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Advanced Product Information 1.1
FMS2021
DC- 6 GHz SPDT WLAN GaAs Low Loss Switch
Features:
Suitable for Multi-band WLAN Applications Excellent low control voltage performance Very low Insertion loss <0.7 dB at 6GHz typical High isolation >25 dB at 6GHz typical
V4 ANT1 ANT2
Functional Schematic
V2 TX RX V3
V1
Description and Applications:
The FMS2021 is a low loss, multi-band single pole double throw Gallium Arsenide antenna switch designed for use in Wireless LAN applications. The die is fabricated using the Filtronic FL05 0.5m switch process technology that offers leading edge performance, optimised for switch applications.
Simulated Electrical Specifications:
Parameter
Insertion Loss (All Paths) Isolation (All Paths) Return Loss 2nd Harmonic Level 3rd Harmonic Level Switching speed P1dB
(TAMBIENT = 25C,Vctrl = 0V/(2.4V,+3.3V), ZIN = ZOUT = 50)
Conditions
(0.5-6) GHz, Small Signal (0.5-6) GHz, Small Signal (0.5-6) GHz, Small Signal 3 GHz, Pin = 20dBm, Vctrl =2.4V 3 GHz, Pin = 20dBm, Vctrl =2.4V Vctrl=2.4V, Pin=20dBm Measured at 2.4V control
Min
Typ
0.7 25 20 -70 -70 30 30
Max
Units
dB dB dB dBc dBc ns dBm
Note: External DC blocking capacitors are required on all RF ports (typ: 47pF)
1
Preliminary specifications subject to change without notice Filtronic Compound Semiconductors Ltd Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email: sales@filcsi.com Website: www.filcs.com
Advanced Product Information 1.1
FMS2021
Truth Table:
State
1 2 3 4 5 6
Vctrl1
HIGH LOW LOW LOW LOW HIGH
Vctrl2
LOW HIGH LOW LOW HIGH LOW
Vctrl3
LOW LOW HIGH LOW LOW HIGH
Vctrl4
LOW LOW LOW HIGH HIGH LOW
ON PATH(S)
ANT1-RX ANT2-RX ANT2-TX ANT1-TX ANT1-TX and ANT2-RX ANT1-RX and ANT2-TX
Note:
`High' `Low'
= +2.4V to +3.3V = 0V to +0.2V
Pad and Die Layout:
Pad Name
V4
Description
Vctrl4 Antenna 1 Antenna 2 Vcrtl1 Ground 2 Vctrl3 Receive Transmit Vctrl2 Ground 1
Pin Coordinates
(x m, y m)
134 , 568 134 , 439 134 , 257 134 , 114 355.5 , 114 547 , 114 547 , 257 547 , 439 547 , 568 353 , 568
V4 GND1 ANT1
V2
ANT1
TX
ANT2 V1 GND2
ANT2 GND2 V1
RX
V3 RX TX
V3
V2 GND1
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the bond pad opening Die Size (m x m)
660 x 680
Die Thickness (m)
150
Min. Bond Pad Pitch(m)
129
Min. Bond pad opening (m x m)
80 x 80
2
Preliminary specifications subject to change without notice Filtronic Compound Semiconductors Ltd Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email: sales@filcsi.com Website: www.filcs.com
Advanced Product Information 1.1
FMS2021
Simulated Performance:
Insertion Loss
-0.4 -0.5
Loss(dB)
-0.6 -0.7 -0.8 -0.9 -1 0.5 2.5 4.5 6
Frequency (GHz)
Isolation
-25 -30
Isolation (dB)
-35 -40 -45 -50 0.5 2.5 4.5 6
Frequency (GHz)
Return Loss
-20
-22
S11 (dB)
-24
-26
-28 0.5 2.5 4.5 6
Frequency (GHz)
3
Preliminary specifications subject to change without notice Filtronic Compound Semiconductors Ltd Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email: sales@filcsi.com Website: www.filcs.com
Advanced Product Information 1.1
FMS2021
Preferred Assembly Instructions:
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The back of the die is not metallised and the recommended mounting method is by the use of conductive epoxy. Epoxy should be applied to the attachment surface uniformly and sparingly to avoid encroachment of epoxy on to the top face of the die and ideally should not exceed half the chip height. For automated dispense Ablestick LMISR4 is recommended and for manual dispense Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150C for 1 hour in an oven especially set aside for epoxy curing only. If possible the curing oven should be flushed with dry nitrogen. This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4m diameter gold wire is used. Thermosonic ball bonding is preferred. A nominal stage temperature of 150C and a bonding force of 40g has been shown to give effective results for 25m wire. Ultrasonic energy shall be kept to a minimum. For this bonding technique, stage temperature should not be raised above 200C and bond force should not be raised above 60g. Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve good wire bonds. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires should be minimised especially when making RF or ground connections.
Handling Precautions:
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V) as defined in JEDEC Standard No. 22-A114-B. Further information on ESD control measures can be found in MIL-STD-1686 and MILHDBK-263.
Disclaimers:
This product is not designed for use in any space based or life sustaining/supporting equipment.
4
Preliminary specifications subject to change without notice Filtronic Compound Semiconductors Ltd Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email: sales@filsi.com Website: www.filcs.com

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