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| The future of communications February 10, 2006 Prof. Dr. Hermann Eul Member of the Infineon Management Board Business Group Communication Solutions Future of communications Feb 10, 2006 Slide 1 Copyright (c) Infineon Technologies 2006. All rights reserved. Disclaimer Please note that while you are reviewing this information, this presentation was created as of the date listed, and reflected management views as of that date. This presentation contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. Such risks and uncertainties include, but are not limited to the Risk Factors noted in the Company's Earnings Releases and the Company's filings with the Securities and Exchange Commission. Future of communications Feb 10, 2006 Slide 2 Copyright (c) Infineon Technologies 2006. All rights reserved. Four Hot Topics in the Wireless Communication Market - Infineon Drives Them All HSDPA HSDPA enabled mobile phones to increase from 10 million in 2007 to more than 300 million by 2010* Cellular ULC ULC ("Ultra-Low-Cost") phones to represent 12% of worldwide mobile phone sales by 2010 compared to 1% in 2005* Connectivity Bluetooth penetration will increase to more than 50% by 2008* WLAN and GPS to move into smart phones *Source: Strategy Analytics Mobile TV Mobile TV service (DMB) has started from May 2005 in Korea Portable receivers emerging Copyright (c) Infineon Technologies 2006. All rights reserved. Future of communications Feb 10, 2006 Slide 3 Growth Drivers: HSDPA, WCDMA, EDGE and ULC Mobile phone market development Mobile phone market development [Units m] 681 823 945 1038 1109 1170 1222 HSDPA / WCDMA / EDGE WCDMA / EDGE EDGE GSM / GPRS CDMA CY04 CY05 CY06 CY07 CY08 CY09 Source: Strategy Analytics, January 2006 CY10 Mobile phone sales by price-tier Mobile phone sales by price-tier 100% 80% 60% 40% 20% Future of communications Feb 10, 2006 Slide 4 High Mid Entry 0% Ultra-Low ( 40 US$) CY04 CY05 CY06 CY07 CY08 CY09 CY10 Copyright (c) Infineon Technologies 2006. All rights reserved. Source: Strategy Analytics, January 2006 3GSM 2006: Infineon Provides All Key Elements of HSDPA Solution HSDPA multimedia baseband S-GOLD 3H One-chip HSDPA // WCDMA // EDGE solution One-chip HSDPA WCDMA EDGE solution 7.2 Mbit/s baseband 7.2 Mbit/s baseband Video telephony and streaming without companion Video telephony and streaming without companion Status: Sampling Status: Sampling HSDPA RF CMOS transceiver SMARTi 3GE World's first one-chip six-band WCDMA and World's first one-chip six-band WCDMA and quad-band EDGE transceiver quad-band EDGE transceiver Offers data rates up to 7.2Mbit/s Offers data rates up to 7.2Mbit/s Status: Sampling Status: Sampling HSDPA protocol stack 3GPP WCDMA FDD multimode type II protocol stack 3GPP WCDMA FDD multimode type II protocol stack Full support of 3GPP release 5 HSDPA Full support of 3GPP release 5 HSDPA Supports GSM, GPRS and EDGE up to Class 12 Supports GSM, GPRS and EDGE up to Class 12 Status: Delivery to first customer in Q1 CY06 Status: Delivery to first customer in Q1 CY06 Future of communications Feb 10, 2006 Slide 5 Power management and connectivity solutions Copyright (c) Infineon Technologies 2006. All rights reserved. Infineon Introduces HSDPA Platform HSDPA multimedia platform HSDPA data rates up to 7.2 Mbit/s Enabling broadband multimedia applications: - Video streaming - High-speed audio/video download Infineon provides complete solution: All key hardware components Reference design Protocol stack and application software Reference design expected to be available mid CY06 Copyright (c) Infineon Technologies 2006. All rights reserved. HSDPA market development HSDPA market development [Units m] Future of communications Feb 10, 2006 Slide 6 CY04 CY10 Source: Strategy Analytics, January 2006 Panasonic and Vodafone Selected Infineon's 3G Platform Infineon's 3G platform Infineon's 3G platform Ramp-up expected 2H CY06 Ramp-up expected 2H CY06 Infineon provides multimedia Infineon provides multimedia baseband, RF transceiver, baseband, RF transceiver, power management, power management, connectivity solutions, connectivity solutions, reference design and software reference design and software < 200 electronic components < 200 electronic components Low eBoM Low eBoM 3G market development 3G market development [Units m] Design win Design win Panasonic CY04 Future of communications Feb 10, 2006 Slide 7 CY10 Vodafone Copyright (c) Infineon Technologies 2006. All rights reserved. Source: Strategy Analytics, January 2006 Several OEMs Selected Infineon's EDGE Platform Infineon's EDGE platform Infineon's EDGE platform Ramp-up expected 2H CY06 Ramp-up expected 2H CY06 Infineon provides multimedia Infineon provides multimedia baseband, RF transceiver, power baseband, RF transceiver, power management, connectivity management, connectivity solutions, reference design and solutions, reference design and software software PCB footprint < 12.5cm PCB footprint < 12.5cm Low eBoM Low eBoM EDGE market development EDGE market development [Units m] Design wins Design wins BenQ CY04 Future of communications Feb 10, 2006 Slide 8 CY10 OEM Copyright (c) Infineon Technologies 2006. All rights reserved. Source: Strategy Analytics, January 2006 Several Design Wins for RF / Baseband Single-Chip "EGOLDradio" Infineon's ULC1 platform Infineon's ULC1 platform Ramp-up expected 1H CY06 Ramp-up expected 1H CY06 Infineon provides RF // Baseband Infineon provides RF Baseband single-chip, power management, single-chip, power management, reference design and software reference design and software < 100 electronic components < 100 electronic components PCB footprint < 9cm PCB footprint < 9cm ULC phone BoM < 20USD ULC phone BoM < 20USD ULC market development ULC market development [% of mobile phone units] EGOLDradio platform design wins EGOLDradio platform design wins Future of communications Feb 10, 2006 Slide 9 Source: Strategy Analytics, January 2006 CY04 CY10 BenQ OEM OEM ODM ODM Copyright (c) Infineon Technologies 2006. All rights reserved. Infineon`s New Single-Chip Generation Drives Further BoM Reduction ULC1 EGOLDradio: RF+Baseband single-chip EGOLDvoice: RF + Baseband + Power Management + SRAM single-chip ULC2 20% BoM reduction < 9 cm2 < 100* < $ 20 Future of communications Feb 10, 2006 Slide 10 PCB size area PCB components Phone BoM 4 cm2 < 50 < $ 16 2005 2006 Copyright (c) Infineon Technologies 2006. All rights reserved. Competitive Mobile Phone Platform Offering Leads to Several Design Wins Complete offering from 2G to 3.5G Complete offering from 2G to 3.5G Design wins Design wins Customer OEM OEM ODM ODM Platform GSM ULC GSM ULC GSM ULC GSM ULC GSM/GPRS entry phones EDGE Multimedia 2x EDGE Multimedia 3G Multimedia Software APOXI reference MMI Applications Rampup 1H CY06 2H CY06 2H CY06 2H CY06 2H CY06 2H CY06 2H CY06 2H CY06 APOXI framework Protocol stack Hardware driver Realtime operating system Reference Design Hardware Power management BenQ BenQ Baseband Future of communications Feb 10, 2006 Slide 11 RF transceiver OEM Panasonic + Bluetooth, A-GPS, WLAN single-chip solutions Copyright (c) Infineon Technologies 2006. All rights reserved. Expanding RF Customer Base Through RF CMOS Leadership No. 1 in RF with approximately 200 million RF chips sold in CY05 Several 3G and EDGE mobile phone platforms ramping up in 2H CY06 will be based on our CMOS transceivers SMARTi 3GE SMARTi 3GE HSDPA // WCDMA // EDGE HSDPA WCDMA EDGE SMARTi 3G SMARTi 3G HSDPA // WCDMA HSDPA WCDMA SMARTi PM SMARTi PM EDGE EDGE Future of communications Feb 10, 2006 Slide 12 World's first CMOS oneWorld's first CMOS onechip 6-band WCDMA chip 6-band WCDMA and 4-band EDGE and 4-band EDGE transceiver transceiver World's first CMOS World's first CMOS single-chip single-chip 6-band transceiver 6-band transceiver World's first CMOS World's first CMOS EDGE single-chip EDGE single-chip transceiver transceiver Copyright (c) Infineon Technologies 2006. All rights reserved. Growth Driver: Connectivity Growth driver Growth driver Increasing demand for connectivity in mobile phones: 60% Infineon's position Infineon's position Bluetooth Customers: BenQ, Panasonic Bluetooth 2.0 + EDR solution sampling since early 2005 Design win at OEM 50% [% of worldwide mobile phone shipments] A-GPS World's first RF / BB single-chip solution sampling since early 2005 Design-wins at 2 mobile phone platforms 40% 30% 20% WLAN 802.11 a/g single-chip for mobile phones available in 2006 VoIP functionality integrated UMA support CY04 CY05e CY06e CY07e WLAN CY08e CY09e 10% 0% UWB Single-chip in development Copyright (c) Infineon Technologies 2006. All rights reserved. Future of communications Feb 10, 2006 Slide 13 Bluetooth A-GPS Source: Strategy Analytics, March 2005 Growth Driver: Digital Terrestrial TV and Mobile TV Digital terrestrial TV Digital terrestrial TV Growth Drivers: Introduction of digital terrestrial TV in many regions Analog terrestrial TV to be switched off by 2015 Infineon's Position: Leading share worldwide in tuners for digital terrestrial TV Infineon tuners are fully compliant to DVB-T, DVB-C, ISDB-T, ATSC Mobile TV Mobile TV Growth Drivers: World's first roll-out took place in South Korea in May 2005 Field trials in many regions all over the world Infineon's Position: Volume shipments of portable TV tuners since end 2005 DVB-H frontend solution demo at 3GSM '06 Future of communications Feb 10, 2006 Slide 14 Copyright (c) Infineon Technologies 2006. All rights reserved. Growth Driver: DSL DSL market development DSL market development Triple play services and network replacement drive DSL demand For example: Deutsche Telekom intends to provide Germany's 50 largest cities with up to 50Mbit/s broadband lines by 2007 By mid-2006, already 2.9 million households can use the new technology 50 40 30 20 10 0 Future of communications Feb 10, 2006 Slide 15 Infineon's position Infineon's position VDSL2 leadership We offer the first fully standard compliant VDSL2 chip solution Several major OEMs decided to start VDSL2 designs based on our chipset First VDSL2 revenues already achieved in Q4 CY05 New customers in ADSL2/2+ Design-wins at several new major OEMs during CY05 Worldwide IP DSLAM port shipments [mn] CY04 CY05e CY06e CY07e CY08e ADSL SHDSL VDSL Copyright (c) Infineon Technologies 2006. All rights reserved. Source: Infonetics, Q2 2005 Critical Factors for VDSL2 - Infineon Has it All Early availability VINAX: 1st fully standard compliant VDSL2 chip solution IFX: Sole company meeting all regional requirements Experience More than 4 million VDSL1 lines powered by Infineon chip solutions Fully ADSL backwards compatible Complete solution Extensive line-card and CPE solutions portfolio including: DSL, Communications Processors, VoIP, WLAN, switch/PHYs Future of communications Feb 10, 2006 Slide 16 Copyright (c) Infineon Technologies 2006. All rights reserved. Infineon Communication Solutions Drive the Convergence of Communication Technologies Broadband Broadband Access RF Solutions RF Solutions RF Engine Tuner Systems Connectivity Mobile Phone Mobile Phone Platforms Platforms Feature Phone Entry Phone Mobile Software RF transceivers and BAW filters for 3G and 2G mobile phones and wireless data modules Complete xDSL CO / CPE portfolio One chipset family for all VoIP applications Reference designs for VDSL2, ADSL2+ router, VoIP router and IP phones Future of communications Feb 10, 2006 Slide 17 Bluetooth EDR, A-GPS and WLAN connectivity solutions DECT/WDCT chipset Analog and digital terrestrial tuner systems Power amplifiers and RF ASIC for 3G and 2G base stations Reference designs for 3G and 2G mobile phones RF / Baseband single-chip and multimedia baseband for 3G and 2G Protocol stack and application framework software for 3G and 2G Copyright (c) Infineon Technologies 2006. All rights reserved. Chipsets for T/E carrier, analog linecards and ISDN Infineon Successfully Produced First 65nm Samples Successfully produced first sample chips in our 65nm technology Leveraging results of 65nm / 45nm ICIS alliance Wafer production was done at multiple fabs Volume production intended to start in Q4 CY06 at Chartered 65nm technology is expected to further strengthen our leading position in baseband and RF CMOS single-chip integration Copyright (c) Infineon Technologies 2006. All rights reserved. Future of communications Feb 10, 2006 Slide 18 Infineon's Advanced Logic Manufacturing Strategy Strategy Strategy Use existing in-house capacity to Use existing in-house capacity to 100% 100% Surplus volume in foundry Surplus volume in foundry First ramp of technology in foundry, First ramp of technology in foundry, then, transfer to in-house then, transfer to in-house manufacturing as second step manufacturing as second step Only limited in-house capacity; major Only limited in-house capacity; major volume share stays in foundry volume share stays in foundry Development of 65nm // 45nm CMOS Development of 65nm 45nm CMOS technology within ICIS alliance (IBM, technology within ICIS alliance (IBM, Chartered, Infineon, Samsung) Chartered, Infineon, Samsung) Manufacturing cooperation between Manufacturing cooperation between Chartered and Infineon Chartered and Infineon Advantage Advantage 130nm 130nm Proven and low cost Proven and low cost manufacturing technology manufacturing technology 90nm 90nm Limited investment in own Limited investment in own fabs fabs Nevertheless, staying Nevertheless, staying abreast of technology abreast of technology development development Pooling of intellectual capital Pooling of intellectual capital Sharing of R&D expenditures Sharing of R&D expenditures Maintaining process Maintaining process technology and design technology and design system expertise system expertise Copyright (c) Infineon Technologies 2006. All rights reserved. 65nm 65nm Future of communications Feb 10, 2006 Slide 19 Never stop thinking. Future of communications Feb 10, 2006 Slide 20 Copyright (c) Infineon Technologies 2006. All rights reserved. |
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