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U2750B-A
Tuner IC for DAB
Description
The U2750B-A is a monolithically integrated tuner circuit fabricated in TEMIC's advanced UHF5S technology. Designed for applications in DAB receivers it performs two selectable mixers, one VCO, a SAW-filter driver, an LO output buffer, a tri-state band switch and an AGC-voltage generation block.
Features
D 8.5 V supply voltage D RF frequency range 70 to 260 MHz D Two identical mixers, selectable by bandswitch input D Balanced mixer input, balanced mixer output
(open collector)
D Balanced LO output for PLL D SAW filter driver with low impedance output D Power measurement and generation of AGC voltage
by charge pump output
D Three charge pump currents selectable
(zero, low, high)
D Four pin voltage controlled oscillator
D Voltage regulator for stable operating characteristics
Block Diagram
LO1 MXO2 LO2 MAI1 MBI1 MBI2 GND MAI2 MXO1 GND VS SWI1 SWI2 SLI
SLI NWAGC BUF_LO MIXA MIXB
SAWdriver
VCO C2 B1 B2 C1
Bandswitch
Voltage stabilization
GND
CP
BDSW
GND VS
TH
SWO2 NWAGC SWO1
12485
V Tune
Figure 1.
TELEFUNKEN Semiconductors Rev. A1, 28-Aug-96
1 (10)
Preliminary Information
U2750B-A
Pin Description
CP TH BDSW GND GND C1VC B2VC B1VC C2VC
1 2 3 4 5 6 7 8 9
28 SLI 27 SWI1 26 SWI2 25 MXO1 24 MXO2 23 VS 22 GND 21 MBI2
20 MBI1 19 18 17 16 15
912486
GND 10 VS 11
MAI2 MAI1 GND LO2 LO1
SWO1 12 SWO2 13
NWAGC 14
Figure 2.
2 (10)
Preliminary Information
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2 TH 3 BDSW 4, 5, GND 10, 21, 26 6 C1VC Collector Pin 1 of VCO 7 B2VCAAAAAAAAAAA Base Pin 2 of VCO 8 B1VC Base Pin 1 of VCO 9 C2VC Collector Pin 2 of VCO 11, 20 VS Supply voltage 12 SWO1 Differential output of SAW-driver 13 SWO2 Differential output of SAW-driver 14 NWAGC AGC mode selection 15 SLI AGC mode selection 16 SWI1 Differential input of SAW-driver 17 SWI2 Differential input of SAW-driver 18 MXO1 Differential mixer output 19 MXO2 Differential mixer output 22 MBI2 Differential input of mixer B 23 MBI1 Differential input of mixer B 24 MAI2 Differential input of mixer A 25 MAI1 Differential input of mixer A 27 LO2 Differential output of LO for PLL 28 LO1 Differential output of LO for PLL TELEFUNKEN Semiconductors Rev. A1, 28-Aug-96
Pin 1
Symbol CP
Function Charge pump output of comparator Threshold input of comparator Band switch input Ground
U2750B-A
Functional Description
The U2750B-A represents a tuner IC for applications in DAB receivers. It is intended to be used for receiption of band II or band III DAB signals and consists of two mixers, one VCO, a SAW-filter driver, an LO output buffer, a tri-state band switch and an AGC-voltage generation circuitry as shown in figure 1. its differential output pins SWO1, SWO2 to an external SAW-filter.
AGC-Voltage Generation Block
The incoming RF signal which appears at the input pins MAI1, MAI2 or MBI1, MBI2 depending on the selection made by the BDSW pin is amplified, weakly band pass filtered (transition range: 50 to 300 MHz), rectified and finally low pass filtered. The voltage derived in this `power measurement process' is compared with a voltage threshold which is defined by an external resistor connected to pin TH according to figure 3. Depending on the result of this comparison a charge pump feeds a positive or negative current to pin CP in order to charge or discharge an external capacitor. The voltage of this external capacitor can be used to control the gain of an external (pre-) amplifier stage. By means of the pins NWAGC and SLI the current of the charge pump can be selected according to the following table:
Mixers and VCO
In order to support two different channels two identical mixers are integrated. The RF signal is fed to these mixers via the differential input ports MAI1, MAI2 and MBI1, MBI2. The band switch input BDSW allows to select one of these mixers or to switch off both. An internal four pin (pins: B1VC, C1VC, B2VC, C2VC) oscillator an equivalent circuit is shown in figure 5 provides the LO signal to both mixers. Via an LO-buffer the oscillators signal can be accessed at the balanced output pins LO1, LO2 in order to be fed to a frequency synthesizer circuit (U2753B or U2733B). The result of the mixing process of both mixers appears at the differential open collector output MXO1, MXO2. In the application shown in figure 3 these mixer output pins are loaded by a resonant load.
* *
*
*
SAW-Filter Driver
The filters' mixer output signal is applied to the differential input pins SWI1, SWI2 of a SAW-filter driver which amplifies the result of the mixing process and feeds it via
TELEFUNKEN Semiconductors Rev. A1, 28-Aug-96
Preliminary Information
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NWAGC `Low' `High' `High' SLI X `Low' `High' Charge Pump Current / A off 40 A (slow mode) 250 A (fast mode) An overview of the functionality of this block can be taken from figure 4. 3 (10)
U2750B-A
Absolute Maximum Ratings
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-40 0.4 -0.3 -0.3 -0.3 6.5
Parameters Symbol Supply voltage Pins 11 and 20 VS Junction temperature Tj Storage temperature Tstg Ext. applied voltage at charge pump output Pin 1 VCP Band switch input voltage Pin 3 VBDSW NWAGC input voltage Pin 14 VNWAGC SLI input voltage Pin 15 VSLI differential input voltage of SAW-driver Pins 16 and 17 VSWI mixer output supply voltage Pin 19 VMXO differential input voltage mixer A,B VMXI Pins 22, 23, 24 and 25
Min. -0.3
Typ.
Max. 9.5 +125 +125 6.9 6 6 6 300 9.5 50
Unit V C C V V V V mVRMS V mVRMS
Operating Range
Supply voltage Ambient temperature
Parameters Pins 11 and 20
Symbol VS Tamb
Min. 8.0 -40
Typ. 8.5
Max. 9.35 85
Unit V C
Thermal Resistance
Parameters Junction ambient SSO28 Symbol RthJA Min. Typ. 130 Max. Unit K/W
Electrical Characteristics
Test conditions (unless otherwise specified): VS = 8.5 V, Tamb = +25C, test circuit see figure 3 Parameters Overall characteristics Supply voltage Supply current Voltage gain Noise figure double side band Maximum input level Test Conditions / Pins VS VS Pins MXA, MXB 1) IF-Port Pins MXA, MXB 1) IF-Port 3rd order intermodulation distance 30 dBc Pins MXA,MXB 1) Symbol VS IS GV,tot NF,DSB Pin, max -25 Min. 8.0 21.6 30 Typ. 8.5 27 32 8 -22 Max. 9.35 32.4 34 Unit V mA dB dB dBm

Mixer A, B Mixer output current Input frequency range Input impedance VCO Phase noise
Pins 18 and 19 Pins 22, 23, 24 and 25 Pins 22, 23, 24 and 25 Pin LO port Df = 10 kHz
IOMX fin, IMX Zin, max L(f) fLO
2.6 70
3.3 80 -92
4.0 260
mA MHz
W
110
300
dBc/Hz MHz
4 (10)
Preliminary Information
TELEFUNKEN Semiconductors Rev. A1, 28-Aug-96
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Test conditions (unless otherwise specified): VS = 8.5 V, Tamb = +25C, test circuit see figure 3
TELEFUNKEN Semiconductors Rev. A1, 28-Aug-96 1) 2) Control voltage at SLI Control voltage at SLI Bandswitch Bandswitch Control voltage at NWAGC High impedance mode charge pump current Minimum gain control voltage Maximum gain control voltage Control voltage at NWAGC Maximum negative charge pump current, slow mode Maximum positive charge pump current, slow mode Maximum negative charge pump current, fast mode Voltage gain AGC unit Internal voltage for threshold adjustment Maximum positive charge pump current, fast mode Output impedance SAW driver Input impedance Parameters LO buffer LO output power LO output impedance
Electrical Characteristics (continued)
Measurement corrected by loss of transformers. Ratio of the output voltage at the primary coil of L4 (Pins 12 and 13) to the input voltage (MXA, MXB).
Without external resistor Pin 2 VNWAGC =`H', VSLI = `H', PRF = -30 dBm, Pin 1 Rth = 12 kW, VNWAGC = `H', VSLI = `H', PRF = -25 dBm, Pin 1 Rth = 12 kW, VNWAGC = `H', VSLI = `L', PRF = -30 dBm, Rth = 12 kW, Pin 1 VNWAGC = `H', VSLI = `L', PRF = -25 dBm, Rth = 12 kW, Pin 1 VNWAGC = `L' Pin 1
MXA active MXB active MXA,MXB inactive
SLI = `H' SLI = `L'
NWAGC = `L'
NWAGC = `H'
Differential Pins 16 and 17 Differential Pins 12 and 13 Pins 16, 17 - 12, 13 2)
200 W load, differential Differential Pins 27 and 28
Test Conditions / Pins
Preliminary Information
Pin 14 Pin 14 VNWAGCVNWAGCVBDSWA VBDSWB VBDSWoff VAGCmax VAGCmin ICPneg,sm ICPpos,sm ICPneg,fm ICPpos,fm GV,SAW ZOSAW pLO ZoutLO Symbol ZISAW VSLIH VSLIL ICPhi VTH
H L
-300
Min.
-50
-48
200
4.0 2.0
3.0
3.0
32
26
-250
Typ.
1.94
-40
250
580
34 200
0 5.0
6.9
0.5
40
18
24
0
U2750B-A
Max.
-200
-32
300
3.0
1.0
1.5
1.5
50
48
mVeff
Unit
A
A
A
A
nA
dB
5 (10)
W W W
V V V V V V V V V V
U2750B-A
Application Circuit
( fIF = 38.912 MHz )
MXB L1 VS 100 n
MXA
L2 100 p
L3
12 p 1n PLL U2733B, U2753B LO-Port 1n L1,L2 : Toko 617PT-1026 (3T:3Tx2) L3 : Toko 600ENS-9272Y (6Tx2) L4 : Toko 600ENS-9273X (13T:2T) L5 : Air coil enamelled copper wire (3.5T, d=3.0mm) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1n 1n 1n 1n 10 n 10 n SLI
U2750B-A
SSO28
1
2
3
4
5
6
7
8
9
10
11 12 13
14 NWAGC
1n VS 100 p 2.2 p 2.2 p VAGC 3.3 u 1n 2.7 p 2.7 p 10 n 10 n
R th BDSW 4.7 k 12 p D1 VTune 22k fLO 208 to 285 MHz 108 to 285 MHz Ck D1 BB 515 BB 619 Cp 4.7 p - Ck L5 Cp L5 L4 IF-Port
22 p 3.5 T, d = 3.0 mm 100 p 4.5 T, d = 3.0 mm
12487
Figure 3.
6 (10)
Preliminary Information
TELEFUNKEN Semiconductors Rev. A1, 28-Aug-96
U2750B-A
Equivalent Circuit of AGC-Voltage Generation Block
BDSW MAI
MBI BUF_IN AGC_BP AGC_RECT 1.94 V Mixer 100 AGC_THRESH 6.48 k TH Rth AGC_COMP AGC_TP
SLI
NWAGC AGC voltage CP
CHARGE PUMP
Cagc
12488
Figure 4.
Equivalent Circuit of VCO
5.9 V VS
C1VC
3.5 k
3.5 k
V Tune
B1VC
B2VC
C2VC
12489
Figure 5.
TELEFUNKEN Semiconductors Rev. A1, 28-Aug-96
7 (10)
Preliminary Information
U2750B-A
Typical Operation Characteristics
Operating conditions: VS = 8.5 V, Tamb = 27C. Test conditions see figure 3.
Overall Gain
fRF = 240 MHz applied to MXA-Port; pIF measured at IF-Port
5 0 -5 -10 -15 -20 -25 -40
12490
RF Power Adjustment by Rth
fRF = 240 MHz
-20
-25 pRF_th / dBm
pIF / dBm
-30
-35
-40 5 -35 -30 pRF / dBm -25 -20
12492
10
15
20
25
30
35
40
Rth / kW
Figure 8.
Figure 6.
Output Impedance SAW-Filter Driver
Pins 12 and 13, differential
3rd Order 2-Tone Intermodulation Ratio
fRF1 = 240 MHz and fRF2 = 241 MHz applied to MXAPort; DIM3 measured at IF-Port
70 60 DIM3 / dBc 50 40 30 20 10 -40
12491
-35
-30 pRF / dBm
-25
-20
12493
Figure 7.
Figure 9.
8 (10)
Preliminary Information
TELEFUNKEN Semiconductors Rev. A1, 28-Aug-96
U2750B-A
fPackage Information
Package: SSO28 Dimensions in mm
95 9943
TELEFUNKEN Semiconductors Rev. A1, 28-Aug-96
9 (10)
Preliminary Information
U2750B-A
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
10 (10)
Preliminary Information
TELEFUNKEN Semiconductors Rev. A1, 28-Aug-96

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