|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
PD - 9.1404A PRELIMINARY l l l l l l IRFI5210 HEXFET(R) Power MOSFET D Advanced Process Technology Isolated Package High Voltage Isolation = 2.5KVRMS Sink to Lead Creepage Dist. = 4.8mm P-Channel Fully Avalanche Rated VDSS = -100V RDS(on) = 0.06 G ID = -23A S Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip or by a single screw fixing. TO-220 FULLPAK Absolute Maximum Ratings Parameter ID @ TC = 25C ID @ TC = 100C IDM PD @TC = 25C VGS EAS IAR EAR dv/dt TJ TSTG Continuous Drain Current, VGS @ -10V Continuous Drain Current, VGS @ -10V Pulsed Drain Current Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Mounting torque, 6-32 or M3 srew Max. -23 -16 -140 63 0.42 20 690 -21 6.3 -5.0 -55 to + 175 300 (1.6mm from case ) 10 lbf*in (1.1N*m) Units A W W/C V mJ A mJ V/ns C Thermal Resistance Parameter RJC RJA Junction-to-Case Junction-to-Ambient Typ. --- --- Max. 2.4 65 Units C/W 3/16/98 IRFI5210 Electrical Characteristics @ TJ = 25C (unless otherwise specified) V(BR)DSS V(BR)DSS/TJ RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf LD LS Ciss Coss Crss C Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance Internal Source Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Drain to Sink Capacitance Min. -100 --- --- -2.0 10 --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- Typ. --- -0.11 --- --- --- --- --- --- --- --- --- --- 17 86 79 81 4.5 7.5 2700 790 450 12 Max. Units Conditions --- V VGS = 0V, ID = -250A --- V/C Reference to 25C, I D = -1mA 0.06 VGS = 10V, ID = -12A -4.0 V VDS = VGS, ID = -250A --- S VDS = -50V, ID = -21A -25 VDS = -100V, VGS = 0V A -250 VDS = -80V, VGS = 0V, TJ = 150C 100 VGS = 20V nA -100 VGS = -20V 180 ID = -21A 25 nC VDS = -80V 97 VGS = -10V, See Fig. 6 and 13 --- VDD = -50V --- ID = -21A ns --- RG = 2.5 --- RD = 2.4, See Fig. 10 D Between lead, --- 6mm (0.25in.) nH G from package --- and center of die contact S --- VGS = 0V --- VDS = -25V pF --- = 1.0MHz, See Fig. 5 --- = 1.0MHz Source-Drain Ratings and Characteristics IS ISM VSD trr Qrr Notes: Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge Min. Typ. Max. Units --- --- --- --- --- --- --- --- 170 1.2 -23 A -140 -1.3 260 1.8 V ns C Conditions D MOSFET symbol showing the G integral reverse S p-n junction diode. TJ = 25C, IS = -12A, VGS = 0V TJ = 25C, IF = -21A di/dt = -100A/s Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 11 ) Pulse width 300s; duty cycle 2%. t=60s, =60Hz Uses IRF5210 data and test conditions VDD = -25V, starting TJ = 25C, L = 3.1mH RG = 25, IAS = -21A. (See Figure 12) ISD -21A, di/dt -480A/s, VDD V(BR)DSS, TJ 175C IRFI5210 1000 VGS - 15V - 10V - 8.0V - 7.0V - 6.0V - 5.5V - 5.0V BOTTOM - 4.5V TOP 1000 -ID , D rain-to-S ource C urrent (A ) -ID , D rain-to-S ource C urrent (A ) VGS - 15V - 10V - 8.0V - 7.0V - 6.0V - 5.5V - 5.0V BOTTOM - 4.5V TOP 100 100 10 10 -4.5V 40 s P U LS E W ID TH T C = 175C 0.1 1 10 1 0.1 1 -4.5V 40 s P U LS E W ID TH T c = 25C A 10 100 1 A 100 -VD S , D rain-to-S ource V oltage (V ) -VD S , D rain-to-S ource V oltage (V ) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 1000 3.0 R D S (on ) , D rain-to-S ource O n R esistance (N orm alized) I D = -35A -I D , D rain-to -S o urc e C urre nt (A ) 2.5 100 T J = 2 5 C T J = 1 7 5 C 2.0 1.5 10 1.0 0.5 1 4 5 6 7 V D S = -5 0 V 4 0 s P U L S E W ID T H 8 9 10 A 0.0 -60 -40 -20 0 20 40 60 80 VG S = -10V 100 120 140 160 180 A -VG S , G a te -to -S o u rc e V o lta g e (V ) T J , Junction T em perature (C ) Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance Vs. Temperature IRFI5210 6000 5000 -V G S , G ate-to-S ource V oltage (V ) C is s V GS C iss C rss C oss = = = = 0V , f = 1M H z C gs + C gd , C ds S H O R TE D C gd C ds + C gd 20 I D = -2 1A V D S = -80V V D S = -50V V D S = -20V 16 C , C apacitanc e (pF ) 4000 C os s 3000 12 C rs s 2000 8 1000 4 0 1 10 100 A 0 0 40 80 FO R TE S T C IR C U IT S E E FIG U R E 1 3 120 160 A 200 -VD S , D rain-to-S ource V oltage (V ) Q G , Total G ate C harge (nC ) Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage 1000 1000 -I S D , R everse D rain C urrent (A ) O P E R A TIO N IN TH IS A R E A LIM ITE D B Y R D S (on) -I D , D rain C urrent (A ) 100 100 10 s TJ = 175C T J = 25C 10 100 s 10 1m s 1 0.4 0.8 1.2 1.6 V G S = 0V 2.0 A 1 1 T C = 25C T J = 175C S ingle P uls e 10 10m s A 100 1000 2.4 -VS D , S ource-to-D rain V oltage (V ) -VD S , D rain-to-S ource V oltage (V ) Fig 7. Typical Source-Drain Diode Forward Voltage Fig 8. Maximum Safe Operating Area IRFI5210 25 VDS VGS RD D.U.T. + -ID , Drain Current (A) 15 -10V Pulse Width 1 s Duty Factor 0.1 % 10 Fig 10a. Switching Time Test Circuit td(on) tr t d(off) tf 5 VGS 10% 0 25 50 75 100 125 150 175 90% VDS TC , Case Temperature ( C) Fig 9. Maximum Drain Current Vs. Case Temperature Fig 10b. Switching Time Waveforms 10 Thermal Response (Z thJC ) D = 0.50 1 0.20 0.10 0.05 0.1 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJC + TC 0.01 0.1 1 10 100 PDM t1 t2 0.01 0.00001 0.0001 0.001 t1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case - 20 RG VDD IRFI5210 VD S L 2000 E A S , S ingle P ulse A valanc he E nergy (m J) RG D .U .T IA S TO P 1600 VD D A B O TTO M ID -8.6A -15A -21A -20 V D R IV E R 0.01 tp 15V Fig 12a. Unclamped Inductive Test Circuit IAS tp V (BR)DSS Fig 12b. Unclamped Inductive Waveforms Current Regulator Same Type as D.U.T. QG -10V QGS VG QGD VGS -3mA Charge IG ID Current Sampling Resistors Fig 13a. Basic Gate Charge Waveform Fig 13b. Gate Charge Test Circuit + D.U.T. - + - 1200 800 400 0 25 50 75 100 125 150 A 175 S tarting T J , Junc tion T em perature (C ) Fig 12c. Maximum Avalanche Energy Vs. Drain Current 50K 12V .2F .3F VDS IRFI5210 Peak Diode Recovery dv/dt Test Circuit D.U.T + + Circuit Layout Considerations * Low Stray Inductance * Ground Plane * Low Leakage Inductance Current Transformer - + RG VGS* ** * dv/dt controlled by RG * ISD controlled by Duty Factor "D" * D.U.T. - Device Under Test + - VDD * * Reverse Polarity for P-Channel ** Use P-Channel Driver for P-Channel Measurements Driver Gate Drive P.W. Period D= P.W. Period [VGS=10V ] *** D.U.T. ISD Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt [VDD] Re-Applied Voltage Inductor Curent Body Diode Forward Drop Ripple 5% [ ISD] *** VGS = 5.0V for Logic Level and 3V Drive Devices Fig 14. For P-Channel HEXFETS IRFI5210 Package Outline TO-220 Fullpak Outline Dimensions are shown in millimeters (inches) 10.60 (.417) 10.40 (.409) o 3.40 (.133) 3.10 (.123) -A3.70 (.145) 3.20 (.126) 4.80 (.189) 4.60 (.181) 2.80 (.110) 2.60 (.102) LE A D A S S IG N ME N TS 1 - G A TE 2 - D R A IN 3 - SOURCE 7.10 (.280) 6.70 (.263) 16.00 (.630) 15.80 (.622) 1.15 (.045) M IN . 1 2 3 NOTES: 1 D IME N S IO N IN G & TO LE R A N C IN G P E R A N S I Y 14.5M , 1982 2 C O N TR O LLIN G D IM E N S IO N : IN C H . 3.30 (.130) 3.10 (.122) -B13.70 (.540) 13.50 (.530) C D A 1.40 (.055) 3X 1.05 (.042) 2.54 (.100) 2X 0.90 (.035) 3X 0.70 (.028) 0.25 (.010) M AM B 3X 0.48 (.019) 0.44 (.017) B 2.85 (.112) 2.65 (.104) M IN IM U M C R E E P A G E D IS TA N C E B E TW E E N A -B -C -D = 4.80 (.189) Part Marking Information TO-220 Fullpak E X A M P L E : T H IS IS A N IR F I8 4 0 G W ITH A S S E M B L Y LOT COD E E401 A IN T E R N A T IO N A L R E C T IF IE R LOGO ASSEMBLY LOT CODE PART NUMBER IR F I8 4 0 G E 40 1 92 45 D ATE CO DE (Y Y W W ) Y Y = YE A R W W = W EEK WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan 171 Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 3/98 |
Price & Availability of IRFI5210 |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |