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Philips Semiconductors
Product Specification
PowerMOS transistor Logic level FET
GENERAL DESCRIPTION
N-channel enhancement mode logic level field-effect power transistor in a plastic full-pack envelope. The device is intended for use in Switched Mode Power Supplies (SMPS), motor control, welding, DC/DC and AC/DC converters, and in automotive and general purpose switching applications.
BUK545-100A/B
QUICK REFERENCE DATA
SYMBOL VDS ID Ptot Tj RDS(ON) PARAMETER BUK545 Drain-source voltage Drain current (DC) Total power dissipation Junction temperature Drain-source on-state resistance; VGS = 5 V MAX. -100A 100 13 30 150 0.085 MAX. -100B 100 12 30 150 0.11 UNIT V A W C
PINNING - SOT186
PIN 1 2 3 gate drain source DESCRIPTION
PIN CONFIGURATION
case
SYMBOL
d
g
case isolated
123
s
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL VDS VDGR VGS VGSM ID ID IDM Ptot Tstg Tj PARAMETER Drain-source voltage Drain-gate voltage Gate-source voltage Non-repetitive gate-source voltage Drain current (DC) Drain current (DC) Drain current (pulse peak value) Total power dissipation Storage temperature Junction Temperature CONDITIONS RGS = 20 k tp 50 s Ths = 25 C Ths = 100 C Ths = 25 C Ths = 25 C MIN. - 55 -100A 13 8.2 52 30 150 150 MAX. 100 100 15 20 -100B 12 7.5 48 UNIT V V V V A A A W C C
THERMAL RESISTANCES
SYMBOL Rth j-hs Rth j-a PARAMETER Thermal resistance junction to heatsink Thermal resistance junction to ambient CONDITIONS with heatsink compound MIN. TYP. 55 MAX. 4.17 UNIT K/W K/W
April 1993
1
Rev 1.100
Philips Semiconductors
Product Specification
PowerMOS transistor Logic level FET
STATIC CHARACTERISTICS
Ths = 25 C unless otherwise specified SYMBOL V(BR)DSS VGS(TO) IDSS IDSS IGSS RDS(ON) PARAMETER Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current Zero gate voltage drain current Gate source leakage current Drain-source on-state resistance CONDITIONS VGS = 0 V; ID = 0.25 mA VDS = VGS; ID = 1 mA VDS = 100 V; VGS = 0 V; Tj = 25 C VDS = 100 V; VGS = 0 V; Tj =125 C VGS = 10 V; VDS = 0 V VGS = 5 V; BUK545-100A BUK545-100B ID = 13 A MIN. 100 1.0 -
BUK545-100A/B
TYP. 1.5 1 0.1 10 0.075 0.09
MAX. 2.0 10 1.0 100 0.085 0.11
UNIT V V A mA nA
DYNAMIC CHARACTERISTICS
Ths = 25 C unless otherwise specified SYMBOL gfs Ciss Coss Crss td on tr td off tf Ld Ls PARAMETER Forward transconductance Input capacitance Output capacitance Feedback capacitance Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Internal drain inductance Internal source inductance CONDITIONS VDS = 25 V; ID = 13 A VGS = 0 V; VDS = 25 V; f = 1 MHz VDD = 30 V; ID = 3 A; VGS = 5 V; RGS = 50 ; Rgen = 50 Measured from drain lead 6 mm from package to centre of die Measured from source lead 6 mm from package to source bond pad MIN. 10 TYP. 13.5 1450 280 100 25 65 135 80 4.5 7.5 MAX. 1750 350 150 40 85 180 110 UNIT S pF pF pF ns ns ns ns nH nH
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 C unless otherwise specified SYMBOL Visol PARAMETER Repetitive peak voltage from all three terminals to external heatsink CONDITIONS R.H. 65% ; clean and dustfree MIN. TYP. MAX. 1500 UNIT V
Cisol
Capacitance from T2 to external f = 1 MHz heatsink
-
12
-
pF
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
Ths = 25 C unless otherwise specified SYMBOL IDR IDRM VSD trr Qrr PARAMETER Continuous reverse drain current Pulsed reverse drain current Diode forward voltage Reverse recovery time Reverse recovery charge CONDITIONS IF = 13 A ; VGS = 0 V IF = 13 A; -dIF/dt = 100 A/s; VGS = 0 V; VR = 30 V MIN. TYP. 1.3 90 0.70 MAX. 13 52 1.7 UNIT A A V ns C
April 1993
2
Rev 1.100
Philips Semiconductors
Product Specification
PowerMOS transistor Logic level FET
AVALANCHE LIMITING VALUE
Ths = 25 C unless otherwise specified SYMBOL WDSS PARAMETER Drain-source non-repetitive unclamped inductive turn-off energy CONDITIONS ID = 25 A ; VDD 50 V ; VGS = 5 V ; RGS = 50 MIN. -
BUK545-100A/B
TYP. -
MAX. 140
UNIT mJ
120 110 100 90 80 70 60 50 40 30 20 10 0
PD%
Normalised Power Derating
with heatsink compound
100
ID / A
DS /ID
BUK545-100A.B A B tp = 10 us 100 us 1 ms 10 ms
10
RD
S(
ON
V )=
1
DC
100 ms
0
20
40
60
80 Ths / C
100
120
140
0.1 1 10 VDS / V 100 1000
Fig.1. Normalised power dissipation. PD% = 100PD/PD 25 C = f(Ths)
Normalised Current Derating
with heatsink compound
Fig.3. Safe operating area. Ths = 25 C ID & IDM = f(VDS); IDM single pulse; parameter tp
Zth / (K/W) D= 0.5 1 0.2 0.1 0.05 0.02 BUKx45-lv
120 110 100 90 80 70 60 50 40 30 20 10 0
ID%
10
0.1
0.01
0
P D
tp
D=
tp T t 1E+01
0
20
40
60
80 Ths / C
100
120
140
0.001 1E-07
T 1E-05 1E-03 t/s 1E-01
Fig.2. Normalised continuous drain current. ID% = 100ID/ID 25 C = f(Ths); conditions: VGS 5 V
Fig.4. Transient thermal impedance. Zth j-hs = f(t); parameter D = tp/T
April 1993
3
Rev 1.100
Philips Semiconductors
Product Specification
PowerMOS transistor Logic level FET
BUK545-100A/B
50 40 30
ID / A 10 7 5
BUK555-100A
20
gfs / S
BUK555-100A
VGS / V =
4
15
10
20 3 10 0
5
0
2
4 VDS / V
6
8
10
0 0 20 ID / A 40
Fig.5. Typical output characteristics, Tj = 25 C. ID = f(VDS); parameter VGS
RDS(ON) / Ohm VGS / V = 3 3.5 BUK555-100A
Fig.8. Typical transconductance, Tj = 25 C. gfs = f(ID); conditions: VDS = 25 V
a Normalised RDS(ON) = f(Tj)
0.5 0.4 0.3 0.2 0.1
2.0
2.5
1.5
4 4.5 5 10
1.0
0.5
0
0
0
20 ID / A
40
-60 -40 -20
0
20
40 60 Tj / C
80
100 120 140
Fig.6. Typical on-state resistance, Tj = 25 C. RDS(ON) = f(ID); parameter VGS
ID / A Tj / C = 40 25 150 BUK555-100A
Fig.9. Normalised drain-source on-state resistance. a = RDS(ON)/RDS(ON)25 C = f(Tj); ID = 13 A; VGS = 5 V
VGS(TO) / V max. 2 typ.
50
30
min. 1
20
10
0 0 2 4 VGS / V 6 8
0 -60 -40 -20 0 20 40 60 Tj / C 80 100 120 140
Fig.7. Typical transfer characteristics. ID = f(VGS) ; conditions: VDS = 25 V; parameter Tj
Fig.10. Gate threshold voltage. VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS
April 1993
4
Rev 1.100
Philips Semiconductors
Product Specification
PowerMOS transistor Logic level FET
BUK545-100A/B
1E-01
ID / A
SUB-THRESHOLD CONDUCTION
50
IF / A
BUK555-100A
1E-02 2% 98 %
40
typ
1E-03
30
1E-04
20 Tj / C = 150 25
1E-05
10
1E-06 0 0.4 0.8 1.2 VGS / V 1.6 2 2.4
0 0 1 VSDS / V 2
Fig.11. Sub-threshold drain current. ID = f(VGS); conditions: Tj = 25 C; VDS = VGS
C / pF BUK5y5-100
Fig.14. Typical reverse diode current. IF = f(VSDS); conditions: VGS = 0 V; parameter Tj
WDSS%
10000
120 110 100 90 80 70 60
1000
Ciss
Coss 100 Crss
50 40 30 20 10
10 0 20 VDS / V 40
0 20 40 60 80 100 Ths / C 120 140
Fig.12. Typical capacitances, Ciss, Coss, Crss. C = f(VDS); conditions: VGS = 0 V; f = 1 MHz
VGS / V BUK555-100 VDS / V =20
Fig.15. Normalised avalanche energy rating. WDSS% = f(Ths); conditions: ID = 25 A
12 10 8 6 4 2 0
+
L VDS VGS 0 RGS T.U.T. R 01 shunt
VDD
80
-ID/100
0
20 QG / nC
40
Fig.13. Typical turn-on gate-charge characteristics. VGS = f(QG); conditions: ID = 25 A; parameter VDS
Fig.16. Avalanche energy test circuit. 2 WDSS = 0.5 LID BVDSS /(BVDSS - VDD )
April 1993
5
Rev 1.100
Philips Semiconductors
Product Specification
PowerMOS transistor Logic level FET
MECHANICAL DATA
Dimensions in mm Net Mass: 2 g
BUK545-100A/B
10.2 max 5.7 max 3.2 3.0
0.9 0.5
4.4 max 2.9 max 4.4 4.0
7.9 7.5 17 max
seating plane
3.5 max not tinned
4.4
13.5 min 1 0.4 M 2 3 0.9 0.7 2.54 5.08 top view 1.3
0.55 max
Fig.17. SOT186; The seating plane is electrically isolated from all terminals.
Notes 1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to mounting instructions for F-pack envelopes. 3. Epoxy meets UL94 V0 at 1/8".
April 1993
6
Rev 1.100
Philips Semiconductors
Product Specification
PowerMOS transistor Logic level FET
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values
BUK545-100A/B
This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1996 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
April 1993
7
Rev 1.100
Error Log
545-100.A&B
1) Level: Format Error Message: Page break required with Keep enabled Location: Document Body
Page E1
96-11-11 04:12 pm

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