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H11AA1-M, H11AA2-M, H11AA3-M, H11AA4-M AC Input/Phototransistor Optocouplers
April 2006
H11AA1-M, H11AA2-M, H11AA3-M, H11AA4-M AC Input/Phototransistor Optocouplers
Features
Bi-polar emitter input Built-in reverse polarity input protection Underwriters Laboratory (UL) recognized File
Description
The H11AAX-M series consists of two gallium-arsenide infrared emitting diodes connected in inverse parallel driving a single silicon phototransistor output.
#E90700, Volume 2
VDE approved File #102497 (ordering option `V')
Applications
AC line monitor Unknown polarity DC sensor Telephone line interface
Package and Schematic
1
6 BASE
2
5 COLL
3
4 EMITTER
(c)2006 Fairchild Semiconductor Corporation
1
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H11AAX-M Rev. 1.0.0
H11AA1-M, H11AA2-M, H11AA3-M, H11AA4-M AC Input/Phototransistor Optocouplers
Absolute Maximum Ratings (TA =25C Unless otherwise specified)
Symbol
TOTAL DEVICE TSTG TOPR TSOL PD EMITTER IF IF(pk) PD DETECTOR IC PD Continuous Collector Current Detector Power Dissipation Derate linearity from 25C All All 50 150 1.76 mA mW mW/C Continuous Forward Current Forward Current - Peak (1s pulse, 300 pps) LED Power Dissipation Derate Linearly From 25C All All All 60 1.0 120 1.41 mA A mW mW/C Storage Temperature Operating Temperature Lead Solder Temperature Total Device Power Dissipation Derate Linearly From 25C All All All All -40 to +150 -40 to +100 260 for 10 sec 250 2.94 C C C mW mW/C
Parameter
Device
Value
Units
Electrical Characteristics (TA = 25C Unless otherwise specified.)
Individual Component Characteristics Symbol
EMITTER VF CJ Input Forward Voltage Capacitance Breakdown Voltage Collector to Emitter Collector to Base Emitter to Base Emitter to Collector Leakage Current Collector to Emitter Capacitance Collector to Emitter Collector to Base Emitter to Base IF = 10mA VF = 0 V, f = 1.0MHz All All 1.17 80 1.5 V pF
Parameter
Test Conditions
Device
Min.
Typ.*
Max.
Unit
DETECTOR BVCEO BVCBO BVEBO BVECO ICEO CCE CCB CEB IC = 1.0mA, IF = 0 IC = 100A, IF = 0 IE = 100A, IF = 0 IE = 100A, IF = 0 VCE = 10 V, IF = 0 VCE = 0, f = 1MHz VCB = 0, f = 1MHz VEB = 0, f = 1MHz All All All All H11AA1,3,4(-M) H11AA2-M All All All 30 70 5 7 100 120 10 10 1 1 10 80 15 50 200 pF pF pF V V V V nA
*Typical values at TA = 25C
2 H11AAX-M Rev. 1.0.0
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H11AA1-M, H11AA2-M, H11AA3-M, H11AA4-M AC Input/Phototransistor Optocouplers
Transfer Characteristics (TA = 25C Unless otherwise specified.)
Symbol
CTRCE
Characteristics
Current Transfer Ratio, Collector to Emitter
Test Conditions
IF = 10mA, VCE = 10V
Device
H11AA4-M H11AA3-M H11AA1-M H11AA2-M
Min.
100 50 20 10 .33
Typ.*
Max.
Units
%
Current Transfer Ratio, Symmetry VCE(SAT) Saturation Voltage, Collector to Emitter
IF = 10mA, VCE = 10V (Figure 11) IF = 10mA, ICE = 0.5mA
All All
3.0 .40 V
Isolation Characteristics
Symbol
CI-O VISO RISO
Characteristic
Package Capacitance Input/Output Isolation Voltage Isolation Resistance
Test Conditions
VI-O = 0, f = 1MHz f = 60 Hz, t = 1 sec. VI-O = 500 VDC
Min.
Typ.*
0.7
Max.
Units
pF Vac(pk)
7500 1011
*Typical values at TA = 25C
3 H11AAX-M Rev. 1.0.0
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H11AA1-M, H11AA2-M, H11AA3-M, H11AA4-M AC Input/Phototransistor Optocouplers
Typical Performance Characteristics
Fig. 1 Input Voltage vs. Input Current
100 TA = 25C 80
1.2 1.4 TA = 25C VCE = 5V Normalized to IF = 10mA
Fig. 2 Normalized CTR vs. Forward Current
I F - INPUT CURRENT (mA)
60 40 20 0 -20 -40 -60
0.2 1.0
NORMALIZED CTR
0.8
0.6
0.4
-80 -100 -2.0
0.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
0
5
10
15
20
VF - INPUT VOLTAGE (V)
IF - FORWARD CURRENT (mA)
Fig. 3 Normalized CTR vs. Ambient Temperature
1.4 VCE = 5V Normalized to IF = 10mA, TA = 25C 1.2 IF = 10mA
Fig. 4 CTR vs. RBE (Unsaturated)
1.0
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
V 0.9 0.8 0.7
CE
= 5V
TA = 25C
NORMALIZED CTR
1.0 IF = 5mA 0.8 IF = 20mA 0.6
IF = 20mA
0.6
IF = 10mA
0.5
IF = 5mA
0.4 0.3 0.2 0.1 0.0 10 100 1000
0.4
0.2 -60 -40 -20 0 20 40 60 80 100
TA - AMBIENT TEMPERATURE (C)
RBE - BASE RESISTANCE (k)
Fig. 5 CTR vs. RBE (Saturated)
1.0
Fig. 6 Collector-Emitter Saturation Voltage vs Collector Current
VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
100 T = 25C
A
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
V 0.9 0.8 0.7
CE
= 0.3V
TA = 25C
10
IF = 20mA 0.6 IF = 10mA 0.5 IF = 5mA 0.4 0.3 0.2 0.1 0.0 10 100 1000
1
IF = 2.5mA
IF = 5mA
0.1
0.01
IF = 10mA
IF = 20mA
RBE- BASE RESISTANCE (k )
0.001 0.01
0.1
1
10
IC - COLLECTOR CURRENT (mA)
4 H11AAX-M Rev. 1.0.0
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H11AA1-M, H11AA2-M, H11AA3-M, H11AA4-M AC Input/Phototransistor Optocouplers
Typical Performance Characteristics (Continued)
Fig. 7 Switching Speed vs. Load Resistor
1000 IF = 10mA VCC = 10V T = 25C
A
Fig. 8 Normalized ton vs. RBE
7 VCC = 10V IC = 2mA RL = 100 T = 25C
A
100
NORMALIZED ton - (ton(RBE) / ton(open))
6
SWITCHING SPEED - (s)
5
Toff 10
Tf
4
3
Ton 1 Tr
2
1
0.1 0.1 1 10 100
0 10 100 1000 10000 100000
R-LOAD RESISTOR (k)
RBE- BASE RESISTANCE (k )
Fig. 9 Normalized toff vs. RBE
3.0
10000
Fig. 10 Dark Current vs. Ambient Temperature
ICEO - COLLECTOR -EMITTER DARK CURRENT (nA)
NORMALIZED toff - (toff(RBE) / toff(open))
2.5
VCC = 10V IC = 2mA RL = 100 T = 25C
A
1000
2.0
100
1.5
10
VCE = 30V
VCE = 10V
1.0
1
0.5
0.0 10 100 1000 10000 100000
0.1 0 20 40 60 80 100
RBE- BASE RESISTANCE (k)
TA - AMBIENT TEMPERATURE (C)
Fig. 11 Output Symmetry Characteristics
10 5
NORMALIZED OUTPUT CURRENT
IF = 1 .5 IF =
I - 10mA I I 10mA I
.1 .05
NORMALIZED TO: VCE = 10 V IF = 10 mA THE MAXIMUM PEAK OUTPUT CURRENT WILL BE NO MORE THAN THREE TIMES THE MINIMUM PEAK OUTPUT CURRENT AT IF = 10 mA .05 .1 .5 1 5 10
.01 .005
.01
VCE - COLLECTOR TO EMITTER VOLTAGE (V)
5 H11AAX-M Rev. 1.0.0
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H11AA1-M, H11AA2-M, H11AA3-M, H11AA4-M AC Input/Phototransistor Optocouplers
Mechanical Dimensions
Package Dimensions (Through Hole)
0.350 (8.89) 0.320 (8.13)
Package Dimensions (Surface Mount)
0.350 (8.89) 0.320 (8.13)
0.260 (6.60) 0.240 (6.10)
0.260 (6.60) 0.240 (6.10)
0.390 (9.90) 0.332 (8.43)
0.070 (1.77) 0.040 (1.02)
0.070 (1.77) 0.040 (1.02)
0.014 (0.36) 0.010 (0.25) 0.320 (8.13)
0.320 (8.13) 0.014 (0.36) 0.010 (0.25)
0.200 (5.08) 0.115 (2.93)
0.200 (5.08) 0.115 (2.93)
0.012 (0.30) 0.008 (0.20)
0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15 0.012 (0.30)
0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41)
0.100 [2.54] 0.035 (0.88) 0.006 (0.16)
Package Dimensions (0.4" Lead Spacing)
Recommended Pad Layout for Surface MountLeadform
0.070 (1.78)
0.350 (8.89) 0.320 (8.13)
0.260 (6.60) 0.240 (6.10)
0.060 (1.52)
0.425 (10.79)
0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25)
0.100 (2.54) 0.305 (7.75) 0.030 (0.76)
0.200 (5.08) 0.115 (2.93)
0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16)
Note: All dimensions are in inches (millimeters).
6 H11AAX-M Rev. 1.0.0
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H11AA1-M, H11AA2-M, H11AA3-M, H11AA4-M AC Input/Phototransistor Optocouplers
Ordering Information
Option/Order Entry Identifier
S SR2 T V TV SV SR2V
Description
Surface Mount Lead Bend Surface Mount; Tape and Reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape & Reel
Marking Information
1
H11AA1 V
3 4
2 6
X YY Q
5
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code, e.g., `3' Two digit work week ranging from `01' to `53' Assembly package code
*Note - Parts that do not have the `V' option (see definition 3 above) that are marked with date code `325' or earlier are marked in portrait format.
7 H11AAX-M Rev. 1.0.0
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H11AA1-M, H11AA2-M, H11AA3-M, H11AA4-M AC Input/Phototransistor Optocouplers
Carrier Tape Specifications
12.0 0.1 4.5 0.20 2.0 0.05 0.30 0.05 4.0 0.1 O1.5 MIN 1.75 0.10
11.5 1.0 21.0 0.1 9.1 0.20 24.0 0.3
0.1 MAX
10.1 0.20
O1.5 0.1/-0
User Direction of Feed
Reflow Profile (White Package, -M Suffix)
300 280 260 240 220 200 180 160 C 140 120 100 80 60 40 20 0 0 260C >245C = 42 Sec
Time above 183C = 90 Sec 1.822C/Sec Ramp up rate
33 Sec 60 120 180 270 360
Time (s)
8 H11AAX-M Rev. 1.0.0
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TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet SeriesTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FAST(R) FASTrTM FPSTM FRFETTM DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
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LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
Rev. I20

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