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SUMMIT
MICROELECTRONICS, Inc.
S93662/S93663
Precision Supply-Voltage Monitor and Reset Controller
FEATURES * Precision Monitor & RESET Controller -- RESET and RESET Outputs -- Guaranteed RESET Assertion to VCC = 1V -- 200ms Reset Pulse Width -- Internal 1.26V Reference with 1% Accuracy -- ZERO External Components Required * Memory -- 4K-bit Microwire Memory -- S93662 - Internally Ties ORG Low - 100% Compatible With all 8-bit Implementations - Sixteen Byte Page Write Capability -- S93663 - Internally Ties ORG High - 100% Compatible With all 16-bit Implementations - Eight Word Page Write Capability
OVERVIEW The S93662 and S93663 are precision power supervisory circuits providing both active high and active low reset outputs. Both devices have 4k-bits of E2PROM memory that is accessible via the industry standard microwire bus. The S93662 is configured with an internal ORG pin tied low providing a 8-bit byte organization and the S93663 is configured with an internal ORG pin tied high providing a 16-bit word organization. Both the S93662 and S93663 have page write capability. The devices are designed for a minimum 100,000 program/erase cycles and have data retention in excess of 100 years.
BLOCK DIAGRAM
VCC 8
5kHz OSCILLATOR
RESET PULSE GENERATOR
6
RESET#
+ -
VTRIP
RESET CONTROL 7 RESET
CS
1
1.26V
SK DI
2 3
MODE DECODE
ADDRESS DECODER
WRITE CONTROL
DATA I/O DO 4 5 GND
E2PROM MEMORY ARRAY
2012 T BD 2.0
SUMMIT MICROELECTRONICS, Inc.
*
300 Orchard City Drive, Suite 131
*
Campbell, CA 95008
*
Telephone 408-378-6461
*
Fax 408-378-6586
*
www.summitmicro.com
(c) SUMMIT MICROELECTRONICS, Inc. 2000 2012 2.0 4/18/00
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Characteristics subject to change without notice
S93662/S93663
PIN CONFIGURATION
ing VTRIP. The reset outputs will be valid so long as VCC is 1.0V. During power-down, the reset outputs will begin driving active when VCC falls below VTRIP. The reset pins are I/Os; therefore, the S93662/663 can act as a stabilization circuit for an externally applied reset. The inputs are edge triggered; that is, the RESET input will initiate a reset time-out after detecting a low to high transition and the RESET# input will initiate a reset time-out after detecting a high to low transition. Refer to the applications Information section for more details on device operation as a debounce/reset extender circuit. It should be noted the reset outputs are open drain. When used as outputs driving a circuit they need to be either tied high (RESET#) or tied to ground (RESET) through the use of pull-up or pull-down resistors. Refer to the applications aid section for help in determining the value of resistor to be used. Internally these pins are weakly pulled up (RESET#) and pulled down (RESET): therefore, if the signals are not being used the pins may be left unconnected. GENERAL OPERATION The S93662/663 is a 4096-bit nonvolatile memory intended for use with industry standard microprocessors. The S93663 is organized as X16, seven 11-bit instructions control the reading, writing and erase operations of the device. The S93662 is organized as X8, seven 12bit instructions control the reading, writing and erase operations of the device. The device operates on a single 3V or 5V supply and will generate on chip, the high voltage required during any write operation. Instructions, addresses, and write data are clocked into the DI pin on the rising edge of the clock (SK). The DO pin is normally in a high impedance state except when reading data from the device, or when checking the ready/busy status after a write operation. The ready/busy status can be determined after the start of a write operation by selecting the device (CS high) and polling the DO pin; DO low indicates that the write operation is not completed, while DO high indicates that the device is ready for the next instruction. See the Applications Aid section for detailed use of the ready busy status. The format for all instructions is: one start bit; two op code bits and either eight (x16) or nine (x8) address or instruction bits.
8-Pin PDIP or 8-Pin SOIC
CS SK DI DO
1 2 3 4
8 7 6 5
VCC RESET RESET# GND
2012 T PCon 2.0
PIN FUNCTIONS
Pin Name CS SK DI DO VCC GND RESET/RESET# Function Chip Select Clock Input Serial Data Input Serial Data Output +2.7 to 6.0V Power Supply Ground RESET I/O
DEVICE OPERATION
APPLICATIONS The S93662/663 is ideal for applications requiring low voltage and low power consumption. This device provides microcontroller RESET control and can be manually resettable. RESET CONTROLLER DESCRIPTION The S93662/663 provides a precision reset controller that ensures correct system operation during brownout and power-up/-down conditions. It is configured with two open drain reset outputs; pin 7 is an active high output and pin 6 is an active low output. During power-up, the reset outputs remain active until VCC reaches the VTRIP threshold. The outputs will continue to be driven for approximately 200ms after reach-
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S93662/S93663
Read Upon receiving a READ command and an address (clocked into the DI pin), the DO pin of the S93662/663 will come out of the high impedance state and, will first output an initial dummy zero bit, then begin shifting out the data addressed (MSB first). The output data bits will toggle on the rising edge of the SK clock and are stable after the specified time delay (tPD0 or tPD1). Write After receiving a WRITE command, address and the data, the CS (Chip Select) pin must be deselected for a minimum of 250ns (tCSMIN). The falling edge of CS will start automatic erase and write cycle to the memory location specified in the instruction. The ready/busy status of the S93662/663 can be determined by selecting the device and polling the DO pin. Erase Upon receiving an ERASE command and address, the CS (Chip Select) pin must be deselected for a minimum of 250ns (tCSMIN). The falling edge of CS will start the auto erase cycle of the selected memory location. The ready/busy status of the S93662/663 can be determined by selecting the device and polling the DO pin. Once cleared, the content of a cleared location returns to a logical "1" state. Erase/Write Enable and Disable The S93662/663 powers up in the write disable state. Any writing after power-up or after an EWDS (write disable) instruction must first be preceded by the EWEN (write enable) instruction. Once the write instruction is enabled, it will remain enabled until power to the device is removed, or the EWDS instruction is sent. The EWDS instruction can be used to disable all S93662/663 write and clear instructions, and will prevent any accidental
tSKHI SK t DIS DI t CSS CS VALID
t SKLOW
t CSH
t DIH VALID
t DIS DO
t PD0,t PD1 DATA V ALID
tCSMIN
Figure 1. Sychronous Data Timing
2012 ILL 3 1.0
SK tCS CS STANDBY AN DI 1 1 0 tHZ 0 DN DN-1 D1 D0
2012 ILL4 1.0
AN-1
A0
DO
HIGH-Z
tPD0
HIGH-Z
Figure 2. Read Instruction Timing
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S93662/S93663
writing or clearing of the device. Data can be read normally from the device regardless of the write enable/ disable status. Erase All Upon receiving an ERAL command, the CS (Chip Select) pin must be deselected for a minimum of 250ns (tCSMIN). The falling edge of CS will start the self clocking clear cycle of all memory locations in the device. The clocking of the SK pin is not necessary after the device has entered the self clocking mode. The ready/busy status of the S93662/663 can be determined by selecting the device and polling the DO pin. Once cleared, the contents of all memory bits return to a logical "1" state. Write All Upon receiving a WRAL command and data, the CS (Chip Select) pin must be deselected for a minimum of 250ns (tCSMIN). The falling edge of CS will start the self clocking data write to all memory locations in the device. The clocking of the SK pin is not necessary after the device has entered the self clocking mode. The ready/ busy status of the S93662/663 can be determined by selecting the device and polling the DO pin. It is not necessary for all memory locations to be cleared before the WRAL command is executed.
Page Write 93662 - Assume WEN has been issued. The host will then take CS high, and begin clocking in the start bit, write command and 9-bit byte address immediately followed by the first byte of data to be written. The host can then continue clocking in 8-bit bytes of data with each byte to be written to the next higher address. Internally the address pointer is incremented after receiving each group of eight clocks; however, once the address counter reaches x xxxx 1111 it will roll over to x xxxx 0000 with the next clock. After the last bit is clocked in no internal write operation will occur until CS is brought low. 93663 - Assume WEN has been issued. The host will then take CS high, and begin clocking in the start bit, write command and 8-bit byte address immediately followed by the first 16-bit word of data to be written. The host can then continue clocking in 16-bit words of data with each word to be written to the next higher
address. Internally the address pointer is incremented after receiving each group of sixteen clocks; however, once the address counter reaches xxxx x111 it will roll over to xxxx x000 with the next clock. After the last bit is clocked in no internal write operation will occur until CS is brought low. Continuous Read This begins just like a standard read with the host issuing a read instruction and clocking out the data byte [word]. If the host then keeps CS high and continues generating clocks on SK, the S93662/663 will output data from the next higher address location. The S93662/663 will continue incrementing the address and outputting data so long as CS stays high. If the highest address is reached, the address counter will roll over to address 0000. . CS going low will reset the instruction register and any subsequent read must be initiated in the normal manner of issuing the command and address.
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S93662/S93663
SK tCS CS AN DI 1 0 1 tSV DO HIGH-Z tEW
2012 ILL 5 1.0
STATUS VERIFY AN-1 A0 DN D0
STANDBY
BUSY READY
tHZ HIGH-Z
Figure 3. Write Instruction Timing
SK
CS AN DI 1 1 1 tSV HIGH-Z DO AN-1 A0
STATUS VERIFY tCS
STANDBY
tHZ BUSY tEW
2012 ILL6 1.0
READY HIGH-Z
Figure 4. Erase Instruction Timing
SK
CS
STANDBY
DI
1
0
0
* 1
2012 ILL 7 1.0
* ENABLE=1 DISABLE=00
Figure 5. EWEN/EWDS Instruction Timing
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SK
CS
STATUS VERIFY t CS
STANDBY
DI
1
0
0
1
0 t SV t HZ BUSY t EW
2012 ILL 8 1.0
DO
HIGH-Z
READY HIGH-Z
Figure 6. ERAL Instruction Timing
SK
CS
STATUS VERIFY t CS
STANDBY
DI
1
0
0
0
1
DN
DO t SV t HZ BUSY t EW READY HIGH-Z
DO
Figure 7. WRAL Instruction Timing
2012 ILL 10 1.0
INSTRUCTION SET Instruction READ ERASE WRITE EWEN EWDS ERAL WRAL Start Bit 1 1 1 1 1 1 1 Opcode 10 11 01 00 00 00 00 Address x8 x16 A8-A0 A8-A0 A8-A0 A7-A0 A7-A0 A7-A0 D7-D0 D15-D0 Data x8 Comments x16 Read Address AN-A0 Clear Address AN-A0 Write Address AN-A0 Write Enable Write Disable Clear All Addresses D7-D0 D15-D0 Write All Addresses
2012 PGM T5 1.1
11xxx xxxx 11xxx xxx 00xxx xxxx 00xxx xxx 10xxx xxxx 10xxx xxx 01xxx xxxx 01xxx xxx
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S93662/S93663
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias .................................................................................................................................... -55C to +125C Storage Temperature ......................................................................................................................................... -65C to +150C Voltage on any Pin with Respect to Ground(1) ............................................................................................ -2.0V to +VCC +2.0V VCC with Respect to Ground .................................................................................................................................. -2.0V to +7.0V Package Power Dissipation Capability (Ta = 25C) ............................................................................................................. 1.0W Lead Soldering Temperature (10 seconds) ........................................................................................................................ 300C Output Short Circuit Current(2) ........................................................................................................................................... 100mA
*COMMENT
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
RECOMMENDED OPERATING CONDITIONS
Temperature Commercial Industrial Min 0C -40C Max +70C +85C
2012 PGM T7 1.0
RELIABILITY CHARACTERISTICS Symbol NEND(3) TDR(3) VZAP(3) ILTH(3)(4) Parameter Endurance Data Retention ESD Susceptibility Latch-Up Min. 100,000 100 2000 100 Max. Units Cycles/Byte Years Volts mA Reference Test Method MIL-STD-883, Test Method 1033 MIL-STD-883, Test Method 1008 MIL-STD-883, Test Method 3015 JEDEC Standard 17
2012 PGM T2 1.1
D.C. OPERATING CHARACTERISTICS (over recommended operating conditions unless otherwise specified) Limits Symbol ICC Parameter Power Supply Current (Operating) Power Supply Current (Standby) Input Leakage Current Output Leakage Current (Including ORG pin) Input Low Voltage Input High Voltage Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Output Low Voltage Output High Voltage -0.1 2 0 VCC x 0.7 2.4 0.2 VCC-0.2 Min. Typ. Max. 3 Units mA Test Conditions DI = 0.0V, fSK = 1MHz VCC = 5.0V, CS = 5.0V, Output Open CS = 0V Reset Outputs Open VIN = 0V to VCC VOUT = 0V to VCC, CS = 0V 4.5V-VCC<5.5V 1.8V-VCC<2.7V 4.5V-VCC<5.5V IOL = 2.1mA IOH = -400A 1.8V-VCC<2.7V IOL = 1mA IOH = -100A
2012 PGM T3 1.1
ISB ILI ILO VIL1 VIH1 VIL2 VIH2 VOL1 VOH1 VOL2 VOH2
50 2 10 0.8 VCC+1 VCC x 0.2 VCC+1 0.4
A A A V V V V V V V V
Note: (1) The minimum DC input voltage is -0.5V. During transitions, inputs may undershoot to -2.0V for periods of less than 20ns. Maximum DC voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20ns. (2) Output shorted for no more than one second. No more than one output shorted at a time. (3) This parameter is tested initially and after a design or process change that affects the parameter. (4) Latch-up protection is provided for stresses up to 100mA on address and data pins from -1V to VCC +1V.
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PIN CAPACITANCE Symbol COUT
(1)
Test OUTPUT CAPACITANCE (DO) INPUT CAPACITANCE (CS, SK, DI, ORG)
Max. 5 5
Units pF pF
Conditions VOUT=OV VIN=OV
2012 PGM T4 1.0
CIN(1)
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter.
A.C. CHARACTERISTICS (over recommended operating conditions unless otherwise specified) Limits VCC=2.7V-4.5V VCC=4.5V-5.5V SYMBOL PARAMETER tCSS tCSH tDIS tDIH tPD1 tPD0 tHZ(1) tEW tCSMIN tSKHI tSKLOW tSV SKMAX CS Setup Time CS Hold Time DI Setup Time DI Hold Time Output Delay to 1 Output Delay to 0 Output Delay to High-Z Program/Erase Pulse Width Minimum CS Low Time Minimum SK High Time Minimum SK Low Time Output Delay to Status Valid Maximum Clock Frequency DC 0.5 0.5 0.5 0.5 500 DC Min. 100 0 200 200 0.5 0.5 200 10 0.25 0.25 0.25 0.25 1000 Max. Min. 50 0 100 100 0.25 0.25 100 10 ns ns ns ns s s ns ms s s s s KHZ
2012 PGM T6 1.0
Test
Max. UNITS Conditions
VIL = 0.45V VIH = 2.4V CL = 100pF VOL = 0.8V VOH = 2.0v CL = 100pF
CL = 100pF
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter.
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S93662/S93663
RESET CIRCUIT AC and DC ELECTRICAL CHARACTERISTICS
2.7 Symbol VTRIP tPURST tRPD VRVALID tGLITCH VOLRS VOHRS Reset Trip Point Power-Up Reset Timeout VTRIP to RESET Output Delay RESET# Output Valid Glitch Reject Pulse Width RESET# Output Low Voltage IOL=1mA RESET Output High IOH VCC-.75 1 30 0.4 VCC-.75 Parameter Min 2.55 130 Max 2.7 270 5 1 30 0.4 VCC-.75 5 Volt-A Min 4.25 130 Max 4.5 270 5 1 30 0.4 5 Volt-B Min 4.50 130 Max 4.75 270 5 Unit V ms s V ns V V
2012 PGM T1 1.1
tGLITCH
VTRIP VRVALID
tRPD tPURST tPURST
VCC
RESET#
tRPD
RESET
2012 T fig08 2.0
Figure 8. RESET Timing Diagram
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S93662/S93663
8 Pin SOIC (Type S) Package JEDEC (150 mil body width)
.050 (1.27) TYP. .050 (1.270) TYP. 8 Places
.157 (4.00) .150 (3.80)
.275 (6.99) TYP.
1 .196 (5.00) .189 (4.80)
.030 (.762) TYP. 8 Places
FOOTPRINT
.061 (1.75) .053 (1.35) .020 (.50) x45 .010 (.25)
.0192 (.49) .0138 (.35)
.0098 (.25) .004 (.127) .05 (1.27) TYP.
.035 (.90) .016 (.40)
.244 (6.20) .228 (5.80)
8pn JEDEC SOIC ILL.2
8 Pin PDIP (Type P) Package
.375 (9.525)
PIN 1 INDICATOR
.250 (6.350) .300 (7.620)
.070 (1.778) .0375 (0.952) .015 (.381) Min. SEATING PLANE .130 (3.302) .060 .005 (1.524) .127 TYP. .100 (2.54) TYP. .130 (3.302) .018 (.457) TYP.
5-7TYP. (4 PLCS) 0-15
.350 (8.89)
.009 .002 (.229 .051)
8pn PDIP/P ILL.3
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S93662/S93663
Frequently the reset controller will be deployed on a PC board that provides a peripheral function to a system. Examples might be modem or network cards in a PC or a PCMCIA card in a laptop. In instances like this the peripheral card may have a requirement for a clean reset function to insure proper operation. The system may or may not provide a reset pulse of sufficient duration to clear the peripheral or to protect data stored in a nonvolatile memory. The I/O capability of the RESET pins can provide a solution. The system's reset signal to the peripheral can be fed into the S93662/663 and it in turn can clean up the signal and provide a known entity to the peripheral's circuits. The figure below shows the basic timing characteristics under the assumption the reset input is shorter in duration than tPURST. The same reset output affect can be attained by using the active high reset input.
RESET# Input RESET# Output
RESET Output
t PURST
2012 T fig09 2.0
When planning your resistor pull-up and pull-down values, use the following chart to help determine min. resistances. Worst Case RESET Sink/Source Capabilities at Various VCC Levels Parameter RESET# Output Voltage Symbol VOL Condition
VCC = 1.0V, IOL=100A VCC = 1.2V, IOL=100A VCC = 3.0V, IOL=500A VCC = 3.6V, IOL=500A VCC = 4.5V, IOL=750A VCC = 1.0V, IOL=100A
Min
Typ
Max
0.3 0.3 0.3 0.3 0.3 0.4 0.4 0.4 0.4 0.4
Units
V V V V V V V V V V V V V V V
2012 PGM T5 1.0
RESET# Output Voltage
VOL
VCC = 1.2V, IOL=150A VCC = 3.0V, IOL=750A VCC = 3.6V, IOL=1mA VCC = 4.5V, IOL=1mA VCC = 1.0V, IOH=400A VCC-0.75 VCC-0.75 VCC-0.5 VCC-0.5 VCC-0.5
RESET Output Voltage
VOH
VCC = 1.2V, IOH=800A VCC = 3.0V, IOH=800A VCC = 3.6V, IOH=800A VCC = 4.5V, IOH=800A
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Ready/Busy Status During the internal write operation the S93662/663 memory array is inaccessible. After starting the write operation (taking CS low) the host can implement a 10ms time-out routine or alternatively it can employ a polling routine that tests the state of the DO pin. After starting the write, testing for the status is easily accomplished by taking CS high and testing the state of DO. If it is low the device is still busy with the internal write. If it is high the write operation has completed. For the polling routine the host has the option of toggling CS for each test of DO, or it can place CS high and then intermittently test DO. SK is not required for any of these operations. Once the device is ready, it will continue to drive DO high whenever the S93662/663 is selected. The ready state of DO can be cleared by clocking in a start bit; this start bit can either be the beginning of a new command sequence or it can be a dummy start bit with CS returning low before the host issues a new command.
SK
CS STATUS VERIFY t CS DI t SV DO t EW BUSY READY HIGH-Z t HZ HIGH-Z STATUS CLEARED
2012 ILL 13 1.0
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S93662/S93663
ORDERING INFORMATION
S93662 Base Part Number S93662 = 8-bit configuration S93663 = 16-bit configuration Package P = 8 lead PDIP S = 8 lead 150mil SOIC
P
A
T Tape & Reel Option Blank = Tube T = Tape & Reel Operating Voltage Range A = 4.5V to 5.5V VTRIP min. @ 4.25V B = 4.5V to 5.5V VTRIP min. @ 4.50V 2.7 = 2.7V to 5.5V VTRIP min. @ 2.55V
2012 Tree 2.0
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S93662/S93663
NOTICE SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained herein reflect representative operating parameters, and may vary depending upon a user's specific application. While the information in this publication has been carefully checked, SUMMIT Microelectronics, Inc. shall not be liable for any damages arising as a result of any error or omission. SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of SUMMIT Microelectronics, Inc. is adequately protected under the circumstances. (c) Copyright 2000 SUMMIT Microelectronics, Inc.
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