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| ICX255AL Diagonal 6mm (Type 1/3) CCD Image Sensor for CCIR B/W Video Cameras Description The ICX255AL is an interline CCD solid-state image sensor suitable for CCIR B/W video cameras with a diagonal 6mm (Type 1/3) system. Compared with the current product ICX055BL, basic characteristics such as sensitivity, smear, dynamic range and S/N are improved drastically from visible light region to near infrared light region through the adoption of EXview HAD CCDTM technology. This chip features a field period readout system and an electronic shutter with variable charge-storage time. Features * Sensitivity in near infrared light region (+8dB compared with the ICX055BL, = 945nm) * High sensitivity (+6dB compared with the ICX055BL, no IR cut filter) * Low smear (-20dB compared with the ICX055BL) * High D range (+3dB compared with the ICX055BL) V * High S/N * Low dark current * Excellent antiblooming characteristics 7 * Continuous variable-speed shutter * No voltage adjustment (Reset gate and substrate bias are not adjusted.) * Reset gate: 5V drive * Horizontal register: 5V drive 16 pin DIP (Plastic) Pin 1 1 14 H 30 Pin 9 Optical black position (Top View) Device Structure * Interline CCD image sensor * Image size: Diagonal 6mm (Type 1/3) * Number of effective pixels: 500 (H) x 582 (V) approx. 290K pixels * Total number of pixels: 537 (H) x 597 (V) approx. 320K pixels * Chip size: 6.00mm (H) x 4.96mm (V) * Unit cell size: 9.8m (H) x 6.3m (V) * Optical black: Horizontal (H) direction : Front 7 pixels, rear 30 pixels Vertical (V) direction : Front 14 pixels, rear 1 pixel * Number of dummy bits: Horizontal 16 Vertical 1 (even fields only) * Substrate material: Silicon TM EXview HAD CCD is a trademark of Sony Corporation. EXview HAD CCD is a CCD that drastically improves light efficiency by including near infrared light region as a basic structure of HAD (Hole-Accumulation-Diode) sensor. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E99522-PS ICX255AL Block Diagram and Pin Configuration (Top View) VOUT GND V1 V3 2 8 7 6 5 V2 4 3 Vertical Register Horizontal Register Note) : Photo sensor 9 10 11 12 13 14 15 16 GND SUB H1 VDD RG Pin Description Pin No. 1 2 3 4 5 6 7 8 Symbol V4 V3 V2 V1 GND NC NC VOUT Signal output Description Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock GND Pin No. 9 10 11 12 13 14 15 16 H2 VL NC V4 1 Note) NC NC Symbol VDD GND SUB VL RG NC H1 H2 Description Supply voltage GND Substrate clock Protective transistor bias Reset gate clock Horizontal register transfer clock Horizontal register transfer clock Absolute Maximum Ratings Item VDD, VOUT, RG - SUB Against SUB V1, V3 - SUB V2, V4, VL - SUB H1, H2, GND - SUB VDD, VOUT, RG - GND Against GND V1, V2, V3, V4 - GND H1, H2 - GND Against VL V1, V3 - VL V2, V4, H1, H2, GND - VL Voltage difference between vertical clock input pins Between input clock pins Storage temperature Operating temperature 1 +24V (Max.) when clock width < 10s, clock duty factor < 0.1%. -2- H1 - H2 H1, H2 - V4 Ratings -40 to +8 -50 to +15 -50 to +0.3 -40 to +0.3 -0.3 to +20 -10 to +18 -10 to +6 -0.3 to +28 -0.3 to +15 to +15 -6 to +6 -14 to +14 -30 to +80 -10 to +60 Unit V V V V V V V V V V V V C C 1 Remarks ICX255AL Bias Conditions Item Supply voltage Protective transistor bias Substrate clock Reset gate clock Symbol VDD VL SUB RG Min. 14.55 Typ. 15.0 1 2 2 Max. 15.45 Unit V Remarks 1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used. 2 Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Item Supply current Symbol IDD Min. Typ. 3 Max. 6 Unit mA Remarks Clock Voltage Conditions Item Readout clock voltage Symbol VVT VVH1, VVH2 VVH3, VVH4 VVL1, VVL2, VVL3, VVL4 VV Vertical transfer clock voltage VVH3 - VVH VVH4 - VVH VVHH VVHL VVLH VVLL Horizontal transfer clock voltage VH VHL VRG Reset gate clock voltage VRGLH - VRGLL VRGL - VRGLm Substrate clock voltage VSUB 21.0 22.0 4.75 -0.05 4.5 5.0 0 5.0 Min. 14.55 -0.05 -0.2 -8.0 6.3 -0.25 -0.25 Typ. 15.0 0 0 -7.0 7.0 Max. 15.45 0.05 0.05 -6.5 8.05 0.1 0.1 0.3 0.3 0.3 0.3 5.25 0.05 5.5 0.4 0.5 23.5 Unit V V V V V V V V V V V V V V V V V Waveform diagram 1 2 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 Input through 0.1F capacitance Low-level coupling Low-level coupling High-level coupling High-level coupling Low-level coupling Low-level coupling VVL = (VVL3 + VVL4)/2 VV = VVHn - VVLn (n = 1 to 4) VVH = (VVH1 + VVH2)/2 Remarks -3- ICX255AL Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and GND Symbol CV1, CV3 CV2, CV4 CV12, CV34 Capacitance between vertical transfer clocks CV23, CV41 CV13 CV24 Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND Vertical transfer clock series resistor Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor V1 CV12 Min. Typ. 1500 1000 560 330 150 270 47 22 5 320 75 100 100 10 50 Max. Unit pF pF pF pF pF pF pF pF pF pF Remarks CH1, CH2 CHH CRG CSUB R1, R3 R2, R4 RGND RH RRG V2 R1 R2 RH H1 RH H2 CHH CV23 CV13 CH1 CH2 CV1 CV41 CV24 CV2 CV4 RGND CV3 R4 CV34 R3 V4 V3 Vertical transfer clock equivalent circuit RRG RG Horizontal transfer clock equivalent circuit CRG Reset gate clock equivalent circuit -4- ICX255AL Drive Clock Waveform Conditions (1) Readout clock waveform 100% 90% II II M M 2 tf 0V VVT 10% 0% tr twh (2) Vertical transfer clock waveform V1 V3 VVH1 VVHH VVH VVHL VVHH VVHH VVHL VVHL VVH3 VVHH VVH VVHL VVL1 VVLH VVL3 VVLH VVLL VVL VVL VVLL V2 VVHH VVHH V4 VVHH VVHH VVH VVHL VVH VVH2 VVHL VVHL VVH4 VVHL VVL2 VVLH VVLH VVLL VVL VVL4 VVLL VVL VVH = (VVH1 + VVH2)/2 VVL = (VVL3 + VVL4)/2 VV = VVHn - VVLn (n = 1 to 4) -5- ICX255AL (3) Horizontal transfer clock waveform tr twh tf 90% VH 10% VHL twl (4) Reset gate clock waveform tr twh tf VRGH twl Point A RG waveform VRGLH VRGL VRGLL VRGLm H1 waveform VRG 10% VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL Negative overshoot level during the falling edge of RG is VRGLm. (5) Substrate clock waveform 100% 90% M VSUB 10% 0% VSUB (A bias generated within the CCD) M 2 tf tr twh -6- ICX255AL Clock Switching Characteristics Item Readout clock Vertical transfer clock Horizontal transfer clock During imaging Symbol VT V1, V2, V3, V4 H 37 41 5.6 5.6 11 15 75 79 38 42 12 0.012 0.012 twh twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 2.3 2.5 0.5 15 0.5 Unit Remarks s During readout 250 ns 1 ns 2 15 10 0.012 0.012 15 During H1 parallel-serial conversion H2 RG SUB s ns s During drain charge Reset gate clock Substrate clock 6.5 0.5 4.5 0.5 1.5 2.0 1 When vertical transfer clock driver CXD1267AN is used. 2 tf tr - 2ns. -7- ICX255AL Image Sensor Characteristics Item Sensitivity 1 Sensitivity 2 Saturation signal Smear Video signal shading Dark signal Dark signal shading Flicker Lag Symbol S1 S2 Vsat Sm SH Vdt Vdt F Lag Min. 1300 3000 1000 -120 -103 20 25 2 1 2 0.5 Typ. 1600 4000 Max. Unit mV mV mV dB % % mV mV % % Measurement method 1 2 3 4 5 5 6 7 8 9 (Ta = 25C) Remarks Ta = 60C Zone 0 and I Zone 0 to II' Ta = 60C Ta = 60C Zone Definition of Video Signal Shading 500 (H) 9 6 9 H 8 V 10 H 8 582 (V) Zone 0, I Zone II, II' V 10 8 Ignored region Effective pixel region -8- ICX255AL Image Sensor Characteristics Measurement Method Measurement conditions 1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black (OB) level is used as the reference for the signal output, and the value measured at point [A] in the drive circuit example is used. Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance: 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Indicate the state which removes an IR cut filter of standard imaging condition I. 3) Standard imaging condition III: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. Sensitivity 1 Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/250s, measure the signal output (Vs1) at the center of the screen and 250 S1 = Vs1 x [mV] substitute the value into the following formula. 50 2. Sensitivity 2 Set to standard imaging condition II. After selecting the electronic shutter mode with a shutter speed of 1/1000s, measure the signal output (Vs2) at the center of the screen and 1000 S2 = Vs2 x [mV] substitute the value into the following formula. 50 3. Saturation signal Set to standard imaging condition III. After adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 200mV, measure the minimum value of the signal output. 4. Smear Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to 500 times the intensity with the average value of the signal output, 200mV. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (VSm [mV]) of the signal output and substitute the value into the following formula. Sm = 20 x log 1 YSm 1 x x 10 200 500 [dB] (1/10V method conversion value) -9- ICX255AL 5. Video signal shading Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the signal output is 200mV. Then measure the maximum (Vmax [mV]) and minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula. SH = (Vmax - Vmin)/200 x 100 [%] 6. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 7. Dark signal shading After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. Vdt = Vdmax - Vdmin [mV] 8. Flicker Set to standard imaging condition III. Adjust the luminous intensity so that the average value of the signal output is 200mV, and then measure the difference in the signal level between fields (Vf [mV]). Then substitute the value into the following formula. F = (Vf/200) x 100 [%] 9. Lag Adjust the signal output value generated by strobe light to 200mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/200) x 100 [%] FLD V1 Light Strobe light timing Y signal output 200mV Output Ylag (lag) - 10 - Drive Circuit 15V 1 20 100k 19 18 17 16 1/35V 0.1 3.3/16V CXD1267AN 15 14 13 12 11 22/16V -7.0V 2 3 4 5 6 7 8 9 XSUB XV2 XV1 XSG1 XV3 XSG2 10 XV4 V3 V4 V2 V1 NC NC GND VOUT H2 NC VL GND H1 16 15 14 13 12 11 10 RG SUB 9 1500p 0.01 3.3/20V 1M H2 H1 0.1 RG VDD - 11 - 1 2 3 4 5 6 22/20V 7 8 100 2SK523 3.9k [A] CCD OUT ICX255 (BOTTOM VIEW) ICX255AL ICX255AL Spectral Sensitivity Characteristics (excludes both lens characteristics and light source characteristics) 1.0 0.9 0.8 0.7 Relative Response 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 Wave Length [nm] 800 900 1000 Sensor Readout Clock Timing Chart V1 V2 Odd Field V3 V4 31.1 0.3 2.5 1.2 1.5 2.5 2.0 V1 V2 Even Field V3 V4 Unit : s - 12 - Drive Timing Chart (Vertical Sync) FLD VD BLK HD 10 20 15 25 625 1 2 3 4 5 320 335 315 V1 - 13 - 246 135 246 135 V2 V3 V4 582 581 246 135 246 135 620 CCD OUT 582 581 310 325 330 340 ICX255AL Drive Timing Chart (Horizontal Sync) HD BLK H1 1 2 3 5 20 15 25 30 10 15 16 1 2 3 5 7 1 2 3 5 H2 490 - 14 - RG V1 V2 V3 V4 SUB 495 500 1 2 3 5 10 ICX255AL ICX255AL Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Cover glass 50N Plastic package Compressive strength 50N 1.2Nm Torsional strength - 15 - ICX255AL b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD characteristics. d) This CCD image sensor has sensitivity in the near infrared area. Its focus may not match in the same condition under visible light /near infrared light because of aberration. Incident light component of long wavelength which transmits the silicon substrate may have bad influence upon image. - 16 - Package Outline Unit: mm 16pin DIP (450mil) A 0 to 9 6.1 9 16 D ~ 2.5 C 11.43 8.4 5.7 V H 9.5 11.4 0.1 2.5 2-R0.5 1. "A" is the center of the effective image area. 2. The two points "B" of the package are the horizontal reference. The point "B'" of the package is the vertical reference. 3. The bottom "C" of the package, and the top of the cover glass "D" are the height reference. 4. The center of the effective image area relative to "B" and "B'" is (H, V) = (6.1, 5.7) 0.15mm. 5. The rotation angle of the effective image area relative to H and V is 1. 6. The height from the bottom "C" to the effective image area is 1.41 0.10mm. The height from the top of the cover glass "D" to the effective image area is 1.94 0.15mm. 7. The tilt of the effective image area relative to the bottom "C" is less than 50m. The tilt of the effective image area relative to the top "D" of the cover glass is less than 50m. 8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. The notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing. ICX255AL B ~ 2.5 0.5 B' 0.69 1.27 0.46 0.3 M 0.3 PACKAGE STRUCTURE PACKAGE MATERIAL Plastic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY PACKAGE WEIGHT 0.9g 1.27 3.5 0.3 (For the first pin only) 3.1 - 17 - ~ 1.2 3.35 0.15 9.2 2.5 0.25 1.2 10.3 12.2 0.1 11.6 8 1 |
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