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No. STSE-CC5129A
SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED
MODEL : NFSW036BT
NICHIA CORPORATION
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Nichia STSE-CC5129A 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature (Ts=25C) Unit mA mA mA mW C C C for 10sec. for 3sec.
Symbol IF IFP IR PD Topr Tstg Tj Tsld
Absolute Maximum Rating 180 350 85 684 -40 ~ +100 -40 ~ +100 130 Reflow Soldering : 260C Hand Soldering : 350C
IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = =
(2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Flux v Luminous Intensity Iv x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram.
Condition IF=150[mA] IF=150[mA] IF=150[mA] IF=150[mA] IF=150[mA]
Typ. (3.5) (20.0) (8.0) 0.31 0.32
(Ts=25C) Max. Unit 3.8 V lm cd -
(3) Ranking Item Luminous Flux Rank P9 Rank P8 Rank P7 Rank P6 Symbol v Condition IF=150[mA] Min. 21.4 18.0 15.1 12.7
(Ts=25C) Max. Unit 25.5 21.4 lm 18.0 15.1
Luminous Flux Measurement allowance is 7%.
Color Ranks x y x y x y 0.280 0.248 0.287 0.295 0.296 0.276 Rank a0 0.264 0.283 0.267 0.305 Rank b3 0.283 0.304 0.305 0.330 Rank b5 0.287 0.307 0.295 0.315 0.296 0.276 0.307 0.315 0.311 0.294
-1-
(IF=150mA,Ts=25C)
x y x y
0.307 0.315 0.311 0.294
Rank b4 0.304 0.330 0.330 0.360 Rank b6 0.307 0.330 0.315 0.339
0.330 0.339 0.330 0.318
x y x y
0.291 0.257 0.330 0.339
Rank b7 0.279 0.302 0.276 0.302 Rank c1 0.330 0.361 0.360 0.385
0.308 0.279 0.357 0.361
x y x y
0.308 0.279 0.330 0.318
Nichia STSE-CC5129A Rank b8 0.302 0.319 0.321 0.302 0.318 0.294 Rank c2 0.330 0.357 0.339 0.361 0.356 0.351
Color Coordinates Measurement allowance is 0.01.
(4) Correspondence table of Luminous Flux - Luminous Intensity (Reference) IV (cd) V (lm) 25.5 (10.2) 21.4 (8.5) 18.0 (7.0) 15.1 (5.8) 12.7 (4.8)
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure's page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure's page. Material as follows ; Package Encapsulating Resin Electrodes : : : Ceramics Silicone Resin (with Diffused + Phosphor) Ag Plating
4.PACKAGING
* The LEDs are packed in cardboard boxes after taping. Please refer to figure's page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 4 for 2004, 5 for 2005 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Flux
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B for Nov. )
Nichia STSE-CC5129A
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Vibration Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (Lead Solder) 0C ~ 100C 15sec. 15sec. -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. Ta=100C Ta=60C, RH=90% Ta=-40C Ta=25C, IF=150mA
Tested with Nichia standard circuit board.
Note 2 times
Number of Damaged 0/22
1 time over 95% 20 cycles 100 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs. 48min.
0/22 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/22
Ta=70C, IF=100mA
Tested with Nichia standard circuit board.
60C, RH=90%, IF=100mA
Tested with Nichia standard circuit board.
Ta=-40C, IF=150mA
Tested with Nichia standard circuit board.
JEITA ED-4701 400 403 JEITA ED-4702 JEITA ED-4702 JEITA ED-4701 300 304
Substrate Bending Adhesion Strength Electrostatic Discharges
100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3direction, 4cycles 3mm, 5 1 sec. 5N, 10 1 sec.
1 time 1 time 3 times
Negative/Positive
0/22 0/22 0/22
R=1.5k, C=100pF Test Voltage=2kV
Thermal resistance of LED with Nichia standard circuit board : Rja 120C/W Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm (2) CRITERIA FOR JUDGING DAMAGE Item Symbol Test Conditions Forward Voltage VF IF=150mA Initial Level Luminous Flux v IF=150mA Initial Level 0.7 The test is performed after the board is cooled down to the room temperature.
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Criteria for Judgement Min. Max.
1.1
Nichia STSE-CC5129A
7.CAUTIONS
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs.
(1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag with a zipper. A package of a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following condition. Baking treatment : more than 24 hours at 65 5C * Nichia LED electrodes are silver plated. The silver surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Static Electricity * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA)
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Nichia STSE-CC5129A (4) Designing the position of LED on a board. * No twist / warp / bent / or other stress shall be applied to the board after mounting LED with solder to avoid a crack of LED package. Refer to the following recommended position and direction of LED. No good Recommended Direction
Cathode mark
Cathode mark
Appropriate LED mounting is to place perpendicularly against the stress affected side. * Depending on the position and direction of LED, the mechanical stress on the LED package can be changed. Refer to the following figure.
E
Perforated line
A
C
D B
Slit Stress : A > B = C > D > E * Do not split board by hand. Split with exclusive special tool.
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Nichia STSE-CC5129A (5) Soldering Conditions * The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. * Recommended soldering conditions
Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200C 120 ~ 150C 120 sec. Max. 120 sec. Max. 240C Max. 260C Max. 10 sec. Max. 10 sec. Max. refer to refer to Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) Hand Soldering Temperature Soldering time 350C Max. 3 sec. Max. (one time only)
After reflow soldering rapid cooling should be avoided. Use the conditions shown to the under figure. [Temperature-profile (Surface of circuit board)]
<1 : Lead Solder>
2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max.
Above 200C
<2 : Lead-free Solder>
240C Max. 10sec. Max. 1 ~ 5C / sec. 1 ~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max.
Above 220C
260C Max. 10sec. Max.
2.5 ~ 5C / sec.
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
4 .5 1 .4
Use the following conditions shown in the figure.
3 .7
(Unit : mm)
* Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * When soldering, do not put stress on the LEDs during heating. (6) Cleaning * It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. * Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
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Nichia STSE-CC5129A (7) Heat Generation * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this specifications. Please also take measures to remove heat from the area near the LED to improve the operational characteristics of the LED. * The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation between Tj and Ts. Tj=Ta + Rja W 1 Tj=Ts + Rjs W 2 Tj = Dice Temperature : C, Ta = Ambient Temperature : C, Ts = Solder Temperature (Cathode Side) : C, Rja = Heat resistance from Dice to Ambient temperature : C /W, Rjs = Heat resistance from Dice to Ts measuring point 65C /W, W = Inputting Power (IF VF) : W (8) Others * The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. * Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. * The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). * User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. * The formal specifications must be exchanged and signed by both parties before large volume purchase begins. * The appearance and specifications of the product may be modified for improvement without notice.
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Nichia STSE-CC5129A
ICI Chromaticity Diagram
0.9 520 530 0.8 510 0.7 550 540
560 0.6 570 500 0.5 580 590
y
0.4 b4 b3 0.3 490 b5 a0 0.2 b7
c1 c2 b6 b8
600 610 620 630
0.1
480 470 460 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0
x
Color Coordinates Measurement allowance is 0.01.
-8-
Forward Voltage vs. Forward Current
Forward Current IFP (mA) Ta=25C Relative Luminous Flux (a.u.) 1000
Forward Current vs. Relative Luminous Flux
2.5 2.0 1.5 1.0 0.5 0 0 100 200 300 400 500 Forward Current IFP (mA) Ta=25C Allowable Forward Current IFP (mA)
Duty Ratio vs. Allowable Forward Current
1000 Ta=25C 500 350
150 100 50
180 100 1 Pulse Width < 10msec. = 5 10 20 50 100 Duty Ratio (%)
10 2.5
3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V)
Ambient Temperature vs. Forward Voltage
IFP=150mA IFP=100mA Relative Luminous Flux (a.u.) 5.0 Forward Voltage VF (V)
Ambient Temperature vs. Relative Luminous Flux
2.0 IFP=150mA 1.0 Allowable Forward Current IF (mA)
Ambient Temperature vs. Allowable Forward Current
250 200 180 150 100 50 0 0
Rja=90C/W Rja=120C/W Rja=150C/W
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4.5 4.0 3.5 3.0
0.5
2.5 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C)
0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C)
20 40 60 80 100 120 Ambient Temperature Ta (C)
Nichia STSE-CC5129A
Model
NFSW036B
NICHIA CORPORATION
Title No.
CHARACTERISTICS
050920545111
Forward Current vs. Chromaticity Coordinate
Relative Emission Intensity (a.u.)
Spectrum
1.2 1.0 0.8 0.6 0.4 0.2 0 350 450 550 650 Wavelength (nm) 750 Ta=25C IF=150mA
0.34 Ta=25C 0.33 0.32 0.31 0.30 0.29
20mA 40mA 80mA 150mA 180mA 350mA
y
x Ambient Temperature vs. Chromaticity Coordinate
IFP=150mA
0.30
0.31
0.32
0.33
Directivity
1.0
Relative Illuminance (a.u.)
0.34
0 Ta=25C IFP=150mA
10 20
30 40 50
y
-10-
0.33 0.32 0.31 0.30 0.29
85C
-30C 0C 25C 50C
0.5
60 70 80
0.30
0.31
x
0.32
0.33
0 90
60 30 Radiation Angle
0
0.5
90 1.0
Nichia STSE-CC5129A
Model
NFSW036B
NICHIA CORPORATION
Title No.
CHARACTERISTICS
050920545121
3.5 2.6 0.8
3.3 1.6
3.5
Cathode mark
Anode
3.3
Cathode
-11-
A
K
ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES
MATERIALS Ceramics Silicone Resin (with Diffused + Phosphor) Ag Plating
Protection device
NFSW036B has a protection device built in as a protection circuit against static electricity.
Model
Nichia STSE-CC5129A
NFSW036B
Unit mm 8/1 Scale Allow 0.2
NICHIA CORPORATION
Title No.
OUTLINE DIMENSIONS
050920545131
0.1
Taping PART
1.5
+0.1 -0
Reel PART
0.2 3.85
0.1 0.05
1.75
4
0.1
Cathode mark
2
0.05
180
+0 -3
15.4 +1 13-0
1
21
0.05
8 0.
5.5 +0.3 12-0.1
8
0.1
1 1.5
+0.2 -0
0.1
XXXX LED
3.85
0.1
Reel End of Tape
No LEDs
TYPE NFSx036xT LOT XXXXXX- QTY pcs
LEDs mounting part No LEDs Top cover tape
13
Label
0. 2
60-0
+1
-12Pull direction Reel Lead Min.40mm (No LEDs) Embossed carrier tape Reel Lead Min.160mm (No LEDs is more than 40) Reel Lead Min.400mm
Nichia STSE-CC5129A
2,000pcs/Reel
Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes.
Model
NFSx036xT
Unit mm Scale Allow
NICHIA CORPORATION
Title No.
TAPING DIMENSIONS
050620537332
Nichia STSE-CC5129A
The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed.
Reel
Label
Seal
NICHIA
XXXX LED
TYPE LOT QTY NFSx036xT xxxxxxPCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture absorbent material
Moisture proof foil bag
The box is partitioned with the cardboard. Label
NICHIA
Nichia
LED
XXXX LED
TYPE RANK QTY NFSx036xT PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 2,000 MAX. Reel/box 5reel MAX. 10reel MAX. 20reel MAX. Quantity/box (pcs) 10,000 MAX. 20,000 MAX. 40,000 MAX.
Dimensions (mm) 291 237 120 8t 259 247 243 5t 444 262 259 8t
Model
NFSx036xT
NICHIA CORPORATION
Title No.
PACKING
050616541931
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