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Features
TC1412/TC1412N
Package Type
8-Pin PDIP/SOIC
VDD 1 IN 2 NC 3 GND 4 2 Inverting NC = No internal connection 6, 7 8 VDD VDD 1 IN 2 NC 3 GND 4 2 6, 7 8 VDD
2A High-Speed MOSFET Drivers
* Latch-Up Protected: Will Withstand 500mA Reverse Current * Input Will Withstand Negative Inputs Up to 5V * ESD Protected: 4kV * High Peak Output Current: 2A * Wide Operating Range - 4.5V to 16V * High Capacitive Load Drive Capability: 1000pF in 18nsec * Short Delay Time: 35nsec Typ * Consistent Delay Times With Changes in Supply Voltage * Matched Delay Times * Low Supply Current - With Logic "1" Input: 500A - With Logic "0" Input: 100A * Low Output Impedance: 4 * Pinout Same as TC1410/TC1411/TC1413
TC1412
7 OUT 6 OUT 5 GND
TC1412N
7 OUT 6 OUT 5 GND
Noninverting
General Description
The TC1412/TC1412N are 2A CMOS buffer/drivers. They will not latch up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500mA of current of either polarity being forced back into their output. All terminals are fully protected against up to 4kV of electrostatic discharge. As MOSFET drivers, the TC1412/TC1412N can easily charge a 1000pF gate capacitance in 18nsec with matched rise and fall times, and provide low enough impedance in both the ON and the OFF states to ensure the MOSFET's intended state will not be affected, even by large transients. The rise and fall time edges are matched to allow driving short-duration inputs with greater accuracy.
Applications
* * * * Switch Mode Power Supplies Pulse Transformer Drive Line Drivers Relay Driver
Device Selection Table
Part Number TC1412COA TC1412CPA TC1412EOA TC1412EPA TC1412NCOA TC1412NCPA TC1412NEOA TC1412NEPA Package 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP Temp. Range 0C to +70C 0C to +70C -40C to +85C -40C to +85C 0C to +70C 0C to +70C -40C to +85C -40C to +85C
2002 Microchip Technology Inc.
DS21391B-page 1
TC1412/TC1412N
Functional Block Diagram
TC1412
Inverting Outputs
VDD
300mV
Output
Noninverting Outputs
Input 4.7V
TC1412N
GND Effective Input C = 10pF
DS21391B-page 2
2002 Microchip Technology Inc.
TC1412/TC1412N
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage..................................................... +20V Input Voltage...................... VDD + 0.3V to GND - 5.0V Power Dissipation (TA 70C) PDIP ........................................................ 730mW SOIC........................................................ 470mW Package Thermal Resistance PDIP RJ-A ..............................................125C/W PDIP RJ-C ............................................... 42C/W SOIC RJ-A ............................................ 155C/W SOIC RJ-C .............................................. 45C/W Operating Temperature Range C Version .........................................0C to +70C E Version ..................................... -40C to +85C Storage Temperature Range ............. -65C to +150C
TC1412/TC1412N ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Over operating temperature range with 4.5V VDD 16V, unless otherwise noted. Typical values are measured at TA = +25C, VDD = 16V. Symbol Input VIH VIL IIN Output VOH VOL RO High Output Voltage Low Output Voltage Output Resistance VDD - 0.025 -- -- -- -- 4 5 5 2.0 0.5 -- 0.025 6 7 7 -- -- V V
Parameter
Min
Typ
Max
Units
Test Conditions
Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current
2.0 -- -1 -10
-- -- -- --
-- 0.8 1 10
V V
A
0V VIN VDD, TA = +25C -40C TA +85C DC Test DC Test VDD = 16V, IO = 10mA, TA = +25C, 0C TA +70C -40C TA +85C VDD = 16V Duty cycle 2%, t 300sec, VDD = 16V
IPK IREV
Peak Output Current Latch-Up Protection Withstand Reverse Current
-- --
A A
2002 Microchip Technology Inc.
DS21391B-page 3
TC1412/TC1412N
TC1412/TC1412N ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Over operating temperature range with 4.5V VDD 16V, unless otherwise noted. Typical values are measured at TA = +25C, VDD = 16V. Symbol Parameter Min Typ Max Units Test Conditions
Switching Time (Note 1) tR Rise Time -- 18 20 22 18 20 22 35 40 40 35 40 40 0.5 0.1 26 31 31 26 31 31 45 50 50 45 50 50 1.0 0.15 nsec TA = +25C, 0C TA +70C -40C TA +85C, Figure 3-2 TA = +25C, 0C TA +70C -40C TA +85C, Figure 3-2 TA = +25C, 0C TA +70C -40C TA +85C, Figure 3-2 TA = +25C, 0C TA +70C -40C TA +85C, Figure 3-2 VIN = 3V, VDD = 16V VIN = 0V
tF
Fall Time
--
nsec
tD1
Delay Time
--
nsec
tD2
Delay Time
--
nsec
Power Supply IS
Note 1:
Power Supply Current
Switching times ensured by design.
-- --
mA
DS21391B-page 4
2002 Microchip Technology Inc.
TC1412/TC1412N
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (8-Pin PDIP, SOIC) 1 2 3 4 5 6 7 8
PIN FUNCTION TABLE
Symbol VDD INPUT NC GND GND OUTPUT OUTPUT VDD Supply input, 4.5V to 16V. Control input. No connection. Ground. Ground. CMOS totem-pole output, common to pin 7. CMOS totem-pole output, common to pin 6. Supply Input, 4.5V to 16V. Description
2002 Microchip Technology Inc.
DS21391B-page 5
TC1412/TC1412N
3.0 APPLICATIONS INFORMATION
THERMAL DERATING CURVE
Thermal Derating Curves
1600 1400 8 Pin DIP
FIGURE 3-1:
MAX. POWER (mW)
1200 1000 800 8 Pin SOIC 600 400 200 0 0 10 20 30 40 50 60 70 80 90 100 110 120
AMBIENT TEMPERATURE (C)
FIGURE 3-2:
SWITCHING TIME TEST CIRCUIT
+5V Input VDD = 16V 0V VDD Output 1,8 2 6,7 0V Output CL = 1000pF 10% 10% 10% tD1 90% tF tD2 tR 90% 90%
4.7F
0.1F
Input
Inverting Driver TC1412
+5V Input 90%
TC1412 TC1412N
4,5
0V VDD
10% 90% tR 10% 90% tD2 10%
Input: 100kHz, square wave, tRISE = tFALL 10nsec
tD1 Output 0V
tF
Noninverting Driver TC1412N
DS21391B-page 6
2002 Microchip Technology Inc.
TC1412/TC1412N
4.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Quiescent Supply Current vs. Supply Voltage
500
Quiescent Supply Current vs. Temperature
500
TA = 25C
VSUPPLY = 16V VIN = 3V
400
400
ISUPPLY (A)
300
ISUPPLY (A)
VIN = 3V
300
200
200
100
VIN = 0V
100
VIN = 0V
0
4
6
8
10
12
14
16
0
-40
-20
0
20
40
60
80
VDD (V)
TEMPERATURE (C)
Input Threshold vs. Supply Voltage
1.6
Input Threshold vs. Temperature
1.6
TA = 25C
1.5
VTHRESHOLD (V)
VSUPPLY = 16V
1.5
1.4
VTHRESHOLD (V)
VIH
VIH
1.4
1.3
1.3
1.2 1.1 4
VIL
1.2
VIL
6
8
10
12
14
16
1.1
-40
-20
0
20
40
60
80
VDD (V)
TEMPERATURE (C)
High-State Output Resistance
13 11
13 11
Low-State Output Resistance
Rds-on (Ohms)
Rds-on (Ohms)
9 7 5 3 1
4
TA = 85C TA = 25C
9 7 5 3
TA = 85C
TA = 25C
TA = -40C
TA = -40C
1
6
8
10 VDD (V)
12
14
16
4
6
8
10 VDD (V)
12
14
16
2002 Microchip Technology Inc.
DS21391B-page 7
TC1412/TC1412N
TYPICAL CHARACTERISTICS (CONTINUED)
Rise Time vs. Supply Voltage
70 60
Fall Time vs. Supply Voltage
70 60 50 40 30 20
CLOAD = 1000pF
CLOAD = 1000pF
TRISE (nsec)
40 30 20
TA = 85C
TFALL (nsec)
50
TA = 85C TA = 25C
TA = 25C
TA = -40C
10 4 6 8 10 12 14 16
TA = -40C
10 4 6 8 10 12 14 16
VDD (V)
VDD (V)
TD1 Propagation Delay vs. Supply Voltage
100 90 80
TD2 (nsec)
TD2 Propagation Delay vs. Supply Voltage
100 90 80
CLOAD = 1000pF
CLOAD = 1000pF
TD1 (nsec)
70 60 50 40 30 20 4
TA = 85C
70 60 50 40
TA = 85C TA = 25C
TA = 25C
TA = -40C
6 8 10 12 14 16
30 20 4 6 8
TA = -40C
10 12 14 16
VDD (V)
VDD (V)
Rise and Fall Times vs. Capacitive Load
60
Propagation Delays vs. Capacitive Load
39 38 37 36 35 34 33 32 0 1000 2000 3000 4000 5000
Propagation Delays (nsec)
50
TA = 25C VDD = 16V
TRISE
TA = 25C VDD = 16V
TD2
TRISE, TFALL (nsec)
40 30 20 10 0
TFALL
TD1
0
1000
2000
3000
4000
5000
CLOAD (pF)
CLOAD (pF)
DS21391B-page 8
2002 Microchip Technology Inc.
TC1412/TC1412N
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
5.2
Package Dimensions
8-Pin Plastic DIP
PIN 1
.260 (6.60) .240 (6.10)
.045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92)
.070 (1.78) .040 (1.02)
.310 (7.87) .290 (7.37)
.040 (1.02) .020 (0.51)
.015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87)
3 MIN.
.110 (2.79) .090 (2.29)
.022 (0.56) .015 (0.38)
Dimensions: inches (mm)
8-Pin SOIC
PIN 1
.157 (3.99) .150 (3.81)
.244 (6.20) .228 (5.79)
.050 (1.27) TYP.
.197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) .050 (1.27) .016 (0.40)
Dimensions: inches (mm)
8 MAX. .
2002 Microchip Technology Inc.
DS21391B-page 9
TC1412/TC1412N
NOTES:
DS21391B-page 10
2002 Microchip Technology Inc.
TC1412/TC1412N
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21391B-page11
TC1412/TC1412N
NOTES:
DS21391B-page12
2002 Microchip Technology Inc.
TC1412/TC1412N
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21391B-page 13
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03/01/02
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DS21391B-page 14
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2002 Microchip Technology Inc.

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