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5.0 mm
DIA LED
LAMP
599R2GBC-CA
PACKAGE DIMENSIONS
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Note: 1.All Dimensions are in millimeters. 2.Tolerance is 0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice 6.highlight <-500V the led can withstand the max static level when assembling or operation.
DRAWING NO. : DS-35-04-0637
DATE : 2005-10-19
Page : 1
HD-R/RD013
5.0 mm
DIA LED
LAMP
599R2GBC-CA
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FEATURES * 5.0mm DIA LED LAMP * LOW POWER CONSUMPTION. * I.C. COMPATIBLE. * THREE CHIPS ARE MATCHED FOR UNIFORM LIGHT OUTPUT. * LONG LIFE-SOLIDSTATE RELIABILITY. * FULL COLOR AND HIGH CONTRAST LAMP CHIP MATERIALS * Dice Material : AlGaInP/GaAs & GaInN/GaN & GaInN/GaN * Light Color : FULL COLOR(SUPER RED & ULTRA PURE GREEN & ULTRA BLUE) * Lens Color : WATER CLEAR ABSOLUTE MAXIMUM RATING:(Ta25C)
SYMBOL SUPER ULTRA ULTRA UNIT PURE RED GREEN BLUE PAD Power Dissipation Per Chip mW 70 130 120 VR Reverse Voltage Per Chip V 5 5 5 IF Average Forward Current Per Chip mA 30 30 30 IPF Peak Forward Current Per Chip (Duty=0.1,1KHZ) mA 60 120 70 Derating Linear From 25C Per Chip mA/C 0.4 0.4 0.4 Topr Operating Temperature Range -25C to 85C Tstg Storage Temperature Range -40C to 85C Lead Soldering Temperature1.6mm(0.063 inch) From Body260C5C For 5 Seconds DESCRIPTION
ELECTRO-OPTICAL CHARACTERISTICS:(Ta=25C)
SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT Super Red 1.8 2.2 V Forward Voltage IF=20mA Ultra Pure Green VF 3.5 4.0 V Ultra Blue 3.5 4.0 V Super Red 100 A IR Reverse Current VR=5V Ultra Pure Green 100 A Ultra Blue 100 A Super Red 625 nm D Dominant Wavelength IF=20mA Ultra Pure Green 525 nm Ultra Blue 460 nm Super Red 20 nm Spectral Line Half-Width IF=20mA Ultra Pure Green 22 nm Ultra Blue 30 nm Super Red 85................100 deg 21/2 Half Intensity Angle IF=20mA Ultra Pure Green 85................100 deg Ultra Blue 85................100 deg Super Red 310................435 mcd Ultra Pure Green 770...............1080 mcd IV Luminous Intensity IF=20mA Ultra Blue 200................390 mcd PARAMETER
DRAWING NO. : DS-35-04-0637
DATE : 2005-10-19
Page : 2
HD-R/RD014
5.0 mm
DIA LED
LAMP
599R2GBC-CA
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DRAWING NO. : DS-35-04-0637
DATE : 2005-10-19
Page : 3
5.0 mm
SOLDERING
METHOD
DIA LED
LAMP
599R2GBC-CA
SOLDERING CONDITIONS
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REMARK
DIP SOLDERING
Bath temperature: 2605 Immersion time: with 5 sec
Solder no closer than 3mm from the base of the package
Using soldering flux," RESIN FLUX" is recommended.
During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 260 or lower (To prevent heat from being IRON Soldering time: within 5 sec. transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip.
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
Lead wries
Leave
a slight clearance
(Fig.2)
DRAWING NO. : DS-35-04-0637
DATE : 2005-10-19
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5.0 mm
DIA LED
LAMP
599R2GBC-CA
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3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3).
PC board
F ig.3 jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature.
LED MOUNTING METHOD
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4)
case
pc board
Fig.4
DRAWING NO. : DS-35-04-0637
DATE : 2005-10-19
Page : 5
5.0 mm
DIA LED
LAMP
599R2GBC-CA
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2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
Tube
Stand-off
Fig.5
Fig.6
FORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7)
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8)
2mm
DRAWING NO. : DS-35-04-0637
DATE : 2005-10-19
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5.0 mm
LEAD STRENGTH
1) Bend strength Do not bend the lead more than twice. (Fig.9)
DIA LED
LAMP
599R2GBC-CA
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Fig.9
2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10)
OK
1Kg
Fig.10
HANDLING PRECAUTIONS
Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling.
CHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT Freon TE Chlorothene Isopropyl Alcohol Thinner Acetone Trichloroethylene --Usable ADAPTABILITY
NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted.
Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by
--Do not use.
DRAWING NO. : DS-35-04-0637
DATE : 2005-10-19
Page : 7
5.0 mm
DIA LED
LAMP
599R2GBC-CA
Experiment Item:
Item Test Condition
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OPERATION LIFE
Lamp & IR Ta 255 IF= 20mA RH=60%RH DYNAMIC:100mA 1ms 1/10 duty STATIC STATE: IF20mA TEST TIME: 168HRS-24HRS+24HRS 500HRS-24HRS+24HRS 1000HRS-24HRS+72HRS Ta 655 RH 9095%RH TEST TIME240HRS2HRS 10525-5525 30min 5min 30min 5min 10CYCLES 1055-555 10min 10min 10CYCLES
Reference Standard
MIL-STD-7501026 MIL-STD-8831005 JIS C 7021B-1
HIGH TEMPERATURE HIGH HUMIDITY STORAGE TEMPERATURE CYCLING
MIL-STD-202103B JIS C 7021 B-1
MIL-STD-202107D MIL-STD-7501051 MIL-STD-8831010 JIS C 7021 A-4 MIL-STD-202107D MIL-STD-7501051 MIL-SYD-8831011 MIL-STD-202210A MIL-STD-750-2031 JIS C 7021A-1 MIL-STD-202208D MIL-STD-7502026 MIL-STD-8832003 JIS C 7021 A-2
THERMAL SHOCK
SOLDER RESISTANCE
Tsol2605 DWELL TIME10lsec Tsol2305 DWELL TIME5lsec
SOLDERABILITY
DRAWING NO. : DS-35-04-0637
DATE : 2005-10-19
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