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| ESDALC6V1M3 Dual low capacitance TRANSILTM array for ESD protection Main product applications Where transient overvoltage protection in ESD sensitive equipment is required, such as : Computers Printers Communication systems Cellular phone handsets and accessories Video equipment SOT 883 (JEDEC MO-236AA Compliant) Features Configuration I/O2 2 1 1 22 I/O1 2 unidirectional low capacitance TRANSIL diodes Breakdown Voltage VBR = 6.1 V min Low diode capacitance (11 pF typ at 0 V) Low leakage current < 0.5 A Very small PCB area: 0.6 mm GND 3 GND Underside view Description The ESDALC6V1M3 is a monolithic array designed to protect 1 line or 2 lines against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. Order code Part number ESDALC6V1M3 Marking K Complies with the following standards 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883E-Method 3015-7: class 3 HBM (Human Body Model) IEC61000-4-2 level 4: Benefits High ESD protection level High integration Suitable for high density boards TRANSIL is a trademark of STMicroelectronics Rev 1 1/7 www.st.com 7 August 2005 1 Characteristics ESDALC6V1M3 1 1.1 Characteristics Absolute ratings (TAMB = 25 C - limiting values) Symbol VPP PPP Ipp Tj Tstg TL TOP ESD discharge Parameter IEC61000-4-2 air discharge IEC61000-4-2 contact discharge Tj initial = TAMB Value 15 8 30 3 125 -55 + 150 260 -40 + 125 Unit kV W A C C C C Peak pulse power dissipation (8/20 s)(1) Repetitive peak pulse current typical value (8/20 s) Junction temperature Storage temperature range Maximum lead temperature for soldering during 10 s Operating temperature range 1. For a surge greater than the maximum values, the diode will fail in short-circuit. 1.2 Electrical characteristics (TAMB = 25 C) Symbol VRM VBR VCL IRM IPP T VF Parameter VBR IRM Rd T C IR = 1 mA VR = 0 V, F = 1 MHz, VOSC = 30 mV 11 Parameter Stand-off voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Slope= 1/ Rd VCL VBR VRM I RM IR VF V I IF Voltage temperature coefficient Forward voltage drop Test condition IR = 1 mA VRM = 5 V 1.1 Min 6.1 Typ I PP Max 7.2 0.5 Unit V A 4.2 10-4/C pF 2/7 ESDALC6V1M3 1 Characteristics Figure 1. dB 0.00 - 3 dB - 10.00 S21 attenuation measurement results of each channel Figure 2. dB 0.00 Analog crosstalk measurements between channels -9.3 dB 540 MHz - 30.00 -52 dB - 20.00 - 60.00 - 30.00 - 90.00 f (Hz) - 40.00 100.0k 1.0M Att 1 10.0M 100.0M 1.8 GHz - 120.00 100.0k 1.0M Xtalk 10.0M f (Hz) 100.0M 1.0G 1.0G Figure 3. ESD response to IEC61000-4-2 (+15 kV air discharge) on each channel Figure 4. ESD response to IEC61000-4-2 (-15 kV air discharge) on each channel. Figure 5. Relative variation of peak pulse power versus initial junction temperature Figure 6. Peak pulse power versus exponential pulse duration PPP[Tj initial] /PPP[Tj initial=25C] 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 Tj(C) PPP(W) 1000 Tj initial = 25 C 100 tP (s) 10 1 10 100 3/7 2 Ordering information scheme ESDALC6V1M3 Forward voltage drop versus peak forward current (typical values) Figure 7. Clamping voltage versus peak pulse Figure 8. current (typical values) 1.E+00 IPP(A) 100.0 8/20 s Tj initial =25 C IFM(A) 10.0 1.E-01 Tj =125C Tj=25C 1.0 1.E-02 VCL(V) 0.1 0 10 20 30 40 50 60 70 1.E-03 0.0 0.2 0.4 0.6 0.8 V(V) 1.0 1.2 1.4 1.6 1.8 2.0 Figure 9. Junction capacitance versus reverse voltage applied (typical values) Figure 10. Relative variation of leakage current versus junction temperature (typical values) IR[Tj] / I R[T j =25 C] C(pF) 12 11 10 9 8 7 6 5 4 3 2 1 0 10 F=1 MHz VOSC = 30 mVRMS Tj = 25 C 100 V R = 3V VLINE (V) 1 Tj(C) 25 50 75 100 125 0 1 2 3 4 5 6 2 Ordering information scheme ESDA LC 6V1 ESD Array Low Capacitance Breakdown Voltage 6V1 = 6.1 Volts min Package M3 = SOT883 M3 4/7 ESDALC6V1M3 3 Package information 3 Package information Table 1. Mechanical data E REF. D DIMENSIONS (mm) DIMENSIONS (inch) MIN TYP MAX MIN TYP MAX A A1 b A A1 L b e 1 2 0.45 0.00 0.52 0.05 0.18 0.00 0.04 0.06 0.18 0.20 0.24 0.39 0.14 0.26 0.08 0.10 0.08 0.10 0.2 0.02 0.08 0.22 0.10 0.15 0.20 0.45 0.50 0.55 0.60 1.00 0.35 0.65 0.20 0.25 0.30 0.20 0.25 0.30 b1 D E L1 3 b1 e e1 e1 L L1 0.12 0.12 Figure 11. Foot print Figure 12. marking 0.40 0.40 'K' + cathode bar 0.20 0.15 0.50 2 1 K 3 0.40 All dimensions in mm 5/7 4 Ordering information ESDALC6V1M3 Figure 13. Packing information 40.1 40.1 1.750.1 3.50.1 All dimensions in mm. In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. K 20.1 K 20.1 K 20.1 K 20.1 K User direction of unreeling 4 Ordering information Part number ESDALC6V1M3 Marking K Package SOT883 Weight 0.96 mg Bulk qty 30 000 Delivery mode Tape and reel 5 Revision history Date 04-Aug-2005 Revision 1 Initial release. Changes 6/7 ESDALC6V1M3 5 Revision history Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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