View HSDL-2100_440618.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Infrared IrDA(R) Compliant Transceiver Technical Data
HSDL-2100
Features
* Small Module Package - height of 5.5 mm max. * Integrated EMI Shield - excellent Noise Immunity * Lower ILEDA Current * IEC825-Class 1 Eye Safe * Enhanced Reliability Performance * Fully Compliant to IrDA 1.1 Specifications - excellent Nose-to-Nose operation - 2 Channels: - 2.4 Kb/s to 115.2 Kb/s - 576 Kb/s to 4.0 Mb/s * Designed to Accommodate Light Loss with Cosmetic Windows * Compatible with ASK, HP-SIR and TV Remote * No Mode Programming Required * Interfaces to Various Super I/O and Controller Devices
* Digital Appliances: Internet Web TVs, Internet Appliances * Industrials and Medical Instrumentation - General Data Collection Devices - Patient and Pharmaceutical Data Collection * IR LANs
Description
The HSDL-2100 is a new generation low-cost Infrared (IR) transceiver module that provides the interface between logic and IR signals for through-air, serial, half-duplex IR data links and is compliant to IrDA Physical Layer Specification 1.1. This module is also IEC825-Class 1 Eye Safe. Package This IR module provides two output signals, RXD-A for signal rates from 2.4 Kb/s to 115.2 Kb/s and RXD-B for signal rates of 0.576 Mb/s to 4.0 Mb/s. HSDL-2100 consists of the following basic elements: an Optical SubAssembly (OSA) and an Electrical SubAssembly (ESA) combination with an integrated EMI shield.
I/O pins configuration table is shown on page 2. HSDL-2100 block diagram and recommended application circuit is illustrated in Figure 1 on page 3. The IR transceiver module package outline and recommended PCBoard Pad layout, (Option #001 -- Integrated EMI shield with guide pins) is illustrated in Figure 2 on page 4. Benefits This combination of an integrated EMI shield and transceiver subassembly utilizes existing inhouse high-volume assembly processes ensuring high quality and high-volume supply. An integrated EMI shield helps to ensure low EMI emissions and high immunity to EMI fields, enhancing reliable performance.
Applications
* Data Communication: Notebook Computers, Subnotebook Computers, Desktop Computers, Printers, PDAs, Fax/ Photocopier * Digital Imaging: Digital Cameras, Photo Imaging Printers
2
A brief description of the 2 basic sub-assemblies, Optical SubAssembly (OSA) and Electrical SubAssembly (ESA), is on page 2.
Applications Information
The Applications Engineering group, in the Hewlett-Packard Communications Semiconductor Solutions Division, is available to assist you with the technical understanding associated with this IR transceiver module. You can contact them through your local Hewlett-Packard sales representative for additional details.
a discrete emitter that utilizes a high speed, high efficiency, Transparent Substrate, double heterojunction, Aluminum Gallium Arsenide (TS AlGaAs) LED technology with an integral lens in a clear molded package. The transmitter lens is optimized for speed, efficiency, and distance at an emission wavelength of 870 nm. The receiver utilizes a discrete silicon PIN photodiode with an integral lens in a molded package and contains a dye to absorb visible light. The receiver lens magnifies the effective area of the PIN diode to enhance sensitivity. The power supply for the PIN and preamplifier are filtered to attenuate noise from external sources.
Electrical SubAssembly
The Electrical SubAssembly (ESA) consists of a printed circuit board on which a bipolar silicon Integrated Circuit (IC) and various surface-mount passive circuit elements are attached. The IC contains an LED driver and a receiver providing two output signals, RXD-A and RXD-B.
Optical SubAssembly
The Optical SubAssemblies (OSA) includes a Transmitter and a Receiver. The transmitter has
I/O Pins Configuration Table
Pin 1 2 3 4 5 6 7 8 9 10 Description LED Anode Transmitter Data Input Receiver Data Output - Channel B Receiver Data Output - Channel A Threshold Capacitor Ground Supply Voltage Averaging Capacitor Ground (Analog) PIN Bypass Cap Symbol LEDA TXD RXD-B RXD-A CX3 GND VCC CX4 GND CX1
3
VCC CX7 R2 1 HSDL-2100 CX2 TXD R1 2 LEDA
TXD
IE
EI PIN BIAS VCC CX6 CX1 10 CX1 GND 6 CX4 8 CX4 CX3 5 CX3 R3 CX5 9 GND
ADAPTIVE THRESHOLD & SQUELCH
RXD-A 4 VREF RXD-B 3
7
VCC
Figure 1. HSDL-2100 Block Diagram and Application Circuit.
Recommended Application Circuit Components
Component R1 R2 R3[1] CX1[2] CX2 CX3[4] CX4 CX5[2] CX6 CX7[3] 560 , 5%, 0.125 Watt 4.7 , 5%, 0.5 Watt 10 , 5%, 0.125 Watt 0.47 F, 10%, X7R Ceramic 220 pF, 10%, X7R Ceramic 4700 pF, 10%, X7R Ceramic 0.010 F, 10%, X7R Ceramic 0.47 F, 20%, X7R Ceramic 5 mm lead length 6.8 F Tantalum. Larger value recommended for noisy supplies or environments. 0.47 F, 20%, X7R Ceramic. Recommended Value
Notes: 1. In environments with noisy power supplies, supply rejection can be enhanced by including R3 as shown in application circuit. 2. CX1 and CX5 must be placed within 0.7 cm of the HSDL-2100 to obtain optimum noise immunity. 3. Only necessary in applications where transmitter switching causes more than a 50 mV ripple on VCC. 4. CX3 may be replaced with 1000 pF for MIR, FIR application performance. For FIR application used 4700 pF as shown in application circuit.
4
Package Outline with Dimension and Recommended PCBoard Pad Layout
(Option #001 -- Integrated EMI shield with Guide Pins.)
1.05
1.00 7.5 0.20 8.8 0.20
13.00 0.20
6.30 0.10 TYP. R 0.15 1 0.59 TYP. 0.55 1.143 BSC 0.80 0.15 5.50 0.15 9.60 0.30 10
2.80 0.30 5.30 0.20
GUIDE PINS 3.20 0.30 + 0.15 1.00 0 3 3
1.50 0.30 0.80 0.20 SHIELD GROUND PIN
0.97 0.10 (10X) 0.70 0.51 0.15
PIN 1
1.05 0.10
1.31 0.10 2.31 0.10
1.143 BSC 5.05
(10X) 2.60 2.92 4.30
A R 0.40
2.40
B
A
1.25 5.84 11.86 0.10
SHIELD SOLDER PAD
NOTES: 1. RECOMMENDED SOLDER STENCIL TO BE 5 TO 6 MILS THICK. 2. LETTER 'A' INDICATES LOCATION OF THROUGH HOLE FOR SHIELD GUIDE PIN. 2. LETTER 'B' INDICATES LOCATION OF SHIELD SOLDERED GROUNDING PAD.
Figure 2.
5
Package Outline with Dimension and Recommended PCBoard Pad Layout
(Option #002 -- Integrated EMI shield without Guide Pins.)
1.05
1.00 7.5 0.20 8.8 0.20
13.00 0.20
2.80 0.30 5.30 0.20 TYP. R 0.15 11 TYP. 0.55 1.143 BSC 10 3.20 0.30 0.80 0.15 5.50 0.15 9.60 0.30 + 0.15 1.00 0 3 3 0.80 0.20 SHIELD GROUND PIN 1.50 0.30
0.97 0.10 (10X) 0.70 0.51 0.15
PIN 1
1.05 0.10
1.31 0.10 2.31 0.10
1.143 BSC 5.05
(10X) 2.60 2.92
2.40
A
SHIELD SOLDER PAD 1.25 NOTES: 1. RECOMMENDED SOLDER STENCIL TO BE 5 TO 6 MILS THICK. 2. LETTER 'A' INDICATES LOCATION OF SHIELD SOLDERED GROUNDING PAD.
Figure 3.
6
Truth Table
Inputs TXD VIH VIL VIL VIL EI X EIH EIH
[1] [2]
IE (LED) High (On) Low (Off) Low (Off) Low (Off)
Outputs RXD-A NV Low[3] NV High
RXD-B NV NV Low[3] High
EIL
X = Don't care; NV = Not Valid Notes: 1. In-Band EI 115.2 Kb/s. 2. In-Band EI 1.15 Mb/s. 3. Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity.
Absolute Maximum Ratings[4]
Parameter Storage Temperature Operating Temperature Average LED Current Average LED Current Repetitive Pulsed LED Current Peak LED Current LED Anode Voltage Supply Voltage Transmitter Data Input Current Receiver Data Output Voltage Symbol TS TA ILED(DC1) ILED(DC2) ILED(RP) ILED(PK) VLEDA VCC ITXD(DC) VRXD-A VRXD-B -0.5 0 -12 -0.5 -0.5 350[5] Min. -20 0 Max. 85 70 100 165 660[5] 750 7 7 12 VCC + 0.5 VCC + 0.5 Units C C mA mA mA mA V V mA V V 90 ms Pulse Width, 25% Duty Cycle 90 ms Pulse Width, 25% Duty Cycle 2 ms Pulse Width, 10% Duty Cycle Conditions
Notes: 4. For implementations where case to ambient thermal resistance 50C/W. 5. See the thermal derating curves on pages 10 and 11 for maximum operating conditions in order to maintain T junction <125C. Note: Performance is guaranteed in the operating temperature range of 0C to 70C. The information provided outside of this range is for reference only.
7
Recommended Operating Conditions
Parameter Operating Temperature Supply Voltage Logic High Transmitter Input Voltage Logic Low Transmitter Input Voltage Logic High Receiver Input Irradiance Logic Low Receiver Input Irradiance LED (Logic High) Current Pulse Amplitude Receiver Setup Time Receiver Signal Rate RXD-A Receiver Signal Rate RXD-B Ambient Light 2.4 0.58 Symbol TA VCC VIH(TXD) VIL(TXD) EIH EIL ILEDA 400 Min. 0 4.75 4.25 0 0.0036 0.0090 Max. 70 5.25 5.25 0.3 500 500 0.3 560 1 115 4 Units C V V V mW/cm2 mW/cm2 W/cm2 mA ms Kb/s Mb/s See IrDA Serial Infrared Physical Layer Link Specification, Appendix A for ambient levels.
[2]
Conditions
[2]
For in-band signals 116 kb/s[1] For in-band signals 1.0 Mb/s[1] For in-band signals[1]
[3]
For full sensitivity after transmitting
Notes: 1. An in-band optical signal is a pulse/sequence where the peak wavelength, p, is defined as 850 nm p 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 2. With R1, CX2 Input network and where tr (VI) and tf (VI) 5 ns. See Application Circuit for component values. The driver gate for this input should be able to source and sink 6 mA(DC) and 50 mA(pk). TXD refers to the node on the driver gate side of R1, CX2 on application circuit. 3. See the thermal derating curves on pages X and Y for maximum operating conditions in order to maintain T junction < 125C.
8
Electrical and Optical Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worst case values for the parameters under test. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25C and 5 V unless otherwise noted. Parameter Receiver Data Output Voltage Logic Low Symbol VOL (RXD-A)[2] Min. Typ. Max. 0.5 Unit V Conditions IO(RXD-A)=1.0 mA. For in-band EI 3.6 W/cm2, 1/2 15 IO(RXD-B)=1.0 mA. For in-band EI 9.0 W/cm2, 1/2 15 IOH(RXD-A)=-20 A. For in-band EI 0.3 W/cm2 IOH(RXD-B)=-20 A. For in-band EI 0.3 W/cm2
Logic Low
VOL(RXD-B)[2]
0.5
V
Logic High Logic High
VOH(RXD-A) VOH(RXD-B)
VCC - 0.6 VCC - 1.2 30 0.1 100 177 500
V V degrees cm2 mW/SR
Viewing Angle 21/2 Effective Detector Area Transmitter Radiant Intensity Logic High Intensity Peak Wavelength Spectral Line Half Width Transmitter Data Input Current LED Anode On State Voltage LED Anode Off State Leakage Supply Current Idle Active Receiver Receiver Peak Sensitivity Wavelength Logic Low EIH
VIH(TXD)=4.25 V[1], ILEDA=400 mA, TA=25C, 1/2 15
p 1/2 30 -2
875 35 60 2
nm nm degrees A Gnd VIL(TXD) 0.3 V[1] VIH(TXD)=4.25 V[1] ILEDA=400 mA, 25C VIH(TXD)=4.25 V[1] VLEDA=VCC=5.25 V, VIL(TXD)=0.3 V[1] VCC=5.25 V, VI(TXD)=VIL, EI=0 VCC=5.25 V, VI(TXD)=VIL EI 500 mW/cm2
Viewing Angle 21/2 IL(TXD)
Logic High
IH(TXD) VON(LEDA) ILK (LEDA) ICC1 ICC2
5.4
6.6 2.78 250 3 4 5.1 22
mA V A mA mA
p
880
nm
Notes: 1. With R1, CX2 input network. See Application Circuit for component values. TXD refers to driver gate of R1, CX2 on application circuit. 2. Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity.
9
Switching Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worst case values for the parameters under test. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25C and 5 V unless otherwise noted. Parameter Transmitter Radiant Intensity Pulse Width Symbol tpw (IE) Min. 1.5 115 Transmitter Radiant Intensity Rise and Fall Times RXD-A Pulse Width RXD-B Pulse Width RXD-B Pulse Width (ASK) Receiver Latency Time tL(RXD-B) tL(RXD-A) tr(IE), tf(IE) tpw (RXD-A) tpw (RXD-B) 1 75 0.7 1 0.5 Typ. 1.6 125 Max. 1.8 135 40 Unit s ns ns Conditions tpw (TXD)=1.6 s at 115.2 K pulses/second tpw (TXD)=125 ns at 2.0 M pulses/second tpw (TXD)=125 ns at 2.0 M pulses/second
[1] [2] [3]
7.5 175 1.3 1
s ns s ms
1/2 15 1/2 15
500 kHz/50% duty cycle carrier ASK
[1][2]
Notes: 1. For In-Band signals 115.2 Kb/s where 3.6 W/cm2 EIL 500 mW/cm2. 2. For In-Band signals, 125 ns PW, 4 Mb/s, 4 PPM where 9.0 W/cm2 EI 500 mW/cm2. 3. Pulse width specified is the pulse width of the second 500 kHz carrier pulse received in a data bit. The first 500 kHz carrier pulse may exceed 2 s in width, which will not affect correct demodulation of the data stream. An ASK and DASK system using the HSDL-2100 has been shown to correctly receive all data bits for 9 W/cm2 Reflow Profile
Figure 4 in page 10 is a straight line representation of a nominal temperature profile for a convective IR reflow solder process. The temperature profile is divided into four process zones with four T/time temperature change rates. The T/time temperature change rates are detailed in Table below Figure 4. The temperatures are measured at the component to printed-circuit (pc) board connections. In process zone P1, the pc board and SMT HSDL-2100 castellation I/O pins joints are heated to a temperature of 125C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3 per second to allow for even heating of both the pc board and the SMT HSDL-2100 castellation I/O pins joints. Process zone P2 should be of sufficient time duration to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 170C (338F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 230C (446F) for optimum results. The dwell time above the liquidus point of solder should be between 15 and 90 seconds. It usually takes about 15 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 90 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 170C (338F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed -3C (-5.4F) per second maximum. This limitation is necessary to allow the pc board and SMT HSDL-2100 castellation I/O pins joints to change dimensions evenly, putting minimal stresses on the SMT HSDL-2100 transceiver packages.
10
The Temperature Profile for a Nominal Convective IR Reflow Solder Process See the Table below for Temperature (RX) Values.
230
T - TEMPERATURE - (C)
R3
R4
200 183 170 150 125 100 R1 50 25 0 15 30 45 60
R2
90 sec. MAX. ABOVE 183C R5
75
90
105 120 135 150 165 180 195 210 P3 SOLDER REFLOW P4 COOL DOWN
t-TIME (SECONDS) P1 HEAT UP P2 SOLDER PASTE DRY
Figure 4.
TABLE FOR CONVECTIVE PROCESS ZONES, SEE FIGURE 4. PROCESS ZONE HEAT UP SOLDER PASTE DRY SOLDER REFLOW COOL DOWN SYMBOL P1, R1 P2, R2 P3, R3 R4 P4, R5 T 25C TO 125C 125C TO 170C 170C TO 230C (235C MAX.) 230C TO 170C 170C TO 25C T/TIME 3C/s MAX. 0.5C/s MAX. 4C/s TYP. -4C/s TYP. -3C/s MAX.
Thermal Derating Curves
These 2 graphs show maximum allowable LED drive current as a function of ambient temperature and the designer's PCB-to-ambient thermal resistance.
MAXIMUM AMBIENT TEMPERATURE (C)
100
MAXIMUM DRIVE CURRENT (A)
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 100 120
80 60 40 20 0 -20 THbd-amb = 50 C/W THbd-amb = 100 C/W THbd-amb = 150 C/W THbd-amb = 200 C/W THbd-amb = 250 C/W THbd-amb = 300 C/W
0
0.2
0.4
0.6
0.8
LED DRIVE CURRENT (A)
CASE TEMPERATURE (C)
JUNCTION TO CASE MEASUREMENTS FOR HSDL-2100 IF (A) 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 MAX. CASE TEMPERATURE (C) 101.3 98.4 95.3 92.1 88.7 85.2 81.6 77.9
11
Tape and Reel Dimensions
1.50 0.10 16.00 0.10 1.75 0.10 4.00 0.10 2.00 0.10
11.50 0.10 24.00 0.20
LENS FACING DIRECTION
4.88 0.10
4 MAX. 8 MAX.
7.05 0.10
8.56 0.10
13.16 0.10
Figure 5.
Reel for 24 mm Tape
REEL FOR 24 mm TAPE 30.4 MAX. MEASURED AT HUB
24.4 + 2.00 0 MEASURED AT HUB
1.5 MIN. 330 MAX. 20.2 MIN. 100.0 0.50 HUB DIAMETER (SCROLL START) 1.30 0.20
DIMENSIONS IN MILLIMETERS
27.40 MEASURED AT 23.90 OUTER EDGE
Figure 6.
12
Appendix A.
Test Methods A.1. Background Light and Electromagnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (refer to IEC 801-3, severity level 3 for details). 2. Sunlight: 10 kilolux maximum at the optical port. This is simulated with an IR source having a peak wavelength within the range 850 nm to 900 nm and a spectral width less than 50 nm biased to provide 490 W/cm2 (with no modulation) at the optical port. The light source faces the optical port. This simulates sunlight within the IrDA spectral range. The effect of longer wavelength radiation
is covered by the incandescent condition. 3. Incandescent Lighting: 1000 lux maximum. This is produced with general service, tungsten-filament, gasfilled, inside-frosted lamps in the 60 Watt to 150 Watt range to generate 1000 lux over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The source is expected to have a filament temperature in the 2700 to 3050 degrees Kelvin range and a spectral peak in the 850 nm to 1050 nm range. 4. Fluorescent Lighting: 1000 lux maximum. This is simulated with an IR source having a peak wavelength within the range 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave signal (0 W/cm2 minimum and 0.3 W/cm2 peak amplitude with 10% to 90% rise
and fall times less than or equal to 100 ns) over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The frequency of the optical signal is swept over the frequency range from 20 kHz to 200 kHz. Due to the variety of fluorescent lamps and the range of IR emissions, this condition is not expected to cover all circumstances. It will provide a common floor for IrDA operation. All HP IR transceivers are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1. AEL Class 1 LED devices are considered eye safe. See Hewlett-Packard Application Note 1094 for more information.
13
Appendix B. SMT Assembly Methods
1.0 Solder Pad, Mask and Metal Solder Stencil Adapter
METAL STENCIL FOR SOLDER PASTE PRINTING
STENCIL APERTURE
LAND PATTERN
SOLDER MASK PCB
Figure 1.0. Stencil and PCB.
1.1. Recommended Land Pattern for HSDL-2100 Dim. a b c (pitch) d e f g mm 2.6 0.7 1.14 2.4 1.25 4.22 5.05 Inches 0.1 0.03 0.05 0.09 0.05 0.17 0.2
SHIELD SOLDER PAD e Rx LENS Tx LENS
d
g
b Y
c f
a theta
10x PAD
Figure 2.0. Top View of Land Pattern.
14
1.2. Adjacent Land Keepout and Solder Mask Areas
Dim. g h k j mm min. 0.15 13.4 7.2 2.1 Inches min. 0.006 0.53 0.28 0.08 * "g" is the minimum solder resist strip width required to avoid solder bridging adjacent pads. Note: Wet/Liquid PhotoImageable solder resist/mask is recommended.
* Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area.
h
Rx LENS
Tx LENS
DIM. g h k j
mm MIN. 0.15 13.4 7.2 2.1
INCHES MIN. 0.006 0.53 0.28 0.08
LAND
g
SOLDER MASK
k
* ADJACENT LAND KEEP-OUT IS THE MAXIMUM SPACE OCCUPIED BY THE UNIT RELATIVE TO THE LAND PATTERN. THERE SHOULD BE NO OTHER SMD COMPONENTS WITHIN THIS AREA. * "g" IS THE MINIMUM SOLDER RESIST STRIP WIDTH REQUIRED TO AVOID SOLDER BRIDGING ADJACENT PADS. NOTE: WET/LIQUID PHOTO-IMAGEABLE SOLDER RESIST/MASK IS RECOMMENDED.
j
Figure 3.0. PCBA -- Adjacent Land Keep-out and Solder Mask.
15
2.0. Recommended Solder Paste/Cream Volume for Castellation Joints. The printed solder paste volume required per castellation pad is
0.36 cubic mm 15% (based on either on-clean or aqueous solder cream types with typically 60 to 65% solid content by volume).
2.1. Recommended Metal Solder Stencil Aperture. To ensure adequate printed solder paste volume, the following combination of metal stencil aperture and metal stencil thickness should be used:
See Figure 4.0 t, nominal stencil thickness mm inches 0.127 0.152 0.203 0.005 0.006 0.008 l, length of aperture mm inches 3.8 0.1 3.4 0.1 2.7 0.1 0.150 0.004 0.134 0.004 0.106 0.004
w, the width of aperture is fixed at 0.7 mm (0.028 inches)
APERTURE AS PER LAND DIMENSIONS
t (STENCIL THICKNESS)
SOLDER PASTE METAL STENCIL
w l
Figure 4.0. Solder Paste Stencil/Aperture.
3.0. Pick and Place Misalignment Tolerance and Product Self-Alignment after Solder Reflow
If the printed solder paste volume is adequate, the HSDL-2100 will self align after solder reflow. Units should be properly
reflowed in IR-Hot Air convection oven using the recommended reflow profile. The direction of board travel does not matter.
Allowable Misalignment Tolerance X - Direction Theta - Direction < = 0.2 mm (0.008 inches) 3 degrees
3.1. Tolerance for X-axis Alignment of Castellation. Misalignment of castellation to the land pad should not exceed 0.2 mm or approximately half the width of the castellation during placement of the unit. The castellations will completely selfalign to the pads during the solder reflow.
3.2. Tolerance for Rotational (Theta) Misalignment. Units when mounted should not be rotated more than 3 degrees with reference to center X-Y as specified in Figure 2.0. Units with a Theta misalignment of more than 3 degrees does not completely self-align after reflow. Units with 3 degrees rotational or Theta misalignment self-aligns completely after solder reflow.
3.3. Y-axis Misalignment of Castellation. In the Y direction, the unit does not self align after solder reflow. This should not be an issue as the length of the pad (2.6 mm) is sufficient for a misplacement accuracy of 0.2 mm from center of Y-axis as shown in Figure 5.0 below. There is still more than sufficient space for a proper strong solder fillet to be fully formed on both sides of the castellation joints.
X
Y 0.2 0.2 CENTER OF Y AXIS
Figure 5.0 Section of a castellation in Y-axis
www.hp.com/go/ir For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright (c) 1998 Hewlett-Packard Co. Obsoletes 5966-1639E (1/98) Printed in U.S.A. 5966-3834E (1/98)

▲Up To Search▲

Price & Availability of HSDL-2100

	To Download HSDL-2100 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .