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Preliminary Data Sheet No. PD60192 IR2171/IR2172 (S) LINEAR CURRENT SENSING IC Features * * * * * * * * Floating channel up to +600V Monolithic integration Linear current feedback through shunt resistor Direct digital PWM output for easy interface Low IQBS allows the boot strap power supply Independent fast overcurrent trip signal High common mode noise immunity Input overvoltage protection for IGBT short circuit condition * Open Drain outputs Product Summary VOFFSET IQBS Vin Gain temp.drift fo Overcurrent trip signal delay (IR2172) Overcurrent trip level 600Vmax 1mA +/-260mVmax 20ppm/oC (typ.) 40kHz (typ.) 1.5usec (typ) +/-260mV (typ.) Description IR2171/IR2172 are monolithic current sensing IC designed for motor drive applications. It senses the motor phase current through an external shunt resistor, converts from analog to digital signal, and transfers the signal to the low side. IR's proprietary high voltage isolation technology is implemented to enable the high bandwidth signal processing. The output format is discrete PWM to eliminate need for the A/D input interface for the IR2172. The dedicated overcurrent trip (OC) signal facilitates IGBT short circuit protection and the OC output pulse can be programmed by the external resistor and capacitor. The open-drain outputs make easy for any interface from 3.3V to 15V. Packages 8-Lead SOIC 8-Lead PDIP Block Diagram 15V PWM Output GND VCC PO V+ V- Up to 600V IR2171 COM NC VB VS To Motor Phase Up to 600V 15V PWM Output GND Overcurrent VCC PO V+ V- IR2172 COM OC VB VS (Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout. To Motor Phase IR2171/IR2172 Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol VS VBS VCC VIN VPO VOC VINdV/dt PD RthJA TJ TS TL Definition High side offset voltage High side floating supply voltage Low side and logic fixed supply voltage Maximum input voltage between VIN+ and VINDigital PWM output voltage Overcurrent output voltage (IR2172) VIN- input voltage (note 1) Allowable offset voltage slew rate Package power dissipation @ TA +25C Thermal resistance, junction to ambient Junction temperature Storage temperature Lead temperature (soldering, 10 seconds) 8 lead SOIC 8 lead PDIP 8 lead SOIC 8 lead PDIP Min. -0.3 -0.3 -0.3 -5 COM -0.3 COM -0.3 VS -5 -- -- -- -- -- -- -55 -- Max. 600 25 25 5 VCC +0.3 VCC +0.3 VB+ 0.3 50 .625 1.0 200 125 150 150 300 Units V V/ns W C/W C Note 1: Capacitors are required between VB and Vin-, and between VB and Vs pins when bootstrap power is used. The external power supply, when used, is required between Vs and Vin-, and between VB and Vs pins. Recommended Operating Conditions The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended conditions. Symbol VB VS VPO VOC VCC VIN TA Definition High side floating supply voltage High side floating supply offset voltage Digital PWM output voltage Overcurrent output voltage Low side and logic fixed supply voltage Input voltage between VIN+ and VINAmbient temperature Min. VS +13.0 note 2 COM COM 9.5 -260 -40 Max. VS +20 600 VCC VCC 20 +260 125 Units V mV C Note 2: Logic operation for Vs of -5 to +600V. Logic state held for Vs of -5V to -VBS. (Please refer to the Design Tip DT97-3 for more details). 2 www.irf.com IR2171/IR2172 DC Electrical Characteristics VCC = VBS = 15V, and TA = 25oC unless otherwise specified. Symbol VIN VOC+ VOCVOS VOS/ TA G G / TA ILK IQBS IQCC LIN VLIN/TA IOPO IOCC Definition Nominal input voltage range before saturation-260 |VIN+ _ VIN-| Overcurrent trip positive input voltage Overcurrent trip negative input voltage Input offset voltage Input offset voltage temperature drift Gain (duty cycle % per VIN) Gain temperature drift Offset supply leakage current Quiescent VBS supply current Quiescent VCC supply current Linearity (duty cycle deviation from ideal linearity curve) Linearity temperature drift Digital PWM output sink current OC output sink current (IR2172) Min. Typ. Max. Units Test Conditions -- 260 -- -- -10 -- 157 -- -- -- -- -- -- 20 2 10 1 -- -- 10 -- 167 -- 50 2 0.5 1 -- -- -- -- -- mA V/oC %/V ppm/ oC A mA % %/ oC VO = 1V VO = 0.1V VO = 1V VO = 0.1V VB = VS = 600V VS = 0V max gain error=5% (Note 2) 20 -- 1 -- 0.5 .005 -- -- -- -- VIN = 0V (Note 1) mV 260 -260 0 25 162 Note 1: 10mV offset represents 1.5% duty cycle fluctuation Note 2: Gain = (full range of duty cycle in %) / (full input voltage range). AC Electrical Characteristics VCC = VBS = 15V, and TA = 25oC unless otherwise specified. Symbol Definition Propagation delay characteristics fo f / TA Dmin Dmax BW PHS Carrier frequency output Temperature drift of carrier frequency Minimum duty Maximum duty fo bandwidth Phase shift at 1kHz Min. Typ. Max. Units Test Conditions -- -- -- -- 40 500 7 93 15 -10 -- -- -- -- kHz ppm/oC % % kHz o figure 1 VIN = 0 & 5V VIN+=-260mV,VIN-=0V VIN+=+260mV,VIN-=0V VIN+ = 100mVpk -pk sine wave, gain=-3dB VIN+ =100mVpk-pk sine wave www.irf.com 3 IR2171/IR2172 AC Electrical Characteristics cont. VCC = VBS = 15V, unless otherwise specified. Symbol Definition Proagation delay characteristics tdoc twoc Propagation delay time of OC (IR2172) Low true pulse width of OC (IR2172) Min. Typ. Max. Units Test Conditions 1 -- 1.5 1 -- -- sec Timing Waveforms PO Duty=7% Vin+= -260mV Vin- = 0V Duty=93% PO Vin+= +260mV Vin- = 0V Carrier Frequency = 40kHz Figure 1 Output waveform Application Hint: Temperature drift of the output carrier frequency can be cancelled by measuring both a PWM period and the on-time of PWM (Duty) at the same time. Since both periods vary in the same direction, computing the ratio between these values at each PWM period gives consistent measurement of the current feedback over the temperature drift. 4 www.irf.com IR2171/IR2172 Lead Definitions Symbol Description VCC COM VIN+ VINVB VS PO OC N.C. Low side and logic supply voltage Low side logic ground Positive sense input Negative sense input High side supply High side return Digital PWM output Overcurrent output (negative logic) (IR2172 only) No connection Lead Assignment 1 VCC VIN+ 8 1 VCC VIN+ 8 2 PO 8 lead SOIC VIN- 7 2 PO 8 lead PDIP VIN- 7 IR2171S 3 IR2171 VB 6 3 COM COM VB 6 4 NC VS 5 4 NC VS 5 1 VCC VIN+ 8 1 VCC VIN+ 8 8 lead SOIC 2 8 lead PDIP VIN7 2 PO PO VIN- 7 IR2172S 3 IR2172 VB 6 3 COM COM VB 6 4 OC VS 5 4 OC VS 5 www.irf.com 5 IR2171/IR2172 Case outlines 8 Lead PDIP 01-6014 01-3003 01 (MS-001AB) D A 5 B F OOT PRINT 8X 0.72 [.028] DIM A b INCHES MIN .0532 .013 .0075 .189 .1497 MAX .0688 .0098 .020 .0098 .1968 .1574 MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 4.00 A1 .0040 c 6 E 8 7 6 5 H 0.25 [.010] A 6.46 [.255] D E e e1 H K L 8X 1.78 [.070] 1 2 3 4 .050 BAS IC .025 BAS IC .2284 .0099 .016 0 .2440 .0196 .050 8 1.27 BAS IC 0.635 BAS IC 5.80 0.25 0.40 0 6.20 0.50 1.27 8 6X e e1 A C 3X 1.27 [.050] y K x 45 y 0.10 [.004] 8X b 0.25 [.010] A1 CAB 8X L 7 8X c NOT ES: 1. DIMENS IONING & T OLERANCING PE R ASME Y14.5M-1994. 2. CONT ROLLING DIMENSION: MILLIMET ER 3. DIMENS IONS ARE SHOWN IN MILLIME TE RS [INCHES]. 4. OUT LINE CONF ORMS T O JEDEC OUTLINE MS-012AA. 5 DIMENS ION DOES NOT INCLUDE MOLD PROT RUSIONS . MOLD PROT RUS IONS NOT TO EXCEED 0.15 [.006]. 6 DIMENS ION DOES NOT INCLUDE MOLD PROT RUSIONS . MOLD PROT RUS IONS NOT TO EXCEED 0.25 [.010]. 7 DIMENS ION IS T HE LENGT H OF LEAD FOR SOLDERING T O A SUBST RATE. 8 Lead SOIC 6 01-6027 01-0021 11 (MS-012AA) 6/11/2001 www.irf.com |
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