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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MRFIC2006/D The MRFIC Line 900 MHz 2 Stage PA The MRFIC2006 is an Integrated PA designed for linear operation in the 800 MHz to 1.0 GHz frequency range. The design utilizes Motorola's advanced MOSAIC 3 silicon bipolar RF process to yield superior performance in a cost effective monolithic device. Applications for the MRFIC2006 include CT-1 and CT-2 cordless telephones, remote controls, video and audio short range links, low cost cellular radios, and ISM band transmitters. * 50 Input and Output Impedance * Typical Gain = 23 dB @ 900 MHz * Bias Current Externally Adjustable * Bias Pin can be used to Ramp or Disable * Class A or AB Linear Operation * Unconditionally Stable * SO-8 Leaded Plastic Package * Order MRFIC2006R2 for Tape and Reel. R2 Suffix = 2,500 Units per 12 mm, 13 inch Reel. * Device Marking = M2006 MRFIC2006 900 MHz 2 STAGE PA SILICON MONOLITHIC INTEGRATED CIRCUIT CASE 751-05 (SO-8) ABSOLUTE MAXIMUM RATINGS (TA = 25C, Zo = 50 unless otherwise noted) Rating Supply Voltages Bias Voltage Total Supply Current RF Output Power (VCC2 < 4.0 V) RF Output Power (4.0 V < VCC2 5.0 V) RF Input Power Operating Ambient Temperature Storage and Junction Temperature Thermal Resistance, Junction to Case Symbol VCC1, VCC2 Vbias ICC1, ICC2 Pout Pout Pin TA Tstg RJC Value 5.0 6.0 100 +21 53 - 8 VCC2 +10 - 35 to + 85 - 65 to +150 63 Unit Vdc Vdc mA dBm dBm dBm C C C/W GND 4 GND 3 GND 2 RF OUT (VCC2) 1 5 RF IN 6 GND 7 VCC1 8 Vbias Pin Connections and Functional Block Diagram REV 2 (c)MOTOROLA RF DEVICE DATA Motorola, Inc. 1997 MRFIC2006 1 RECOMMENDED OPERATING RANGES Parameter Supply Voltage Ranges Bias Voltage Range RF Frequency Range Symbol VCC1, VCC2 Vbias f Value 1.8 to 4.0 0 to 5.0 500 to 1000 Unit Vdc Vdc MHz ELECTRICAL CHARACTERISTICS (VCC1, VCC2, Vbias = 3.0 V, TA = 25C, f = 900 MHz, Zo = 50 unless otherwise noted) Characteristics (1) Supply Current -- Total ICC1 ICC2 I Bias Small Signal Gain Input Return Loss, RF IN Port Output Return Loss, RF OUT Port Reverse Isolation Output Power at 1.0 dB Gain Compression 3rd Order Intercept Point (Out) 5th Order Intercept Point (Out) Min -- -- -- -- 19 -- -- -- +12 -- -- Typ 46 14 29 3.0 23 15 15 35 +15.5 + 25 + 21 Max 55 -- -- -- 26 -- -- -- -- -- -- Unit mA mA mA mA dB dB dB dB dBm dBm dBm NOTE: 1. All electrical characteristics measured in test circuit schematic shown in Figure 1 below. RF IN 50 C1 5 4 6 DUT 7 C3 L1 R1 VCC1 + - Vbias + - C4 8 3 2 C2 1 L2 RF OUT 50 VCC2 + - C5 C1, C2 -- 100 pF Chip Capacitor C3, C5 -- 1.0 nF Chip Capacitor C4 -- 10 nF Chip Capacitor L1 -- 150 nH Chip Inductor L2 -- 10 nH Chip Inductor R1 -- Resistor Optional RF Connectors -- SMA Type Board Material -- Epoxy/Glass r = 4.5, Dielectric Thickness = 0.014 (0.36 mm) Figure 1. Typical Biasing Configuration MRFIC2006 2 MOTOROLA RF DEVICE DATA Table 1. Scattering Parameters for 900 MHz Two - Stage PA (VCC1, VCC2, VBIAS = 3 V, I = 49 mA, TA = 25C, 50 W System) S21 -16.67 -24.53 -33.09 -41.55 -49.79 -58.60 -67.09 -75.32 -83.69 -91.79 -95.35 -98.65 -101.69 -104.40 -106.50 -108.28 -109.85 -111.02 -111.65 -112.24 -112.60 -112.81 -113.50 -114.93 -115.32 -116.04 -116.66 -117.91 -118.87 -120.47 -122.39 -124.03 -126.22 -128.77 -131.41 -133.93 -136.68 -140.85 |S21| 3.785 5.772 7.901 10.065 12.287 14.576 16.834 19.009 20.901 22.237 22.626 22.821 22.834 22.647 22.299 21.813 21.204 20.538 19.824 19.094 18.334 17.594 16.880 16.127 15.438 14.796 14.165 13.555 13.009 12.515 12.004 11.517 11.063 10.634 10.228 9.841 9.479 9.125 51.56 46.52 40.16 32.12 23.06 12.25 1.32 -10.72 -23.88 -37.89 -45.02 -52.22 -59.20 -66.13 -73.01 -79.43 -85.70 -91.62 -97.20 -102.54 -107.76 -112.54 -117.13 -122.44 -126.92 -130.89 -134.57 -138.19 -141.73 -145.08 -148.23 -151.36 -154.40 -157.40 -160.15 -163.04 -165.88 -168.50 |S12| 0.003 0.001 0.001 0.001 0.002 0.002 0.003 0.005 0.005 0.007 0.007 0.010 0.009 0.010 0.011 0.011 0.012 0.012 0.014 0.014 0.014 0.016 0.015 0.017 0.017 0.017 0.018 0.019 0.019 0.019 0.020 0.022 0.022 0.024 0.023 0.023 0.025 0.025 S12 -163.12 15.96 84.34 -165.89 -159.68 171.75 -160.23 -167.93 167.71 159.88 168.37 162.65 159.52 155.15 151.24 148.14 145.35 140.66 136.88 136.98 134.67 133.71 129.16 131.80 126.66 127.06 121.77 122.40 120.80 122.53 119.56 115.24 117.88 112.04 112.42 115.77 110.34 109.94 |S22| 0.461 0.354 0.263 0.208 0.169 0.136 0.113 0.105 0.122 0.157 0.178 0.196 0.216 0.233 0.246 0.258 0.269 0.273 0.280 0.281 0.285 0.284 0.282 0.281 0.279 0.275 0.273 0.269 0.265 0.265 0.259 0.254 0.251 0.248 0.246 0.245 0.241 0.241 f (MHz) 50 100 150 200 250 300 350 400 450 500 525 550 575 600 625 650 675 700 725 750 775 800 825 850 875 900 925 950 975 1000 1025 1050 1075 1100 1125 1150 1175 1200 |S11| 0.739 0.702 0.671 0.649 0.630 0.610 0.592 0.567 0.537 0.495 0.470 0.448 0.421 0.397 0.371 0.349 0.329 0.310 0.293 0.278 0.265 0.252 0.242 0.233 0.224 0.216 0.210 0.203 0.195 0.191 0.186 0.179 0.175 0.168 0.163 0.161 0.155 0.152 S11 S22 -89.23 -117.30 -144.77 -167.08 170.65 145.40 113.52 73.18 33.86 2.30 -10.93 -22.73 -32.62 -42.62 -50.98 -59.21 -66.61 -73.29 -79.97 -85.86 -91.50 -96.72 -102.24 -107.68 -112.88 -117.56 -120.85 -125.53 -129.73 -132.68 -137.22 -140.85 -144.69 -148.25 -151.75 -155.28 -158.69 -161.95 MOTOROLA RF DEVICE DATA MRFIC2006 3 TYPICAL CHARACTERISTICS 28 VCC1, VCC2, Vbias = 3 V 26 G, GAIN (dB) TA = - 35C 24 25C + 85C 22 G, GAIN (dB) 26 3V 24 2V 22 28 TA = 25C VCC1, VCC2, Vbias = 4 V 20 20 500 600 700 800 f, FREQUENCY (MHz) 900 1000 18 500 600 700 800 f, FREQUENCY (MHz) 900 1000 Figure 2. Gain versus Frequency Figure 3. Gain versus Frequency 20 Pout , OUTPUT POWER (dBm) Pout , OUTPUT POWER (dBm) 25 20 VCC1, VCC2, Vbias = 4 V 15 3V 2V 10 f = 900 MHz TA = 25C -15 -10 -5 Pin, INPUT POWER (dBm) 0 5 15 TA = - 35C 10 85C f = 900 MHz VCC1, VCC2, Vbias = 3 V 25C 5 5 0 - 20 0 - 20 -15 -10 -5 Pin, INPUT POWER (dBm) 0 5 Figure 4. Output Power versus Input Power Figure 5. Output Power versus Input Power 0 ORL, OUTPUT RETURN LOSS (dB) IRL, INPUT RETURN LOSS (dB) 0 TA = 25C -10 VCC1, VCC2, Vbias = 2 V 3V - 20 4V -5 TA = 25C -10 VCC1, VCC2, Vbias = 2 V -15 3V - 20 500 600 700 800 f, FREQUENCY (MHz) 900 4V 1000 - 30 500 600 700 800 f, FREQUENCY (MHz) 900 1000 Figure 6. Input Return Loss versus Frequency Figure 7. Output Return Loss versus Frequency MRFIC2006 4 MOTOROLA RF DEVICE DATA TYPICAL CHARACTERISTICS - 30 REV ISO, REVERSE ISOLATION (dB) , POWER ADDED EFFICIENCY (%) 35 30 25 20 15 10 5 0 10 12 14 16 Pout, OUTPUT POWER (dBm) 18 20 3V 4V TA = 25C f = 900 MHz VCC1, VCC2, Vbias = 2 V - 35 VCC1, VCC2, Vbias = 2 V 4V - 40 3V - 45 TA = 25C - 50 500 600 700 800 f, FREQUENCY (MHz) 900 1000 Figure 8. Reverse Isolation versus Frequency Po 1 dB, OUTPUT POWER AT 1 dB GAIN COMPRESSION (dBm) Po 1 dB, OUTPUT POWER AT 1 dB GAIN COMPRESSION (dBm) Figure 9. Power Added Efficiency versus Output Power 17 TA = 85C 16 - 35C 15 25C 20 VCC1, VCC2, Vbias = 4 V 3V 16 TA = 25C 2V 12 14 VCC1, VCC2, Vbias = 3 V 13 500 600 700 800 f, FREQUENCY (MHz) 900 1000 8 500 600 700 800 f, FREQUENCY (MHz) 900 1000 Figure 10. Output Power at 1 dB Gain Compression versus Frequency Figure 11. Output Power at 1 dB Gain Compression versus Frequency 20 TA = + 85C 30 20 10 0 VCC1, VCC2 = 4 V 2V 3V Pout , OUTPUT POWER (dBm) 10 0 - 35C -10 25C VCC1, VCC2 = 3 V Pin = 0 dBm f = 900 MHz Pout , OUTPUT POWER (dBm) -10 TA = 25C Pin = 0 dBm f = 900 MHz 0 1 2 3 Vbias, BIAS VOLTAGE (V) 4 5 - 20 - 30 - 20 - 30 0 1 2 3 Vbias, BIAS VOLTAGE (V) 4 5 Figure 12. Output Power versus Bias Voltage Figure 13. Output Power versus Bias Voltage MOTOROLA RF DEVICE DATA MRFIC2006 5 TYPICAL CHARACTERISTICS 100 ICC1 + ICC2 , SUPPLY CURRENT (mA) 100 ICC1 + ICC2 , SUPPLY CURRENT (mA) 80 80 60 TA = + 85C 25C - 35C 20 VCC1, VCC2 = 3 V 0 0 1 2 3 Vbias, BIAS VOLTAGE (V) 4 5 60 VCC1, VCC2 = 4 V 40 2V 3V 40 20 TA = 25C 0 0 1 2 3 Vbias, BIAS VOLTAGE (V) 4 5 Figure 14. Supply Current versus Bias Voltage 7 6 I BIAS, BIAS CURRENT (mA) 5 4 3 2 1 0 0 1 TA = + 85C - 35C Figure 15. Supply Current versus Bias Voltage 25C VCC1, VCC2 = 2 V TO 4 V 2 3 Vbias, BIAS VOLTAGE (V) 4 5 Figure 16. Bias Current versus Bias Voltage MRFIC2006 6 MOTOROLA RF DEVICE DATA APPLICATIONS INFORMATION DESIGN PHILOSOPHY The MRFIC2006 was designed for low cost and flexibility. Low cost was achieved by minimizing external components and using an SOIC package. Flexibility was achieved by allowing the bias current to be externally adjustable resulting in a broad range of output power capability. The bias pin can be ramped to reduce AM splatter in TDD/TDMA systems and can be used to trim the RF output power. THEORY OF OPERATION The input port is internally matched to 50 ohms. Return loss is typically 15 -16 dB in the 800 -1000 MHz range. The output port is nearly 50 ohms but is an open collector and therefore requires an external bias inductor. Using an RF choke will result in a 11-12 dB output return loss. However, a 10 nH inductor will improve it to 15 - 20 dB. A 10 nH inductor is small enough in value to be printed on the board. DC blocks are required on the input and output. Values of 100 pF are recommended. Supply decoupling must be done as close to the IC as possible. A 1000 pF capacitor is recommended. A series RF choke is recommended to keep the RF signal off the supply line. A 10 nF decoupling capacitor is recommended on the Vbias line but does not need to be very close to the IC. The Vbias pin can be used several ways. Tying it directly to VCC will maximize the bias current which will maximize linearity. Adding a series resistor will reduce the bias current which will improve efficiency. Figure 9 shows the efficiency versus output power with Vbias tied to VCC. The series resistor will cause these curves to shift to the left. The RF output power can be trimmed by using a variable resistor. The Vbias pin can also be used to power down the IC or, in the case of TDD/TDMA systems, to ramp the IC. By applying a linear ramp voltage, such as the one provided by the MRFIC2004, it has been demonstrated to meet the CT2 Common Air Interface splatter specifications. The MRFIC2006 is internally temperature compensated. For input powers of - 5.0 to 0 dBm the output power temperature variation is typically less than 0.2 dB from - 35 to + 85C. EVALUATION BOARDS Evaluation boards are available for RF Monolithic Integrated Circuits by adding a "TF" suffix to the device type. For a complete list of currently available boards and ones in development for newly introduced product, please contact your local Motorola Distributor or Sales Office. MOTOROLA RF DEVICE DATA MRFIC2006 7 PACKAGE DIMENSIONS A 8 D 5 C E 1 4 H 0.25 M B M h B C e A SEATING PLANE X 45 _ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.18 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ q L 0.10 A1 0.25 B M CB S A S q CASE 751-05 ISSUE S Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303-675-2140 or 1-800-441-2447 JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141, Japan. 81-3-5487-8488 MfaxTM: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, - US & Canada ONLY 1-800-774-1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 INTERNET: http://motorola.com/sps MRFIC2006 8 MRFIC2006/D MOTOROLA RF DEVICE DATA |
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