Part Number Hot Search : 
TS3V712 MX674A S2475RLP 1N4747 P8044AH VBXXXXX LNK562D BNT70
Product Description
Full Text Search
 

To Download MF443 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 Obsolescence Notice
This product is obsolete. This information is available for your convenience only. For more information on Zarlink's obsolete products and replacement product lists, please visit
http://products.zarlink.com/obsolete_products/
MF443 1310 nm, 1550 nm, 155 Mbps PIN with Preamplifier
Data Sheet
January 2004
Ordering Information MF443 MF443ST MF443PT TO-46 with lens ST receptacle Pigtail including 1.4 m of 50/125 mm multi-mode fiber and SC connector -40C to +85C
Note: The rated Responsivity applies to all options.
Features
* * * * 1310-1550 nm PIN/TIA Data-rate up to 200 Mbps TIA with AGC Low power consumption
Description
This device consists of a PIN photodiode and a transimpedance amplifier assembled in a TO-46 package. It is designed for FDDI, ATM and SDH/ Sonet up to 155 Mbps. The AGC (Automatic Gain Control) ensures a wide dynamic range. Its double-lens optical system is designed for single-mode fiber as well as for multimode fiber with core diameter up to 62.5 m.
Applications
* * * * Sonet OC-3 FDDI ATM 155 Mbps General Purpose
Data Out
VDD
VDD
Data Out
Data Data Out
Data Out Data Case VSS Bottom View
VSS
Figure 1 - Pin Diagram
Figure 2 - Functional Schematic
1
Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2004, Zarlink Semiconductor Inc. All Rights Reserved.
MF443
Optical and Electrical Characteristics - Case Temperature 250C Parameter Responsivity, single differential Output Voltage (differential, peak to peak) Bandwidth (3 dBel) Noise-Equivalent Power Sensitivity (BER Dynamic Range Output Resistance (differential) Power Supply Current R0 IDD 10-9 ) Symbol R Vo fc NEP S 36 140 15 -39 40 50 32 40 Min. Typ. 100 200 1.2 Max. Unit kV/W V MHz nW dBm dB mA Pf = 1 W
Data Sheet
Test Condition = 1300 nm Note 1
= 1300 nm = 1300 nm Extinction Ratio = 0
Operating Conditions: See table. Fiber: Single-mode to multimode 62.5/125 m.
Note 1: Pf = 1 W average power at 10 MHz/50% duty cycle.
Absolute Maximum Ratings Parameter Supply voltage Operating Temperature Storage Temperature Recommended Operating Conditions Parameter Supply Voltage Output Differential Load Symbol VDD-VSS RL Min. 4.5 1 Typ. 5.0 3 Max. 5.2 Unit V k Symbol VDD-VSS Top Tstg Min. 0 -40 -55 Max. 6.0 +85 +125 Unit V
oC oC
Typical Responsivity Core Diameter/Cladding Diameter Numerical Aperture 10/125 m 0.11 Single Differential 100 kV/W 200 kV/W 50/125 m 0.20 100 kV/W 200 kV/W 62.5/125 m 0.275 100 kV/W 200 kV/W
2
Zarlink Semiconductor Inc.
MF443
Data Sheet
r
100
z
Relative Responsivity (%)
80
r - optimal OC = 62.5 m
60
40
20
0 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3 z - Axial Displacem ent of Fiber (nm )
Figure 3 - z - Axial Displacement of Fiber
r
100
z
Relative Responsivity (%)
80
z - optimal OC = 62.5 m
60
40
20
0 0 10 20 30 40 50 60 70 80 90 100
r - Radial Displacem ent of Fiber (m m )
Figure 4 - r - Radial Displacement of Fiber
3
Zarlink Semiconductor Inc.
MF443
Data Sheet
100
80 Relative Responsivity (%)
60
40
20
0 800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
Wavelength (nm )
Figure 5 - Relative Responsivity vs. Wavelength
4
Zarlink Semiconductor Inc.
BOTTOM VIEW ( 10 : 1 )
3,8
SIDE VIEW
13,460,76
2,54
n1,17 + 0,05 (3x) n0,45 + 0,04 (4x) -
0,6 0,03 * Brazed
0
R2,7 45
n1,02 max
n4,7
3, 6
1, 02
0,33 max Lens n1.50.05 R0,4 max
NOTES:1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 m. Header: Ni min 0,5 m / Au min 1,5 m.
* 0,25 max glass overmould (3x)
(c) Zarlink Semiconductor 2002. All rights reserved.
Package code Previous package codes
Drawing type
ISSUE ACN DATE
1
JS0 04078R1A
TB
Package drawing, TO-46 with lens Title
22-MAR-03
APPRD. TD/BE
JS004078
For more information about all Zarlink products visit our Web Site at
www.zarlink.com
Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively "Zarlink") is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink's conditions of sale which are available on request.
Purchase of Zarlink's I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved.
TECHNICAL DOCUMENTATION - NOT FOR RESALE


▲Up To Search▲   

 
Price & Availability of MF443

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X