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INTEGRATED CIRCUITS
DATA SHEET
TDA3654 TDA3654Q Vertical deflection and guard circuit (110)
Product specification File under Integrated Circuits, IC02 March 1991
Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
GENERAL DESCRIPTION
TDA3654 TDA3654Q
The TDA3654 is a full performance vertical deflection output circuit for direct drive of the deflection coils and can be used for a wide range of 90 and 110 deflection systems. A guard circuit is provided which blanks the picture tube screen in the absence of deflection current. Features * Direct drive to the deflection coils * 90 and 110 deflection system * Internal blanking guard circuit * Internal voltage stabilizer QUICK REFERENCE DATA Output voltage Output current (peak-to-peak) Supply voltage Guard circuit output voltage Operating ambient temperature range Storage temperature THERMAL RESISTANCE From junction to mounting base PACKAGE OUTLINES TDA3654 : 9-lead SIL; plastic power (SOT131) (1). TDA3654Q : 9-lead SIL bent to DIL; plastic power (SOT157) (2). Notes 1. SOT131-2; 1997 January 07 2. SOT157-2; 1997 January 07 Rth j-mb 3,5 to 4 K/W V5-2 I5(p-p) V9-2 V7-2 Tamb Tstg max. max. max. max. 60 3 40 5,6 V A V V C C
-25 to +60 -55 to +150
March 1991
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Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
TDA3654 TDA3654Q
Fig.1 Block diagram.
March 1991
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Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
FUNCTIONAL DESCRIPTION Output stage and protection circuits
TDA3654 TDA3654Q
The output stage consists of two Darlington configurations in class B arrangement. Each output transistor can deliver 1,5 A maximum and the VCEO is 60 V. Protection of the output stage is such that the operation of the transistors remains well within the SOAR area in all circumstances at the output pin, (pin 5). This is obtained by the cooperation of the thermal protection circuit, the current-voltage detector and the short circuit protection. Special measures in the internal circuit layout give the output transistors extra solidity, this is illustrated in Fig.5 where typical SOAR curves of the lower output transistor are given. The same curves also apply for the upper output device. The supply for the output stage is fed to pin 6 and the output stage ground is connected to pin 4. Driver and switching circuit Pin 1 is the input for the driver of the output stage. The signal at pin 1 is also applied to pin 3 which is the input of a switching circuit (pin 1 and 3 are connected via external resistors). This switching circuit rapidly turns off the lower output stage when the flyback starts and it, therefore, allows a quick start of the flyback generator. The maximum required input signal for the maximum output current peak-to-peak value of 3 A is only 3 V, the sum of the currents in pins 1 and 3 is then maximum 1 mA. Flyback generator During scan, the capacitor between pins 6 and 8 is charged to a level which is dependent on the value of the resistor at pin 8 (see Fig.1). When the flyback starts and the voltage at the output pin (pin 5) exceeds the supply voltage, the flyback generator is activated. The supply voltage is then connected in series, via pin 8, with the voltage across the capacitor during the flyback period. This implies that during scan the supply voltage can be reduced to the required scan voltage plus saturation voltage of the output transistors. The amplitude of the flyback voltage can be chosen by changing the value of the external resistor at pin 8. It should be noted that the application is chosen such that the lowest voltage at pin 8 is > 1,5 V, during normal operation. Guard circuit When there is no deflection current, for any reason, the voltage at pin 8 becomes less than 1 V, the guard circuit will produce a d.c. voltage at pin 7. This voltage can be used to blank the picture tube, so that the screen will not burn in. Voltage stabilizer The internal voltage stabilizer provides a stabilized supply of 6 V to drive the output stage, so the drive current is not affected by supply voltage variations.
March 1991
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Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134). Pins 2 and 4 are externally connected to ground. Voltages Output voltage Supply voltage Supply voltage output stage Input voltage Input voltage switching circuit External voltage at pin 7 Currents Repetitive peak output current Non-repetitive peak output current (note 1) Repetitive peak output current of flyback generator Non-repetitive peak output current of flyback generator (note 1) Temperatures Storage temperature range Operating ambient temperature range (see Fig.3) Operating junction temperature range (the output current at pin 5 should not exceed 2.5A) Tstg Tamb Tj I5RM I5SM I8RM I8SM V5-4 V9-4 V6-4 V1-2 V3-2 V7-2
TDA3654 TDA3654Q
0 to 60 0 to 40 0 to 60 0 to V9-4 0 to V9-4 0 to 5,6
V V V V V V
max. 1,5 max. 3 max. + 1,5 - 1,6 max. 3 -65 to + 150 -25 to + 60 -25 to + 150
A A A A A C C C
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Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
TDA3654 TDA3654Q
CHARACTERISTICS Tamb = 25 C, supply voltage (V9-4) = 26 V; unless otherwise stated; pin 1 externally connected to pin 3. Pins 2 and 4 externally connected to ground. PARAMETER Supply Supply voltage, pin 9 (note 2) Supply voltage output stage Supply current, pins 6 and 9 (note 3) Quiescent current (note 4) Variation of quiescent current with temperature Output current Output current, pin 5 (peak-to-peak) Output current flyback generator, pin 8 Output voltage Peak voltage during flyback Saturation voltage to supply at I5 = -1,5 A at I5 = 1,5 A (note 5) at I5 = -1,2 A at I5 = 1,2 A (note 5) Saturation voltage to ground at I5 = 1,2 A at I5 = 1,5 A Flyback generator Saturation voltage at I8 = -1,6 A at I8 = 1,5 A (note 5) at I8 = -1,3 A at I8 = 1,2 A (note 5) Leakage current at pin 8 Flyback generator active if: Input Input current, pin 1, for I5 = 1,5 A Input voltage during scan, pin 1 I1 V1-2 - - 0,33 2,35 0,55 3 mA V V9-8(sat) V8-9(sat) V9-8(sat) V8-9(sat) -I8 V5-9 - - - - - 4 1,6 2,3 1,4 2,2 5 - 2,1 3 1,9 2,7 100 - V V V V A V V5-4(sat) V5-4(sat) - - 2,2 2,5 2,7 3,2 V V V6-5(sat) V5-6(sat) V6-5(sat) V5-6(sat) 2,5 2,5 2,2 2,3 3,2 3,2 2,7 2,8 V V V V V5-4 - - 60 V + I8(p-p) -I8(p-p) - - 1,25 1,35 1,5 1,6 A A I5(p-p) - 2,5 3 A TC - -0,04 - mA/K I6+I9 I4 35 25 55 40 85 65 mA mA V9-4 V6-4 10 - - - 40 60 V V SYMBOL MIN. TYP. MAX. UNIT
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Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
TDA3654 TDA3654Q
SYMBOL I3 V3-2 V1-2 V3-2 MIN. 0,03 0,8 - - TYP. - - - - - V9-4 250 250 MAX. UNIT mA V mV mV
PARAMETER Input current, pin 3, during scan (note 6) Input voltage, pin 3, during scan (note 6) Input voltage, pin 1, during flyback Input voltage, pin 3, during flyback Guard circuit Output voltage, pin 7 RL = 100 k (note 9) Output voltage, pin 7 at IL = 0,5 mA (note 9) Internal series resistance of pin 7 Guard circuit activates (note 7) General data Thermal protection activation range Thermal resistance From junction to mounting base Power dissipation Open loop gain at 1 kHz; (note 8) Frequency response, -3 dB; (note 10) Notes 1. Non-repetitive duty factor 3,3%.
V7-2 V7-2 Ri7 V8-2
4,1 3,4 0,95 -
4,5 3,9 1,35 -
5,8 5,3 1,7 1,0
V V k V
Tj Rth j-mb Ptot Go f
158 - - - -
175
192
C
3,5
4
K/W
see Fig.3 33 60 - - kHz
2. The maximum supply voltage should be chosen so that during flyback the voltage at pin 5 does not exceed 60 V. 3. When V5-4 is 13 V and no load at pin 5. 4. See Fig.4. 5. Duty cycle, d = 5% or d = 0,05. 6. When pin 3 is driven separately from pin 1. 7. During normal operation the voltage V8-2 may not be lower than 1,5 V. 8. RL = 8 ; IL = 125 mA (r.m.s.). 9. If guard circuit is active. 10. With a 22 pF capacitor between pins 1 and 5.
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Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
TDA3654 TDA3654Q
Fig.2 Application diagram.
March 1991
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Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
TDA3654 TDA3654Q
Fig.3 Power derating curve.
Fig.4 Quiescent current as a function of the supply voltage.
March 1991
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Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
TDA3654 TDA3654Q
curve 1 2 3 4 5 6 7 8 9
tp d.c. 10 ms 10 ms 1 ms 1 ms 1 ms 1 ms 0,2 ms 0,2 ms - 0,5
peak junction temperature 150 C 150 C 150 C 150 C 150 C 150 C 180 C 150 C 180 C
0,25 0,5 0,25 0,05 0,05 0,1 0,1
Fig.5 Typical SOAR of lower output transistor.
March 1991
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Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
TDA3654 TDA3654Q
Fig.6 Application diagram in combination with TDA2579.
March 1991
11
Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
PACKAGE OUTLINES SIL9P: plastic single in-line power package; 9 leads
TDA3654 TDA3654Q
SOT131-2
non-concave x Dh
D Eh
view B: mounting base side d A2
B seating plane j E
A1 b
L
c 1 Z e bp wM 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT mm A1 max. 2.0 A2 4.6 4.2 b max. 1.1 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 Eh 6 j 3.4 3.1 L 17.2 16.5 Q 2.1 1.8 w 0.25 x 0.03 Z (1) 2.00 1.45 10 mm 9 Q
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT131-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
March 1991
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Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
TDA3654 TDA3654Q
SOT157-2
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)
non-concave D x Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c
1 Z e1 e bp wM
9 m e2 vM
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 5.08 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.25 x 0.03 Z (1) 2.00 1.45
2.54 5.08
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT157-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-12 95-03-11
March 1991
13
Philips Semiconductors
Product specification
Vertical deflection and guard circuit (110)
SOLDERING Introduction
TDA3654 TDA3654Q
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Short-form specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
March 1991
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