinsclkl
t
hpinsclkl
MSB (LSB)
LSB (MSB)
Figure 8.20: PCM Slave Timing Long Frame Sync
fsclk t sclkh PCM_CLK t tsclkl
t susclksynch PCM_SYNC
t hsclksynch
t dsclkhpout PCM_OUT MSB (LSB)
tr ,t f LSB (MSB)
t dpoutz
t dpoutz
t supinsclkl PCM_IN
t hpinsclkl LSB (MSB)
MSB (LSB)
Figure 8.21: PCM Slave Timing Short Frame Sync
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Device Terminal Descriptions
8.8.19 PCM_CLK and PCM_SYNC Generation
BlueCore3-Multimedia External has two methods of generating PCM_CLK and PCM_SYNC in master mode. The first is generating these signals by Direct Digital Synthesis (DDS) from BlueCore3-Multimedia External internal 4MHz clock (which is used in BlueCore2-External). Using this mode limits PCM_CLK to 128, 256 or 512kHz and PCM_SYNC to 8kHz. The second is generating PCM_CLK and PCM_SYNC by DDS from an internal 48MHz clock which allows a greater range of frequencies to be generated with low jitter but consumes more power. This second method is selected by setting bit `48M_PCM_CLK_GEN_EN' in PSKEY_PCM_CONFIG32. When in this mode and with long frame sync, the length of PCM_SYNC can be either 8 or 16 cycles of PCM_CLK, determined by `LONG_LENGTH_SYNC_EN' in PSKEY_PCM_CONFIG32. The Equation 8.10 describes PCM_CLK frequency when being generated using the internal 48MHz clock:
f= CNT _ RATE x 24MHz CNT _ LIMIT
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Equation 8.10: PCM_CLK Frequency When Being Generated Using the Internal 48MHz clock The frequency of PCM_SYNC relative to PCM_CLK can be set using following equation:
f= PCM _ CLK SYNC _ LIMIT x 8
Equation 8.11: PCM_SYNC Frequency Relative to PCM_CLK CNT_RATE, CNT_LIMIT and SYNC_LIMIT are set using PSKEY_PCM_LOW_JITTER_CONFIG. As an example, to generate PCM_CLK at 512kHz with PCM_SYNC at 8kHz, set PSKEY_PCM_LOW_JITTER_CONFIG to 0x08080177.
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Device Terminal Descriptions
8.8.20 PCM Configuration
The PCM configuration is set using two PS Keys, PSKEY_PCM_CONFIG32 and PSKEY_PCM_LOW_JITTER_CONFIG. The following tables detail these PS Keys. PSKEY_PCM_CONFIG32. The default for this key is 0x00800000 i.e. first slot following sync is active, 13-bit linear voice format, long frame sync and interface master generating 256kHz PCM_CLK from 4MHz internal clock with no tristating of PCM_OUT. PSKEY_PCM_LOW_JITTER_CONFIG is described in Table 8.8. Name SLAVE_MODE_EN Bit Position 0 1 Description Set to 0. 0 selects Master mode with internal generation of PCM_CLK and PCM_SYNC. 1 selects Slave mode requiring externally generated PCM_CLK and PCM_SYNC. 0 selects long frame sync (rising edge indicates start of frame), 1 selects short frame sync (falling edge indicates start of frame). Set to 0. 0 selects padding of 8 or 13-bit voice sample into a 16bit slot by inserting extra LSBs, 1 selects sign extension. When padding is selected with 13-bit voice sample, the 3 padding bits are the audio gain setting; with 8-bit samples, the 8 padding bits are zeroes. 0 transmits and receives voice samples MSB first, 1 uses LSB first. 0 drives PCM_OUT continuously, 1 tri-states PCM_OUT immediately after the falling edge of PCM_CLK in the last bit of an active slot, assuming the next slot is not active. 0 tristates PCM_OUT immediately after the falling edge of PCM_CLK in the last bit of an active slot, assuming the next slot is also not active. 1 tristates PCM_OUT after the rising edge of PCM_CLK. 0 enables PCM_SYNC output when master, 1 suppresses PCM_SYNC whilst keeping PCM_CLK running. Some CODECS utilise this to enter a low power state. 1 enables GCI mode. 1 forces PCM_OUT to 0. 0 sets PCM_CLK and PCM_SYNC generation via DDS from internal 4 MHz clock, as for BlueCore2-External. 1 sets PCM_CLK and PCM_SYNC generation via DDS from internal 48 MHz clock. 0 sets PCM_SYNC length to 8 PCM_CLK cycles and 1 sets length to 16 PCM_CLK cycles. Only applies for long frame sync and with 48M_PCM_CLK_GEN_EN set to 1. Set to 0b00000. Selects 128 (0b01), 256 (0b00), 512 (0b10) kHz PCM_CLK frequency when master and 48M_PCM_CLK_GEN_EN (bit 11) is low. Default is `0001'. Ignored by firmware. Selects between 13 (0b00), 16 (0b01), 8 (0b10) bit sample with 16 cycle slot duration or 8 (0b11) bit sample with 8 cycle slot duration.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
SHORT_SYNC_EN
2
SIGN_EXTEND_EN
3 4
LSB_FIRST_EN TX_TRISTATE_EN
5 6
TX_TRISTATE_RISING_EDGE_EN
7
SYNC_SUPPRESS_EN
8
GCI_MODE_EN MUTE_EN 48M_PCM_CLK_GEN_EN
9 10 11
LONG_LENGTH_SYNC_EN
12
MASTER_CLK_RATE
[20:16] [22:21]
ACTIVE_SLOT SAMPLE_FORMAT
[26:23] [28:27]
Table 8.7: PSKEY_PCM_CONFIG32 Description
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Device Terminal Descriptions
Name CNT_LIMIT CNT_RATE SYNC_LIMIT
Bit Position [12:0] [23:16] [31:24]
Description Sets PCM_CLK counter limit. Sets PCM_CLK count rate. Sets PCM_SYNC division relative to PCM_CLK.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Table 8.8: PSKEY_PCM_LOW_JITTER_CONFIG Description
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8.8.21 Digital Audio Bus
The digital audio interface supports the industry standard formats for I2S, left-justified (LJ) or right-justified(RJ)(1). The interface shares the same pins as the PCM interface as shown in Table 6.1 and the timing diagram is shown in Figure 8.22.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
WS
Left Channel
Right Channel
SCK
SD_IN/OUT
MSB
LSB
MSB Left-Justified Mode
LSB
WS
Left Channel
Right Channel
SCK
SD_IN/OUT
MSB
LSB
MSB
LSB
Right-Justified Mode WS
Left Channel
Right Channel
SCK
SD_IN/OUT
MSB
LSB I2S Mode
MSB
LSB
Figure 8.22: Digital Audio Interface Modes The internal representation of audio samples within BlueCore3-Multimedia External is 16-bit and data on SD_OUT is limited to 16-bit per channel. On SD_IN, if more than 16-bit per channel is present will round th considering the 17 bit. SCK typically operates 64 x WS frequency and cannot be less than 36 x WS.
Note:
(1)
Subject to firmware support; contact CSR for current status.
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Device Terminal Descriptions
Symbol tch tcl topd tssu tsh tisu tih
Parameter SCK Frequency WS Frequency SCK high time SCK low time SCK to SD_OUT delay WS to SCK high set-up time WS to SCK high hold time SD_IN to SCK high set-up time SD_IN to SCK high hold time
Minimum
Typical
Maximum 6.2 96
Unit MHz kHz ns ns ns ns ns ns ns
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Table 8.9: Digital Audio Interface Slave Timing
WS(Input)
tssu t ch SCK(Input) t cl
t sh
topd SD_OUT
t isu SD_IN
Figure 8.23: Digital Audio Interface Slave Timing
t ih
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Device Terminal Descriptions
Symbol topd tspd tisu tih
Parameter SCK Frequency WS Frequency SCK to SD_OUT delay SCK to WS delay SD_IN to SCK high set-up time SD_IN to SCK high hold time
Minimum
Typical
Maximum 6.2 96
Unit MHz kHz
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
ns ns ns ns
Table 8.10: Digital Audio Interface Master Timing
WS(Output) t spd
SCK(Output)
t opd SD_OUT
t isu SD_IN
Figure 8.24: Digital Audio Interface Master Timing
t ih
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Device Terminal Descriptions
8.8.22 IEC 60958 Interface
The IEC 60958 interface is a digital audio interface that uses bi-phase coding to minimise the DC content of the transmitted signal and allows the receiver to decode the clock information from the transmitted signal. The IEC 60958 specification is based on the two industry standards AES/EBU and the Sony and Philips interface specification SPDIF. The interface is compatible with IEC 60958-1, IEC 60958-3 and IEC 60958-4(1).
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Note:
(1)
Subject to firmware support; contact CSR for current status.
The SPDIF interface signals are SPDIF_IN and SPDIF_OUT and are shared on the PCM interface pins as shown in Figure 5.1. The input and output stages of the SPDIF pins can interface either 75 coaxial cable with an RCA connector or there is an option to use an optical link that uses Toslink optical components. Typical output and input stage interfaces for the coaxial solution interface is shown in Figure 8.25 and Figure 8.26 and the equivalent optical solution is shown in Figure 8.27 and Figure 8.28.
74HCU04
SPDIF_OUT
74HCU04 74HCU04
10nF
100
RCA Connector
SPDIF Output
75
74HCU04
Figure 8.25: Example Circuit for SPDIF Interface with Coaxial Output
Note:
The 100 and 75 resistors are dependent on the supply voltage and therefore subject to change
10K RCA Connector
10nF
100
SPDIF Input
75 74HCU04 74HCU04
SPDIF_IN
Figure 8.26: Example Circuit for SPDIF Interface with Coaxial Input
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Device Terminal Descriptions
SPDIF_OUT
+5V 4.7
4
3 2 100nF 8.2K 1
TOTX173
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Figure 8.27: Example Circuit for SPDIF Interface with Optical Output
Level Translator
1 3 100nF 2 47 H
SPDIF_IN
+5V
TORX173
4 5 6
Figure 8.28: Example Circuit for SPDIF Interface with Optical Input
8.8.23 Audio Input Stage
The input stage of BlueCore3-Multimedia External consists of a low noise input amplifier, which receives its analogue input signal from pins AUDIO_IN_P_LEFT and AUDIO_IN_N_LEFT to a second-order - ADC that outputs a 4MBit/sec single-bit stream into the digital circuitry. The input can be configured to be either single ended or fully differential. It can be programmed for either microphone or line input and has a 3-bit digital gain setting of the input-amplifier in 3dB steps to optimize it for the use of different microphones.
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8.8.24 Microphone Input
The audio-input is intended for use from 1A@94dB SPL to about 10A@94dB SPL. With biasing-resistors R1 and R2 equal to 1k, this requires microphones with sensitivity between about -40dBV and -60dBV. The microphone for each channel should be biased as shown in Figure 8.29.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Microphone Bias R2 C1 C3 R1 C2
BlueCore3-Multimedia External
AUDIO_IN_P_LEFT Input Amplifier
AUDIO_IN_N_LEFT
C4
+
MIC1
Figure 8.29: Microphone Biasing (Left Channel Shown) The input impedance at AUDIO_IN_N_LEFT, AUDIO_IN_P_LEFT, AUDIO_IN_N_RIGHT and AUDIO_IN_P_RIGHT is typically 20k. C1 and C2 should be 47nF. R1 sets the microphone load impedance and is normally in a range of 1 to 2 k. R2, C3 and C4 improve the supply rejection by decoupling supply noise from the microphone. Values should be selected as required in the specification. R2 may be connected to a convenient supply, in which case the bias network is permanently enabled, or to the AUX_DAC output (which is ground referenced and so provides good rejection of the supply), which maybe configured to provide bias only when the microphone is required.
8.8.25 Line Input
If the input gain is set to less than 21dB BlueCore3-Multimedia External automatically selects line input mode. In this mode the input impedance at AUDIO_IN_N_LEFT, AUDIO_IN_P_LEFT, AUDIO_IN_N_RIGHT and AUDIO_IN_P_RIGHT are increased to 130k typically. In line-input mode, the full-scale input signal is about 400mV rms. Figure 8.30 and Figure 8.31 show two circuits for line input operation and show connections for either differential or single ended inputs.
C1 AUDIO_IN_P_LEFT
C2 AUDIO_IN_N_LEFT
Figure 8.30: Differential Input (Left Channel Shown)
C1 AUDIO_IN_P_LEFT
C2 AUDIO_IN_N_LEFT
Figure 8.31: Single Ended Input (Left Channel Shown)
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Device Terminal Descriptions
8.8.26 Output Stage
The output digital circuitry converts the signal from 16-bit per sample, linear PCM of variable sampling frequency to an 8 MBits/sec bit stream, which is fed into the analogue output circuitry. The output circuit comprises a digital to analogue converter with gain setting and output amplifier. Its class-AB output-stage is capable of driving a signal on both channels of up to 2V pk-pk- differential into a load of 32 and 500pF with a typical THD+N of -74dBc. The output is available as a differential signal between AUDIO_OUT_N_LEFT and AUDIO_OUT_P_LEFT for the left channel as shown in Figure 8.32; and between AUDIO_OUT_N_RIGHT and AUDIO_OUT_P_RIGHT for the right channel. The output is capable of driving a speaker directly if its impedance is at least 16 if only one channel is connected or an external regulator is used.
AUDIO_OUT_P_LEFT
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
AUDIO_OUT_N_LEFT
Figure 8.32: Speaker Output (Left Channel Shown) The gain of the output stage is controlled by a 3-bit programmable resistive divider, which sets the gain in steps of approximately 3dB. The single bit stream from the digital circuitry is low pass filtered by a second order bi-quad filter with a pole at 20kHz. The signal is then amplified in the fully differential output stage, which has a gain bandwidth of typically 1MHz. It uses its high open loop gain in the closed loop application circuit to achieve low distortion while operating with low standing current.
8.9
I/O Parallel Ports
Fifteen lines of programmable bi-directional input/outputs (I/O) are provided. PIO[11:8] and PIO[3:0] are powered from VDD_PIO. PIO[7:4] are powered from VDD_PADS. AIO [3:0] are powered from VDD_MEM. PIO lines can be configured through software to have either weak or strong pull-ups or pull-downs. All PIO lines are configured as inputs with weak pull-downs at reset. PIO[0] and PIO[1] are normally dedicated to RXEN and TXEN respectively, but they are available for general use. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. PIO[6] or PIO [2] can be configured as a request line for an external clock source. This is useful when the clock to BlueCore3-Multimedia External is provided from a system application specific integrated circuit (ASIC). BlueCore3-Multimedia External has four general purpose analogue interface pins, AIO[0], AIO[1], AIO[2] and AIO[3]. These are used to access internal circuitry and control signals. One pin is allocated to decoupling for the on-chip band gap reference voltage, the other three may be configured to provide additional functionality. Auxiliary functions available via these pins include an 8-bit ADC and an 8-bit DAC. Typically the ADC is used for battery voltage measurement. Signals selectable at these pins include the band gap reference voltage and a variety of clock signals; 48, 24, 16, 8MHz and the XTAL clock frequency. When used with analogue signals the voltage range is constrained by the analogue supply voltage (1.8V). When configured to drive out digital level signals (clocks) generated from within the analogue part of the device, the output voltage level is determined by VDD_MEM (1.8V).
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Device Terminal Descriptions
8.9.1
PIO Defaults for BTv1.2 HCI Level Bluetooth Stack
Description Pull high on boot up to select USB transport rather than BCSP Control output for external LNA after boot up completion
I/O Terminal PIO[0] PIO[1] PIO[2] PIO[3] PIO[4] PIO[5] PIO[6] PIO[7] PIO[8] AIO[0] AIO[2]
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Pull high on boot up to select 16MHz reference clock frequency rather than 26MHz Control output for external PA (Class 1 operation) after boot up completion Clock request output Clock request "OR" gate input UART Bypass (UART_TX) UART Bypass (UART_RTS) UART Bypass (UART_CTS) E2PROM (SCL) UART Bypass (UART_RX) E2PROM (SDA) E2PROM (write protect) 32kHz sleep clock input Vref output. Must be decoupled Table 8.11: PIO Defaults
Important Note:
CSR cannot guarantee that these terminal functions remain the same. Please refer to the software release note for the implementation of these PIO lines, since they are firmware build specific.
8.10
I2C Interface
PIO[8:6] can be used to form a Master I2C interface. The interface is formed using software to drive these lines. Therefore it is suited only to relatively slow functions such as driving a dot matrix liquid crystal display (LCD), keyboard scanner or EEPROM.
Notes:
PIO lines need to be pulled-up through 2.2k resistors. PIO[7:6] dual functions, UART bypass and EEPROM support, therefore devices using an EEPROM cannot support UART bypass mode. For connection to EEPROMs, refer to CSR documentation on I2C EEPROMS for use with BlueCore. This provides information on the type of devices which are currently supported.
+1.8V
10nF 2.2K 2.2K 2.2K U2 8 PIO[8] PIO[6] PIO[7] 7 6 5 VCC WP SCL SDA A0 A1 A2 GND 1 2 3 4
Serial EEPROM (AT24C16A)
Figure 8.33: Example EEPROM Connection
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Device Terminal Descriptions
8.11
TCXO Enable OR Function
An OR function exists for clock enable signals from a host controller and BlueCore3-Multimedia External where either device can turn on the clock without having to wake up the other device. PIO[3] can be used as the Host clock enables input and PIO[2] can be used as the OR output with the TCXO enable signal from BlueCore3-Multimedia External.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
VDD GSM System TCXO CLK IN Enable CLK REQ OUT
BlueCore System CLK REQ IN/ PIO[3] CLK REQ OUT/ PIO[2]
XTAL IN
Figure 8.34: Example TXCO Enable OR Function On reset and up to the time the PIO has been configured, PIO[2] will be tri-stated. Therefore, the developer must ensure that the circuitry connected to this pin is pulled via a 470k resistor to the appropriate power rail. This ensures that the TCXO is oscillating at start up.
8.12
RESET and RESETB
BlueCore3-Multimedia External may be reset from several sources: RESET or RESETB pins, power on reset, a UART break character or via a software configured watchdog timer. The RESET pin is an active high reset and is internally filtered using the internal low frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following RESET being active. It is recommended that RESET be applied for a period greater than 5ms. The RESETB pin is the active low version of RESET and is `ORed' on chip with the active high RESET with either causing the reset function. The power on reset occurs when the VDD_CORE supply falls below typically 1.5V and is released when VDD_CORE rises above typically 1.6V. At reset the digital I/O pins are set to inputs for bi-directional pins and outputs are tristated. The PIOs have weak pull-downs. Following a reset, BlueCore3-Multimedia External assumes the maximum XTAL_IN frequency, which ensures that the internal clocks run at a safe (low) frequency until BlueCore-Multimedia is configured for the actual XTAL_IN frequency. If no clock is present at XTAL_IN, the oscillator in BlueCore3-Multimedia External free runs, again at a safe frequency.
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Device Terminal Descriptions
8.12.1 Pin States on Reset
Table 8.12 shows the pin states of BlueCore3-Multimedia External on reset. Pin Name PIO[11:0] PCM_OUT PCM_IN PCM_SYNC PCM_CLK UART_TX UART_RX UART_RTS UART_CTS USB_DP USB_DN SPI_CSB SPI_CLK SPI_MOSI SPI_MISO AIO[3:0] RESET RESETB TEST_EN AUX_DAC TX_A TX_B RX_IN XTAL_IN XTAL_OUT State: BlueCore3-Multimedia External
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Input with weak pull-down Tri-stated with weak pull-down Input with weak pull-down Input with weak pull-down Input with weak pull-down Output tri-stated with weak pull-up Input with weak pull-down Output tri-stated with weak pull-up Input with weak pull-down Input with weak pull-down Input with weak pull-down Input with weak pull-up Input with weak pull-down Input with weak pull-down Output tri-stated with weak pull-down Output, driving low Input with weak pull-down Input with weak pull-up Input with strong pull-down High impedance High impedance High impedance High impedance High impedance, 250k to XTAL_OUT High impedance, 250k to XTAL_IN Table 8.12: Pin States of BlueCore3-Multimedia External on Reset
8.12.2 Status after Reset
The chip status after a reset is as follows:
! !
Note:
(1)
Warm Reset: Baud rate and RAM data remain available Cold Reset(1): Baud rate and RAM data not available Cold Reset consititutes one of the following:
! ! !
Power cycle System reset (firmware fault code) Reset signal, see Section 8.12
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Device Terminal Descriptions
8.13
Power Supply
8.13.1 Voltage Regulator
An on-chip linear voltage regulator can be used to power the 1.8V dependent supplies. It is advised that a smoothing circuit using a 2.2F low ESR capacitor and 2.2 resistor be placed on the output VDD_ANA adjacent to VREG_IN. The regulator is switched into a low power mode when the device is sent into deep sleep mode. When the on chip regulator is not required VDD_ANA is a 1.8V input and VREG_IN must be either open circuit or tied to VDD_ANA.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
8.13.2 Sequencing
It is recommended that VDD_CORE, VDD_RADIO, VDD_LO and VDD_ANA be powered at the same time. The order of powering supplies for VDD_CORE, VDD_PIO, VDD_PADS and VDD_USB is not important. However if VDD_CORE is not present, all inputs have a weak pull-down irrespective of the reset state.
8.13.3 Sensitivity to Disturbances
It is recommended that if you are supplying BlueCore3-Multimedia External from an external voltage source that VDD_LO, VDD_ANA and VDD_RADIO should have less than 10mV rms noise levels between 0 to 10MHz. Single tone frequencies are also to be avoided. A simple RC filter is recommended for VDD_CORE as this reduces transients put back onto the power supply rails. The remaining supplies VDD_MEM, VDD_PIO, VDD_PADS and VDD_USB can be connected together with the VREG_IN to the 3.3V supply and simply decoupled as shown in Figure 11.10.1. The transient response of the regulator is also important. At the start of a packet, power consumption will jump to high levels, see average current consumption section. The regulator should have a response time of 20s or less, it is essential that the power rail recovers quickly.
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Typical Audio CODEC Performance
9
9.1
Typical Audio CODEC Performance
Output
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Relative Level of 2nd Harmonic to Fundamental as a Function of Digital Level 2nd Harmonic @ 600 load
-70
-72
-74
-76
-78
-80
Harmonic / dB0
-82
Measurements below noise floor
-84
-86
-88
-90
-92
-94
-96
-98 -20.0
-18.0
-16.0
-14.0
-12.0
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
Digital Level Relative to Full Scale
227mV
321mV
457mV
639mV
Figure 10.9.1: Relative Level of 2nd Harmonic to Fundamental, PL = 600
BC352239A-ds-001Pc
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Typical Audio CODEC Performance
Relative Level of 3rd Harmonic to Fundamental as a Function of Digital Level 3rd Harmonic @ 600 Load
-70
-72
-74
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
-76
-78
-80
-82 Harmonic / dB0
-84
-86
-88
-90
-92
-94
-96
-98
-100 -20.0
-18.0
-16.0
-14.0
-12.0
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
231mV 639mV
324mV 904mV
462mV
Digital Level Relative to Full Scale
Figure 10.9.2: Relative Level of 3rd Harmonic to Fundamental, PL = 600
Note:
Signal below full scale - 7dB are below measurement system's noise floor.
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Typical Audio CODEC Performance
Relative Level of 2nd Harmonic to Fundamental as a Function of Digital Level 2nd Harmonic @ 32 Load
-70
-72
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
-74
-76
-78
-80
Harmonic / dB0
-82
-84
-86
-88
-90
-92
-94
-96
-98 -20.0
-18.0
-16.0
-14.0
-12.0
-10.0
-8.0
)
-6.0
-4.0
-2.0
0.0
Digital Level Relative to Full Scale
227mV
320mV
455mV
636mV
Figure 10.9.3: Relative Level of 2nd Harmonic to Fundamental, PL = 32
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Typical Audio CODEC Performance
Relative Level of 3rd Harmonic to Fundamental as a Function of Digital Level 3rd Harmonic @ 32 Load
-70
-72
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
-74
-76
-78
-80
Harmonic / dB0
-82
-84
-86
-88
-90
-92
-94
-96
-98 -20.0
-18.0
-16.0
-14.0
-12.0
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
Digital Level Relative to Full Scale
227mV
320mV
455mV
636mV
Figure 10.9.4: Relative Level of 3rd Harmonic to Fundamental, PL = 32
BC352239A-ds-001Pc
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Typical Audio CODEC Performance
Relative Level of 2nd Harmonic to Fundamental as a Function of Digital Level 2nd Harmonic @ 22 Load
-70
-72
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
-74
-76
-78
-80
Harmonic / dB0
-82
-84
-86
-88
-90
-92
-94
-96
-98 -20.0
-18.0
-16.0
-14.0
-12.0
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
Digital Level Relative to Full Scale
227mV
321mV
457mV
639mV
Figure 10.9.5: Relative Level of 2nd Harmonic to Fundamental, PL = 22
BC352239A-ds-001Pc
(c) Cambridge Silicon Radio Limited 2004 Production Information
Page 104 of 116
Typical Audio CODEC Performance
Relative Level of 3rd Harmonic to Fundamental as a Function of Digital Level 3rd Harmonic @ 22 Load
-70
-72
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
-74
-76
-78
-80
Harmonic / dB0
-82
-84
-86
-88
-90
-92
-94
-96
-98 -20.0
-18.0
-16.0
-14.0
-12.0
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
Digital Level Relative to Full Scale
227mV
320mV
455mV
639mV
Figure 10.9.6: Relative Level of 3rd Harmonic to Fundamental, PL = 22
BC352239A-ds-001Pc
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Typical Audio CODEC Performance
Noise Floor, Sample Rate = 44.1kHz, Noise A-Weighted in 17kHz Band Width
0
-10
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
-20
-30
-40
Noise / dBV
-50
-60
-70
-80
-90
-100
-110 0.0 100.0 200.0 300.0 400.0 500.0 Full Scale rms Output, mV 600.0 700.0 800.0 900.0 1000.0
600ohm
22ohm
Figure 10.9.7: Noise Floor
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Typical Audio CODEC Performance
THD+N, Input Signal is Full Scale Sine Wave at 1kHz, Sample Rate = 44.1kHz
0.200
0.180
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
0.160
0.140
0.120
THD+N %
0.100
0.080
0.060
0.040
0.020
0.000 10.0
100.0 Full Scale rms Output, mV
1000.0
10000.0
600ohm
22ohm
Figure 10.9.8: THD+N
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Application Schematic
10 Application Schematic
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Figure 11.10.1: Application Circuit for Radio Characteristics Specification with 7 x 7 VFBGA Package
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Package Dimensions
11 Package Dimensions
11.1 7 x 7 VFBGA 120-Ball Package
Top View
X PIN A1 A B C D E F G H J K L M N 0.1 Z 13 12 11 10 9 8 7 6 5 4 3 2 1 D Y A B C D E F G H J K L M N 13 12 11 10 9 8 7 6 5 4 3 2 1
Bottom View
D1 PIN 1 CORNER
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
12X e E1
E A
120X "b
1 ZXY Z
"0.15M M "0.05M M
DETAIL K // A3
3 0.1
Z
SEE DETAIL K
A2 A1 0.08 Z SEATING PLANE 2
DIM A A1 A2 A3 b D E e D1 E1
Package: 7 x 7 x 1mm MIN TYP MAX 1 0.18 0.21 REF 0.45 REF 0.27 7 BSC 7 BSC 0.5 BSC 6 BSC 6 BSC 0.37 0.28
0.5mm Pitch
120 Ball VFBGA NOTES
1
DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER PARALLEL TO DATUM PLANE Z. DATUM Z IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS PARALLELISM MEASUREMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE
2
3
VFBGA 120 BALLS 7 x 7 x 1 mm (JEDEC-MO-225)
UNIT MM
Figure 12.11.1: BlueCore3-Multimedia External 120-Ball VFBGA Package Dimensions
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Solder Profiles
12 Solder Profiles
The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder re-flow. There are four zones: 1. 2. Preheat Zone - This zone raises the temperature at a controlled rate, typically 1-2.5C/s. Equilibrium Zone - This zone brings the board to a uniform temperature and also activates the flux. The duration in this zone (typically 2-3 minutes) will need to be adjusted to optimise the out gassing of the flux. Reflow Zone - The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. Cooling Zone - The cooling rate should be fast, to keep the solder grains small which will give a longer lasting joint. Typical rates will be 2-5C/s.
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
3.
4.
12.1
Solder Re-flow Profile for Devices with Lead-Free Solder Balls
Composition of the solder ball: Sn 95.5%, Ag 4.0%, Cu 0.5%
Lead Free Reflow Solder Profile 2
300
250
200 Temperature (C)
150
100
50
0 0 50 100 150 200 250 Time (s) 300 350 400 450 500
Figure 13.12.1: Typical Lead-Free Re-flow Solder Profile Key features of the profile:
! ! ! ! !
Initial Ramp = 1-2.5C/sec to 175C25C equilibrium Equilibrium time = 60 to 180 seconds Ramp to Maximum temperature (250C) = 3C/sec max. Time above liquidus temperature (217C): 45-90 seconds Device absolute maximum reflow temperature: 260C
Devices will withstand the specified profile. Lead-free devices will withstand up to 5 reflows to a maximum temperature of 260C.
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Ordering Information
13 Ordering Information
13.1 BlueCore3-Multimedia External
Package Interface Version Type UART and USB 120-Ball VFBGA (Pb free) Size 7 x 7 x 1mm Shipment Method Tape and reel BC352239A-IVQ-E4(1) Order Number
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Minimum Order Quantity 2kpcs Taped and Reeled
Note:
(1)
Until BlueCore3-Multimedia External reaches Production status order number is BC352239AES-IVQ-E4.
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Contact Information
14 Contact Information
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
CSR plc Churchill House Cambridge Business Park Cowley Road Cambridge CB4 0WZ United Kingdom Tel: +44 (0) 1223 692 000 Fax: +44 (0) 1223 692 001 e-mail: sales@csr.com
CSR Japan CSR KK 9F Kojimachi KS Square 5-3-3, Kojimachi, Chiyoda-ku, Tokyo 102-0083 Japan Tel: +81-3-5276-2911 Fax: +81-3-5276-2915 e-mail: sales@csr.com
CSR Korea Rm. 1111 Keumgang Venturetel, #1108 Beesan-dong, Dong An-ku, Anyang-city, Kyunggi-do 431-050, Korea Tel: +82 31 389 0541 Fax : +82 31 389 0545 e-mail: sales@csr.com
CSR Denmark Novi Science Park Niels Jernes Vej 10 9220 Aalborg East Denmark Tel: +45 72 200 380 Fax: +45 96 354 599 e-mail: sales@csr.com
CSR Taiwan Rm6A,6F, No. 118, Hsing-Shan Rd., NeiHu, Taipei, Taiwan, R.O.C. Tel: +886 2 7721 5588 Fax: +886 2 7721 5589 e-mail: sales@csr.com
CSR U.S. 1651 N. Collins Blvd. Suite 210 Richardson TX75080 Tel: +1 (972) 238 2300 Fax: +1 (972) 231 1440 e-mail: sales@csr.com
To contact a CSR representative, go to http://www.csr.com/contacts.htm
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Document References
15 Document References
Document: Specification of the Bluetooth System Universal Serial Bus Specification Selection of I C EEPROMS for Use with BlueCore Selection of Flash Memory for Use with BlueCore
2
Reference, Date: v1.2, 05 November 2003
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
v2.0, 27 April 2000 bcore-an-008Pb, 30 September 2003 bcore-an-001Pd, 30 March 2004
BC352239A-ds-001Pc
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Acronyms and Definitions
Acronyms and Definitions
BlueCoreTM BluetoothTM CSR ACL ADC AGC A-law API ASIC BCSP BER BIST BMC CFI CMOS CODEC CQDDR CSB CSR CTS CVSD DAC dBm DC DFU DSP ESR FIR FSK GSM HCI IQ Modulation IF IIR ISDN ISM ksps L2CAP LC LCD LFBGA LJ LNA Group term for CSR's range of Bluetooth chips Set of technologies providing audio and data transfer over short-range radio connections Cambridge Silicon Radio Asynchronous Connection-Less. A Bluetooth data packet. Analogue to Digital Converter Automatic Gain Control Audio encoding standard Application Programming Interface Application Specific Integrated Circuit BlueCoreTM Serial Protocol Bit Error Rate. Used to measure the quality of a link Built-In Self-Test Burst Mode Controller Common Flash Interface Complementary Metal Oxide Semiconductor Coder Decoder Channel Quality Driven Data Rate Chip Select (Active Low) Cambridge Silicon Radio Clear to Send Continuous Variable Slope Delta Modulation Digital to Analogue Converter Decibels relative to 1mW Direct Current Device Firmware Upgrade Digital Signal Processor Equivalent Series Resistance Finite Impulse Response Frequency Shift Keying Global System for Mobile communications Host Controller Interface In-Phase and Quadrature Modulation Intermediate Frequency Infinite Impulse Response Integrated Services Digital Network Industrial, Scientific and Medical KiloSamples Per Second Logical Link Control and Adaptation Protocol (protocol layer) Link Controller Liquid Crystal Display Low profile Fine Ball Grid Array Left-Justified Low Noise Amplifier
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
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Acronyms and Definitions
LPF LSB MCU
-law
Low Pass Filter Least-Significant Bit MicroController Unit Audio Encoding Standard Million Instructions Per Second
MIPS MMU MISO OHCI PA PCM PIO PLL ppm PS Key RAM REB REF RF RFCOMM RISC RJ rms RoHS RSSI RTS RX SCO SD SDK SDP SIG SPI SSI TBD TX UART USB VCO VFBGA VM W-CDMA WEB www
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
Memory Management Unit Master In Serial Out Open Host Controller Interface Power Amplifier Pulse Code Modulation. Refers to digital voice data Parallel Input Output Phase Lock Loop parts per million Persistent Store Key Random Access Memory Read enable (Active Low) Reference. Represents dimension for reference use only. Radio Frequency Protocol layer providing serial port emulation over L2CAP Reduced Instruction Set Computer Right-Justified root mean squared The Restriction of Hazardous Substances in Electrical and Electronic Equipment Directive (2002/95/EC) Receive Signal Strength Indication Ready To Send Receive or Receiver Synchronous Connection-Oriented. Voice oriented Bluetooth packet Secure Digital Software Development Kit Service Discovery Protocol Special Interest Group Serial Peripheral Interface Signal Strength Indication To Be Defined Transmit or Transmitter Universal Asynchronous Receiver Transmitter Universal Serial Bus or Upper Side Band (depending on context) Voltage Controlled Oscillator Very Fine Ball Grid Array Virtual Machine Wideband Code Division Multiple Access Write Enable (Active Low) world wide web
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Record of Changes
Record of Changes
Date: 19FEB04 11AUG04 Revision a b Reason for Change: Original publication of this document. (CSR reference: BC352239A-ds-001Pa) Update to external memory section. Update to power consumption table, to include 'Digital audio processing subsystem' figure. Datasheet still at Advance Information status. Added typical audio CODEC performance data. Updated application schematic. Added the following sub-sections:
_aiEceEPJjiaiaaECa~=bniEea~a Product Data Sheet
!
15NOV04 c
8.1.2: Transmit Port Impedances for 7 x 7 VFBGA Package (2.4-2.5GHz vs. Temperature) 8.1.3: Receive Port Impedances for 7 x 7 VFBGA Package (2.4-2.5GHz vs. Temperature) 8.1.4: Transmit S Parameters 8.1.5:Balanced Receive S Parameters
! ! !
Data Book and Data Sheet now have Production Information status.
BlueCoreTM3-Multimedia External Product Data Sheet BC352239A-ds-001Pc November 2004
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