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HS-80C86RH
September 1995
Radiation Hardened 16-Bit CMOS Microprocessor
Description
The Intersil HS-80C86RH high performance radiation hardened 16-bit CMOS CPU is manufactured using a hardened field, self aligned silicon gate CMOS process. Two modes of operation, MINimum for small systems and MAXimum for larger applications such as multiprocessing, allow user configuration to achieve the highest performance level. Industry standard operation allows use of existing NMOS 8086 hardware and software designs.
Features
* Radiation Hardened - Latch Up Free EPl-CMOS - Total Dose >100K RAD (Si) - Transient Upset >108 RAD (Si)/s * Low Power Operation - ICCSB = 500A (Max) - ICCOP = 12mA/MHz (Max) * Pin Compatible with NMOS 8086 and Intersil 80C86 * Completely Static Design DC to 5MHz * 1MB Direct Memory Addressing Capability * 24 Operand Addressing Modes * Bit, Byte, Word, and Block Move Operations * 8-Bit and 16-Bit Signed/Unsigned Arithmetic - Binary or Decimal - Multiply and Divide * Bus-hold Circuitry Eliminates Pull-up Resistors for CMOS Designs * Hardened Field, Self-Aligned, Junction-Isolated CMOS Process * Single 5V Power Supply * Military Temperature Range -35oC to +125oC * Minimum LET for Single Event Upset -6MEV/mg/cm2 (Typ)
Ordering Information
PART NUMBER HS1-80C86RH-8 HS1-80C86RH-Q HS9-80C86RH-8 HS9-80C86RH-Q HS9-80C86RH-SAMPLE HS1-80C86RH-SAMPLE HS9-80C86RH-PROTO HS1-80C86RH-PROTO TEMPERATURE RANGE -35o C to +125o C -35o C to +125o C -35o C to +125o C -35o C to +125o C 25o C 25o C -35o C to +125o C -35o C to +125o C SCREENING LEVEL Intersil Class B Equivalent Intersil Class S Equivalent Intersil Class B Equivalent Intersil Class S Equivalent Sample Sample Prototype Prototype PACKAGE 40 Lead Braze Seal DIP 40 Lead Braze Seal DIP 42 Lead Braze Seal Flatpack 42 Lead Braze Seal Flatpack 42 Lead Braze Seal Flatpack 40 Lead Braze Seal DIP 42 Lead Braze Seal Flatpack 40 Lead Braze Seal DIP
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999
Spec Number File Number
856
518055 3035.1
HS-80C86RH Pinouts
HS-80C86RH 40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835, CDIP2-T40 TOP VIEW
MAX 40 VDD 39 AD15 38 AD16/S3 37 A17/S4 36 A18/S5 35 A19/S6 34 BHE/S7 33 MN/MX 32 RD 31 RQ/GT0 30 RQ/GT1 29 LOCK 28 S2 27 S1 26 S0 25 QS0 24 QS1 23 TEST 22 READY 21 RESET (HOLD) (HLDA) (WR) (M/IO) (DT/R) (DEN) (ALE) (INTA) MIN
GND AD14 AD13 AD12 AD11 AD10 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 NMI INTR CLK GND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
HS-80C86RH 42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE (FLATPACK) INTERSIL OUTLINE K42.A TOP VIEW
GND AD14 AD13 AD12 AD11 AD10 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 NC NMI INTR CLK GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 MAX VDD AD15 NC A16/S3 A17/S4 A18/S5 A19/S6 BHE/S7 MN/MX RD RQ/GT0 RQ/GT1 LOCK S2 S1 S0 QS0 QS1 TEST READY RESET MIN
(HOLD) (HLDA) (WR) (M/IO) (DT/R) (DEN) (ALE) (INTA)
Spec Number 857
518055
HS-80C86RH Functional Diagram
BUS INTERFACE UNIT EXECUTION UNIT REGISTER FILE DATA POINTER AND INDEX REGS (8 WORDS) RELOCATION REGISTER FILE SEGMENT REGISTERS AND INSTRUCTION POINTER (5 WORDS)
16-BIT ALU FLAGS BUS INTERFACE UNIT
4 16 3 4
BHE/S7 A19/S6 A16/S3 AD15-AD0 INTA, RD, WR DT/R, DEN, ALE, M/IO
6-BYTE INSTRUCTION QUEUE TEST INTR NMI RQ/GT0, 1 HOLD HLDA 3 GND VDD 2 CONTROL AND TIMING
LOCK 2 3 QS0, QS1 S2, S1, S0
CLK
RESET READY MN/MX
MEMORY INTERFACE C-BUS
B+BUS ES BUS INTERFACE UNIT CS SS DS IP
INSTRUCTION STREAM BYTE QUEUE
EXECUTION UNIT CONTROL SYSTEM A-BUS
AH BH CH EXECUTION UNIT DH SP BP SI DI
AL BL CL DL
ARITHMETIC/ LOGIC UNIT
FLAGS
Spec Number 858
518055
HS-80C86RH Pin Description
SYMBOL PIN NUMBER TYPE DESCRIPTION
The following pin function descriptions are for HS-80C86RH systems in either minimum or maximum mode. The "Local Bus" in these descriptions is the direct multiplexed bus interface connection to the HS-80C86RH (without regard to additional bus buffers). AD15-AD0 2-16, 39 I/O ADDRESS DATA BUS: These lines constitute the time multiplexed memory/IO address (T1) and data (T2, T3, TW, T4) bus. AO is analogous to BHE for the lower byte of the data bus, pins D7-D0. It is LOW during T1 when a byte is to be transferred on the lower portion of the bus in memory or I/O operations. Eight-bit oriented devices tied to the lower half would normally use AD0 to condition chip select functions (See BHE). These lines are active HIGH and are held at high impedance to the last valid logic level during interrupt acknowledge and local bus "hold acknowledge" or "grant sequence". ADDRESS/STATUS: During T1, these are the four most significant address lines for memory operations. During I/O operations these lines are low. During memory and I/O operations, status information is available on these lines during T2, T3, TW, T4. S6 is always zero. The status of the interrupt enable FLAG bit (S5) is updated at the beginning of each CLK cycle. S4 and S3 are encoded. This information indicates which segment register is presently being used for data accessing. These lines are held at high impedance to the last valid logic level during local bus "hold acknowledge" or "grant sequence". S4 S3 0 0 Extra Data 0 1 Stack 1 0 Code or None 1 1 Data BHE/S7 34 O BUS HIGH ENABLE/STATUS: During T1 the bus high enable signal (BHE) should be used to enable data onto the most significant half of the data bus, pins D15-D8. Eight bit oriented devices tied to the upper half of the bus would normally use BHE to condition chip select functions. BHE is LOW during T1 for read, write, and interrupt acknowledge cycles when a byte is to be transferred on the high portion of the bus. The S7 status information is available during T2, T3 and T4. The signal is active LOW, and is held at high impedance to the last valid logic level during interrupt acknowledge and local bus "hold acknowledge" or "grant sequence"; it is LOW during T1 for the first interrupt acknowledge cycle. BHE A0 0 0 Whole Word 0 1 Upper Byte from/to Odd Address 1 0 Lower Byte from/to Even Address 1 1 None READ: Read strobe indicates that the processor is performing a memory or I/O read cycle, depending on the state of the M/IO or S2 pin. This signal is used to read devices which reside on the HS-80C86RH local bus. RD is active LOW during T2, T3 and TW of any read cycle, and is guaranteed to remain HIGH in T2 until the 80C86 local bus has floated. This line is held at a high impedance logic one state during "hold acknowledge" or "grant sequence". READY 22 I READY: is the acknowledgment from the addressed memory or I/O device that will complete the data transfer. The RDY signal from memory or I/O is synchronized by the HS-82C85RH Clock Generator to form READY. This signal is active HIGH. The HS-80C86RH READY input is not synchronized. Correct operation is not guaranteed if the Setup and Hold Times are not met. INTERRUPT REQUEST: is a level triggered input which is sampled during the last clock cycle of each instruction to determine if the processor should enter into an interrupt acknowledge operation. If so, an interrupt service routine is called via an interrupt vector lookup table located in system memory. INTR is internally synchronized and can be internally masked by software resetting the interrupt enable bit. This signal is active HIGH. TEST: input is examined by the "Wait" instruction. If the TEST input is LOW execution continues, otherwise the processor waits in an "Idle" state. This input is synchronized internally during each clock cycle on the leading edge of CLK. NON-MASKABLE INTERRUPT: is an edge triggered input which causes a type 2 interrupt. An interrupt service routine is called via an interrupt vector lookup table located in system memory. NMI is not maskable internally by software. A transition from LOW to HIGH initiates the interrupt at the end of the current instruction. This input is internally synchronized.
A19/S6 A18/S5 A17/S4 A16/S3
35-38
O
RD
32
O
INTR
18
I
TEST
23
I
NMI
17
I
Spec Number 859
518055
HS-80C86RH Pin Description (Continued)
SYMBOL RESET PIN NUMBER 21 TYPE I DESCRIPTION RESET: causes the processor to immediately terminate its present activity. The signal must change from LOW to HIGH and remain active HIGH for at least 4 CLK cycles. It restarts execution, as described in the Instruction Set description, when RESET returns LOW. RESET is internally synchronized. CLOCK: provides the basic timing for the processor and bus controller. It is asymmetric with a 33% duty cycle to provide optimized internal timing. VDD: +5V power supply pin. A 0.1F capacitor between pins 20 and 40 is recommended for decoupling. GND: Ground. Note: both must be connected. A 0.1F capacitor between pins 1 and 20 is recommended for decoupling. I MINIMUM/MAXIMUM: Indicates what mode the processor is to operate in. The two modes are discussed in the following sections.
CLK VDD GND MN/MX
19 40 1, 20 33
I
The following pin function descriptions are for the HS-80C86RH system in maximum mode (i.e., MN/MX = GND). Only the pin functions which are unique to maximum mode are described below. S0, S1, S2 26-28 O STATUS: is active during T4, T1 and T2 and is returned to the passive state (1,1,1) during T3 or during TW when READY is HIGH. This status is used by the 82C88 Bus Controller to generate all memory and I/O access control signals. Any change by S2, S1, or S0 during T4 is used to indicate the beginning of a bus cycle, and the return to the passive state in T3 or TW is used to indicate the end of a bus cycle. These status lines are encoded. These signals are held at a high impedance logic one state during "grant sequence". S2 S1 S0 0 0 0 Interrupt Acknowledge 0 0 1 Read I/O Port 0 1 0 Write I/O Port 0 1 1 Halt 1 0 0 Code Access 1 0 1 Read Memory 1 1 0 Write Memory 1 1 1 Passive REQUEST/GRANT: pins are used by other local bus masters to force the processor to release the local bus at the end of the processor's current bus cycle. Each pin is bidirectional with RQ/GT0 having higher priority than RQ/GT1. RQ/GT has an internal pull-up bus hold device so it may be left unconnected. The request/grant sequence is as follows (see RQ/GT Sequence Timing.) 1. A pulse of 1 CLK wide from another local bus master indicates a local bus request ("hold") to the HS-80C86RH (pulse 1). 2. During a T4 or T1 clock cycle, a pulse 1 CLK wide from the HS-80C86RH to the requesting master (pulse 2) indicates that the HS-80C86RH has allowed the local bus to float and that it will enter the "grant sequence" state at the next CLK. The CPU's bus interface unit is disconnected logically from the local bus during "grant sequence". 3. A pulse 1 CLK wide from the requesting master indicates to the HS-80C86RH (pulse 3) that the "hold" request is about to end and that the HS-80C86RH can reclaim the local bus at the next CLK. The CPU then enters T4 (or T1 if no bus cycles pending). Each Master-Master exchange of the local bus is a sequence of 3 pulses. There must be one idle CLK cycle after each bus exchange. Pulses are active low. If the request is made while the CPU is performing a memory cycle, it will release the local bus during T4 of the cycle when all the following conditions are met: 1. Request occurs on or before T2. 2. Current cycle is not the low byte of a word (on an odd address). 3. Current cycle is not the first acknowledge of an interrupt acknowledge sequence. 4. A locked instruction is not currently executing. If the local bus is idle when the request is made the two possible events will follow: 1. Local bus will be released during the next cycle. 2. A memory cycle will start within 3 CLKs. Now the four rules for a currently active memory cycle apply with condition number 1 already satisfied.
RQ/GT0 RQ/GT1
31, 30
I/O
Spec Number 860
518055
HS-80C86RH Pin Description (Continued)
SYMBOL LOCK PIN NUMBER 29 TYPE O DESCRIPTION LOCK: output indicates that other system bus masters are not to gain control of the system bus while LOCK is active LOW. The LOCK signal is activated by the "LOCK" prefix instruction and remains active until the completion of the next instruction. This signal is active LOW, and is held at a HIGH impedance logic one state during "grant sequence". In MAX mode, LOCK is automatically generated during T2 of the first INTA cycle and removed during T2 of the second INTA cycle. QUEUE STATUS: The queue status is valid during the CLK cycle after which the queue operation is performed. QS1 and QS2 provide status to allow external tracking of the internal HS-80C86RH instruction queue. Note that QS1, QS0 never become high impedance. QS1 QS0 0 0 No Operation 0 1 First Byte of Opcode from Queue 1 0 Empty the Queue 1 1 Subsequent Byte from Queue The following pin function descriptions are for the HS-80C86RH in minimum mode (i.e. MN/MX = VDD). Only the pin functions which are unique to minimum mode are described; all other pin functions are as described below. M/IO 28 O STATUS LINE: logically equivalent to S2 in the maximum mode. It is used to distinguish a memory access from an I/O access. M/IO becomes valid in the T4 preceding a bus cycle and remains valid until the final T4 of the cycle (M = HIGH, IO = LOW). M/IO is held to a high impedance logic zero during local bus "hold acknowledge". WRITE: indicates that the processor is performing a write memory or write I/O cycle, depending on the state of the M/IO signal. WR is active for T2, T3 and TW of any write cycle. It is active LOW, and is held to high impedance logic one during local bus "hold acknowledge". INTERRUPT ACKNOWLEDGE: is used as a read strobe for interrupt acknowledge cycles. It is active LOW during T2, T3 and TW of each interrupt acknowledge cycle. Note that INTA is never floated. ADDRESS LATCH ENABLE: is provided by the processor to latch the address into the 82C82 latch. It is a HIGH pulse active during clock LOW of Tl of any bus cycle. Note that ALE is never floated. DATA TRANSMIT/RECEIVE: is needed in a minimum system that desires to use a data bus transceiver. It is used to control the direction of data flow through the transceiver. Logically, DT/R is equivalent to S1 in maximum mode, and its timing is the same as for M/IO (T = HlGH, R = LOW). DT/R is held to a high impedance logic one during local bus "hold acknowledge". DATA ENABLE: provided as an output enable fora bus transceiver in a minimum system which uses the transceiver. DEN is active LOW during each memory and I/O access and for INTA cycles. For a read or INTA cycle it is active from the middle of T2 until the middle of T4, while for a write cycle it is active from the beginning of T2 until the middle of T4. DEN is held to a high impedance logic one during local bus "hold acknowledge". HOLD: indicates that another master is requesting a local bus "hold". To be a acknowledged, HOLD must be active HIGH. The processor receiving the "hold" will issue a "hold acknowledge" (HLDA) in the middle of a T4 or T1 clock cycle. Simultaneously with the issuance of HLDA, the processor will float the local bus and control lines. After HOLD is detected as being LOW, the processor will lower HLDA, and when the processor needs to run another cycle, it will again drive the local bus and control lines. HOLD is not an asynchronous input. External synchronization should be provided if the system cannot otherwise guarantee the setup time.
QS1, QS0
24, 25
O
WR
29
O
INTA
24
O
ALE
25
O
DT/R
27
O
DEN
26
O
HOLD HLDA
31 30
I O
Spec Number 861
518055
Specifications HS-80C86RH
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V Input or Output Voltage Applied for all Grades . . . . . . . . . . . . . . . . . .VSS-0.3V to VDD+0.3V Storage Temperature Range . . . . . . . . . . . . . . . . . -65oC to +150oC Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300oC Typical Derating Factor . . . . . . . . . . . 12mA/MHz Increase in IDDOP ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Reliability Information
Thermal Resistance JA JC SBDIP Package . . . . . . . . . . . . . . . . . . . . 40.0oC/W 8.6oC/W Ceramic Flatpack Package . . . . . . . . . . . 72.1oC/W 9.7oC/W Maximum Package Power Dissipation at +125oC Ambient SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.25W Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.69W If Device Power Exceeds Package Dissipation Capability, Provide Heat Sinking or Derate Linearly at the Following Rate SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25.0mW/oC Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . 13.9mW/oC Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9750 Gates
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Operating Conditions
Operating Supply Voltage Range (VDD) . . . . . . . +4.75V to +5.25V Operating Temperature Range (TA) . . . . . . . . . . . . -35oC to +125oC Input Low Voltage (VIL) . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V Input High Voltage (VIH) . . . . . . . . . . . . . . . . . . . . . . . . 3.5V to VDD Clock Input Low Voltage (VILC) . . . . . . . . . . . . . . . . . . 0.0V to 0.8V CLK and MN/MX Input High (VIHC) . . . . . . . . . . VDD - 0.8V to VDD
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS GROUP A SUBGROUPS 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 LIMITS TEMPERATURE -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC VDD 0.4V -1.0 0.4 1.0 V V A MIN 3.0 MAX UNITS V
PARAMETERS TTL High Level Output Voltage CMOS High Level Output Voltage Low Level Output Voltage Input Leakage Current Output Leakage Current Input Current Bus Hold High Input Current Bus Hold Low Standby Power Supply Current Operating Power Supply Current Functional Tests
SYMBOL VOH1 VOH2 VOL IIH or IIL IOZL or IOZH IBHH
CONDITIONS VDD = 4.75V, IO = -2.5mA VIN = 0V or VDD VDD = 4.75V, IO = -100A VIN = 0V or VDD VDD = 4.75V, IO = +2.5mA VIN = 0V or VDD VDD = 5.25V VIN = 0V or VDD Pins: 17-19, 21-23, 33 VDD = 5.25V VIN = 0V or VDD Pins: 2-16, 26-29, 32, 34-39 VDD = 4.75V and 5.25V VIN = 3.0V (Note 1) Pins: 2-16, 26-32, 34-39 VDD = 4.75V and 5.25V VIN = 0.8V (Note 2) Pins: 2-16, 34-39 VDD = 5.25V, VIN = GND or VDD, IO = 0mA (Note 3) VDD = 5.25V, VIN = GND or VDD, IO = 0mA, f = 1MHz VDD = 4.75V and 5.25V, VIN = GND or VDD, f = 1MHz VDD = 4.75V and 5.25V, VIN = GND or 3.5V and VDD = 4.5V, VIN = 0.8V or VDD (Note 4)
1, 2, 3
-10
10
A
1, 2, 3
-600
-40
A
IBHL
1, 2, 3
40
600
A
IDDSB IDDOP FT
1, 2, 3 1, 2, 3 7, 8A, 8B
-
500 12 -
A mA/MHz -
Noise Immunity Functional Tests
FN
7, 8A, 8B
-
-
-
NOTES: 1. IBHH should be measured after raising VIN to VDD and then lowering to 3.0V. 2. IBHL should be measured after lowering VIN to VSS and then raising to 0.8V. 3. IDDSB tested during Clock high time after halt instruction executed. 4. CLK and MN/MX Input High (VIHC) = VDD -0.8
Spec Number 862
518055
Specifications HS-80C86RH
TABLE 2A. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (MIN MODE) ACs tested at worst case VDD, ACs guaranteed over full operating specifications. GROUP A SUBGROUPS 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 LIMITS TEMPERATURE -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC MIN 200 118 69 30 10 113 30 -8 35 30 MAX UNITS ns ns ns ns ns ns ns ns ns ns
PARAMETERS CLK Cycle Period CLK Low Time CLK High Time Data in Setup Time Data in Hold Time Ready Setup Time into 80C86RH Ready Hold Time into 80C86RH Ready Inactive to CLK (Note 2) Hold Setup Time INTR, NMI, Test/Setup Time
SYMBOL TCLCL TCLCH TCHCL TDVCL TCLDX1 TRYHCH TCHRYX TRYLCL THVCH TINVCH
CONDITIONS VDD = 4.75V VDD = 5.25V VDD = 4.75V VDD = 4.75V VDD = 5.25V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V
MIN MODE TIMING RESPONSES (CL = 100pF) Address Valid Delay ALE Width ALE Active Delay ALE Inactive Delay Address Hold Time to ALE Inactive Control Active Delay 1 Control Active Delay 2 Control Inactive Delay RD Active Delay RD Inactive Delay RD Inactive to Next Address Active HLDA Valid Delay TCLAV TLHLL TCLLH TCHLL TLLAX TCVCTV TCHCTV TCVCTX TCLRL TCLRH TRHAV TCLHAV VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC 10 TCLCH 20 TCHCL 10 10 10 10 10 10 TCLCL 45 10 110 80 85 110 110 110 165 150 160 ns ns ns ns ns ns ns ns ns ns ns ns
Spec Number 863
518055
Specifications HS-80C86RH
TABLE 2A. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (MIN MODE) (Continued) ACs tested at worst case VDD, ACs guaranteed over full operating specifications. GROUP A SUBGROUPS 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 LIMITS TEMPERATURE -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC MIN 2TCLCL 75 2TCLCL 60 TCLCH 60 MAX 20 20 UNITS ns ns ns ns ns
PARAMETERS RD Width WR Width Address Valid to ALE Low Output Rise Time Output Fall Time NOTES:
SYMBOL TRLRH TWLWH TAVLL TOLOH TOHOL
CONDITIONS VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V From 0.8V to 2.0V VDD = 4.75V From 2.0V to 0.8V
1. Setup requirement for asynchronous signal only to guarantee recognition at next CLK. 2. Applies only to T2 State (8ns into T3). TABLE 2B. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (MAX MODE) ACs tested at worst case VDD, ACs guaranteed over full operating specifications. GROUP A SUBGROUPS LIMITS TEMPERATURE MIN MAX UNITS
PARAMETERS TIMING REQUIREMENTS CLK Cycle Period CLK Low Time CLK High Time Data in Setup Time Data in Hold Time Ready Setup Time into 80C86RH Ready Hold Time into 80C86RH Ready Inactive to CLK (Note 2) INTR, NMI, Test/Setup Time RQ/GT Setup Time RQ Hold Time into HS-80C86RH (Note 3)
SYMBOL
CONDITIONS
TCLCL TCLCH TCHCL TDVCL TCLDX1 TRYHCH TCHRYX TRYLCL TINVCH TGVCH TCHGX
VDD = 4.75V VDD = 5.25V VDD = 4.75V VDD = 4.75V VDD = 5.25V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V
9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11
-35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC
200 118 69 30 10 113 30 -8 30 30 40
TCHCL + 10
ns ns ns ns ns ns ns ns ns ns ns
MAX MODE TIMING RESPONSES (CL = 100pF) Ready Active to Status Passive (Notes 2 and 4) Status Active Delay TRYHSH TCHSV VDD = 4.75V VDD = 4.75V 9, 10, 11 9, 10, 11 -35oC, +25oC, +125oC -35oC, +25oC, +125oC 10 110 110 ns ns
Spec Number 864
518055
Specifications HS-80C86RH
TABLE 2B. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (MAX MODE) (Continued) ACs tested at worst case VDD, ACs guaranteed over full operating specifications. GROUP A SUBGROUPS 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 LIMITS TEMPERATURE -35oC, +25oC, +125oC TCLAV TCLRL TCLRH TRHAV TCLGL TCLGH TRLRH TOLOH TOHOL VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V VDD = 4.75V From 0.8V to 2.0V VDD = 4.75V From 2.0V to 0.8V -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC -35oC, +25oC, +125oC 10 10 10 TCLCL 45 0 0 2TCLCL 75 110 165 150 85 85 20 20 ns ns ns ns ns ns ns ns ns MIN 10 MAX 130 UNITS ns
PARAMETERS Status Inactive Delay (Note 4) Address Valid Delay RD Active Delay RD Inactive Delay RD Inactive to Next Address Active GT Active Delay GT Inactive Delay RD Width Output Rise Time Output Fall Time NOTES:
SYMBOL TCLSH
CONDITIONS VDD = 4.75V
1. Setup requirement for asynchronous signal only to guarantee recognition at next CLK. 2. Applies only to T2 State (8ns into T3). 3. The HS-80C86RH actively pulls the RQ/GT pin to a logic one on the following clock low time. 4. Status lines return to their inactive (logic one) state after CLK goes low and READY goes high. TABLE 3A. ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETERS Input Capacitance Output Capacitance I/O Capacitance TIMING REQUIREMENTS CLK Rise Time TCH1CH2 VDD = 4.75V and 5.25V Min and Max Mode from 1.0V to 3.5V VDD = 4.75V and 5.25V Min and Max Mode from 3.5V to 1.0V VDD = 4.75V and 5.25V Min and Max Mode from 0.8V to 2.0V VDD = 4.75V and 5.25V Min and Max Mode from 2.0V to 0.8V -35oC < TA < +125oC 15 ns SYMBOL CIN COUT CI/O CONDITIONS VDD = Open, f = 1MHz (Note 1) VDD = Open, f = 1MHz (Note 1) VDD = Open, f = 1MHz (Note 1) TEMPERATURE TA = +25oC MIN MAX 15 15 20 UNITS pF pF pF
TA = +25oC TA = +25oC
CLK Fall Time
TCL2CL1
-35oC < TA < +125oC
-
15
ns
Input Rise Time
TILIH
-35oC < TA < +125oC
-
25
ns
Input Fall Time
TIHIL
-35oC < TA < +125oC
-
25
ns
Spec Number 865
518055
Specifications HS-80C86RH
TABLE 3A. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) LIMITS PARAMETERS TIMING RESPONSES Address Hold Time Address Float Delay (Note 2) Data Valid Delay Data Hold Time Data Hold Time After WR Status Float Delay (Note 2) Address Float to Read Active (Note 2) NOTES: 1. All measurements referenced to device ground. 2. Output drivers disabled. Bus hold circuitry still active. 3. The parameters are controlled via design or process parameters and are not directly tested. These parameters are characterized upon initial design release and upon design changes which would affect these characteristics. TABLE 3B. ELECTRICAL PERFORMANCE CHARACTERISTICS Timing Signals at HS-82C85RH or 82C88 for Reference Only. LIMITS PARAMETERS RDY Setup Time into HS-82C85RH (Note 1) RDY Hold Time into HS-82C85RH (Note 1) Command Active Delay Command Inactive Status Valid to ALE High Status Valid to MCE High CLK Low to ALE Valid CLK Low to MCE High ALE Inactive Delay MCE Inactive Delay Control Active Delay Control Inactive Delay NOTE: 1. Setup requirement for asynchronous signal only to guarantee recognition at next CLK. TABLE 4. POST 100K RAD ELECTRICAL PERFORMANCE CHARACTERISTICS NOTE: See 25oC limits in Table 1 and Table 2 for Post RAD limits (Subgroups 1, 7 and 9). SYMBOL TR1VCL TCLR1X TCLML TCLMH TSVLH TSVMCH TCLLH TCLMCH TCHLL TCLMCL TCVNV TCVNX CONDITIONS Min and Max Mode Min and Max Mode Max Mode Only Max Mode Only Max Mode Only Max Mode Only Max Mode Only Max Mode Only Max Mode Only Max Mode Only Max Mode Only Max Mode Only TEMPERATURE -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC MIN MAX 35 0 5 5 4 5 10 35 35 20 30 20 25 18 15 45 45 UNITS ns ns ns ns ns ns ns ns ns ns ns ns TCLAX TCLAZ TCLDV TCLDX2 TWHDX TCHSZ TAZRL VDD = 4.75V and 5.25V Min and Max Mode VDD = 4.75V and 5.25V Min and Max Mode VDD = 4.75V and 5.25V Min and Max Mode VDD = 4.75V and 5.25V Min and Max Mode VDD = 4.75V and 5.25V Min Mode VDD = 4.75V and 5.25V Max Mode VDD = 4.75V and 5.25V Min and Max Mode -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC -35oC < TA < +125oC 10 TCLAX 10 10 TCLCL - 30 0 80 110 80 ns ns ns ns ns ns ns SYMBOL CONDITIONS TEMPERATURE MIN MAX UNITS
Spec Number 866
518055
Specifications HS-80C86RH
TABLE 5. BURN-IN DELTA PARAMETERS (+25oC) PARAMETER Standby Power Supply Current Output Leakage Current Input Leakage Current Low Level Output Voltage TTL High Level Output Voltage CMOS High Level Output Voltage SYMBOL IDDSB IOZL, IOZH IIH, IIL VOL VOH1 VOH2 DELTA LIMITS 100A 2A 200nA 80mV 600mV 150mV
TABLE 6. APPLICABLE SUBGROUPS GROUP A SUBGROUPS CONFORMANCE GROUP Initial Test Interim Test 1 PDA 1 Interim Test 2 PDA 2 Final Test Group A (Note 1) Subgroup B5 Subgroup B6 Group C Group D Group E, Subgroup 2 NOTES: 1. Alternate Group A testing in accordance with MIL-STD-883 method 5005 may be exercised. 2. Table 5 parameters only. MIL-STD-883 METHOD 100%/5004 100%/5004 100%/5004 100%/5004 100%/5004 100%/5004 Sample 5005 Sample 5005 Sample 5005 Sample 5005 Sample 5005 Sample 5005 TESTED FOR -Q 1, 7, 9 1, 7, 9, 1, 7, 1, 7, 9, 1, 7, 2, 3, 8A, 8B, 10, 11 1, 2, 3, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 7, 8A, 8B, 9, 10, 11 1, 7, 9 N/A 1, 7, 9 1, 7, 9 N/A 1, 2, 3 (Note 2) 1, (Note 2) RECORDED FOR -Q 1 (Note 2) 1, (Note 2) TESTED FOR -8 1, 7, 9 1, 7, 9 1, 7 N/A N/A 2, 3, 8A, 8B, 10, 11 1, 2, 3, 7, 8A, 8B, 9, 10, 11 N/A N/A 1, 2, 3, 7, 8A, 8B, 9, 10, 11 1, 7, 9 1, 7, 9 RECORDED FOR -8
Functional Description
Static Operation All HS-80C86RH circuitry is of static design. Internal registers, counters and latches are static and require no refresh as with dynamic circuit design. This eliminates the minimum operating frequency restriction placed on other microprocessors. The CMOS HS-80C86RH can operate from DC to 5MHz. The processor clock may be stopped in either state (HIGH/LOW) and held there indefinitely. This type of operation is especially useful for system debug or power critical applications. The HS-80C86RH can be single stepped using only the CPU clock. This state can be maintained as long as is necessary. Single step clock operation allows simple interface circuitry to provide critical information for bringing up your system. Static design also allows very low frequency operation (down to DC). In a power critical situation, this can provide extremely low power operation since HS-80C86RH power dissipation is directly related to operating frequency. As the system frequency is reduced, so is the operating power until, ultimately, at a DC input frequency, the HS-80C86RH power requirement is the standby current, (500A maximum). Internal Architecture The internal functions of the HS-80C86RH processor are partitioned logically into two processing units. The first is the Bus Interface Unit (BIU) and the second is the Execution Unit (EU) as shown in the CPU functional diagram. These units can interact directly but for the most part perform as separate asynchronous operational processors. The bus interface unit provides the functions related to instruction fetching and queuing, operand fetch and store, and address relocation. This unit also provides the basic bus control. The overlap of instruction pre-fetching provided by this unit serves to increase processor performance through improved bus bandwidth utilization. Up to 6 bytes of the instruction stream can be queued while waiting for decoding and execution.
Spec Number 867
518055
HS-80C86RH
The instruction stream queuing mechanism allows the BlU to keep the memory utilized very efficiently. Whenever there is space for at least 2 bytes in the queue, the BlU will attempt a word fetch memory cycle. This greatly reduces "dead-time" on the memory bus. The queue acts as a First-In-First-Out (FlFO) buffer, from which the EU extracts instruction bytes as required. If the queue is empty (following a branch instruction, for example), the first byte into the queue immediately becomes available to the EU. The execution unit receives pre-fetched instructions from the BlU queue and provides un-relocated operand addresses to the BlU. Memory operands are passed through the BlU for processing by the EU, which passes results to the BlU for storage. Memory Organization The processor provides a 20-bit address to memory, which locates the byte being referenced. The memory is organized as a linear array of up to 1 million bytes, addressed as 00000(H) to FFFFF(H). The memory is logically divided into code, data, extra and stack segments of up to 64K bytes each, with each segment falling on 16 byte boundaries. (See Figure 1).
FFFFFH
All memory references are made relative to base addresses contained in high speed segment registers. The segment types were chosen based on the addressing needs of programs. The segment register to be selected is automatically chosen according to the specific rules of Table 7. All information in one segment type share the same logical attributes (e.g. code or data). By structuring memory into relocatable areas of similar characteristics and by automatically selecting segment registers, programs are shorter, faster and more structured. (See Table 7). Word (16-bit) operands can be located on even or odd address boundaries and are thus not constrained to even boundaries as is the case in many 16-bit computers. For address and data operands, the least significant byte of the word is stored in the lower valued address location and the most significant byte in the next higher address location. The BlU automatically performs the proper number of memory accesses, one if the word operand is on an even byte boundary and two if it is on an odd byte boundary. Except for the performance penalty, this double access is transparent to the software. The performance penalty does not occur for instruction fetches; only word operands. Physically, the memory is organized as a high bank (D15D6) and a low bank (D7-D0) of 512K bytes addressed in parallel by the processor's address lines. Byte data with even addresses is transferred on the D7-D0 bus lines while odd addressed byte data (A0 HIGH) is transferred on the D15-D6 bus lines. The processor provides two enable signals, BHE and A0, to selectively allow reading from or writing into either an odd byte location, even byte location, or both. The instruction stream is fetched from memory as words and is addressed internally by the processor at the byte level as necessary. In referencing word data, the BlU requires one or two memory cycles depending on whether the starting byte of the word is on an even or odd address, respectively. Consequently, in referencing word operands performance can be optimized by locating data on even address boundaries. This is an especially useful technique for using the stack, since odd address references to the stack may adversely affect the context switching time for interrupt processing or task multiplexing. Certain locations in memory are reserved for specific CPU operations (See Figure 2). Locations from address FFFF0H through FFFFFH are reserved for operations including a jump to the initial program loading routine. Following RESET, the CPU will always begin execution at location FFFF0H where the jump must be located. Locations 00000H through 003FFH are reserved for interrupt operations. Each of the 256 possible interrupt service routines is accessed through its own pair of 16-bit pointers - segment address pointer and offset address pointer. The first pointer, used as the offset address, is loaded into the 1P and the second pointer, which designates the base address is loaded into the CS. At this point program control is transferred to the interrupt routine. The pointer elements are assumed to have been stored at the respective places in reserved memory prior to occurrence of interrupts.
64K BIT
CODE SEGMENT XXXXOH
STACK SEGMENT + OFFSET
SEGMENT REGISTER FILE CS SS DS ES
DATA SEGMENT
EXTRA SEGMENT
00000H
FIGURE 1. HS-80C86RH MEMORY ORGANIZATION TABLE 7. TYPE OF MEMORY REFERENCE Instruction Fetch Stack Operation Variable (Except Following) String Source String Destination BP Used as Base Register DEFAULT SEGMENT BASE CS SS DS DS ES SS ALTERNATE SEGMENT BASE None None CS, ES, SS CS, ES, SS None CS, DS, ES
OFFSET IP SP Effective Address SI DI Effective Address
Spec Number 868
518055
HS-80C86RH
RESET BOOTSTRAP PROGRAM JUMP FFFFFH FFFFOH
Status bits S0, S1 and S2 are used by the bus controller, in maximum mode, to identify the type of bus transaction according to Table 8.
TABLE 8. S2 0 S1 0 0 1 1 0 0 1 1 S0 0 1 0 1 0 1 0 1 CHARACTERISTICS Interrupt Acknowledge Read I/O Port Write I/O Port Halt Instruction Fetch Read Data from Memory Write Data to Memory Passive (no bus cycle)
INTERRUPT POINTER FOR TYPE 255
3FFH 3FCH
7H INTERRUPT POINTER FOR TYPE 1 INTERRUPT POINTER FOR TYPE 0 4H 3H 0H
0 0 0 1 1 1 1
FIGURE 2. RESERVED MEMORY LOCATIONS
Minimum and Maximum Operation Modes The requirements for supporting minimum and maximum HS-80C86RH systems are sufficiently different that they cannot be met efficiently using 40 uniquely defined pins. Consequently, the HS-80C86RH is equipped with a strap pin (MN/MX) which defines the system configuration. The definition of a certain subset of the pins changes, dependent on the condition of the strap pin. When the MN/MX pin is strapped to GND, the HS-80C86RH defines pins 24 through 31 and 34 in maximum mode. When the MN/MX pin is strapped to VDD, the HS-80C86RH generates bus control signals itself on pins 24 through 31 and 34. Bus Operation
Status bits S3 through S7 are time multiplexed with high order address bits and the BHE signal, and are therefore valid during T2 through T4. S3 and S4 indicate which segment register (see Instruction Set Description) was used for this bus cycle in forming the address, according to Table 9.
TABLE 9. S4 0 (Low) 0 S3 0 1 0 1 CHARACTERISTICS Alternate Data (extra segment) Stack Code or None Data
The HS-80C86RH has a combined address and data bus commonly referred to as a time multiplexed bus. This technique provides the most efficient use of pins on the processor while permitting the use of a standard 40-lead package. This "local bus" can be buffered directly and used throughout the system with address latching provided on memory and I/O modules. In addition, the bus can also be demultiplexed at the processor with a single set of 82C82 latches if a standard non-multiplexed bus is desired for the system. Each processor bus cycle consists of at least four CLK cycles. These are referred to as T1, T2, T3 and T4 (see Figure 3). The address is emitted from the processor during T1 and data transfer occurs on the bus during T3 and T4. T2 is used primarily for changing the direction of the bus during read operations. In the event that a "NOT READY" indication is given by the addressed device, "Wait" states (TW) are inserted between T3 and T4. Each inserted wait state is the same duration as a CLK cycle. Idle periods occur between HS-80C86RH driven bus cycles whenever the processor performs internal processing. During T1 of any bus cycle, the ALE (Address Latch Enable) signal is emitted (by either the processor or the 82C88 bus controller, depending on the MN/MX strap). At the trailing edge of this pulse, a valid address and certain status information for the cycle may be latched.
1 (High) 1
S5 is a reflection of the PSW interrupt enable bit. S6 is always zero and S7 is a spare status bit. I/O Addressing In the HS-80C86RH, I/O operations can address up to a maximum of 64K I/O byte registers or 32K I/O word registers. The I/O address appears in the same format as the memory address on bus lines A15-A0. The address lines A19-A16 are zero in I/O operations. The variable I/O instructions which use register DX as a pointer have full address capability while the direct I/O instructions directly address one or two of the 256 I/O byte locations in page 0 of the I/O address space. I/O ports are addressed in the same manner as memory locations. Even addressed bytes are transferred on the D7D0 bus lines and odd addressed bytes on D15-D8. Care must be taken to ensure that each register within an 8-bit peripheral located on the lower portion of the bus be addressed as even.
Spec Number 869
518055
HS-80C86RH
(4 + NWAIT) = TCY T1 CLK T2 T3 TWAIT T4 T1 T2
(4 + NWAIT) = TCY T3 TWAIT T4
GOES INACTIVE IN THE STATE JUST PRIOR TO T4 ALE
S2-S0
ADDR/ STATUS
BHE, A19-A16
S7-S3
ADDR/DATA
A15-A0
D15-D0 VALID
A15-A0
DATA OUT (D15-D0)
RD, INTA READY READY WAIT WAIT READY
DT/R
DEN MEMORY ACCESS TIME
WP
FIGURE 3. BASIC SYSTEM TIMING
Spec Number 870
518055
HS-80C86RH External Interface
Processor RESET and lnitialization Processor initialization or start up is accomplished with activation (HIGH) of the RESET pin. The HS-80C86RH RESET is required to be HIGH for greater than 4 CLK cycles. The HS-80C86RH will terminate operations on the high-going edge of RESET and will remain dormant as long as RESET is HIGH. The low-going transition of RESET triggers an internal reset sequence for approximately 7 CLK cycles. After this interval, the HS-80C86RH operates normally beginning with the instruction in absolute location FFFFOH. (See Figure 2). The RESET input is internally synchronized to the processor clock. At initialization, the HIGH-to-LOW transition of RESET must occur no sooner than 50s (or 4 CLK cycles, whichever is greater) after power-up, to allow complete initialization of the HS-80C86RH. NMl will not be recognized prior to the second clock cycle following the end of RESET. If NMI is asserted sooner than 9 CLK cycles after the end of RESET, the processor may execute one instruction before responding to the interrupt. Bus Hold Circuitry To avoid high current conditions caused by floating inputs to CMOS devices and to eliminate need for pull- up/down resistors, "bus-hold" circuitry has been used on the HS-80C86RH pins 2-16, 26-32 and 34-39. (See Figure 4A and 4B). These circuits will maintain the last valid logic state if no driving source is present (i.e. an unconnected pin or a driving source which goes to a high impedance state). To overdrive the "bus hold" circuits, an external driver must be capable of supplying approximately 400A minimum sink or source current at valid input voltage levels. Since this "bus hold" circuitry is active and not a "resistive" type element, the associated power supply current is negligible and power dissipation is significantly reduced when compared to the use of passive pull-up resistors.
BOND PAD OUTPUT DRIVER INPUT BUFFER EXTERNAL PIN
Interrupt Operations Interrupt operations fall into two classes: software or hardware initiated. The software initiated interrupts and software aspects of hardware interrupts are specified in the Instruction Set Description. Hardware interrupts can be classified as non-maskable or maskable. Interrupts result in a transfer of control to a new program location. A 256-element table containing address pointers to the interrupt service routine locations resides in absolute locations 0 through 3FFH, which are reserved for this purpose. Each element in the table is 4 bytes in size and corresponds to an interrupt "type". An interrupting device supplies an 8-bit type number during the interrupt acknowledge sequence, which is used to "vector" through the appropriate element to the interrupt service routine location. All flags and both the Code Segment and Instruction Pointer register are saved as part of the INTA sequence. These are restored upon execution of an Interrupt Return (lRET) instruction. Non-Maskable Interrupt (NMI) The processor provides a single non-maskable interrupt pin (NMl) which has higher priority than the maskable interrupt request pin (INTR). A typical use would be to activate a power failure routine. The NMl is edge-triggered on a LOWto-HIGH transition. The activation of this pin causes a type 2 interrupt. NMl is required to have a duration in the HIGH state of greater than 2 CLK cycles, but is not required to be synchronized to the clock. Any positive transition of NMl is latched on-chip and will be serviced at the end of the current instruction or between whole moves of a block-type instruction. Worst case response to NMl would be for multiply, divide, and variable shift instructions. There is no specification on the occurrence of the low-going edge; it may occur before, during or after the servicing of NMl. Another positive edge triggers another response if it occurs after the start of the NMl procedure. The signal must be free of logical spikes in general and be free of bounces on the low-going edge to avoid triggering extraneous responses. Maskable Interrupt (INTR) The HS-80C86RH provides a single interrupt request input (INTR) which can be masked internally by software with the resetting of the interrupt enable flag (IF) status bit. The interrupt request signal is level triggered. It is internally synchronized during each clock cycle on the high-going edge of CLK. To be responded to, INTR must be present (HIGH) during the clock period preceding the end of the current instruction or the end of a whole move for a block- type instruction. INTR may be removed anytime after the falling edge of the first INTA signal. During the interrupt response sequence further interrupts are disabled. The enable bit is reset as part of the response to any interrupt (INTR, NMl, software interrupt or single-step), although the FLAGS register which is automatically pushed onto the stack reflects the state of the processor prior to the interrupt. Until the old FLAGS register is restored the enable bit will be zero unless specifically set by an instruction.
INPUT PROTECTION CIRCUITRY
FIGURE 4A. BUS HOLD CIRCUITRY PIN 2-16, 34-39
BOND PAD OUTPUT DRIVER INPUT BUFFER VCC P
EXTERNAL PIN
INPUT PROTECTION CIRCUITRY
FIGURE 4B. BUS HOLD CIRCUITRY PIN 26-32
Spec Number 871
518055
HS-80C86RH
During the response sequence (Figure 5) the processor executes two successive (back-to-back) interrupt acknowledge cycles. The HS-80C86RH emits the LOCK signal (Max mode only) from T2 of the first bus cycle until T2 of the second. A local bus "hold" request will not be honored until the end of the second bus cycle. In the second bus cycle, a byte is supplied to the HS-80C86RH by the HS-82C89ARH Interrupt Controller, which identifies the source (type) of the interrupt. This byte is multiplied by four and used as a pointer into the interrupt vector lookup table. An INTR signal left HIGH will be continually responded to within the limitations of the enable bit and sample period. The INTERRUPT RETURN instruction includes a FLAGS pop which returns the status of the original interrupt enable bit when it restores the FLAGS.
T1 ALE T2 T3 T4 TI T1 T2 T3 T4
External Synchronization Via TEST As an alternative to interrupts, the HS-80C86RH provides a single software-testable input pin (TEST). This input is utilized by executing a WAIT instruction. The single WAIT instruction is repeatedly executed until the TEST input goes active (LOW). The execution of WAIT does not consume bus cycles once the queue is full. If a local bus request occurs during WAIT execution, the HS80C86RH three-states all output drivers while inputs and I/O pins are held at valid logic levels by internal bus-hold circuits. If interrupts are enabled, the HS-80C86RH will recognize interrupts and process them when it regains control of the bus. The WAIT instruction is then refetched, and reexecuted. Basic System Timing Typical system configurations for the processor operating in minimum mode and in maximum mode are shown in Figures 6A and 6B, respectively. In minimum mode, the MN/MX pin is strapped to VDD and the processor emits bus control signals (e.g. RD, WR, etc.) directly. In maximum mode, the MN/MX pin is strapped to GND and the processor emits coded status information which the 82C88 bus controller used to generate MULTIBUSTM compatible bus control signals. Figure 3 shows the signal timing relationships.
TABLE 10. HS-80C86RH REGISTER MODEL
AX BX CX DX AH BH CH DH SP BP SI DI IP FLAGSH CS DS FLAGSL AL BL CL DL ACCUMULATOR BASE COUNT DATA STACK POINTER BASE POINTER SOURCE INDEX DESTINATION INDEX INSTRUCTION POINTER STATUS FLAGS CODE SEGMENT DATA SEGMENT STACK SEGMENT EXTRA SEGMENT
LOCK
INTA
AD0AD15
FLOAT
TYPE VECTOR
FIGURE 5. INTERRUPT ACKNOWLEDGE SEQUENCE
Halt When a software "HALT" instruction is executed the pro- cessor indicates that it is entering the "HALT" state in one of two ways depending upon which mode is strapped. In minimum mode, the processor issues one ALE with no qualifying bus control signals. In maximum mode the processor issues appropriate HALT status on S2, S1, S0 and the 82C88 bus controller issues one ALE. The HS-80C86RH will not leave the "HALT" state when a local bus "hold" is entered while in "HALT". In this case, the processor reissues the HALT indicator at the end of the local bus hold. An NMl or interrupt request (when interrupts enabled) or RESET will force the HS-80C86RH out of the "HALT" state.
Read/Modify/Write (Semaphore)
Operations Via Lock The LOCK status information is provided by the processor when consecutive bus cycles are required during the execution of an instruction. This gives the processor the capability of performing read/modify/write operations on memory (via the Exchange Register With Memory instruction, for example) without another system bus master receiving intervening memory cycles. This is useful in multiprocessor system configurations to accomplish "test and set lock" operations. The LOCK signal is activated (forced LOW) in the clock cycle following decoding of the software "LOCK" prefix instruction. It is deactivated at the end of the last bus cycle of the instruction following the "LOCK" prefix instruction. While LOCK is active a request on a RQ/GT pin will be recorded and then honored at the end of the LOCK.
SS ES MULTIBUSTM is an Intel Trademark
System Timing - Minimum System The read cycle begins in T1 with the assertion of the Address Latch Enable (ALE) signal. The trailing (low-going) edge of this signal is used to latch the address information, which is valid on the address/data bus (AD0-AD15) at this time, into the 82C82 latches. The BHE and A0 signals address the low, high or both bytes. From T1 to T4 the M/IO signal indicates a memory or I/O operation. At T2, the address is removed from the address/data bus and the bus is held at the last valid logic state by internal bus hold devices. The read control signal is also asserted at T2. The read (RD) signal causes the addressed device to enable its data bus drivers to the local bus. Some time later, valid data
Spec Number 872
518055
HS-80C86RH
will be available on the bus and the addressed device will drive the READY line HIGH. When the processor returns the read signal to a HIGH level, the addressed device will threestate its bus drivers. If a transceiver is required to buffer the HS-80C86RH local bus, signals DT/R and DEN are provided by the HS-80C86RH. A write cycle also begins with the assertion of ALE and the emission of the address. The M/IO signal is again asserted to indicate a memory or I/O write operation. In T2, immediately following the address emission, the processor emits the data to be written into the addressed location. This data remains valid until at least the middle of T4. During T2, T3 and TW, the processor asserts the write control signal. The write (WR) signal becomes active at the beginning of T2 as opposed to the read which is delayed somewhat into T2 to provide time for output drivers to become inactive. The BHE and A0 signals are used to select the proper byte(s) of the memory/IO word to be read or written according to Table 11.
TABLE 11. BHE 0 0 1 1 A0 0 1 0 1 CHARACTERISTICS Whole word Upper byte from/to odd address Lower byte from/to even address None
Bus Timing - Medium and Large Size Systems For medium complexity systems the MN/MX pin is connected to GND and the 82C88 Bus Controller is added to the system as well as three 82C82 latches for latching the system address, and a transceiver to allow for bus loading greater than the HS-80C86RH is capable of handling. Bus control signals are generated by the 82C88 instead of the processor in this configuration, although their timing remains relatively the same. The HS-80C86RH status outputs (S2, S1, and S0) provide type-of-cycle information and become 82C88 inputs. This bus cycle information specifies read (code, data or I/O), write (data or I/O), interrupt acknowledge, or software halt. The 82C88 issues control signals specifying memory read or write, I/O read or write, or interrupt acknowledge. The 82C88 provides two types of write strobes, normal and advanced, to be applied as required. The normal write strobes have data valid at the leading edge of write. The advanced write strobes have the same timing as read strobes, and hence, data is not valid at the leading edge of write. The transceiver receives the usual T and 0E inputs from the 82C88 DT/R and DEN signals. For large multiple processor systems, the 82C89 bus arbiter must be added to the system to provide system bus management. In this case, the pointer into the interrupt vector table, which is passed during the second INTA cycle, can be derived from an HS-82C59ARH located on either the local bus or the system bus. The processor's INTA output should drive the SYSB/RESB input of the 82C89 to the proper state when reading the interrupt vector number from the HS82C59ARH during the interrupt acknowledge sequence and software "poll". A Note on Radiation Hardened Product Availability
I/O ports are addressed in the same manner as memory location. Even addressed bytes are transferred on the D7-D0 bus lines and odd address bytes on D15-D6. The basic difference between the interrupt acknowledge cycle and a read cycle is that the interrupt acknowledge signal (INTA) is asserted in place of the read (RD) signal and the address bus is held at the last valid logic state by internal bus hold devices. (See Figure 4). In the second of two successive INTA cycles a byte of information is read from the data bus (D7-D0) as supplied by the interrupt system logic (i.e. HS-82CS9ARH Priority Interrupt Controller). This byte identifies the source (type) of the interrupt. It is multiplied by four and used as a pointer into an interrupt vector Iookup table, as described earlier.
There are no immediate plans to develop the 82C88 Bus Controller or the 82C89 Arbiter as radiation hardened integrated circuits. A Note on SEU Capability of the HS-80C86RH Previous heavy ion testing of the HS-80C86RH has indicated that the SEU threshold of this part is about 6 MEV/mg/cm2. Based upon these results and other analysis, a deep space galactic cosmic-ray environment will result in an SEU rate of about 0.08 upsets/day.
Spec Number 873
518055
HS-80C86RH
VDD MN/MX S0 S1 S2 GND CLK S0 MRDC MWTC NC
RES
HS-82C85RH CLOCK CONTROLLER/ GENERATOR RDY
CLK
READY RESET
HS-80C86RH CPU GND WAIT STATE GENERATOR GND 1 VDD C1 20 C2 40 C1 = C2 = 0.1F VDD LOCK NC
82C88 S1 BUS AMWC S2 CTRLR IORC IOWC DEN DT/R AIOWC ALE INTA
NC
STB GND AD0-AD15 A16-A19 BHE GND ADDR/DATA OE 82C82 (2 OR 3) ADDR
T/R OE HS-82C08RH TRANSCEIVER (2) DATA A0 BHE E W E HS-65262RH CMOS RAM (16) 16K x 1 G CS RD WR
HS-6617RH CMOS PROM (2) 2K x 8 2K x 8
CMOS HS-82CXXRH PERIPHERALS
FIGURE 6A. MAXIMUM MODE HS-80C86RH TYPICAL CONFIGURATION
VDD
RES
HS-82C85RH CLOCK CONTROLLER/ GENERATOR RDY
CLK
MN/MX M/IO RD WR DT/R DEN
VDD
READY INTA RESET
GND
WAIT STATE GENERATOR GND 1 C1 20 C2 40 C1 = C2 = 0.1F
HS-80C86RH CPU ALE GND AD0-AD15 A16-A19 BHE GND ADDR/DATA STB OE 82C82 (2 OR 3) ADDR
VDD
VDD
T/R OE HS-82C08RH TRANSCEIVER (2) OPTIONAL FOR INCREASED DATA BUS DRIVE A0 BHE E W E HS-65262RH CMOS RAM (16) 16K x 1 G CS RD WR DATA
HS-6617RH CMOS PROM (2) 2K x 8 2K x 8
CMOS HS-82CXXRH PERIPHERALS
FIGURE 6B. MINIMUM MODE HS-80C86RH TYPICAL CONFIGURATION
Spec Number 874
518055
HS-80C86RH Waveforms
T1 TCH1CH2 CLK (HS-82C85RH OUTPUT) TCLAV AD15-AD0 TCVCTV WRITE CYCLE (NOTE 1) (RD, INTA, DT/R = VOH) DEN TCVCTV TWLWH WR TCVCTX TCLAZ AD15-AD0 TCHCTV INTA CYCLE (NOTES 1, 3) (RD, WR = VOH BHE = VOL) DT/R TCVCTV INTA TCVCTV DEN TCVCTX TDVCL TCLDX1 POINTER TCHCTV TCLDV TCLAX DATA OUT TWHDX TCVCTX T2 T3 TCL2CL1 TW TCLDX2 T4
AD15-AD0
SOFTWARE HALT DEN, RD, WR, INTA = VOH AD15-AD0
INVALID ADDRESS
SOFTWARE HALT
DT/R = INDETERMINATE
TCLAV
FIGURE 7. BUS TIMING - MINIMUM MODE SYSTEM NOTES: 1. All signals switch between VOH and VOL unless otherwise specified. 2. RDY is sampled near the end of T2, T3, TW to determine if TW machines states are to be inserted. 3. Two INTA cycles run back-to-back. The HS-80C86RH local ADDR/DATA bus is inactive during both INTA cycles. Control signals are shown for the second INTA cycle. 4. Signals at HS-82C85RH are shown for reference only. 5. All timing measurements are made at 1.5V unless otherwise noted.
Spec Number 875
518055
HS-80C86RH Waveforms (Continued)
T1 T2 TCH1CH2 T3 TCL2CL1 TCLCL CLK (HS-82C85RH OUTPUT) TCHCTV M/IO TCLDV TCLAX BHE, A19-A16 TCLLH ALE TCHLL VIH RDY (HS-82C85RH INPUT) SEE NOTE 4 TAVLL VIL TCLRIX TR1VCL TLHLL TLLAX S7-S3 TCLAV TCHCL TCHCTV TCLCH TW T4
TCLAV BHE/S7, A19/S6-A16/S3
TRYLCL
READY (HS-80C86RH INPUT)
TCHRYX
TRYHCH TCLDX1 TCLAZ AD15-AD0 AD15-AD0 TAZRL READ CYCLE (NOTE 1) (WR, INTA = VOH) RD TCHCTV TCLRL DT/R TCVCTV DEN TCVCTX TRLRH TCHCTV TDVCL DATA IN TCLRH TRHAV
FIGURE 8. BUS TIMING - MINIMUM MODE SYSTEM NOTES: 1. All signals switch between VOH and VOL unless otherwise specified. 2. RDY is sampled near the end of T2, T3, TW to determine if TW machines states are to be inserted. 3. Two INTA cycles run back-to-back. The HS-80C86RH local ADDR/DATA bus is inactive during both INTA cycles. Control signals are shown for the second INTA cycle. 4. Signals at HS-82C85RH are shown for reference only. 5. All timing measurements are made at 1.5V unless otherwise noted.
Spec Number 876
518055
HS-80C86RH Waveforms (Continued)
T1 TCLCL CLK TCHCL TCLAV QS0, QS1 TCHSV S2, S1, S0 (EXCEPT HALT) TCLAV BHE/S7, A19/S6-A16/S3 TSVLH TCLLH ALE (82C88 OUTPUT) NOTE 5 RDY (HS-82C85RH INPUT) TCLR1X TRYLCL TR1VCL TCLDV TCLAX BHE, A19-A16 S7-S3 TCLSH (SEE NOTE 8) TCLAV TCLCH T2 TCH1CH2 T3 TCL2CL1 TW T4
TCHLL
READY (HS-80C86RH INPUT) TCLAX
TRYHSH TRYHCH
TCHRYX
READ CYCLE AD15-AD0
TCLAV AD15-AD0 TAZRL RD TCHDTL
TCLAZ
TDVCL DATA IN TCLRH
TCLDX1
TRHAV
TRLRH TCLRL DT/R TCLML 82C88 OUTPUTS SEE NOTES 5, 6 MRDC OR IORC TCVNV DEN TCVNX TCLMH
TCHDTH
FIGURE 9. BUS TIMING - MAXIMUM MODE SYSTEM NOTES: 1. All signals switch between VOH and VOL unless otherwise specified. 2. RDY is sampled near the end of T2, T3, TW to determine if TW machines states are to be inserted. 3. Cascade address is valid between first and second INTA cycle. 4. Two INTA cycles run back-to-back. The HS-80C86RH local ADDR/DATA bus is inactive during both INTA cycles. Control for pointer address is shown for the second INTA cycle. 5. Signals at HS-82C85RH or 82C88 are shown for reference only. 6. The issuance of the 82C88 command and control signals (MRDC, MWTC, AMWC, IORC, IOWC, AIOWC, INTA and DEN) lags the active high 82C88 CEN. 7. All timing measurements are made at 1.5V unless otherwise noted. 8. Status inactive in state just prior to T4.
Spec Number 877
518055
HS-80C86RH Waveforms (Continued)
T1 CLK TCHSV S2, S1, S0 (EXCEPT HALT) TCLDV TCLAX TCLSH (SEE NOTE 8) TCLDX2 T2 T3 TW T4
WRITE CYCLE AD15-AD0
TCLAV
TCVNV DEN 82C88 OUTPUTS SEE NOTES 5, 6 TCLML AMWC OR AIOWC TCLML MWTC OR IOWC INTA CYCLE AD15-AD0 (SEE NOTES 3, 4) TCLAZ AD15-AD0 TSVMCH TCLMCL RESERVED FOR CASCADE ADDR TDVCL POINTER TCLDX1 TCLMH TCLMH TCVNX
MCE/PDEN TCLMCH DT/R 82C88 OUTPUTS SEE NOTES 5, 6
TCHDTL
TCHDTH
TCLML INTA TCVNV DEN TCVNX TCLMH
SOFTWARE HALT - RD, MRDC, IORC, MWTC, AMWC, IOWC, AIOWC, INTA, S0, S1 = VOH AD15-AD0 TCLAV S2 TCHSV TCLSH INVALID ADDRESS
FIGURE 10. BUS TIMING - MAXIMUM MODE SYSTEM (USING 82C88) NOTES: 1. All signals switch between VOH and VOL unless otherwise specified. 2. RDY is sampled near the end of T2, T3, TW to determine if TW machines states are to be inserted. 3. Cascade address is valid between first and second INTA cycle. 4. Two INTA cycles run back-to-back. The HS-80C86RH local ADDR/DATA bus is inactive during both INTA cycles. Control for pointer address is shown for the second INTA cycle. 5. Signals at HS-82C85RH or 82C88 are shown for reference only. 6. The issuance of the 82C88 command and control signals (MRDC, MWTC, AMWC, IORC, IOWC, AIOWC, INTA and DEN) lags the active high 82C88 CEN. 7. All timing measurements are made at 1.5V unless otherwise noted. 8. Status inactive in state just prior to T4.
Spec Number 878
518055
HS-80C86RH Waveforms (Continued)
CLK
TINVCH (SEE NOTE) NMI INTR TEST SIGNAL
NOTE: Setup Requirements for asynchronous signals only to guarantee recognition at next CLK.
FIGURE 11. ASYNCHRONOUS SIGNAL RECOGNITION
50s ANY CLK CYCLE CLK TCLAV TCLAV ANY CLK CYCLE VCC
CLK TCLDX TDVCL
LOCK RESET 4 CLK CYCLES
FIGURE 12. BUS LOCK SIGNAL TIMING (MAXIMUM MODE ONLY)
TCLGL
FIGURE 13. RESET TIMING
ANY CLK CYCLE CLK TCLGH TCLCL RQ/GT PREVIOUS GRANT AD15-AD0
0-CLK CYCLES
TCLGH
TGVCH TCHGX PULSE 1 COPROCESSOR RQ HS-80C86RH (SEE NOTE) TCHSV PULSE 2 HS-80C86RH GT TCLAZ
PULSE 3 COPROCESSOR RELEASE
RD, LOCK BHE/S7, A19/S6-A16/S3 S2, S1, S0
TCHSZ
NOTE: The coprocessor may not drive the buses outside the region shown without risking contention. FIGURE 14. REQUEST/GRANT SEQUENCE TIMING (MAXIMUM MODE ONLY)
1CLK CYCLE CLK THVCH HOLD TCLHAV HLDA TCLAZ AD15-AD0 80C86
1 OR 2 CYCLES
THVCH
TCLHAV
COPROCESSOR TCHSZ
80C86
BHE/S7, A19/S6-A16/S3 RD, WR, M/IO, DT/R, DEN
FIGURE 15. HOLD/HOLD ACKNOWLEDGE TIMING (MINIMUM MODE ONLY)
Spec Number 879
518055
HS-80C86RH AC Test Circuit
OUTPUT FROM DEVICE UNDER TEST CL (Note) TEST POINT
AC Testing Input, Output Waveform
INPUT VIH VIL - 0.4V 1.5V 1.5V OUTPUT VOH VOH
NOTE: Includes stray and jig capacitance.
NOTE: All inputs signals (other than CLK) must switch between VIL Max -0.4V and VIH Min +0.4. CLK must switch between 0.4V and VDD -0.4V. TR and TF must be less than or equal to 15ns. CLK TR and TF must be less than or equal to 10ns.
Burn-In Circuits
HS-80C86RH 40 PIN DIP
VDD 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 CLK 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 VDD 2.7K T T 5.0s LOAD 2.7K F0 F15 F14 F13 F12 F11 F10 F9 F8 F7 F6 F5 F4 F3 F2 F1 NMI 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 READY RESET LOAD LOAD LOAD LOAD LOAD LOAD F16 LOAD LOAD LOAD LOAD LOAD MN/MX LOAD
HS-80C86RH 40 PIN DIP
VDD
STATIC VDD = +6.5V 10% TA = +125oC Minimum Part is Static Sensitive Voltages Must Be Ramped Package: 40 Lead DIP Resistors: 10k 10% (Pins 17, 18, 21-23, 31, 33) 2.7k 5% (Pins 2-16, 39) 1.0k 5% 1/10W Min (Pin 19) Minimum of 5 CLK Pulses After Initial Pulses, CLK is Left High Pulses are 50% Duty Cycle Square Wave VDD = 6.5V 5% (Burn-In) VDD = 6.0V 5% (Life Test) TA = +125oC Package: 40 Lead DIP Part is Static Sensitive Voltage Must Be Ramped
DYNAMIC Resistors: 10k (Pins 17, 18, 21, 22, 23, 33) 3.3k (Pins 2-16, 19, 30, 31, 39) 2.7k Loads As Indicated All Resistors Are At Least 1/8W, 10% F0 = 100kHz, F1 = F0/2, F2 = F1/2 . . . RESET, NMI low after initialization. READY pulsed low every 320ms MN/MX changes state every 5.24s
Spec Number 880
518055
HS-80C86RH Burn-In Circuits (Continued)
HS-80C86RH 42 LEAD FLATPACK
VDD 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 CLK 19 20 21 42 41 40 39 38 37 36 35 34 33 32 31 F4 30 29 28 27 26 25 24 23 22 F0 F3 F2 F1 OPEN NMI 13 14 15 16 17 18 19 20 21 30 29 28 27 26 25 24 23 22 READY RESET LOAD LOAD LOAD LOAD LOAD LOAD F15 F14 F13 F12 F11 F10 F9 F8 F7 F6 F5 2 3 4 5 6 7 8 9 10 11 12 42 41 40 39 38 37 36 35 34 33 32 31 OPEN LOAD LOAD LOAD LOAD LOAD MN/MX LOAD F16
HS-80C86RH 42 LEAD FLATPACK
VDD
VDD 2.7k LOAD
2.7k
STATIC VDD = +6.5V 10% TA = +125oC Minimum Part is Static Sensitive Voltages Must Be Ramped Package: 42 Lead Flatpack Resistors: 10k 10% (Pins 18, 19, 22-24, 32, 34) 2.7k 5% (Pins 2-16, 41) 1.0k 5% 1/10W Min (Pin 20) Minimum of 5 CLK Pulses After Initial Pulses, CLK is Left High Pulses are 50% Duty Cycle Square Wave VDD = 6.5V 5% (Burn-In) VDD = 6.0V 5% (Life Test) TA = +125oC Package: 42 Lead Flatpack Part is Static Sensitive Voltage Must Be Ramped
DYNAMIC Resistors: 10k (Pins 17, 18, 19, 22, 23, 24, 34) 3.3k (Pins 2-16, 20, 31, 32, 41) 2.7k Loads As Indicated All Resistors Are At Least 1/8W, 10% F0 = 100kHz, F1 = F0/2, F2 = F1/2 . . . RESET, NMI low after initialization. READY pulsed low every 320s MN/MX changes state every 5.24s
Spec Number 881
518055
HS-80C86RH Timing Diagrams
F5 READY 4T
READY TIMING AS COMPARED TO F5
F14 F16 RESET NMI PULSE
RESET, NMI, AND MN/MX TIMING AS COMPARED TO F14 AND F16 F0 = 100kHz, 50% duty cycle square wave. F1 = F0/2, F2 = F1/2 . . . F16 = F15/2. READY, RESET, and NMI timing are as shown below: T = 10s. All signals have rise/fall time limits: 100ns < t-rise, t-fall < 500ns RESET has a pulse width = 8T and occurs every two cycles of F16. NMI has a pulse width = 4T and occurs every two cycles of F16. MN/MX is a 50% duty cycle square wave and changes every eight cycles of F16.
Irradiation Circuit
VDD 1 R2 R2 R2 R2 R2 R2 R2 R2 R2 R2 R2 R2 R2 R2 R2 R3 R3 R3 CLOCK 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 NMI INTR CLK GND TEST READY RESET HOLD HLDA MN/MX VSS VCC 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 R3 R3 R2 R2 LOAD LOAD LOAD LOAD LOAD R2 LOAD R2 LOAD LOAD LOAD LOAD LOAD LOAD LOAD R3 R3 R3 RESET 2.7K 2.7K LOAD
NOTES: 1. VDD = 5.0V 0.5V 2. R2 = 3.3k, R3 = 47k 3. Pins Tied to GND: 1-18, 20, 23, 39 Pins Tied to VCC: 22, 31, 33, 40 Pins With Loads: 24-29, 30, 32, 34-38 Pins Brought Out: 19 (Clock), 21 (Reset) 4. Clock and reset should be brought out separately so they can be toggled before irradiation. 5. Group E Sample Size is 2 Die/Wafer.
Spec Number 882
518055
HS-80C86RH Intersil Space Level Product Flow - Q
All Lots - Wafer Lot Acceptance (Including SEM) Method 5007 Each Wafer - GAMMA Radiation Verification, Two samples/wafer, 0 rejects, Method 1019 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method 2011 Sample - Die Shear Monitor, Method 2019 or 2027 100% Internal Visual Inspection, Method 2010, Condition A 100% Temperature Cycle - Method 1010, Condition C, 10 cycles 100% Constant Acceleration, Method 2001, Condition Per Method 5004 100% PIND - Method 2020, Condition A 100% External Visual 100% Serialization 100% Initial Electrical Test (T0) 100% Static Burn-In 1, Method 1015, Condition A or B, 72 Hours Minimum, 125oC minimum
NOTES: 1. Modified SEM Inspection, not compliant to MIL-STD-883, Method 2018. This device does not meet the Class S minimum metal step coverage of 50%. The metal does meet the current density requirement of <2 E5 A/cm2. Data provided upon request. 2. Failures from subgroups 1, 7 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the failures from subgroup 7. 3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004. 4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005. 5. Group B and D inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include separate line items for Group B test, Group B samples, Group D tests and Group D samples. 6. Group D Generic Data, as defined by MIL-I-38535, is optional and will not be supplied unless required by the P.O. When required, the P.O. should include separate line items for Group D generic data. Generic Data is not guaranteed to be available and is therefore not available in all cases. 7. Data Package Contents: * Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quantity). Wafer Lot Acceptance Report (Method 5007) to include reproductions of SEM photos with percent of step coverage. * GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, test package used, specification numbers, test equipment, etc. Radiation Read and Record data on file at Intersil. * X-Ray Report and Film, including penetrameter measurements. * Lot Serial Number Sheet (Good Unit(s) Serial Number and Lot Number). * Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test. * Group B and D attributes and/or Generic data is included when required by P.O. * The Certificate of Conformance is a part of the shipping invoice and is not part of Data Book. The Certificate of Conformance is signed by an authorized Quality Representative.
100% Interim Electrical Test 1 (T1) 100% Delta Calculation (T0-T1) 100% PDA 1, Method 5004 (Note 1) 100% Dynamic Burn-In, Condition D, 240 hours, +125oC or Equivalent Per Method 1015 100% Interim Electrical Test 2 (T2) 100% Delta Calculation (T0-T2) 100% PDA 2, Method 5004 (Note 2) 100% Final Electric Test (T3) 100% Fine/Gross Leak, Method 1014 100% Radiographic, Method 2012 (Note 3) 100% External Visual, Method 2009 Sample - Group A, Method 5005 (Note 4) Sample - Group B, Method 5005 (Note 5) Sample - Group D, Method 5005 (Notes 5, 6) 100% Data Package Generation (Note 6)
Spec Number 883
518055
HS-80C86RH Intersil Space Level Product Flow - 8
Each Wafer - GAMMA Radiation Verification, 2 samples/wafer, 0 rejects, Method 1019 100% Die Attach Periodic - Wire Bond Pull Monitor, Method 2011 Periodic - Die Shear Monitor, Method 2019 or 2027 100% Internal Visual Inspection, Method 2010, Condition B CSI and/or GSI PreCap (Note 5) 100% Temperature Cycle, Method 1010, Condition C, 10 cycles 100% Constant Acceleration, Method 2001, Condition Per Method 5004 100% External Visual 100% Initial Electrical Test 100% Dynamic Burn-In, Condition D, 160 hours, +125oC, or Equivalent, Per Method 1015
NOTES: 1. Failures from subgroups 1, 7 are used for calculating PDA. The maximum allowable PDA = 5%. 2. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005 may be performed. 3. Group B, C, and D inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include separate line items for Group B Test, Group C Test, Group C Samples, Group D Test and Group D Samples. 4. Group C and/or Group D Generic Data, as defined by MIL-I-38535, is optional and will not be supplied unless required by the P.O. When required, the P.O. should include separate line items for Group D generic data. Generic Data is not guaranteed to be available and is therefore not available in all cases. 5. CSI and /or GSI inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include separate line items for CSI PreCap inspection, CSI final inspection, GSI PreCap inspection, and/or GSI final inspection. 6. Data Package Contents: * Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quantity). * GAMMA Radiation Report. Contains Cover page, disposition, RAD Dose, Lot Number, test package used, specification numbers, test equipment, etc. Radiation Read and Record data on file at Intersil. * Screening, Electrical, and Group A attributes (Screening attributes begins at Initial Electrical Test). * Group B, C and D attributes and/or Generic data is included when required by P.O. * Variables Data (All Delta operations) Data is identified by serial number. Data header includes lot number and date of test. * Group B and D attributes and/or Generic data is included when required by P.O. * The Certificate of Conformance is a part of the shipping invoice and is not part of Data Book. The Certificate of Conformance is signed by an authorized Quality Representative.
100% Interim Electrical Test 100% PDA, Method 5004 (Note 1) 100% Final Electric Test 100% Fine/Gross Leak, Method 1014 100% External Visual, Method 2009 Sample - Group A, Method 5005 (Note 2) Sample - Group B, Method 5005 (Note 3) Sample - Group C, Method 5005 (Notes 3, 4) Sample - Group D, Method 5005 (Notes 3, 4) 100% Data Package Generation (Note 6) CSI and/or GSI Final (Note 5)
Spec Number 884
518055
HS-80C86RH Metallization Topology
DIE DIMENSIONS: 6370m x 7420m x 485m METALLIZATION: Type: Al/S Thickness: 11kA 2kA GLASSIVATION: Thickness: 8kA 1kA WORST CASE CURRENT DENSITY: <2 x 105A/cm2
Metallization Mask Layout
HS-80C86RH
(3) AD13 (37) A17/S4 (39) AD15 (38) AD16 (5) AD11 (4) AD12 (40) VCC (2) AD14
(1) GND
(36) A18/S5
(35) A19/S6 AD10 (6) AD9 (7) (34) BHE/S7 (33) MN/MX
AD8 (8) (32) RD AD7 (9)
(31) RQ/GT0 AD6 (10) AD5 (11) (30) RQ/GT1
AD4 (12) AD3 (13)
(29) LOCK
(28) S2 AD2 (14) (27) S1 AD1 (15) (26) S0 AD0 (16)
NMI (17)
INTR (18)
READY (22)
RESET (21)
QSI (21)
CLK (19)
GND (20)
TEST (23)
QS0 (25)
Spec Number 885
518055
HS-80C86RH Instruction Set Summary
INSTRUCTION CODE MNEMONIC AND DESCRIPTION DATA TRANSFER MOV = MOVE: Register/Memory to/from Register Immediate to Register/Memory Immediate to Register Memory to Accumulator Accumulator to Memory Register/Memory to Segment Register Segment Register to Register/Memory PUSH = Push: Register/Memory Register Segment Register POP = Pop: Register/Memory Register Segment Register XCHG = Exchange: Register/Memory with Register Register with Accumulator IN = Input from: Fixed Port Variable Port OUT = Output to: Fixed Port Variable Port XLAT = Translate Byte to AL LEA = Load EA to Register2 LDS = Load Pointer to DS LES = Load Pointer to ES LAHF = Load AH with Flags SAHF = Store AH into Flags PUSHF = Push Flags POPF = Pop Flags 1110011w 1110111w 11010111 10001101 11000101 11000100 10011111 10011110 10011100 10011101 mod reg r/m mod reg r/m mod reg r/m port 1110010w 1110110w port 1000011w 1 0 0 1 0 reg mod reg r/m 10001111 0 1 0 1 1 reg 0 0 0 reg 1 1 1 mod 0 0 0 r/m 11111111 0 1 0 1 0 reg 0 0 0 reg 1 1 0 mod 1 1 0 r/m 100010dw 1100011w 1 0 1 1 w reg 1010000w 1010001w 10001110 10001100 mod reg r/m mod 0 0 0 r/m data addr-low addr-low mod 0 reg r/m mod 0 reg r/m data data if w 1 addr-high addr-high data if w 1 76543210 76543210 76543210 76543210
Spec Number 886
518055
HS-80C86RH Instruction Set Summary (Continued)
INSTRUCTION CODE MNEMONIC AND DESCRIPTION ARITHMETIC ADD = Add: Register/Memory with Register to Either Immediate to Register/Memory Immediate to Accumulator ADC = Add with Carry: Register/Memory with Register to Either Immediate to Register/Memory Immediate to Accumulator INC = Increment: Register/Memory Register AAA = ASCll Adjust for Add DAA = Decimal Adjust for Add SUB = Subtract: Register/Memory and Register to Either Immediate from Register/Memory Immediate from Accumulator SBB = Subtract with Borrow Register/Memory and Register to Either Immediate from Register/Memory Immediate from Accumulator DEC = Decrement: Register/Memory Register NEG = Change Sign CMP = Compare: Register/Memory and Register Immediate with Register/Memory Immediate with Accumulator AAS = ASCll Adjust for Subtract DAS = Decimal Adjust for Subtract MUL = Multiply (Unsigned) IMUL = Integer Multiply (Signed) AAM = ASCll Adjust for Multiply DlV = Divide (Unsigned) IDlV = Integer Divide (Signed) AAD = ASClI Adjust for Divide CBW = Convert Byte to Word CWD = Convert Word to Double Word 001110dw 100000sw 0011110w 00111111 00101111 1111011w 1111011w 11010100 1111011w 1111011w 11010101 10011000 10011001 mod 1 0 0 r/m mod 1 0 1 r/m 00001010 mod 1 1 0 r/m mod 1 1 1 r/m 00001010 mod reg r/m mod 1 1 1 r/m data data data if w = 1 data if s:w = 01 1111111w 0 1 0 0 1 reg 1111011w mod 0 1 1 r/m mod 0 0 1 r/m 000110dw 100000sw 0001110w mod reg r/m mod 0 1 1 r/m data data data if w = 1 data if s:w = 01 001010dw 100000sw 0010110w mod reg r/m mod 1 0 1 r/m data data data if w = 1 data if s:w = 01 1111111w 0 1 0 0 0 reg 00110111 00100111 mod 0 0 0 r/m 000100dw 100000sw 0001010w mod reg r/m mod 0 1 0 r/m data data data if w = 1 data if s:w = 01 000000dw 100000sw 0000010w mod reg r/m mod 0 0 0 r/m data data data if w = 1 data if s:w = 01 76543210 76543210 76543210 76543210
Spec Number 887
518055
HS-80C86RH Instruction Set Summary (Continued)
INSTRUCTION CODE MNEMONIC AND DESCRIPTION LOGIC NOT = Invert SHL/SAL = Shift Logical/Arithmetic Left SHR = Shift Logical Right SAR = Shift Arithmetic Right ROL = Rotate Left ROR = Rotate Right RCL = Rotate Through Carry Flag Left RCR = Rotate Through Carry Right AND = And: Reg./Memory and Register to Either Immediate to Register/Memory Immediate to Accumulator TEST = And Function to Flags, No Result: Register/Memory and Register Immediate Data and Register/Memory Immediate Data and Accumulator OR = Or: Register/Memory and Register to Either Immediate to Register/Memory Immediate to Accumulator XOR = Exclusive or: Register/Memory and Register to Either Immediate to Register/Memory Immediate to Accumulator STRING MANIPULATION REP = Repeat MOVS = Move Byte/Word CMPS = Compare Byte/Word SCAS = Scan Byte/Word LODS = Load Byte/Word to AL/AX STOS = Stor Byte/Word from AL/A CONTROL TRANSFER CALL = Call: Direct Within Segment Indirect Within Segment Direct Intersegment 11101000 11111111 10011010 disp-low mod 0 1 0 r/m offset-low seg-low Indirect Intersegment 11111111 mod 0 1 1 r/m offset-high seg-high disp-high 1111001z 1010010w 1010011w 1010111w 1010110w 1010101w 001100dw 1000000w 0011010w mod reg r/m mod 1 1 0 r/m data data data if w = 1 data if w = 1 000010dw 1000000w 0000110w mod reg r/m mod 1 0 1 r/m data data data if w = 1 data if w = 1 1000010w 1111011w 1010100w mod reg r/m mod 0 0 0 r/m data data data if w = 1 data if w = 1 0010000dw 1000000w 0010010w mod reg r/m mod 1 0 0 r/m data data data if w = 1 data if w = 1 1111011w 110100vw 110100vw 110100vw 110100vw 110100vw 110100vw 110100vw mod 0 1 0 r/m mod 1 0 0 r/m mod 1 0 1 r/m mod 1 1 1 r/m mod 0 0 0 r/m mod 0 0 1 r/m mod 0 1 0 r/m mod 0 1 1 r/m 76543210 76543210 76543210 76543210
Spec Number 888
518055
HS-80C86RH Instruction Set Summary (Continued)
INSTRUCTION CODE MNEMONIC AND DESCRIPTION JMP = Unconditional Jump: Direct Within Segment Direct Within Segment-Short Indirect Within Segment Direct Intersegment Direct Intersegment 11101001 11101011 11111111 11101010 11101010 disp-low disp mod 1 0 0 r/m offset-low offset-low seg-low Indirect Intersegment RET = Return from CALL: Within Segment Within Seg Adding lmmed to SP Intersegment Intersegment Adding Immediate to SP JE/JZ = Jump on Equal/Zero JL/JNGE = Jump on Less/Not Greater or Equal JLE/JNG = Jump on Less or Equal/ Not Greater JB/JNAE = Jump on Below/Not Above or Equal JBE/JNA = Jump on Below or Equal/Not Above JP/JPE = Jump on Parity/Parity Even JO = Jump on Overtlow JS = Jump on Sign JNE/JNZ = Jump on Not Equal/Not Zero JNL/JGE = Jump on Not Less/Greater or Equal JNLE/JG = Jump on Not Less or Equal/Greater JNB/JAE = Jump on Not Below/Above or Equal JNBE/JA = Jump on Not Below or Equal/Above JNP/JPO = Jump on Not Par/Par Odd JNO = Jump on Not Overflow JNS = Jump on Not Sign LOOP = Loop CX Times LOOPZ/LOOPE = Loop While Zero/Equal LOOPNZ/LOOPNE = Loop While Not Zero/Equal JCXZ = Jump on CX Zero INT = Interrupt Type Specified Type 3 INTO = Interrupt on Overflow IRET = Interrupt Return 11001101 11001100 11001110 11001111 type 11000011 11000010 11001011 11001010 01110100 01111100 01111110 01110010 01110110 01111010 01110000 01111000 01110101 01111101 01111111 01110011 01110111 01111011 01110001 01111001 11100010 11100001 11100000 11100011 data-low disp disp disp disp disp disp disp disp disp disp disp disp disp disp disp disp disp disp disp disp data-high data-low data-high 11111111 mod 1 0 1 r/m offset-high offset-high seg-high disp-high 76543210 76543210 76543210 76543210
Spec Number 889
518055
HS-80C86RH Instruction Set Summary (Continued)
INSTRUCTION CODE MNEMONIC AND DESCRIPTION PROCESSOR CONTROL CLC = Clear Carry CMC = Complement Carry STC = Set Carry CLD = Clear Direction STD = Set Direction CLl = Clear Interrupt ST = Set Interrupt HLT = Halt WAIT = Wait ESC = Escape (to External Device) LOCK = Bus Lock Prefix NOTES: AL = 8-bit accumulator AX = 16-bit accumulator CX = Count register DS= Data segment ES = Extra segment Above/below refers to unsigned value. Greater = more positive; Less = less positive (more negative) signed values if d = 1 then "to" reg; if d = 0 then "from" reg if w = 1 then word instruction; if w = 0 then byte instruction if mod = 11 then r/m is treated as a REG field if mod = 00 then DISP = O, disp-low and disp-high are absent if mod = 01 then DISP = disp-low sign-extended 16-bits, disp-high is absent if mod = 10 then DISP = disp-high:disp-low if r/m = 000 then EA = (BX) + (SI) + DISP if r/m = 001 then EA = (BX) + (DI) + DISP if r/m = 010 then EA = (BP) + (SI) + DISP if r/m = 011 then EA = (BP) + (DI) + DISP if r/m = 100 then EA = (SI) + DISP if r/m = 101 then EA = (DI) + DISP if r/m = 110 then EA = (BP) + DISP if r/m = 111 then EA = (BX) + DISP DISP follows 2nd byte of instruction (before data if required) except if mod = 00 and r/m = 110 then EA = disp-high: disp-low. MOV CS, REG/MEMORY not allowed. 11111000 11110101 11111001 11111100 11111101 11111010 11111011 11110100 10011011 11011xxx 11110000 if s:w = 01 then 16 bits of immediate data form the operand. if s:w. = 11 then an immediate data byte is sign extended to form the 16-bit operand. if v = 0 then "count" = 1; if v = 1 then "count" in (CL) x = don't care z is used for string primitives for comparison with ZF FLAG. SEGMENT OVERRIDE PREFIX 001 reg 11 0 REG is assigned according to the following table: 16-BIT (w = 1) 000 AX 001 CX 010 DX 011 BX 100 SP 101 BP 110 SI 111 DI 8-BIT (w = 0) 000 AL 001 CL 010 DL 011 BL 100 AH 101 CH 110 DH 111 BH SEGMENT 00 ES 01 CS 10 SS 11 DS 00 ES 00 ES 00 ES 00 ES mod x x x r/m 76543210 76543210 76543210 76543210
Instructions which reference the flag register file as a 16-bit object use the symbol FLAGS to represent the file: FLAGS = X:X:X:X:(OF):(DF):(IF):(TF):(SF):(ZF):X:(AF):X:(PF):X:(CF) Mnemonics (c) Intel, 1978
Spec Number 890
518055
HS-80C86RH Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
c1 -A-DBASE METAL b1 M (b) SECTION A-A (c) LEAD FINISH
D40.6 MIL-STD-1835 CDIP2-T40 (D-5, CONFIGURATION C) 40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
INCHES SYMBOL A b b1 b2 b3 MIN 0.014 0.014 0.045 0.023 0.008 0.008 0.510 MAX 0.225 0.026 0.023 0.065 0.045 0.018 0.015 2.096 0.620 MILLIMETERS MIN 0.36 0.36 1.14 0.58 0.20 0.20 12.95 MAX 5.72 0.66 0.58 1.65 1.14 0.46 0.38 53.24 15.75 NOTES 2 3 4 2 3 4 4 5 6 7 2 8 Rev. 0 4/94
E M -Bbbb S C A - B S BASE PLANE SEATING PLANE S1 b2 b AA D S2 -CQ A L DS
c c1 D eA E e eA eA/2
e
eA/2
c
0.100 BSC 0.600 BSC 0.300 BSC 0.125 0.015 0.005 0.005 90o 40 0.200 0.070 105o 0.015 0.030 0.010 0.0015
2.54 BSC 15.24 BSC 7.62 BSC 3.18 0.38 0.13 0.13 90o 40 5.08 1.78 105o 0.38 0.76 0.25 0.038
ccc M C A - B S D S
aaa M C A - B S D S
NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. Dimension Q shall be measured from the seating plane to the base plane. 6. Measure dimension S1 at all four corners. 7. Measure dimension S2 from the top of the ceramic body to the nearest metallization or lead. 8. N is the maximum number of terminal positions. 9. Braze fillets shall be concave. 10. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 11. Controlling dimension: INCH.
L Q S1 S2
aaa bbb ccc M N
Spec Number 891
518055
HS-80C86RH Ceramic Metal Seal Flatpack Packages (Flatpack)
1
E N A A D b E1 L C Q E2 A S1
K42.A TOP BRAZED 42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
INCHES SYMBOL A b b1 c c1 D E E1 E2 e k MIN 0.017 0.017 0.007 0.007 1.045 0.630 0.530 0.320 0.045 0.000 42 MAX 0.100 0.025 0.023 0.013 0.010 1.075 0.650 0.680 0.550 0.350 0.065 0.0015 MILLIMETERS MIN 0.43 0.43 0.18 0.18 26.54 16.00 13.46 8.13 1.14 0.00 42 MAX 2.54 0.64 0.58 0.33 0.25 27.31 16.51 17.27 13.97 8.89 1.65 0.04 1.27 BSC NOTES 3 3 11 8 6 Rev. 0 6/17/94
e
c1
LEAD FINISH
0.050 BSC
BASE METAL b1 M M (b) SECTION A-A
(c)
L Q S1 M N
NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. Alternately, a tab (dimension k) may be used to identify pin one. 2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply. 3. This dimension allows for off-center lid, meniscus, and glass overrun. 4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. N is the maximum number of terminal positions. 6. Measure dimension S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension Q minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. 11. The basic lead spacing is 0.050 inch (1.27mm) between center lines. Each lead centerline shall be located within 0.005 inch (0.13mm) of its exact longitudinal position relative to lead 1 and the highest numbered (N) lead.
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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Sales Office Headquarters
NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
Spec Number 892
518055

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