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GL610T
GL610T
s Features
1. Ultra-compact type (1.6 x 0.8 x 0.8 mm) 2. Thin type (thickness : 0.8 mm) 3. Taped-packed type (4,000 pieces/reel) 4. Leadless type
Ultra-compact Chip Part Type Infrared Emitting Diodes
s Outline Dimensions
1.6 (0.2) 0.8 0.3
(Unit : mm)
0.8
1
2 Chip position 1.2
s Applications
1. Compact and thin remote controllers 2. Tape end detection of VCRs and VCR cameras 3. Power source for car navigator touch panels 4. Other portable equipment
1.0 0.5 0.3
(0.3)
(0.3)
* Plating area * Terminal connection 1 Anode 2 Cathode
1 Chip side mark
2
* Tolerance : 0.1mm
s Absolute Maximum Ratings
Parameter Forward current *1 Peak forward current Reverse voltage Power dissipation Operating temperature Storage temperature *2 Soldering temperature
*1 Pulse width <= 100 s, Duty ratio=0.01 *2 Hand soldering temperature, for MAX. 3 seconds
(Ta=25C) Unit mA mA V mW C C C
Symbol Rating IF 50 500 IFM VR 6 150 P - 25 to + 85 Topr - 25 to + 100 Tstg 260 Tsol
s Electro-optical Characteristics
Parameter Forward voltage *1 Peak forward voltage Reverse current Radiant flux Peak emission wavelength Half intensity wavelength Response frequency Half intensity angle Symbol VF V FM IR e p fc Conditions IF = 50mA IFM = 0.5A VR = 3V IF = 20mA IF = 20mA IF = 20mA IF = 20mA MIN. 0.7 TYP. 1.3 2.2 2.0 950 40 300 60 MAX. 1.5 3.5 10 -
(Ta=25 C) Unit V V A mW nm nm kH Z
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