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NUF4107FC 4 Channel EMI Pi-Filter Array with Full USB Filter
This device is a 4 channel EMI filter array for data lines. Greater than -35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers USB filtering circuitry with speed detection. This includes the inline resistors for impedance matching and EMI filtering. ESD protection is provided across all capacitors.
Features http://onsemi.com CIRCUIT DESCRIPTION
A1 D1 C1 R2 D2 D11 A3 D3 C3 B3 A4 D5 C5 B4 A5 D7 C7 B5 A6 D9 Symbol VPP 30 16 0.4 PR PT TJ Top Tstg 100 600 150 -40 to +85 -55 to +150 mW mW C C C A1 Value Unit kV C9 C10 R6 C6 D10 R5 C8 C5 D8 R4 C6 C4 D6 C2 B2 R3 C4 C3 D4 B1 C2 R1 C1 R7
* * * * * * * * * * * * * *
EMI Filtering and ESD Protection for Data Lines USB 1.1 Filtering Provided with Speed Detection Integration of 27 Discretes Offers Cost and Space Savings Pb-Free Package May be Available. The G-Suffix Denotes a Pb-Free Lead Finish 350 mm Solder Spheres All TVS Protected Inputs Comply with IEC61000-4-2 (Level 4) 30 kV (Contact) 30 kV (Air) Low Profile Flip-Chip Packaging MSL 1 All Pins Exceed 2000 Volts Human Body Model EMI and USB Filtering and ESD Protection for Data Lines Cell Phones Handheld Portables Notebook Computers MP3 Players
Rating ESD Discharge IEC61000-4-2 (Note 1) - Air Discharge, Contact Discharge Human Body Model Machine Model DC Power per Resistor DC Power per Package Junction Temperature Operating Temperature Range Storage Temperature Range
A2
Typical Applications
MAXIMUM RATINGS (TA = 25C)
FLIP-CHIP-17 CASE 499AD
DEVICE MARKING
1. This does not include Pins B1, C1 and C2
ORDERING INFORMATION
Device NUF4107FCT1G Package Flip-Chip Shipping 3000/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2004
1
April, 2004 - Rev. 0
EE EE
NUF4107
Publication Order Number: NUF4107FC/D
NUF4107FC
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Symbol VBR IR R3 - R6 R1, R2 R7 Cline C1, C2 Cpower IR = 1 mA VRM = 3.3 V per line EMI Filter Resistors USB Resistors; Impedance Matching USB Pull-up; Speed Detection Resistor At 2.5 V Bias At Pins A1 and A2; At 2.5 V Bias At Pins B2; At 2.5 V Bias Characteristic Min 6.0 - 80 18 1250 48 29 54 Typ 6.8 - 100 22 1500 60 36 68 Max 8.0 0.1 120 26 1750 72 43 82 Unit V mA W W W pF pF pF
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NUF4107FC
TYPICAL CHARACTERISTICS
110 108 24 RESISTANCE RESISTANCE -20 0 20 40 60 80 85 23 22 21 20 19 -40 106 104 102 100 98 96 94 92 90 -40 -20 0 20 40 60 80 85
25
TEMPERATURE C
TEMPERATURE C
Figure 1. USB 1.1 Resistors (R1, R2) vs. Temperature
Figure 2. Data Resistors (R3, R4, R5, R6) vs. Temperature
0 -10 -20 S21 (dB) USB2 -30 -40 -50 -60 Test Conditions: Pins B1, B2 floating Vline = 0 V 1 10 100 1000 FREQUENCY (MHz) 10,000 USB1
1600 1580 1560 RESISTANCE 1540 1520 1500 1480 1460 1440 1420 1400 -40 -20 0 20 40 60 80 85
TEMPERATURE C
Figure 3. Pull-up Resistor (R7) vs. Temperature
Figure 4. Insertion Loss Characteristic USB1, USB2
0 -10 -20 Test Conditions: Pins B1, B2 floating Vline = 0 V
0 -5 -10 -15 S21 (dB) -20 -25 -30 -35 -40 -45 -50 1 10 100 1000 FREQUENCY (MHz) 10,000 Test Conditions: Pins B1, B2 floating Vline = 0 V EMI5 EMI4 EMI6 EMI3 S41 (dB)
-30 -40 -50 -60 -70 -80 -90 1 10 100 1000 FREQUENCY (MHz) 10,000 USB1 - USB2 USB2 - EMI3 EMI3 - EMI4 EMI5 - EMI6 EMI4 - EMI5
Figure 5. Insertion Loss Characteristic EMI3, EMI4, EMI5, EMI6
Figure 6. Analog Crosstalk Curve EMI Filter
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NUF4107FC
Printed Circuit Board Recommendations
Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width 500 mm Pitch 300 mm Solder Ball 250 mm +25 250 mm -0 Round NSMD 350 mm 25 125 mm 250 x 250 mm sq. 50/50 No Clean Type 3 or Finer OSP Cu 150 mm Max
Copper
Solder Mask
NSMD
SMD
Figure 7. Solder Mask versus Non-Solder Mask Definition
0- 15 - 30 - 45 - 60 - 75 - 90 - 105 - 119 - 134 - 149 - 165 - 180 - 195 - 209 - 224 - 239 - 254 - 269 - 284 - 299 - 314 - 329 - 344 - 359 - 374 - 389 - 404 - 419 - 434 - 449 - 464 - 479 - 494 -
280 270 260 250 240 230 TL= 217 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0
- - - - - - - - - - - - - - - - - - - - - - - - - - - -
Tp = (15-30 sec) Tp = 260C - 5C RAMP-UP
TEMPERATURE (C)
RAMP-DOWN tL (60-90 sec)
PRE-HEAT ZONE
TIME (seconds)
Figure 8. Typical Pb-Free Solder Heating Profile
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NUF4107FC
PACKAGE DIMENSIONS
FLIP-CHIP-17 CSP CASE 499AD-01 ISSUE O
4X
D
A
B
TERMINAL A1 LOCATOR
0.10 C A2 0.05 C A C
17 X
b
0.05 C A B 0.03 C
EE EE
TOP VIEW SIDE VIEW
SEATING PLANE
0.10 C
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS MIN MAX --- 0.740 0.250 0.310 0.380 0.430 2.960 BSC 1.330 BSC 0.290 0.350 0.500 BSC 0.435 BSC 2.500 BSC 0.870 BSC
E
DIM A A1 A2 D E b e e1 D1 E1
A1
D1 e /2
C B
e
E1 e1
A 1 2 3 4 5 6
BOTTOM VIEW
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NUF4107FC
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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NUF4107FC/D

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