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ZXLD1100 ADJUSTABLE LED DRIVER WITH INTERNAL SWITCH AND OPEN CIRCUIT PROTECTION IN SC70-6 DESCRIPTION The ZXLD1100 is a PFM inductive boost converter designed for driving 2, 3 or 4 series connected white LEDs from a Li-Ion cell and up to 8 LEDs from a 5V supply. The device operates from an input supply of between 2.5V and 5.5V and provides an adjustable output current of up to 50mA. The ZXLD1100 includes the output switch and peak current sense resistor, and can operate with a maximum output voltage of 28V. Quiescent current is typically 60 A and a shutdown function is provided to reduce this current to less than 500nA in the 'off' state. Output current can be adjusted by applying a PWM control signal to the 'Enable' pin. Depending upon the control frequency, this will provide either a continuous or a 'chopped' output current. The PWM filter components are contained within the chip. The ZXLD1100 contains an internal avalanche diode to protect the output switch. This allows the device to operate indefinitely if the load is open circuit. Input supply current during this condition is less than 1mA. The device is assembled in a low profile SC70-6 pin package with industry standard pinout. ADVANCED FEATURES * Internal 30V NDMOS switch, current sense and open circuit protection * True Analog Dimming via PWM APPLICATIONS * Mobile phones * Digital cameras * PDAs * LCD modules * Portable internet appliances * Palmtop computers FEATURES * * * * * * * * * * Low profile SC70 6 pin package Internal PWM filter for flicker free output High efficiency (80% typ) Wide input voltage range: 2.5V to 5.5V Up to 50mA output current Low quiescent current: (60 A typ) 500nA maximum shutdown current Up to 1MHz switching frequency Low external component count Inherently matched LED currents TYPICAL APPLICATION CIRCUIT PIN CONNECTIONS ISSUE 4 - JULY 2004 1 SEMICONDUCTORS ZXLD1100 ORDERING INFORMATION DEVICE ZXLD1100H6 DEVICE DESCRIPTION Boost convertor in SC70-6 TEMPERATURE RANGE -40 to +85C PART MARK 110 TAPING OPTIONS TA, TC ZXLD1100H6TA = 7" reel of 3,000 devices ZXLD1100H6TC = 13" reel of 10,000 devices ABSOLUTE MAXIMUM RATINGS (Voltages to GND unless otherwise stated) PARAMETER Input voltage LX output voltage Switch output current Power dissipation Operating temperature Storage temperature Junction temperature SYMBOL (V IN ) (V LX ) (I LX ) (PD) (T OP ) (T ST ) (T j MAX ) LIMIT 7 30 500 300 -40 to 85 -55 to 150 125 UNIT V V mA mW C C C ISSUE 4 - JULY 2004 SEMICONDUCTORS 2 ZXLD1100 ELECTRICAL CHARACTERISTICS (at VIN = 3V, Tamb = 25C unless otherwise stated(1)) SYMBOL V IN I IN PARAMETER Input voltage Supply current Quiescent Shutdown V FB I FB f LX T OFF T ON I LXpk R LX I LX(leak) V OUT FB pin control voltage FB pin input current Operating frequency LX output 'OFF' time LX output 'ON' time (2) Switch peak current limit Switch 'On' resistance Switch leakage current Controller output voltage V LX =20V Normal operation VSENSE pin open-circuit or grounded VSENSE connected to Vout Device active Device in shutdown V EN =0V V EN =V IN V EN switched from high to low 10kHz < f < 100kHz, V ENH =V IN 20 4 f=30kHz 52.5 120 100 25 1.5 30 VIN 0.4 -100 1 L=10 H, V OUT =10V, I OUT =20mA 320 1.5 1 28 A V L=10 H, V OUT =10V, I OUT =20mA 350 0.35 500 5 V EN = V IN , I LX = 0, Output not switching V EN = 0V 90.5 60 100 500 109.5 100 1 A nA mV nA MHz ns s mA CONDITIONS MIN. 2.5 TYP. MAX. UNIT 5.5 V V OUT(MAX) Controller output voltage with output open circuit (3) V ENH V ENL I ENL I ENH T EN(hold) T/T f LPF A LPF EN pin High level Input voltage EN pin Low level Input voltage EN pin Low level input current EN pin High level input current EN pin turn off delay (4) V V V nA A s % kHz dB PWM duty cycle range at `EN' input for filtered PWM control (5) Internal PWM low pass filter cut-off frequency Filter attenuation NOTES: (1) Production testing of the device is performed at 25C. Functional operation of the device over a -40C to +85C temperature range is guaranteed by design, characterization and process control. (2) Nominal 'on' time (TONnom) is defined by the input voltage (VIN), coil inductance (L) and peak current (ILXpkdc) according to the expression: TONnom = {ILX(pkdc) x L/VIN} +200ns. (3) When using the open circuit protection feature, the maximum output voltage under normal operation should be maintained below the minimum value specified, in order to prevent possible disturbance of the current control loop. (4) This is the time for which the device remains active after the EN pin has been asserted low. This delay is necessary to allow the output to be maintained during dc PWM mode operation. (5) The minimum PWM signal frequency during this mode of operation is to ensure that the device remains active during PWM control. This provides a continuous dc output current. For lower frequencies, the device will be gated 'on' and 'off' during PWM control. (6) The maximum PWM signal frequency during this mode of operation should be kept as low as possible to minimize errors due to the turn-off delay of the device (see Enable pin turn-off delay). ISSUE 4 - JULY 2004 3 SEMICONDUCTORS ZXLD1100 PIN DESCRIPTION PIN NO. 1 2 3 4 NAME LX GND FB EN DESCRIPTION Output of NDMOS switch Ground (0V) Feedback pin for current control loop (connect resistor R1 from this pin to GND for output current I=100mV/ R1) Enable input (active high to turn on device) Also used to adjust output current by PWM signal. Connect to V in for permanent operation. 5 6 VSENSE V IN Output voltage sense (used for open circuit protection). Connect to GND if not required. Input voltage (2.5V to 5.5V). Decouple with capacitor close to device. BLOCK DIAGRAM ISSUE 4 - JULY 2004 SEMICONDUCTORS 4 ZXLD1100 DEVICE DESCRIPTION The device is a PFM flyback dc-dc boost converter, working in discontinuous mode. With reference to the chip block diagram and typical application circuit, the operation of the device is as follows: Control loop When 'EN' is high, the control circuits become active and the low side of the coil (L1) is switched to ground via NDMOS transistor (MN). The current in L1 is allowed to build up to an internally defined level (nominally 320mA) before MN is turned off. The energy stored in L1 is then transferred to the output capacitor (C2) via schottky diode (D1). When the voltage on C2 has risen above the threshold voltage of the series connected LEDs, current will flow through external sense resistor R1. The voltage developed across R1 is sensed at pin 'FB' and compared to a 100mV reference voltage (V REF ). A comparator senses when the feedback voltage is above VREF and its output is used to control the 'off' time of the output switch. The control loop is self-oscillating, producing pulses of up to 5 s maximum duration (switch 'on'), at a frequency that varies in proportion to the LED current. The feedback loop maintains a voltage of VREF at the FB pin and therefore defines a maximum LED current equal to VREF divided by R1. The minimum 'off' time of the output switch is fixed at 0.5 s nominal, to allow time for the coil's energy to be dissipated before the switch is turned on again. This maintains stable and efficient operation in discontinuous mode. Open circuit protection There is an internal avalanche diode between the VSENSE and FB pins of the device. This diode, together with the associated resistors provides open circuit protection when the VSENSE pin is connected to the output voltage. In the event of an open circuit condition, the output voltage will rise above the breakdown voltage of the internal diode, which will then conduct and override the control signal from the current sense resistor. This maintains the output voltage at a level below the breakdown voltage of the output switch. Supply current in this condition will fall to a low value as the control loop provides only the bias current for the diode. Filtered PWM operation The input of an internal low pass filter is switched to VREF when the EN pin is high and switched to ground when the EN pin is low. The output of this filter drives the comparator within the control loop. A continuous high state on EN therefore provides a filtered voltage of value VREF to the comparator. However, by varying the duty cycle of the EN signal at a suitably high frequency (f>10kHz), the control loop will see a voltage, that has an average value equal to the duty cycle multiplied by VREF. This provides a means of adjusting the output current to a lower value. It also allows the device to be both turned on and adjusted with a single signal at the 'EN' pin. The output during this mode of operation will be a dc current equal to (VREF/R1) x duty cycle Gated PWM operation The internal circuitry of the ZXLD1100 is turned off when no signal is present on the 'EN' pin for more than 120 s (nominal). A low frequency signal applied to the EN pin will therefore gate the device 'on' and 'off' at the gating frequency and the duty cycle of this signal can be varied to provide a 'chopped' output current equal to (VREF/R1) x duty cycle. For best accuracy, the gating frequency should be made as low as possible (e.g. below 1kHz), such that the turn off delay of the chip is only a small proportion of the gating period Further details of setting output current are given in the applications section under brightness control. ISSUE 4 - JULY 2004 5 SEMICONDUCTORS ZXLD1100 TYPICAL CHARACTERISTICS (For typical application circuit at VIN=3V and TA=25 C unless otherwise stated) ISSUE 4 - JULY 2004 SEMICONDUCTORS 6 ZXLD1100 TYPICAL OPERATING CHARACTERISTICS (For typical applications circuit at VIN=3V, L=10 H Coilcraft DO1608C Series, 3 series LEDs, ILED=15mA, TA=25 C unless otherwise stated) ISSUE 4 - JULY 2004 7 SEMICONDUCTORS ZXLD1100 APPLICATIONS Programming the maximum LED current The maximum LED current is programmed by adding a single resistor in series with the LED chain. The current is determined by the resistor value and feedback voltage and is given by: ILED = VFB/R1 where VFB=100mV The table below gives recommended resistor values for required LED currents: LED Current 10mA 15mA 20mA 30mA R1 Value 10 6.8 5 3.3 Dimming Control using a DC voltage For applications where the EN pin is not available a DC voltage can be used to control dimming. By adding resistors R2 and R3 and applying a DC voltage, the LED current can be adjusted from 100% to 0%. As the DC voltage increases, the voltage drop across R2 increases and the voltage drop across R1 decreases, thus reducing the current through the LEDs. Selection of R2 and R3 should ensure that the current from the DC voltage is much less than the LED current and much larger than the feedback current. The component values in the diagram below represent 0% to 100% dimming control from a 0 to 2V DC voltage. Dimming Control via a PWM signal on the EN pin A Pulse Width Modulated (PWM) signal can be applied to the EN pin in order to adjust the output current to a value below the maximum LED current. Two modes of adjustment are possible as described below. True Analog Dimming - Filtered `DC' mode If a PWM signal of 10kHz or higher is applied to the EN pin, the device will remain active when the EN pin is low. However, the input to the internal low pass filter will be switched alternately from VREF to ground, with a duty cycle (D) corresponding to that of the PWM signal. This will present a filtered dc voltage equal to the duty cycle multiplied by VREF to the control loop and will produce a dc output current lower than the maximum set value. This current is given by: IOUTdc = 0.1D/R1 This mode of adjustment minimizes flicker in the light output and system noise. Pulsed Dimming - Gated Mode If a lower frequency of 1kHz or less is applied to the EN pin, the device will be gated `on' and `off' at a duty cycle (D) corresponding to that of the input signal. The average output current is then given by: IOUTavg 0.1D/R1 This mode may be preferred over dc current control if the purest white output is required. However, note the 120 s nominal turn-off delay of the device, when using the device in this mode. MOSFET `off' Dimming Control using a logic signal For applications where the LED current needs to be adjusted in discrete steps a logic signal can be applied as shown in the diagram below. When Q1 os `off', R1 sets the minimum LED current. When Q1 is `on', R2 sets the LED current that will be added to the minimum LED current. The formula for selecting values for R1 and R2 are given below: I LED ( MIN ) MOSFET `on' V FB RLED V FB RLED where VFB = 100mV I LED ( MAX ) I LED ( MIN ) ISSUE 4 - JULY 2004 SEMICONDUCTORS 8 ZXLD1100 Open circuit protection The voltage sense pin (VSENSE) can be connected to the output to provide open circuit protection for the device and external circuits when driving series connected LEDs, thus eliminating the need for an external Zener diode. Protection is provided by the internal avalanche diode (ZD), which limits the maximum output voltage to a value below the breakdown voltage of the output switch when the connection to the diodes is broken. Capacitor selection A ceramic capacitor grounded close to the GND pin of the package is recommended at the output of the device. Surface mount types offer the best performance due to their lower inductance. A minimum value of 0.22 F is advised, although higher values will lower switching frequency and improve efficiency especially at lower load currents. A higher value will also minimize ripple when using the device to provide an adjustable dc output current. A good quality, low ESR capacitor should also be used for input decoupling, as the ESR of this capacitor is effectively in series with the source impedance and lowers overall efficiency. This capacitor has to supply the relatively high peak current to the coil and smooth the current ripple on the input supply. A minimum value of 1 F is acceptable if the input source is close to the device, but higher values will improve performance at lower input voltages, when the source impedance is high. The input capacitor should be mounted as close as possible to the IC For maximum stability over temperature, capacitors with X7R dielectric are recommended, as these have a much smaller temperature coefficient than other types. A table of recommended manufacturers is provided below: Manufacturer Murata Taiyo Yuden Kemet AVX Website www.murata.com www.t-yuden.com www.kement.com www.avxcorp.com ISSUE 4 - JULY 2004 9 SEMICONDUCTORS ZXLD1100 Inductor selection The choice of inductor will depend on available board space as well as required performance. Small value inductors have the advantage of smaller physical size and may offer lower series resistance and higher saturation current compared to larger values. A disadvantage of lower inductor values is that they result in higher frequency switching, which in turn causes reduced efficiency due to switch losses. Higher inductor values can provide better performance at lower supply voltages. However, if the inductance is too high, the output power will be limited by the internal oscillator, which will prevent the coil current from reaching its peak value. This condition will arise whenever the ramp time (I LX(peak) x L/V IN ) exceeds the nominal 5 s maximum `on' time limit for the LX output. The graphs opposite show the ZXLD1100 performance for given inductor values and different manufacturers. Recommended inductor values for the ZXLD1100 are in the range 6.8 H to 22 H. The inductor should be mounted as close to the device as possible with low resistance connections to the LX and VIN pins. Suitable coils for use with the ZXLD1100 are shown in the table below: Part No. L ( H) DCR () I SAT (A) Manufacturer Sumida www.sumida.com Coilcraft www.coilcraft.com Murata www.murata.com Taiyo Yuden www.t-yuden.com CMD4D11-100MC 10 DO1608-103 LQH31CN100 LB2012Y100MR 10 10 10 0.457 0.5 0.16 1.3 0.5 1.1 0.23 0.1 Diode selection The rectifier diode (D1) should be a fast low capacitance schottky diode with low reverse leakage at the working voltage. It should also have a peak current rating above the peak coil current and a continuous current rating higher than the maximum output load current. The table below gives some typical characteristics for diodes that can be used with the ZXLD1100: Layout considerations PCB tracks should be kept as short as possible to minimize ground bounce, and the ground pin of the device should be soldered directly to the ground plane. It is particularly important to mount the coil and the input/output capacitors close to the device to minimize parasitic resistance and inductance, which will degrade efficiency. The FB pin is a high impedance input so PCB track lengths to this should also be kept as short as possible to reduce noise pickup. Excess capacitance from the FB pin to ground should be avoided. Ic (mA) 400 500 I R at 30V ( A) 15 15 Package SOD323 SOT23 Diode ZHCS400 ZHCS500 V F @ 100mA (mV) 300 300 I FSM (mA) 1000 1000 ISSUE 4 - JULY 2004 SEMICONDUCTORS 10 ZXLD1100 REFERENCE DESIGNS 3 LED Driver for Handset LCD Backlight Circuit Diagram Note: LED current is set to 15mA Bill of materials Ref U1 D1 L1 R1 R2 1 C1 C2 LEDs 400mA 10 H 6.8 100k 1F 1F 0603 0603 0603 0603 Value Package SC70-6 SOD323 Part Number ZXLD1100H6 ZHCS400 CMD4D11-100MC Generic Generic Generic Generic NSCW215 Manufacturer Zetex Zetex Sumida Generic Generic Generic Generic Nichia 3pcs per board Notes LED Driver IC 400mA Schottky Diode 1mm Height Profile Note: R2 is optional. If EN is floating add R2 to shutdown the ZXLD1100 and LEDs. If EN pin can be driven low, R2 is not necessary. Performance Graphs ISSUE 4 - JULY 2004 11 SEMICONDUCTORS ZXLD1100 4 LED Driver for Handset LCD Backlight Circuit Diagram Note: LED current is set to 15mA Bill of materials Ref U1 D1 L1 R1 R2 1 C1 C2 LEDs 400mA 10 H 6.8 100k 1F 1F 0603 0603 0603 0603 Value Package SC70-6 SOD323 Part Number ZXLD1100H6 ZHCS400 CMD4D11-100MC Generic Generic Generic Generic NSCW215 Manufacturer Zetex Zetex Sumida Generic Generic Generic Generic Nichia 4pcs per board Notes LED Driver IC 400mA Schottky Diode 1mm Height Profile Note: R2 is optional. If EN is floating add R2 to shutdown the ZXLD1100 and LEDs. If EN pin can be driven low, R2 is not necessary. Performance Graphs ISSUE 4 - JULY 2004 SEMICONDUCTORS 12 ZXLD1100 5 LED Driver for Handset Main and Sub Display LCD Backlight Circuit Diagram Note: LED current is set to 15mA Bill of materials Ref U1 D1 L1 R1 R2 1 C1 C2 LEDs 400mA 10 H 6.8 100k 1F 1F 0603 0603 0603 0603 Value Package SC70-6 SOD323 Part Number ZXLD1100H6 ZHCS400 CMD4D11-100MC Generic Generic Generic Generic NSCW215 Manufacturer Zetex Zetex Sumida Generic Generic Generic Generic Nichia 5pcs per board Notes LED Driver IC 400mA Schottky Diode 1mm Height Profile Note: R2 is optional. If EN is floating add R2 to shutdown the ZXLD1100 and LEDs. If EN pin can be driven low, R2 is not necessary. Performance Graphs ISSUE 4 - JULY 2004 13 SEMICONDUCTORS ZXLD1100 6 LED Driver for LCD Backlight Circuit Diagram Note: LED current is set to 15mA Bill of materials Ref U1 D1 L1 R1 R2 1 C1 C2 LEDs 400mA 10 H 6.8 100k 1F 1F 0603 0603 0603 0603 Value Package SC70-6 SOD323 Part Number ZXLD1100H6 ZHCS400 CMD4D11-100MC Generic Generic Generic Generic NSCW215 Manufacturer Zetex Zetex Sumida Generic Generic Generic Generic Nichia 6pcs per board Notes LED Driver IC 400mA Schottky Diode 1mm Height Profile Note: R2 is optional. If EN is floating add R2 to shutdown the ZXLD1100 and LEDs. If EN pin can be driven low, R2 is not necessary. Performance Graphs ISSUE 4 - JULY 2004 SEMICONDUCTORS 14 ZXLD1100 ISSUE 4 - JULY 2004 15 SEMICONDUCTORS ZXLD1100 PACKAGE OUTLINE - SC70-6 Controlling dimensions are in millimeters. Approximate conversions are given in inches PACKAGE DIMENSIONS Millimeters DIM Min A A1 A2 b C D 0.80 0.80 0.15 0.08 Max 1.10 0.10 1.00 0.30 0.25 Min 0.0315 0.0315 0.006 0.0031 Max 0.0433 0.0039 0.0394 0.0118 0.0098 E E1 e e1 L a Inches DIM Min Max Min Max 2.10BSC 1.25 1.35 0.0826 BSC 0.0492 0.0531 Millimeters Inches 0.65 BSC 1.30 BSC 0.26 0 0.46 8 0.0255 BSC 0.0511 BSC 0.0102 0 0.0181 8 2.00 BSC 0.0787 BSC (c) Zetex plc 2003 Europe Zetex plc Fields New Road Chadderton Oldham, OL9 8NP United Kingdom Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com Zetex GmbH Streitfeldstrae 19 D-81673 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com ISSUE 4 - JULY 2004 SEMICONDUCTORS 16 SCZXLD1100DS2 |
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