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Precision 5.0V SOT-23 FGATM Voltage Reference FEATURES * Output Voltage: 5.000V * Absolute Initial Accuracy Options: 1.0mV, 2.5mV, & 5.0mV * Ultra Low Power Supply Current: 500nA * Low Temperature Coefficient Options: 10 & 20ppm/C * 10 mA Source & Sink Current Capability * 10 ppm/1000hrs Long Term Stability * * * * * Very Low Dropout Voltage: 100 mV @ no load Supply Voltage Range: 5.1V to 9.0V 5kV ESD (Human Body Model) Standard Package: 3-lead SOT-23 Temp Range: -40C to +85C DESCRIPTION X60003B-50 X60003C-50 X60003D-50 The X60003x-50 FGATM voltage references are very high precision analog voltage references fabricated in Xicor's proprietary Floating Gate Analog technology, which achieves superior levels of performance when compared to conventional band gap, buried zener, or XFETTM technologies. FGATM voltage references feature very high initial accuracy, very low temperature coefficient, excellent long term stability, low noise and excellent line and load regulation, at the lowest power consumption currently available. These voltage references enable advanced applications for precision industrial & portable systems operating at significantly higher accuracy and lower power levels than can be achieved with conventional technologies. APPLICATIONS * High Resolution A/Ds & D/As * Digital Meters * Calibration Systems * V-F Converters TYPICAL APPLICATION * Precision Current Sources * Precision Regulators * Precision Oscillators * Battery Management Systems * Smart sensors * Strain Gage Bridges * Threshold Detectors * Servo Systems VIN = +6.5V 0.1F VIN VOUT 10F X60003x-50 GND 0.001F(*) REF IN Serial Bus Enable SCK SDAT 16 to 24-bit A/D Converter () * Also see Figure 3 in Applications Information REV 1.3.1 2/18/04 www.xicor.com 1 of 14 X60003B-50, X60003C-50, X60003D-50 PACKAGE DIAGRAM X60003x-50 SOT-23 VIN 1 3 GND VOUT 2 PIN CONFIGURATIONS Pin Name GND VIN VOUT Ground Connection Power Supply Input Connection Voltage Reference Output Connection Description ORDERING INFORMATION X 60003 X I G3 - 50 Logo Device Part Number 60003 = Standard B = 1.0 mV, 10 ppm/C C = 2.5 mV, 20 ppm/C D = 5.0 mV, 20 ppm/C I = -40C to +85C G3 = 3 lead SOT-23 50 = 5.000 V Grade Temperature Range Package VOUT Option PART MARKING Order Part Number X60003BIG3-50 X60003CIG3-50 X60003DIG3-50 Top Marking AHA AHB AHC REV 1.3.1 2/18/04 www.xicor.com 2 of 14 X60003B-50, X60003C-50, X60003D-50 ABSOLUTE MAXIMUM RATINGS Storage Temperature Range ...........- 65C to + 125C Voltage on any Pin Referenced to Gnd........................... - 0.5V to + 10V Lead Temperature (soldering, 10 secs) .......... + 225C RECOMMENDED OPERATING CONDITIONS Temperature Industrial COMMENT Absolute Maximum Ratings indicate limits beyond which permanent damage to the device and impaired reliability may occur. These are stress ratings provided for information only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification are not implied. For guaranteed specifications and test conditions, see Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Min. -40C Max. +85C ELECTRICAL CHARACTERISTICS (Operating Conditions: VIN = 6.5V, IOUT = 0mA, COUT = 0.001F, TA = -40 to +85C unless otherwise specified.) Symbol VOUT VOA Parameter Output Voltage VOUT Accuracy X60003B-50 X60003C-50 X60003D-50 Supply Current Input Voltage Range Output Voltage Temperature Coefficient(1) Line Regulation Load Regulation Long Term Stability Thermal Hysteresis(2) Dropout Voltage(3) Current(4) Short Circuit Conditions TA = 25C Min Typ 5.000 Max Units V mV -1.0 -2.5 -5.0 500 5.1 X60003B-50 X60003C-50 X60003D-50 +5.5V VIN +8.0V 0mA ISOURCE 10mA -10mA ISINK 0mA TA = 25C T = -40C to +85C IOUT = 5mA, VOUT = -0.01% TA = 25C 0.1Hz to 10Hz 10 20 10 100 150 50 30 +1.0 +2.5 +5.0 900 9.0 10 20 20 150 50 100 nA V ppm/C IIN VIN TC VOUT VOUT/VIN VOUT/IOUT VOUT/t VOUT/TA VDO ISC VN Note: V/V V/mA ppm/ 1000Hrs ppm 300 80 mV mA Vpp Output Voltage Noise 1. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided by the temperature range; in this case, -40C to +85C = 125C. 2. Thermal Hysteresis is the change in VOUT created by package stress @ TA = 25C after temperature cycling. VOUT is read initially at TA = 25C; the X60003x-50 is then cycled between Hot (85C) and Cold (-40C) before a second VOUT measurement is taken at 25C. The deviation between the initial VOUT reading and the second VOUT reading is then expressed in ppm. 3. Dropout voltage (VDO) is the minimum voltage (VIN) into the X60003x-50 which will produce the output voltage (VOUT) drop specified in the Electrical Characteristics table. 4. Guaranteed by Device Characterization REV 1.3.1 2/18/04 www.xicor.com 3 of 14 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25C unless otherwise specified) LINE REGULATION 150 125 Delta VOUT (V) (normailized to VIN = 6.5V) 100 75 50 25 0 +85C +25C -40C -25 -50 5 6 7 8 9 VIN (V) LINE REGULATION (3 Representative Units) 5.0003 Unit 3, IIN = 700nA Delta VOUT (V) (normailized to 5V at VIN = 6.5V) 5.0002 Unit 1, IIN = 350nA 5.0001 5 Unit 2, IIN = 500nA 4.9999 4.9998 4.9997 5 5.5 6 6.5 7 VIN (V) 7.5 8 8.5 9 REV 1.3.1 2/18/04 www.xicor.com 4 of 14 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25C unless otherwise specified) LOAD REGULATION 1.40 1.20 +85C 1.00 +25C 0.80 DELTA Vout (mV) +25C 0.60 -40C 0.40 0.20 0.00 -0.20 -0.40 0 -20 -15 SINKING -10 -5 0 5 10 15 SOURCING 20 OUTPUT CURRENT (mA) 0.1Hz to 10Hz VOUT NOISE Band Pass Filter with 1 zero at .1Hz and 2 poles at 10 Hz 10V/div 1 Sec/div REV 1.3.1 2/18/04 www.xicor.com 5 of 14 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25C unless otherwise specified) VOUT vs TEMPERATURE Normalized to 25C (3 Representative Units) 5.0025 5.002 5.0015 5.001 Unit 3, IIN = 700nA Unit 1, IIN = 350nA VOUT (V) 5.0005 5 4.9995 4.999 4.9985 4.998 -40 Unit 2, IIN = 500nA -15 10 35 60 85 TEMPERATURE (C) PSRR vs CAP Load 0 -10 -20 -30 No Load 1nF Load 10nF Load PSRR (dB) -40 -50 -60 -70 -80 -90 -100 1 10 100 1000 10000 100000 1000000 100nF Load FREQUENCY (Hz) REV 1.3.1 2/18/04 www.xicor.com 6 of 14 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25C unless otherwise specified) 10mA LOAD TRANSIENT RESPONSE CL = .001F 50A LOAD TRANSIENT RESPONSE CL = .001F 500mV/DIV IIN = -10mA IIN = +10mA 100mV/DIV IIN = -50A IIN = +50A 2mSEC/DIV 500SEC/DIV LINE TRANSIENT RESPONSE CL = 0 LINE TRANSIENT RESPONSE CL = .001F 200mV/DIV VIN = -500mV VIN = +500mV 200mV/DIV VIN = -500mV VIN = +500mV 500SEC/DIV 500SEC/DIV MINIMUM VIN to VOUT DIFFERENTIAL vs. OUTPUT CURRENT 0.45 0.4 VIN to VOUT DIFFERENTIAL (V) +85C 0.35 0.3 0.25 0.2 -40C +25C 0.15 0.1 0.05 0 0 2 4 6 8 10 OUTPUT CURRENT (Sourcing mA) REV 1.3.1 2/18/04 www.xicor.com 7 of 14 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25C unless otherwise specified) ZOUT vs FREQUENCY 180 no Load 160 1nF Load 140 120 10nF Load ZOUT () 100 80 60 40 20 0 1 10 100 1000 10000 100000 100nF Load FREQUENCY (Hz) IIN vs VIN 700 -40C 600 500 25C 85C I IN (nA) 400 300 200 100 0 5 5.5 6 6.5 7 7.5 VIN (V) 8 8.5 9 9.5 REV 1.3.1 2/18/04 www.xicor.com 8 of 14 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25C unless otherwise specified) IIN vs VIN (3 Representative Units) 900 800 700 600 Unit 1 Unit 2 Unit 3 I IN (nA) 500 400 300 200 100 0 5.0 6.0 7.0 8.0 9.0 10.0 VIN (V) TURN-ON TIME 6 IIN = 500nA 5 VIN & VOUT (V) 4 3 2 1 0 0 2 4 6 TIME (mSec) 8 10 12 REV 1.3.1 2/18/04 www.xicor.com 9 of 14 X60003B-50, X60003C-50, X60003D-50 APPLICATIONS INFORMATION FGA Technology The X60003x-50 voltage reference uses the floating gate technology to create references with very low drift and supply current. Essentially the charge stored on a floating gate cell is set precisely in manufacturing. The reference voltage output itself is a buffered version of the floating gate voltage. The resulting reference device has excellent characteristics which are unique in the industry: very low temperature drift, high initial accuracy, and almost zero supply current. Also, the reference voltage itself is not limited by voltage bandgaps or zener settings, so a wide range of reference voltages can be programmed (standard voltage settings are provided, but customer-specific voltages are available). The process used for these reference devices is a floating gate CMOS process, and the amplifier circuitry uses CMOS transistors for amplifier and output transistor circuitry. While providing excellent accuracy, there are limitations in output noise level and load regulation due to the MOS device characteristics. These limitations are addressed with circuit techniques discussed in other sections. Nanopower Operation Reference devices achieve their highest accuracy when powered up continuously, and after initial stabilization has taken place. The X60003x-50 is the first high precision voltage reference with ultra low power consumption that makes it practical to leave power on continuously in battery operated circuits. The X60003x-50 consumes extremely low supply current due to the proprietary FGA technology. Supply current at room temperature is typically 500nA which is 1 to 2 orders of magnitude lower than competitive devices. Application circuits using battery power will benefit greatly from having an accurate, stable reference which essentially presents no load to the battery. In particular, battery powered data converter circuits that would normally require the entire circuit to be disabled when not in use can remain powered up between conversions as shown in figure 1. Data acquisition circuits providing 12 to 24 bits of accuracy can operate with the reference device continuously biased with no power penalty, providing the highest accuracy and lowest possible long term drift. Other reference devices consuming higher supply currents will need to be disabled in between conversions to conserve battery capacity. Absolute accuracy will suffer as the device is biased and requires time to settle to its final value, or, may not actually settle to a final value as power on time may be short. Figure 1. VIN = +6-9V 10F VIN 0.01F VOUT X60003x-50 GND 0.001F REF IN Serial Bus Enable SCK SDAT 12 to 24-bit A/D Converter Board mounting Considerations For applications requiring the highest accuracy, board mounting location should be reviewed. Placing the device in areas subject to slight twisting can cause degradation of the accuracy of the reference voltage due to die stresses. It is normally best to place the device near the edge of a board, or the shortest side, as the axis of bending is most limited at that location. Obviously mounting the device on flexprint or extremely thin PC material will likewise cause loss of reference accuracy. Noise Performance and Reduction: The output noise voltage in a 0.1Hz to 10Hz bandwidth is typically 30Vp-p. This is shown in the plot in the Typical Performance Curves. The noise measurement is made with a bandpass filter made of a 1 pole highpass filter with a corner frequency at .1Hz and a 2-pole low-pass filter with a corner frequency at 12.6Hz to create a filter with a 9.9Hz bandwidth. Noise in the 10KHz to 1MHz bandwidth is approximately 400Vp-p with no capacitance on the output, as shown in Fig. 2 below. These noise measurements are made with a 2 decade bandpass filter made of a 1 pole high-pass filter with a corner frequency at 1/10 of the center frequency and 1-pole low-pass filter with a corner frequency at 10 times the center frequency. Figure 2 also shows the noise in the 10KHz to 1MHz band can 10 of 14 REV 1.3.1 2/18/04 www.xicor.com X60003B-50, X60003C-50, X60003D-50 be reduced to about 50Vp-p using a .001F capacitor on the output. Noise in the 1KHz to 100KHz band can be further reduced using a 0.1F capacitor on the output, but noise in the 1Hz to 100Hz band increases due to instability of the very low power amplifier with a 0.1F capacitance load. For load capacitances above .001F the noise reduction network shown in fig. 3 is recommended. This network reduces noise significantly over the full bandwidth. As shown in fig. 2, noise is reduced to less than 40Vp-p from 1Hz to 1MHz using this network with a .01F capacitor and a 2Kohm resistor in series with a 10F capacitor. Figure 2. X60003x-50 NOISE REDUCTION 400 350 NOISE VOLTAGE (Vp-p) 300 250 200 150 100 50 0 1 10 100 1000 10000 100000 VIN & VOUT (V) CL = 0 CL = .001F CL = .1F CL = .01F & 10F + 2kohm Turn-On Time The X60003x-50 device has ultra-low supply current and thus the time to bias up internal circuitry to final values will be longer than with higher power references. Normal turn-on time is typically 7ms. This is shown in the graph, Figure 4. Since devices can vary in supply current down to 300nA, turn-on time can last up to about 12ms. Care should be taken in system design to include this delay before measurements or conversions are started. Figure 4. X60003 TURN-ON TIME (25C) (3 Representative Units) 7 6 5 4 3 2 1 0 0 2 4 6 TIME (mSec) 8 10 12 IIN = 500nA IIN = 700nA IIN = 350nA Figure 3. VIN = 6.5V 10F .1F VIN VO X60003x-50 GND .01F 10F 2K Temperature Coefficient The limits stated for temperature coefficient (tempco) are governed by the method of measurement. The overwhelming standard for specifying the temperature drift of a reference is to measure the reference voltage at two temperatures, take the total variation, (VHIGH - VLOW), and divide by the temperature extremes of measurement (THIGH - TLOW). The result is divided by the nominal reference voltage (at T=25C) and multiplied by 106 to yield ppm/C. This is the "Box" method for determining temperature coefficient. REV 1.3.1 2/18/04 www.xicor.com 11 of 14 X60003B-50, X60003C-50, X60003D-50 TYPICAL APPLICATION CIRCUITS Precision 5V, 50mA Reference. 6V to 9V R = 200 2N2905 VIN X60003x-50 VOUT GND 5.0V/50mA 0.001F 5.0V Dual Output, High Accuracy Reference 5.5V to 9V 0.1F VIN X60003x-50 VOUT GND 0.001F 5.0V VIN X60003x-50 VOUT GND VIN = -5.5V to -9.0V R1 0.001F R1 = 5.0V - | VIN | ; IOUT 10mA -(IOUT) -5.0V Kelvin Sensed Load 5.5V to 9V 0.1F VIN VOUT X60003x-50 GND + - Load VOUT Sense REV 1.3.1 2/18/04 www.xicor.com 12 of 14 X60003B-50, X60003C-50, X60003D-50 TYPICAL APPLICATION CIRCUITS Negative Voltage Reference X60003x-50 VIN VOUT GND CIN 0.001 COUT = 0.001F -5.0V R1 = 800 VIN = -9V R1 Limits max load current with RI = 800, ILOAD MAX = 4mA R1 = 5.0V - | VIN | -(IOUT) 5V Full Scale Low-Drift 10-bit Adjustable Voltage Source 5.5V to 9V 0.1F VIN VOUT X60003x-50 GND 0.001F VCC RH X9119 2-Wire Bus SDA SCL VSS RL + - VOUT (buffered) VOUT REV 1.3.1 2/18/04 www.xicor.com 13 of 14 X60003B-50, X60003C-50, X60003D-50 PACKAGING INFORMATION 3-Lead Plastic, SOT-23, Package Code G3 0.007 (0.20) B 0.0003 (0.08) 0.046 (1.18) BSC 0.055 (1.40) 0.047 (1.20) 0.093 (2.35) BSC B C L 4X 0.35 H A-B D 0.35 C A-B D 2X N/2 TIPS 1 0.075 (1.90) BSC 2 0.120 (3.04) 0.110 (2.80) 0.034 (0.88) 0.047 (1.02) 0.038 (0.95) BSC Parting Line Seating Plane 0.0004 (0.01) 0.0040 (0.10) 0.035 (0.89) 0.044 (1.12) NOTES: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH 3. DIE AND DIE PADDLE IS FACING DOWN TOWARDS SEATING PLANE 4. THIS PART IS COMPLIANT WITH JEDEC SPECIFICATION TO-236AB 5. DIMENSIONING AND TOLERANCES PER ASME, Y14.5M-1994 LIMITED WARRANTY 12 REF. TYP. 0.10 R MIN. 0.20 in 0.10 R MIN. SEATING PLANE 0-8C 0.575 REF. .024 (0.60) .016 (0.40) (c)Xicor, Inc. 2004 Patents Pending Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without notice. Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, or licenses are implied. TRADEMARK DISCLAIMER: Xicor and the Xicor logo are registered trademarks of Xicor, Inc. AutoStore, Direct Write, Block Lock, SerialFlash, MPS, BiasLock and XDCP are also trademarks of Xicor, Inc. All others belong to their respective owners. U.S. PATENTS Xicor products are covered by one or more of the following U.S. Patents: 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976; 4,980,859; 5,012,132; 5,003,197; 5,023,694; 5,084,667; 5,153,880; 5,153,691; 5,161,137; 5,219,774; 5,270,927; 5,324,676; 5,434,396; 5,544,103; 5,587,573; 5,835,409; 5,977,585. Foreign patents and additional patents pending. LIFE RELATED POLICY In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection and correction, redundancy and back-up features to prevent such an occurrence. Xicor's products are not authorized for use in critical components in life support devices or systems. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. REV 1.3.1 2/18/04 www.xicor.com Characteristics subject to change without notice. 14 of 14 |
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