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DISCRETE SEMICONDUCTORS DATA SHEET BLV958; BLV958FL UHF power transistors Product specification Supersedes data of 1997 Oct 15 2000 Jan 12 Philips Semiconductors Product specification UHF power transistors FEATURES * Internal input and output matching for easy matching, high gain and efficiency * Poly-silicon emitter ballasting resistors for an optimum temperature profile * Gold metallization ensures excellent reliability. APPLICATIONS * Base stations in the 800 to 960 MHz frequency range. PINNING - SOT391A PIN 1 2 3 SYMBOL c b e base emitter; connected to flange DESCRIPTION collector PINNING - SOT391B PIN 1 2 Ground plane DESCRIPTION BLV958; BLV958FL NPN silicon planar epitaxial transistors primarily intended for common emitter class-AB operation. The transistors have internal input and output matching by means of MOS capacitors. The encapsulations are a 2-lead rectangular SOT391A flange package and a SOT391B flangeless package, both with a ceramic cap. SYMBOL c b e base DESCRIPTION collector emitter handbook, halfpage 1 c b 3 handbook, halfpage 1 c b 2 Top view MAM203 e 2 Top view MSA465 e Fig.1 Simplified outline (SOT391A) and symbol. Fig.2 Simplified outline (SOT391B) and symbol. QUICK REFERENCE DATA RF performance at Th = 25 C in a common emitter test circuit. MODE OF OPERATION CW, class-AB f (MHz) 900 960 VCE (V) 26 26 PL (W) 75 75 Gp (dB) 8 8.5 C (%) 50 50 WARNING Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste. 2000 Jan 12 2 Philips Semiconductors Product specification UHF power transistors LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCBO VCEO VEBO IC IC(AV) Ptot Tstg Tj PARAMETER collector-base voltage collector-emitter voltage emitter-base voltage collector current (DC) average collector current total power dissipation storage temperature operating junction temperature Tmb 25 C CONDITIONS open emitter open base open collector BLV958; BLV958FL MIN. - - - - - - -65 - MAX. 70 30 3 15 15 250 +150 200 UNIT V V V A A W C C THERMAL CHARACTERISTICS SYMBOL Rth j-mb Rth mb-h Note 1. Thermal resistance is determined under specified RF operating conditions. PARAMETER thermal resistance from junction to mounting base thermal resistance from mounting base to heatsink CONDITIONS Ptot = 250 W; Tmb = 25 C; note 1 VALUE 0.7 0.2 UNIT K/W K/W 2000 Jan 12 3 Philips Semiconductors Product specification UHF power transistors CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL V(BR)CBO V(BR)CEO V(BR)EBO ICES hFE Cc Notes 1. Measured under pulsed conditions: tp 500 s; 0.01. PARAMETER collector-base breakdown voltage collector-emitter breakdown voltage emitter-base breakdown voltage collector leakage current DC current gain collector capacitance CONDITIONS open emitter; IC = 60 mA open base; IC = 150 mA open collector; IE = 3 mA VBE = 0; VCE = 28 V VCE = 10 V; IC = 4.5 A; note 1; see Fig 3 VCB = 26 V; IE = ie = 0; f = 1 MHz; note 2; see Fig 4 BLV958; BLV958FL MIN. 70 30 3 - 30 - TYP. - - - - - 75 MAX. - - - 5 120 - UNIT V V V mA pF 2. Value of Cc is that of the die only, it is not measurable because of internal matching network. handbook, halfpage 120 MLD243 handbook, halfpage 200 MLD244 h FE Cc (pF) (1) 150 80 (2) 100 40 50 0 0 4 8 12 I C (A) 16 0 0 10 20 30 VCB (V) 40 Measured under pulsed conditions; tp 500 s; 0.01. (1) VCE = 26 V. (2) VCE = 10 V. Value Cc is that of the die only, it is not measurable because of internal matching network. IE = ie = 0; f = 1 MHz. Fig.3 DC current gain as a function of collector current; typical values. Fig.4 Collector capacitance as a function of collector-base voltage; typical values. 2000 Jan 12 4 Philips Semiconductors Product specification UHF power transistors BLV958; BLV958FL APPLICATION INFORMATION RF performance at Th = 25 C in a common emitter, class-AB test circuit; Rth mb-h = 0.2 K/W. MODE OF OPERATION f (MHz) 900 CW, class-AB 960 VCE (V) 26 26 ICQ (mA) 200 200 PL (W) 75 75 Gp (dB) 8 typ. 9.5 8.5 typ. 9.5 C (%) 50 typ. 55 50 typ. 55 Ruggedness in class-AB operation The transistors are capable of withstanding a load mismatch corresponding to VSWR = 4 : 1 through all phases at rated output power, under the following conditions: VCE = 26 V; f = 960 MHz; ICQ = 200 mA; Th = 25 C; Rth mb-h = 0.2 K/W. handbook, halfpage 12 MLD245 60 C (%) 40 MLD246 handbook, halfpage 120 Gp (dB) 8 Gp PL (W) 80 C 4 20 40 0 0 20 40 60 0 80 100 P L (W) 0 0 4 8 12 P i (W) 16 VCE = 26 V; ICQ = 200 mA; f = 960 MHz. VCE = 26 V; ICQ = 200 mA; f = 960 MHz. Fig.5 Power gain and collector efficiency as functions of load power; typical values. Fig.6 Load power as a function of input power; typical values. 2000 Jan 12 5 Philips Semiconductors Product specification UHF power transistors BLV958; BLV958FL handbook, full pagewidth L5 +Vbias C4 C5 C6 C7 R1 C9 C10 L8 R2 +VS C16 C13 C14 C15 C8 L6 L7 C11 C12 L3 L1 C1 L2 C2 L4 DUT L9 L10 C19 L11 C20 C18 MBH109 input 50 L12 output 50 C3 C17 C21 Fig.7 Class-AB test circuit at f = 960 MHz. List of components (see Figs 7 and 8) COMPONENT C1, C20 C2, C19 C3 C4 C5 C6 C7 C8, C11, C14 C9, C10, C13 C12 C15 C16 DESCRIPTION Tekelec, type 5201 multilayer ceramic chip capacitor; note 1 multilayer ceramic chip capacitor; note 1 electrolytic capacitor multilayer ceramic chip capacitor multilayer ceramic chip capacitor; note 1 multilayer ceramic chip capacitor; note 1 multilayer ceramic chip capacitor; note 1 multilayer ceramic chip capacitor; note 1 solid tantalum capacitor multilayer ceramic chip capacitor electrolytic capacitor VALUE 0.8 to 10 pF 15 pF; 500 V 6.2 pF; 500 V 10 F; 63 V 22 nF; 50 V 1 nF; 500 V 33 pF; 500 V 100 pF; 500 V 20 pF; 500 V 1 F; 35 V 100 nF; 50 V 47 F; 40 V 2222 036 68479 2222 030 28109 DIMENSIONS CATALOGUE No. 2000 Jan 12 6 Philips Semiconductors Product specification UHF power transistors BLV958; BLV958FL COMPONENT C17 C18 C21 L1 L2 L3 L4 L5, L8 L6 L7 L9 L10 L11 L12 R1, R2 Notes DESCRIPTION multilayer ceramic chip capacitor; note 1 multilayer ceramic chip capacitor; note 1 multilayer ceramic chip capacitor; note 1 stripline; note 2 stripline; note 2 stripline; note 2 stripline; note 2 Ferroxcube chip-bead grade 4S2 5 turns enamelled 1 mm copper wire 4 turns enamelled 1 mm copper wire stripline; note 2 stripline; note 2 stripline; note 2 stripline; note 2 metal film resistor VALUE 4.7 pF; 500 V 3.3 pF; 500 V 2.7 pF; 500 V DIMENSIONS CATALOGUE No. length 51 mm width 2.2 mm length 7 mm width 2.2 mm length 5.5 mm width 20 mm length 9 mm width 20 mm 4330 030 36300 int. diameter 4 mm close wound int. diameter 4 mm close wound length 12.5 mm width 20 mm length 2 mm width 20 mm length 17 mm width 2.2 mm length 41 mm width 2.2 mm 100 ; 0.4 W 1. American Technical Ceramics type 100B or capacitor of same quality. 2. The striplines are on double-clad printed-circuit board with PTFE fibre-glass dielectric (r = 2.25); thickness 132 inch. 2000 Jan 12 7 Philips Semiconductors Product specification UHF power transistors BLV958; BLV958FL handbook, full pagewidth 75 75 70 70 C5 C4 C6 +Vbias L1 L5 L2 C2 C3 C1 C19 C18 C17 C21 C7 R1 C8 C9 L6 L3 L4 L9 C10 L10 L7 C11 C12 C13 R2 L8 C15 C16 C14 +VS L12 L11 C20 MBH110 The same printed-circuit board can also be used for the flangeless version FL. Dimensions in mm. The components are located on one side of the copper-clad PTFE microfibre-glass board, the other side is unetched and serves as a ground plane. Earth connections from the component side to the ground plane are made by through metallization. Fig.8 Component layout and printed-circuit board for 960 MHz class-AB test circuit. 2000 Jan 12 8 Philips Semiconductors Product specification UHF power transistors BLV958; BLV958FL MLD249 MLD252 handbook, halfpage 5 handbook, halfpage 6 Zi () 4 xi 3 ZL () 4 RL 2 0 2 2 ri 1 4 XL 0 800 850 900 950 1000 1050 f (MHz) 6 800 850 900 950 1000 1050 f (MHz) VCE = 26 V; ICQ = 200 mA; PL = 75 W; Th = 25 C; Rth mb-h = 0.2 K/W. VCE = 26 V; ICQ = 200 mA; PL = 75 W; Th = 25 C; Rth mb-h = 0.2 K/W. Fig.9 Input impedance as a function of frequency (series components); typical values. Fig.10 Load impedance as a function of frequency (series components); typical values. handbook, halfpage 12 MLD253 Gp (dB) 8 handbook, halfpage 4 Zi ZL MBA451 0 800 850 900 950 1000 1050 f (MHz) VCE = 26 V; ICQ = 200 mA; PL = 75 W; Th = 25 C; Rth mb-h = 0.2 K/W. Fig.11 Power gain as a function of frequency; typical values. Fig.12 Definition of transistor impedance. 2000 Jan 12 9 Philips Semiconductors Product specification UHF power transistors PACKAGE OUTLINES Flanged ceramic package; 2 mounting holes; 2 leads BLV958; BLV958FL SOT391A D A F 3 D1 U1 q C B c 1 H U2 p E1 E A b 2 w2 M C M w1 M A M B M Q 0 5 scale 10 mm DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT mm inches A 5.21 4.45 b 5.84 5.59 c 0.15 0.10 D D1 E E1 F 1.65 1.40 H 15.75 14.73 p 3.43 3.18 Q 2.29 2.03 q 20.32 0.800 U1 22.99 22.73 0.905 0.895 U2 9.91 9.65 w1 0.25 w2 0.51 10.87 10.92 10.26 10.29 10.67 10.67 10.06 10.03 0.205 0.230 0.006 0.428 0.430 0.404 0.405 0.065 0.620 0.175 0.220 0.004 0.420 0.420 0.396 0.395 0.055 0.580 0.135 0.090 0.125 0.080 0.390 0.010 0.020 0.380 OUTLINE VERSION SOT391A REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-29 99-12-08 2000 Jan 12 10 Philips Semiconductors Product specification UHF power transistors BLV958; BLV958FL Flangeless ceramic package; 2 leads D SOT391B A c L 1 0 5 scale E DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A 4.09 3.02 b 5.85 5.58 c 0.16 0.10 D E L 2.79 2.29 Q 1.02 0.76 10 mm L b OUTLINE VERSION SOT391B 2 Q REFERENCES IEC JEDEC EIAJ mm 11.54 10.93 10.51 9.90 EUROPEAN PROJECTION ISSUE DATE 97-05-29 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. 2000 Jan 12 11 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000 Internet: http://www.semiconductors.philips.com SCA 69 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 125002/04/pp12 Date of release: 2000 Jan 12 Document order number: 9397 750 06671 |
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