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11.0-19.0 GHz GaAs MMIC Power Amplifier
January 2007 - Rev 30-Jan-07
P1020-BD Chip Device Layout
Features
Compact, Low Cost Design 20.0 dB Small Signal Gain +27.0 dBm Saturated Output Power 100% On-Wafer RF, DC and Output Power Testing 100% Visual Inspection to MIL-STD-883 Method 2010
XP1020-BD
General Description
Mimix Broadband's two stage 11.0-19.0 GHz GaAs MMIC power amplifier has a small signal gain of 20.0 dB with a +27.0 dBm saturated output power. This MMIC uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.
Absolute Maximum Ratings
Supply Voltage (Vd) Supply Current (Id) Gate Bias Voltage (Vg) Input Power (Pin) Storage Temperature (Tstg) Operating Temperature (Ta) Channel Temperature (Tch)
+9.0 VDC 500 mA +0.3 VDC +17.0 dBm -65 to +165 OC -55 to MTTF Table1 MTTF Table 1
(1) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.
Electrical Characteristics (Ambient Temperature T = 25 oC)
Parameter Frequency Range (f ) Input Return Loss (S11) Output Return Loss (S22) Small Signal Gain (S21) Gain Flatness ( S21) Reverse Isolation (S12) Saturated Output Power (Psat) Drain Bias Voltage (Vd1,2) Gate Bias Voltage (Vg1) Supply Current (Id) (Vd=5.0V, Vg=-0.9V Typical) Units GHz dB dB dB dB dB dBm VDC VDC mA Min. 11.0 -1.0 Typ. 12.0 8.0 20.0 +/-1.0 40.0 +27.0 +5.0 -0.9 380 Max. 19.0 +8.0 0.1 420
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
11.0-19.0 GHz GaAs MMIC Power Amplifier
January 2007 - Rev 30-Jan-07
P1020-BD
Power Amplifier Measurements @ Tamb=25C
Small Signal Parameters
22 20 18 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 5 7 9 11
S11
S21
0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 -13 -14 -15 -16 -17 -18 -19 -20 0 2 4 6
DB(|S(1,1)|) All S ources
S22
S11
13 15 17 Fr equency ( G Hz) 19 21 23 25
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Fr equency ( G Hz)
S21
25 20 15 10 5 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 0 2 4 6
DB(|S(2,1)|) All S ources
S12
0 -10 -20 -30 -40 -50 -60 -70
DB(|S(1,2)|) All S ources
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Fr equency ( G Hz)
0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Fr equency ( G Hz)
S22
22 20 18 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 0 2 4 6
DB(|S(2,2)|) All S ources
XP1020-BD: Pout (d Bm) v s . f req ( GHz ) Vgs= -0.5 Vds =5 V Pin = +10 dBm
30 28 26 24 22 20
Pout (d Bm)
18 16 14 12 10 8 6 4 2
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Fr equency ( G Hz)
0 11 12 13 14 15 16 17 18 19 20
freq (GHz)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 2 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
11.0-19.0 GHz GaAs MMIC Power Amplifier
January 2007 - Rev 30-Jan-07
P1020-BD
0.600 (0.023) 1.000 (0.039)
Mechanical Drawing
1.100 (0.043)
2
0.731 (0.028)
3
1
XP1020-BD
4 5
0.0 0.0 0.659 (0.026)
(Note: Engineering designator is 15MPA0566)
0.294 (0.012)
1.400 (0.055)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad. Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.810 mg. Bond Pad #1 (RF In) Bond Pad #2 (Vd1) Bond Pad #3 (Vd2) Bond Pad #4 (RF Out) Bond Pad #5 (Vg)
Bias Arrangement
Vd1,2
Bypass Capacitors - See App Note [2]
2 3
RF In
1
XP1020-BD
4 5
RF Out
Vg
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
11.0-19.0 GHz GaAs MMIC Power Amplifier
January 2007 - Rev 30-Jan-07
P1020-BD
App Note [1] Biasing - It is recommended to bias each amplifier stage Vd(1,2)=5.0V with Id=380mA. It is also recommended to use active biasing to keep the currents constant as the RF power and temperature vary; this gives the most reproducible results. Depending on the supply voltage available and the power dissipation constraints, the bias circuit may be a single transistor or a low power operational amplifier, with a low value resistor in series with the drain supply used to sense the current. The gate of the pHEMT is controlled to maintain correct drain current and thus drain voltage. The typical gate voltage needed to do this is -0.9V. Typically the gate is protected with Silicon diodes to limit the applied voltage. Also, make sure to sequence the applied voltage to ensure negative gate bias is available before applying the positive drain supply. App Note [2] Bias Arrangement -
All the drain or gate pad (Vd1,2 and Vg) DC bypass capacitors (~100-200 pF) can be combined. Additional DC bypass capacitance (~0.01 uF) is also recommended to all DC or combination (if gate or drains are tied together) of DC bias pads.
MTTF Graphs
XP1020-BD Vd=5.0 V, Id=380 mA
1.00E+09
1.00E+05
XP1020-BD Vd=5.0 V, Id=380 mA
1.00E+08
1.00E+04
1.00E+07 MTTF (hours)
1.00E+03 FITS 1.00E+02 1.00E+01 1.00E+00
1.00E+06
1.00E+05
1.00E+04
1.00E+03 55 65 75 85 95 105 115 125 Baseplate Temperature (deg C) No RF Pout=+27 dBm
55
65
75
85
95
105
115
125
Baseplate Temperature (deg C) No RF Pout=+27 dBm
XP1020-BD Vd=5.0 V, Id=380 mA
80 78 76 74 72 70 68 66 64 62 60 58 56 54 52 50 48 46 44 42 40 55 65 75 85 95 105 115 125 Baseplate Temperature (deg C) No RF Pout=+27 dBm
XP1020-BD Vd=5.0 V, Id=380 mA
275
250
225 Tch (deg C)
Rth (deg C/W)
200
175
150
125 55 65 75 85 95 105 115 125 Baseplate Temperature (deg C) No RF Pout=+27 dBm
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
11.0-19.0 GHz GaAs MMIC Power Amplifier
January 2007 - Rev 30-Jan-07
P1020-BD
Device Schematic
Typical Application
XU1005 CMM1118 Sideband Reject XP1020
IF IN 2.0 GHz
RF Out 14.2-15.35 GHz
LO(+6.0dBm) 12.2-13.35 GHz (USB Operation) 16.2-17.35 GHz (LSB Operation)
Mimix Broadband MMIC-based 11.0-18.0 GHz Transmitter Block Diagram
(Changing LO and IF frequencies as required allows design to operate as high as 18.0 GHz)
Mimix Broadband's 11.0-18.0 GHz XU1005 GaAs MMIC Transmitter can be used in saturated radio applications and linear modulation schemes up to 16 QAM. The transmitter can be used in upper and lower sideband applications from 11.0-18.0 GHz.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
11.0-19.0 GHz GaAs MMIC Power Amplifier
January 2007 - Rev 30-Jan-07
P1020-BD
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: Do not ingest. Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers. Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy Specifications for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The work station temperature should be 310 C +/- 10 C. Exposure to these extreme temperatures should be kept to minimum. The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during placement. Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible.
Part Number for Ordering
XP1020-BD-000V XP1020-BD-EV1
Description
RoHS compliant die packed in vacuum release gel packs XP1020-BD evaluation module
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 6 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.

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