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| BCC Bump Chip Carrier BCC+ (exposed paddle without ground ring) * Saw singulated format * Package height 0.8mm max. * Square body size (rectangular body designable) * Staggered dual row or single row bump design BCC++ (exposed paddle with ground ring) BCCs++ (staggered dual row design) FEATURES * Body sizes: 4 x 4mm to 9 x 9mm * Lead pitch: 0.50mm and 0.80mm * Custom body / lead / pitch configurations available * Package profile heights (overall): maximum 0.80mm * Both single row & dual row design * Ni / Pd / Au plated bumps * Excellent thermal and electrical performance * Full in-house package and leadframe design capability * Full in-house electrical, thermal and mechanical simulation and measurement capability * JEDEC standard compliant DESCRIPTION STATS ChipPAC's Bump Chip Carrier (BCC) technology produces a chip scale leadframe based molded package with bumps which are formed after the leadframe is etched away. An exposed die pad coupled with extremely low RLC provides excellent electrical and thermal performance enhancements which are ideal for high frequency and high power applications especially for handheld portable applications such as cell phones. The BCC is manufactured in a molded array format that maximizes product throughput and material utilization. The BCC is available with single row and dual row bumps in BCC++ and BCC+. Overall package profile height is 0.80mm maximum. APPLICATIONS * RF * Power Management * Analog/Linear * Logic * Applications requiring enhanced electrical and thermal performance and reduced package size and weight www.statschippac.com BCC Bump Chip Carrier SPECIFICATIONS Die Thickness Gold Wire Lead Finish Marking Packing Options 279m nominal, 355m max. 25m (1.0mils) diameter Preplated Ni/Pd/Au bumps Laser Tape & reel / JEDEC tray RELIABILITY Moisture Sensitivity Level Temperature Cycling High Temp Storage Temp / Humidity Test Pressure Cooker Test JEDEC Level 2a/2/1@260C (depending upon package) -65C/150C, 1000 cycles 150C, 1000 hrs 85C/85% RH, 1000 cycles 121C, 100% RH, 2 atm, 168 hrs PACKAGE CONFIGURATIONS Package Size (mm) 4 5 6 7 8 9 x x x x x x 4 5 6 7 8 9 Lead Pitch (mm) 0.80 0.50 0.50 0.50 0.50 0.50 Lead Count 16 32 40 48 / 84 56 11 6 CROSS-SECTIONS BCC+ BCCs+ BCC++ BCCs++ Corporate Office Global Offices 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 USA 510-979-8000 JAPAN 81-3-5789-5850 KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 CHINA 86-21-5976-5858 UK 44-1483-413-700 MALAYSIA 603-4257-6222 NETHERLANDS 31-38-333-2023 The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. (c)Copyright 2006. STATS ChipPAC Ltd. All rights reserved. May 2006 |
Price & Availability of BCC
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