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MC10EP01, MC100EP01 3.3V / 5V ECL 4-Input OR/NOR Description The MC10EP01 is a 4-input OR/NOR gate. The device is functionally equivalent to the EL01 device, LVEL01, and E101 (a quad version). With AC performance much faster than the LVEL01 device, the EP01 is ideal for applications requiring the fastest AC performance available. The 100 Series contains temperature compensation. Features http://onsemi.com MARKING DIAGRAMS* 8 1 SOIC-8 D SUFFIX CASE 751 1 8 HEP01 ALYW G 8 KEP01 ALYW G * 230 ps Typical Propagation Delay * Maximum Frequency > 3 GHz Typical * PECL Mode Operating Range: * NECL Mode Operating Range: * * VCC = 3.0 V to 5.5 V with VEE = 0 V VCC = 0 V with VEE = -3.0 V to -5.5 V Open Input Default State Pb-Free Packages are Available 1 8 1 TSSOP-8 DT SUFFIX CASE 948R 8 HP01 ALYWG G 8 KP01 ALYWG G 1 1 DFN8 MN SUFFIX CASE 506AA H K 5H 2W M = MC10 = MC100 = MC10 = MC100 = Date Code 1 4 1 A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. (c) Semiconductor Components Industries, LLC, 2006 December, 2006 - Rev. 8 1 Publication Order Number: MC10EP01/D 2W MG G 4 5H MG G MC10EP01, MC100EP01 Table 1. PIN DESCRIPTION D0 1 8 VCC Pin D0 - D3 D1 2 7 Q Q, Q VCC VEE D2 3 6 Q EP ECL Data Inputs ECL Data Outputs Positive Supply Negative Supply Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. Function D3 4 5 VEE Table 2. TRUTH TABLE D0* L D1* L X H X X H D2* L X X H X H D3* L X X X H H Q L H H H H H Q H L L L L L Figure 1. 8-Lead Pinout (Top View) and Logic Diagram H X X X H *Pins will default LOW when left open. Table 3. ATTRIBUTES Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Human Body Model Machine Model Charged Device Model Pb Pkg Level 1 Level 1 Level 1 Value 75 kW N/A > 4 kV > 200 V > 2 kV Pb-Free Pkg Level 1 Level 3 Level 1 Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC-8 TSSOP-8 DFN8 Flammability Rating Transistor Count Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in 115 Devices http://onsemi.com 2 MC10EP01, MC100EP01 Table 4. MAXIMUM RATINGS Symbol VCC VEE VI Iout IBB TA Tstg qJA qJC qJA qJC qJA Tsol Parameter PECL Mode Power Supply NECL Mode Power Supply PECL Mode Input Voltage NECL Mode Input Voltage Output Current VBB Sink/Source Operating Temperature Range Storage Temperature Range Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Wave Solder Pb Pb-Free 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm <2 to 3 sec @ 248C <2 to 3 sec @ 260C SOIC-8 SOIC-8 SOIC-8 TSSOP-8 TSSOP-8 TSSOP-8 DFN8 DFN8 Condition 1 VEE = 0 V VCC = 0 V VEE = 0 V VCC = 0 V Continuous Surge VI v VCC VI w VEE Condition 2 Rating 6 -6 6 -6 50 100 0.5 -40 to +85 -65 to +150 190 130 41 to 44 185 140 41 to 44 129 84 265 265 Unit V V V V mA mA mA C C C/W C/W C/W C/W C/W C/W C/W C/W C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 3 MC10EP01, MC100EP01 Table 5. 10EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 2) -40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 3) Output LOW Voltage (Note 3) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 20 2165 1365 2090 1365 Typ 24 2290 1490 Max 31 2415 1615 2415 1690 150 0.5 Min 20 2230 1430 2155 1430 25C Typ 24 2355 1555 Max 31 2480 1680 2480 1755 150 0.5 Min 20 2290 1490 2215 1490 85C Typ 24 2415 1615 Max 31 2540 1740 2540 1815 150 Unit mA mV mV mV mV mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to -2.2 V. 3. All loading with 50 W to VCC - 2.0 V. Table 6. 10EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 4) -40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 5) Output LOW Voltage (Note 5) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 20 3865 3065 3790 3065 Typ 24 3990 3190 Max 31 4115 3315 4115 3390 150 0.5 Min 20 3930 3130 3855 3130 25C Typ 24 4055 3255 Max 31 4180 3380 4180 3455 150 0.5 Min 20 3990 3190 3915 3190 85C Typ 24 4115 3315 Max 31 4240 3440 4240 3515 150 Unit mA mV mV mV mV mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to -0.5 V. 5. All loading with 50 W to VCC - 2.0 V. Table 7. 10EP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = -5.5 V to -3.0 V (Note 6) -40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 7) Output LOW Voltage (Note 7) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 20 -1135 -1935 -1210 -1935 Typ 24 -1010 -1810 Max 31 -885 -1685 -885 -1610 150 0.5 Min 20 -1070 -1870 -1145 -1870 25C Typ 24 -945 -1745 Max 31 -820 -1620 -820 -1545 150 0.5 Min 20 -1010 -1810 -1085 -1810 85C Typ 24 -885 -1685 Max 31 -760 -1560 -760 -1485 150 Unit mA mV mV mV mV mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Input and output parameters vary 1:1 with VCC. 7. All loading with 50 W to VCC - 2.0 V. http://onsemi.com 4 MC10EP01, MC100EP01 Table 8. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 8) -40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 9) Output LOW Voltage (Note 9) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 15 2155 1355 2075 1355 Typ 24 2280 1480 Max 32 2405 1605 2420 1675 150 0.5 Min 17 2155 1355 2075 1355 25C Typ 26 2280 1480 Max 36 2405 1605 2420 1675 150 0.5 Min 19 2155 1355 2075 1355 85C Typ 28 2280 1480 Max 38 2405 1605 2420 1675 150 Unit mA mV mV mV mV mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 8. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to -2.2 V. 9. All loading with 50 W to VCC - 2.0 V. Table 9. 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 10) -40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 11) Output LOW Voltage (Note 11) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 15 3855 3055 3775 3055 Typ 24 3980 3180 Max 32 4105 3305 4120 3375 150 0.5 Min 17 3855 3055 3775 3055 25C Typ 26 3980 3180 Max 36 4105 3305 4120 3375 150 0.5 Min 19 3855 3055 3775 3055 85C Typ 28 3980 3180 Max 38 4105 3305 4120 3375 150 Unit mA mV mV mV mV mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 10. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to -0.5 V. 11. All loading with 50 W to VCC - 2.0 V. Table 10. 100EP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = -5.5 V to -3.0 V (Note 12) -40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 13) Output LOW Voltage (Note 13) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 15 -1145 -1945 -1225 -1945 Typ 24 -1020 -1820 Max 32 -895 -1695 -880 -1625 150 0.5 Min 17 -1145 -1945 -1225 -1945 25C Typ 26 -1020 -1820 Max 36 -895 -1695 -880 -1625 150 0.5 Min 19 -1145 -1945 -1225 -1945 85C Typ 28 -1020 -1820 Max 38 -895 -1695 -880 -1625 150 Unit mA mV mV mV mV mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 12. Input and output parameters vary 1:1 with VCC. 13. All loading with 50 W to VCC - 2.0 V. http://onsemi.com 5 MC10EP01, MC100EP01 Table 11. AC CHARACTERISTICS VCC = 3.0 V to 5.5 V; VEE = 0 V or VCC = 0 V; VEE = -3.0 V to -5.5 V (Note 14) -40C Symbol fmax tPLH, tPHL tJITTER tr tf Characteristic Maximum Frequency (See Figure 2. Fmax/JITTER) Propagation Delay Cycle-to-Cycle Jitter (See Figure 2. Fmax/JITTER) Output Rise/Fall Times (20% - 80%) Q, Q 50 D to Q, Q 150 Min Typ >3 260 0.2 120 330 <1 170 60 150 Max Min 25C Typ >3 270 0.2 130 330 <1 180 70 200 Max Min 85C Typ >3 300 0.2 150 350 <1 200 Max Unit GHz ps ps ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 14. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC - 2.0 V. 900 800 VOUTpp (mV) 700 600 500 400 300 200 8 JITTEROUT (ps) (RMS) 7 6 5 4 3 2 1 5000 6000 Driver Device Q Zo = 50 W 50 W 50 W D Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.) EEEEEEEEEE EEEEEEEEEE 0 0 1000 2000 3000 Q Zo = 50 W 6 100 (JITTER) 4000 FREQUENCY (MHz) Figure 2. Fmax/Jitter D Receiver Device VTT VTT = VCC - 2.0 V http://onsemi.com EE EE EE MC10EP01, MC100EP01 ORDERING INFORMATION Device MC10EP01D MC10EP01DG MC10EP01DR2 MC10EP01DR2G MC10EP01DT MC10EP01DTG MC10EP01DTR2 MC10EP01DTR2G MC10EP01MNR4 MC10EP01MNR4G MC100EP01D MC100EP01DG MC100EP01DR2 MC100EP01DR2G MC100EP01DT MC100EP01DTG MC100EP01DTR2 MC100EP01DTR2G MC100EP01MNR4 MC100EP01MNR4G Package SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) DFN8 DFN8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) DFN8 DFN8 (Pb-Free) Shipping 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 100 Units / Rail 100 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 1000 / Tape & Reel 1000 / Tape & Reel 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 100 Units / Rail 100 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 1000 / Tape & Reel 1000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1672/D AND8001/D AND8002/D AND8020/D AND8066/D AND8090/D - ECL Clock Distribution Techniques - Designing with PECL (ECL at +5.0 V) - ECLinPSt I/O SPiCE Modeling Kit - Metastability and the ECLinPS Family - Interfacing Between LVDS and ECL - The ECL Translator Guide - Odd Number Counters Design - Marking and Date Codes - Termination of ECL Logic Devices - Interfacing with ECLinPS - AC Characteristics of ECL Devices http://onsemi.com 7 MC10EP01, MC100EP01 PACKAGE DIMENSIONS SOIC-8 NB CASE 751-07 ISSUE AH -X- A 8 5 B 1 S 4 0.25 (0.010) M Y M -Y- G K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 C -Z- H D 0.25 (0.010) M SEATING PLANE N X 45 _ 0.10 (0.004) M J ZY S X S DIM A B C D G H J K M N S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 MC10EP01, MC100EP01 PACKAGE DIMENSIONS TSSOP-8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R-02 ISSUE A 8x K REF 0.10 (0.004) M 0.15 (0.006) T U S 2X TU S V S L/2 8 1 5 L PIN 1 IDENT 4 B -U- 0.25 (0.010) M 0.15 (0.006) T U S A -V- F DETAIL E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ C 0.10 (0.004) -T- SEATING PLANE D G DETAIL E -W- DIM A B C D F G K L M http://onsemi.com 9 MC10EP01, MC100EP01 PACKAGE DIMENSIONS DFN8 CASE 506AA-01 ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 --- 0.25 0.35 D A B PIN ONE REFERENCE E 2X 0.10 C 2X 0.10 C 0.10 C 8X 0.08 C SEATING PLANE A1 8X K ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CCCC CCCC CCCC CCCC e/2 1 TOP VIEW A (A3) C e 4 SIDE VIEW D2 L E2 8 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW http://onsemi.com 10 MC10EP01/D |
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