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S T M6375 S amHop Microelectronics C orp. S ep.21,2004 P -C hannel E nhancement Mode MOS FE T P R ODUC T S UMMAR Y V DS S -20V F E AT UR E S ( m W ) Max ID -8A R DS (ON) S uper high dense cell design for low R DS (ON). 20 @ V G S = -4.5V 28 @ V G S = -2.5V R ugged and reliable. S urface Mount P ackage. D 8 D 7 D 6 D 5 S O-8 1 1 2 3 4 S S S G ABS OLUTE MAXIMUM R ATINGS (TA=25 C unless otherwise noted) P arameter Drain-S ource Voltage Gate-S ource Voltage Drain C urrent-C ontinuous a @ TJ=25 C b -P ulsed Drain-S ource Diode Forward C urrent a Maximum P ower Dissipation a Operating Junction and S torage Temperature R ange S ymbol VDS VGS ID IDM IS PD TJ, TS TG Limit - 20 10 -8 - 32 -1.7 2.5 -55 to 150 Unit V V A A A W C THE R MAL C HAR AC TE R IS TIC S Thermal R esistance, Junction-to-Ambient a R JA 50 C /W 1 www..com S T M6375 E LE CTR ICAL CHAR ACTE R IS TICS (TA =25 C unless otherwise noted) Parameter OFF CHAR ACTE R IS TICS Drain-S ource Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage BVDSS IDSS IGSS VGS(th) R DS (ON) ID(ON) gFS CISS COSS CRSS c S ymbol Condition VGS = 0V, ID = -250uA VDS = -16V, VGS = 0V VGS = 10V, VDS = 0V VDS = VGS, ID = -250uA VGS =-4.5V,ID= -8A VGS = -2.5V,ID =-6A VDS = -5V, VGS = -4.5V VDS = -5V, ID = - 5A Min Typ C Max Unit -20 -1 V uA 100 nA -0.6 -0.8 14 19 -20 20 1932 550 115 -1.5 V ON CHAR ACTE R IS TICS b Gate Threshold Voltage Drain-S ource On-S tate R esistance On-S tate Drain Current Forward Transconductance 20 m-ohm 28 m-ohm A S PF PF PF DYNAMIC CHAR ACTE R IS TICS c Input Capacitance Output Capacitance R everse Transfer Capacitance VDS =-10V, VGS = 0V f =1.0MHZ S WITCHING CHAR ACTE R IS TICS Turn-On Delay Time R ise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-S ource Charge Gate-Drain Charge tD(ON) tr tD(OFF) tf Qg Qgs Qgd VD = -10V, R L =10 ohm ID = -1A, VGEN = -4.5V, R GE N =6 ohm VDS=-10V,ID =-8A,VGS=-10V VDS=-1V,ID =-8A,VGS=-4.5V VDS =-10V, ID = -8A, VGS =-10V 2 51.8 23.7 335 133 30 7 6.5 5.8 ns ns ns ns nC nC nC nC S T M6375 E LE CTR ICAL CHAR ACTE R IS TICS (TA=25 C unless otherwise noted) Parameter Diode Forward Voltage S ymbol VSD Condition VGS = 0V, Is =-1.7A Min Typ C Max Unit -0.75 -1.2 V DR AIN-S OUR CE DIODE CHAR ACTE R IS TICS b Notes a.Surface Mounted on FR 4 Board, t<= 10sec. b.Pulse Test:Pulse Width<= 300us, Duty Cycle<= 2%. c.Guaranteed by design, not subject to production testing. 20 20 -ID, Drain C urrent (A) -V G S =2V 16 T j=125 C 25 C -55 C 16 -ID, Drain C urrent (A) -V G S =10,9,8,7,6,5,4,3V 12 8 4 12 8 4 0 0 1 2 3 4 5 6 0 0 0.5 1 1.5 2 2.5 3 -V DS , Drain-to-S ource Voltage (V ) -V G S , G ate-to-S ource Voltage (V ) F igure 1. Output C haracteris tics 2400 2000 C is s 1.8 1.6 F igure 2. Trans fer C haracteris tics V G S =-4.5V ID=-8A R DS (ON), On-R es is tance (Normalized) C , C apacitance (pF ) 1600 1200 800 400 0 C os s C rs s 0 5 10 15 20 25 30 1.4 1.2 1.0 0.8 0.6 -50 0 50 100 150 -V DS , Drain-to S ource Voltage (V ) T j, J unction T emperature ( C ) F igure 3. C apacitance F igure 4. On-R es is tance Variation with Temperature 3 S T M6375 B V DS S , Normalized Drain-S ource B reakdown V oltage V th, Normalized G ate-S ource T hres hold V oltage 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -50 -25 0 25 50 75 100 125 150 V DS =V G S ID=-250uA 1.15 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 150 ID=-250uA T j, J unction T emperature ( C ) T j, J unction T emperature ( C ) F igure 5. G ate T hres hold V ariation with T emperature 35 F igure 6. B reakdown V oltage V ariation with T emperature 20.0 V G S =0V gFS , T rans conductance (S ) 21 14 7 0 0 5 10 V DS =-5V 15 20 -Is , S ource-drain current (A) 28 10.0 1.0 0.4 0.6 0.8 1.0 1.2 1.4 -IDS , Drain-S ource C urrent (A) -V S D, B ody Diode F orward V oltage (V ) F igure 7. T rans conductance V ariation with Drain C urrent -V G S , G ate to S ource V oltage (V ) F igure 8. B ody Diode F orward V oltage V ariation with S ource C urrent 50 -ID, Drain C urrent (A) 10 8 6 4 2 0 0 4 8 12 16 20 24 28 32 Qg, T otal G ate C harge (nC ) VDS =-10V ID=-8A 10 R (O DS N) L im it 100 1s 10m ms s 1 DC 0.1 0.03 0.1 VGS =-4.5V S ingle P ulse T A=25 C 1 10 50 -V DS , Drain-S ource V oltage (V ) F igure 9. G ate C harge 4 F igure 10. Maximum S afe O perating Area S T M6375 -VDD ton V IN D VG S R GE N G 90% toff tr 90% RL V OUT td(on) V OUT td(off) 90% 10% tf 10% S V IN 50% 10% 50% INVE R TE D P ULS E WIDTH F igure 11. S witching T es t C ircuit F igure 12. S witching Waveforms 2 r(t),Normalized E ffective T ransient T hermal Impedance 1 Duty C ycle=0.5 0.2 0.1 0.1 0.05 0.02 S ingle P uls e 0.01 10 -4 P DM t1 1. 2. 3. 4. 10 -2 t2 R thJ A (t)=r (t) * R thJ A R thJ A=S ee Datas heet T J M-T A = P DM* R thJ A (t) Duty C ycle, D=t1/t2 10 100 10 -3 10 -1 1 S quare Wave P uls e Duration (s ec) F igure 13. Normalized T hermal T rans ient Impedance C urve 5 S T M6375 PAC K AG E OUT LINE DIME NS IONS S O-8 1 L E D 0.015X45X A e 0.05 TYP. B 0.016 TYP. A1 0.008 TYP. C H S Y MB OLS A A1 D E H L MILLIME T E R S MIN 1.35 0.10 4.80 3.81 5.79 0.41 0X MAX 1.75 0.25 4.98 3.99 6.20 1.27 8X MIN 0.053 0.004 0.189 0.150 0.228 0.016 0X INC HE S MAX 0.069 0.010 0.196 0.157 0.244 0.050 8X 6 S T M6375 SO-8 Tape and Reel Data SO-8 Carrier Tape unit:P PACKAGE SOP 8N 150O A0 6.40 B0 5.20 K0 2.10 D0 r1.5 (MIN) D1 r1.5 + 0.1 - 0.0 E 12.0 O0.3 E1 1.75 E2 5.5 O0.05 P0 8.0 P1 4.0 P2 2.0 O0.05 T 0.3 O0.05 SO-8 Reel UNIT:P TAPE SIZE 12 P REEL SIZE r330 M 330 O 1 N 62 O1.5 W 12.4 + 0.2 W1 16.8 - 0.4 H r12.75 + 0.15 K S 2.0 O0.15 G R V 7 |
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