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M Features TC4420/TC4429 General Description The TC4420/TC4429 are 6A (peak), single output MOSFET drivers. The TC4429 is an inverting driver (pin-compatible with the TC429), while the TC4420 is a non-inverting driver. These drivers are fabricated in CMOS for lower power, more efficient operation versus bipolar drivers. Both devices have TTL-compatible inputs, which can be driven as high as VDD + 0.3V or as low as -5V without upset or damage to the device. This eliminates the need for external level-shifting circuitry and its associated cost and size. The output swing is rail-to-rail, ensuring better drive voltage margin, especially during power-up/ power-down sequencing. Propagational delay time is only 55 nsec (typ.) and the output rise and fall times are only 25 nsec (typ.) into 2500 pF across the usable power supply range. Unlike other drivers, the TC4420/TC4429 are virtually latch-up proof. They replace three or more discrete components, saving PCB area, parts and improving overall system reliability. 6A High-Speed MOSFET Drivers * Latch-Up Protected: will withstand >1.5A Reverse Output Current * Logic Input will withstand Negative Swing Up to 5V * ESD Protected: 4 kV * Matched Rise and Fall Times: - 25 nsec (2500 pF load) * High Peak Output Current: 6A Peak * Wide Input Supply Voltage Operating Range: - 4.5V to 18V * High Capacitive Load Drive Capability: 10,000 pF * Short Delay Time: 55 nsec (typ.) * Logic High Input, Any Voltage: 2.4V to VDD * Low Supply Current With Logic `1' Input: - 450 A (typ.) * Low Output Impedance: 2.5 * Output Voltage Swing to Within 25 mV of Ground or V DD Applications * * * * Switch-Mode Power Supplies Motor Controls Pulse Transformer Driver Class D Switching Amplifiers Package Types: 5-Pin TO-220 Tab is Common to VDD TC4420 TC4429 8-Pin PDIP/SOIC/CERDIP VDD 1 INPUT 2 NC 3 GND 4 TC4420 TC4429 8 VDD 7 OUTPUT 6 OUTPUT 5 GND INPUT GND VDD GND OUTPUT Note: Duplicate pins must both be connected for proper operation. 2003 Microchip Technology Inc. DS21419B-page 1 TC4420/TC4429 Functional Block Diagram VDD 500 A 300 mV Output TC4429 Inverting Input 4.7V TC4420 Non-Inverting GND Effective Input C = 38 pF DS21419B-page 2 2003 Microchip Technology Inc. TC4420/TC4429 1.0 ELECTRICAL CHARACTERISTICS Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings Supply Voltage ..................................................... +20V Input Voltage .................................. - 5V to VDD + 0.3V Input Current (VIN > VDD)................................... 50 mA Power Dissipation (TA 70C) PDIP ............................................................ 730 mW SOIC............................................................ 470 mW CERDIP ....................................................... 800 mW 5-Pin TO-220 .................................................... 1.6W Package Power Dissipation (TA 25C) 5-Pin TO-220 (With Heatsink) ........................ 12.5W Derating Factors (To Ambient) PDIP ........................................................... 8 mW/C SOIC........................................................... 4 mW/C CERDIP ................................................... 6.4 mW/C 5-Pin TO-220 ............................................ 12 mW/C Thermal Impedances (To Case) 5-Pin TO-220 RJ-C ...................................... 10C/W DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = +25C with 4.5V VDD 18V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Voltage Range Input Current Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Operating Input Voltage Note 1: IS VDD -- -- 4.5 0.45 55 -- 1.5 150 18 mA A V VIN = 3V VIN = 0V tR tF tD1 tD2 -- -- -- -- 25 25 55 55 35 35 75 75 nsec. Figure 4-1, CL = 2,500 pF nsec. Figure 4-1, CL = 2,500 pF nsec. Figure 4-1 nsec. Figure 4-1 VOH VOL ROH ROL IPK IREV VDD - 0.025 -- -- -- -- -- -- -- 2.1 1.5 6.0 > 1.5 -- 0.025 2.8 2.5 -- -- V V A A DC TEST DC TEST IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VDD = 18V Duty cycle 2%, t 300 sec VIH VIL VIN IIN 2.4 -- -5 -10 1.8 1.3 -- -- -- 0.8 VDD+0.3 +10 V V V A 0V VIN VDD Sym Min Typ Max Units Conditions Switching times ensured by design. 2003 Microchip Technology Inc. DS21419B-page 3 TC4420/TC4429 DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE) Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 18V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Voltage Range Input Current Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Operating Input Voltage Note 1: IS VDD -- -- 4.5 0.45 60 -- 3 400 18 mA A V VIN = 3V VIN = 0V tR tF tD1 tD2 -- -- -- -- 32 34 50 65 60 60 100 100 nsec. Figure 4-1, CL = 2,500 pF nsec. Figure 4-1, CL = 2,500 pF nsec. Figure 4-1 nsec. Figure 4-1 VOH VOL ROH ROL VDD - 0.025 -- -- -- -- -- 3 2.3 -- 0.025 5 5 V V DC TEST DC TEST IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VIH VIL VIN IIN 2.4 -- -5 -10 -- -- -- -- -- 0.8 VDD + 0.3 +10 V V V A 0V VIN VDD Sym Min Typ Max Units Conditions Switching times ensured by design. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (I) Specified Temperature Range (E) Specified Temperature Range (M) Specified Temperature Range (V) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-CERDIP Thermal Resistance, 5L-TO-220 JA JA JA JA -- -- -- -- 125 155 150 71 -- -- -- -- C/W C/W C/W C/W TA TA TA TA TA TJ TA 0 -25 -40 -55 -40 -- -65 -- -- -- -- -- -- -- +70 +85 +85 +125 +125 +150 +150 C C C C C C C Sym Min Typ Max Units Conditions DS21419B-page 4 2003 Microchip Technology Inc. TC4420/TC4429 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25C with 4.5V V DD 18V. 120 100 80 60 100 80 C L = 10,000 pF TIME (nsec) TIME (nsec) 60 40 20 C L = 10,000 pF C L = 4700 pF 40 20 0 C L = 4700 pF C L = 2200 pF C L = 2200 pF 5 7 9 11 13 15 0 SUPPLY VOLTAGE (V) 5 7 9 11 13 SUPPLY VOLTAGE (V) 15 FIGURE 2-1: Voltage. 100 80 60 TIME (nsec) Rise Time vs. Supply FIGURE 2-4: Voltage. 100 80 60 TIME (nsec) Fall Time vs. Supply 40 VDD = 5V 40 VDD = 5V VDD = 12V VDD = 18V VDD = 12V 20 VDD = 18V 20 10 1000 CAPACITIVE LOAD (pF) 10,000 10 1000 CAPACITIVE LOAD (pF) 10,000 FIGURE 2-2: Load. 50 40 Rise Time vs. Capacitive FIGURE 2-5: Load. 84 70 56 42 28 14 0 Fall Time vs. Capacitive C L = 2200 pF VDD = 18V VDD = 15V DELAY TIME (nsec) t D2 30 20 10 0 -60 t D1 SUPPLY CURRENT (mA) 500 kHz 200 kHz 20 kHz -20 20 60 TA (C) 100 140 0 100 1000 CAPACITIVE LOAD (pF) 10,000 FIGURE 2-3: Temperature. Propagation Delay Time vs. FIGURE 2-6: Capacitive Load. Supply Current vs. 2003 Microchip Technology Inc. DS21419B-page 5 TC4420/TC4429 Note: Unless otherwise indicated, TA = +25C with 4.5V V DD 18V. 50 40 TIME (nsec) 30 20 10 0 -60 C L = 2200 pF VDD = 18V 5 100 mA 4 t FALL t RISE ROUT ( ) 10 mA 50 mA 3 -20 20 60 TA (C) 100 140 2 5 7 9 11 13 SUPPLY VOLTAGE (V) 15 FIGURE 2-7: Temperature. 65 60 DELAY TIME (nsec) 55 50 45 40 35 Rise and Fall Times vs. FIGURE 2-10: High-State Output Resistance vs Supply Voltage. 200 160 120 80 40 0 INPUT 2.4V INPUT 3V INPUT 5V INPUT 8V AND 10V LOAD = 2200 pF tD2 tD1 DELAY TIME (nsec) 4 6 8 10 12 14 16 SUPPLY VOLTAGE (V) 18 5 6 7 8 9 10 11 12 13 14 15 VDD (V) FIGURE 2-8: Supply Voltage. 1000 SUPPLY CURRENT (mA) Propagation Delay Time vs. FIGURE 2-11: Effect of Input Amplitude on Propagation Delay. 2.5 CL = 2200 pF 18V 100 10V ROUT ( ) 5V 2 100 mA 50 mA 10 1.5 10 mA 0 0 100 1000 FREQUENCY (kHz) 10,000 1 5 7 9 11 13 SUPPLY VOLTAGE (V) 15 FIGURE 2-9: Frequency. Supply Current vs. FIGURE 2-12: Low-State Output Resistance vs. Supply Voltage. DS21419B-page 6 2003 Microchip Technology Inc. TC4420/TC4429 Note: Unless otherwise indicated, TA = +25C with 4.5V V DD 18V. 4 -8 Crossover Area (A*S) x 10 3 2 1 0 5 6 7 8 9 10 11 12 13 14 15 SUPPLY VOLTAGE (V) FIGURE 2-13: Crossover Energy *. * The values on this graph represent the loss seen by the driver during one complete cycle. For a single transition, divide the value by 2. 2003 Microchip Technology Inc. DS21419B-page 7 TC4420/TC4429 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin No. (8-Pin PDIP, SOIC, CERDIP) 1 2 3 4 5 6 7 8 PIN FUNCTION TABLE Pin No. (5-Pin TO-220) Symbol VDD INPUT NC GND GND OUTPUT OUTPUT VDD Description -- 1 -- 2 4 5 -- 3 Supply input, 4.5V to 18V Control input, TTL/CMOS-compatible input No Connection Ground Ground CMOS push-pull output CMOS push-pull output Supply input, 4.5V to 18V 3.1 Supply Input (VDD) 3.3 CMOS Push-Pull Output The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 18V with respect to the ground pins. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A minimum value of 1.0 F is suggested. The MOSFET driver output is a low-impedance, CMOS, push-pull style output, capable of driving a capacitive load with 6.0A peak currents. The MOSFET driver output is capable of withstanding 1.5A peak reverse currents of either polarity. 3.2 Control Input 3.4 Ground The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input circuitry of the TC4420/TC4429 MOSFET driver also has a "speedup" capacitor. This helps to decrease the propagation delay times of the driver. Because of this, input signals with slow rising or falling edges should not be used as this can result in double-pulsing of the MOSFET driver output. The ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return. DS21419B-page 8 2003 Microchip Technology Inc. TC4420/TC4429 4.0 APPLICATIONS INFORMATION +5V Input VDD = 18V 4.7 F 1 0.1 F Input 2 6 7 CL = 2,500 pF 4 5 8 0.1 F Output +5V Input 0V +18V Input: 100 kHz, square wave, tRISE = t FALL 10 nsec Output 0V 10% 10% tD1 90% tD2 90% tF 10% 0V +18V Output 0V 10% 10% 10% tD1 90% tF tD2 tR 90% 90% Inverting Driver 90% tR Non-Inverting Driver Note: Pinout shown is for the PDIP, SOIC and CERDIP packages. FIGURE 4-1: Switching Time Test Circuits. 2003 Microchip Technology Inc. DS21419B-page 9 TC4420/TC4429 5.0 5.1 PACKAGING INFORMATION Package Marking Information 8-Lead PDIP (300 mil) Example: XXXXXXXX XXXXXNNN YYWW TC4420 CPA256 0320 8-Lead CERDIP (300 mil) Example: TC4420 MJA256 0320 XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN Example: TC4420 EOA0320 256 5-Lead TO-220 Example: XXXXXXXXX XXXXXXXXX YYWWNNN TC4420CAT XXXXXXXXX 0320256 Legend: XX...X YY WW NNN Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. DS21419B-page 10 2003 Microchip Technology Inc. TC4420/TC4429 8-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A A2 c L A1 eB B1 p B Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB MIN INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 MAX MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 2003 Microchip Technology Inc. DS21419B-page 11 TC4420/TC4429 8-Lead Ceramic Dual In-line - 300 mil (CERDIP) E1 2 n 1 D E A2 A c eB A1 B1 B p L Number of Pins Pitch Top to Seating Plane Standoff Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing *Controlling Parameter JEDEC Equivalent: MS-030 Drawing No. C04-010 Units Dimension Limits n p A A1 E E1 D L c B1 B eB MIN .160 .020 .290 .230 .370 .125 .008 .045 .016 .320 INCHES* NOM 8 .100 .180 .030 .305 .265 .385 .163 .012 .055 .018 .360 MAX MIN .200 .040 .320 .300 .400 .200 .015 .065 .020 .400 MILLIMETERS NOM 8 2.54 4.06 4.57 0.51 0.77 7.37 7.75 5.84 6.73 9.40 9.78 3.18 4.13 0.20 0.29 1.14 1.40 0.41 0.46 8.13 9.15 MAX 5.08 1.02 8.13 7.62 10.16 5.08 0.38 1.65 0.51 10.16 DS21419B-page 12 2003 Microchip Technology Inc. TC4420/TC4429 8-Lead Plastic Small Outline (OA) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A A2 L A1 Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 2003 Microchip Technology Inc. DS21419B-page 13 TC4420/TC4429 5-Lead TO-220 L H1 Q b e3 e e1 E EJECTOR PIN OP a (5X) C1 J1 A F D Lead Pitch Overall Lead Centers Space Between Leads Overall Height Overall Width Overall Length Flag Length Flag Thickness Through Hole Center Through Hole Diameter Lead Length Base to Bottom of Lead Lead Thickness Lead Width Mold Draft Angle Units Dimension Limits e e1 e3 A E D H1 F Q P L J1 C1 b a INCHES* MAX MIN .060 .072 .263 .273 .030 .040 .160 .190 .385 .415 .560 .590 .234 .258 .045 .055 .103 .113 .146 .156 .560 .540 .090 .115 .022 .014 .025 .040 3 7 MILLIMETERS MAX MIN 1.52 1.83 6.68 6.93 0.76 1.02 4.06 4.83 9.78 10.54 14.22 14.99 5.94 6.55 1.14 1.40 2.62 2.87 3.71 3.96 14.22 13.72 2.29 2.92 0.36 0.56 0.64 1.02 3 7 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC equivalent: TO-220 Drawing No. C04-036 DS21419B-page 14 2003 Microchip Technology Inc. TC4420/TC4429 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples: a) TC4420CAT: 6A High-Speed MOSFET Driver, Non-inverting, TO-220 package, 0C to +70C. Device: TC4420: TC4429: C I E V M = = = = = = = = = = 6A High-Speed MOSFET Driver, Non-Inverting 6A High-Speed MOSFET Driver, Inverting 0C to +70C -25C to +85C (CERDIP Only) -40C to +85C -40C to +125C -55C to +125C (CERDIP Only) TO-220, 5-lead Ceramic Dual In-line (300 mil Body), 8-lead Plastic DIP (300 mil Body), 8-lead Plastic SOIC, (150 mil Body), 8-lead Plastic SOIC, (150 mil Body), 8-lead Tape and Reel b) TC4420IJA: 6A High-Speed MOSFET Driver, Non-inverting, Temperature Range: CERDIP package, -25C to +85C. c) TC4420EOA: 6A High-Speed MOSFET Driver, Non-inverting, SOIC package, -40C to +85C. d) TC4420VAT: 6A High-Speed MOSFET Driver, Non-inverting, Package: AT JA PA OA OA713 TO-220 package, -40C to +125C. e) TC4420MJA: 6A High-Speed MOSFET Driver, Non-inverting, CERDIP package, -55C to +125C a) TC4429CAT: A High-Speed MOSFET Driver, Inverting, TO-220 package, 0C to +70C b) TC4429IJA: A High-Speed MOSFET Driver, Inverting, CERDIP package, -25C to +85C c) TC4429EPA: A High-Speed MOSFET Driver, Inverting, PDIP package, -40C to +85C d) TC4429VAT: A High-Speed MOSFET Driver, Inverting, TO-220 package, -40C to +125C e) TC4429MJA: A High-Speed MOSFET Driver, Inverting, CERDIP package, -55C to +125C Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2003 Microchip Technology Inc. DS21419B-page15 TC4420/TC4429 NOTES: DS21419B-page 16 2003 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. DS21419B-page 17 2003 Microchip Technology Inc. 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B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205 Netherlands P. A. De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 07/28/03 Japan Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 DS21419B-page 18 2003 Microchip Technology Inc. |
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