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| USBULC6-2F3 IPADTM Dual ultra low capacitance protection for high speed USB Main application Hi-Speed USB port in wireless handsets (up to 480 Mb/s according to USB 2.0 High Speed Specification) Features Ultra low diode capacitance (1.2 pF max) Two data lines (D+ and D-) protected against 15 kV ESD Breakdown Voltage VBR = 6.0 V min Flip-Chip 400 m pitch, lead-free Very low leakage current Very small PCB area RoHS compliant Flip-Chip (4 Bumps) Pin configuration (bump side) A B 1 2 Description The USBULC6-2F3 is a monolithic, application specific discrete device dedicated to ESD protection of high speed interfaces. Its ultra low line capacitance secures a high level of signal integrity without compromizing the protection of downstream sensitive chips against the most stringently characterized ESD strikes. Configuration A1 B1 Benefits Minimized impact on rise and fall times for maximum data integrity Low PCB space occupation Higher reliability offered by monolithic integration A2 B2 Note: B1 and B2 bumps must be grounded on the PCB together Complies with the following standards: IEC 61000-4-2: 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G - Method 3015.7 25 kV (Human body model) Order code Part Number USBULC6-2F3 Marking EH TM: IPAD is a trademark of STMicroelectronics December 2006 Rev 1 1/8 www.st.com Characteristics USBULC6-2F3 1 Characteristics Table 1. Symbol VPP PPP Tj Top Tstg Absolute Maximum Ratings (Tamb = 25 C) Parameter ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge Peak pulse power dissipation (8/20 s) Maximum junction temperature Operating temperature range Storage temperature range Value 15 8 60 125 -30 to + 85 -55 to +150 Unit kV W C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP T VF Electrical characteristics (Tamb = 25 C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Voltage temperature coefficient Forward voltage drop Test conditions IR = 1 mA VRM = 3 V Exponential wave form 8/20 s, Ipp = 1 to 5 A IR = 1 mA VLINE = 0 V, VOSC = 30 mV, F = 1 MHz 1.6 5 1.2 Min. 6 Typ. Max. 9 100 Unit V nA 10-4/ pF C Slope = 1/Rd I IF VCL VBR VRM IRM VF V IPP Symbol VBR IRM Rd T Cline Figure 1. Application diagram USB CONNECTOR Vbus Vbus B2 A2 D- D- D+ B1 A1 D+ GND GND TO USB TRANSCEIVER 2/8 USBULC6-2F3 Characteristics Figure 2. Eye diagram, board only (according Figure 3. to USB High Speed) Eye diagram, board with USBULC6-2F3 (according to USB 2.0 High Speed) Board 480 Mb/s USBULC6-2F3 480 Mb/s Horiz: 350 ps/div Ver: 200 mV/div Horiz: 350 ps/div Ver: 200 mV/div Figure 4. ESD response to IEC 61000-4-2 (+15 kV air discharge) Figure 5. ESD response to IEC 61000-4-2 (-15 kV air discharge X: 50 ns/division Y: 20 V/division 1 Gs/s X: 50 ns/division Y: 20 V/division 1 Gs/s Figure 6. C(pF) Junction capacitance versus frequency (typical values) VOSC=30 mVRMS Tj=25 C Figure 7. Analog crosstalk measurements 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.00 dB USBULC6 -2F3 -30.00 -60.00 -90.00 F(Hz) 1.E+08 1.E+09 -120.00 100.0k 1.0M 10.0M F (Hz) 100.0M 1.0G 1.E+07 3/8 Characteristics USBULC6-2F3 Figure 8. dB 0.00 S21 (dB) attenuation measurements USBULC6-2F3 -2.00 -4.00 -6.00 -8.00 F (Hz) -10.00 100.0k 1.0M 10.0M 100.0M 1.0G Figure 9. Digital crosstalk 90% Rise time = 1.647 ns INPUT: 1 V/div 0 mV offset 2 ns/div 5 Gs/s 10% Vpkpk = 205 mV OUTPUT: 100 m V/div -300 mV offset 2 ns/div 5 Gs/s Figure 10. Relative variation of peak pulse power versus initial junction temperature 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 Tj(C) Figure 11. Peak pulse power versus exponential pulse duration PPP(W) Tj initial = 25 C PPP[T j initial] / PPP [T j initial=25C] 1000 100 tP(s) 10 1 10 100 4/8 USBULC6-2F3 Ordering information scheme Figure 12. Clamping voltage versus peak pulse current (typical values, exponential waveform) 100.0 Figure 13. Relative variation of leakage current versus junction temperature (typical values) IR [T j] / IR [T j=25C] 1.E+02 VR =3 V IPP(A) 10.0 1.E+01 1.0 VCL(V) 0.1 0 10 20 30 40 50 8/20 s Tj initial =25 C T j(C) 1.E+00 60 70 25 50 75 100 125 2 Ordering information scheme USB ULC 6 - 2 F3 USB protection Ultra Low Capacitance Breakdown voltage 6 = 6 VMIN Number of lines 2 = 2 lines Package F = Flip-Chip 3: Lead free, Pitch = 400 m, Bump = 255 m 5/8 Package information USBULC6-2F3 3 Package information Figure 14. Flip-Chip dimensions 400 m 40 400 m 40 605 m 55 0.92 mm 30 m 255 m 40 Figure 15. Foot print recommendations Figure 16. Marking 0.97 mm 30m Dot xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 220m recommended 260m maximum Solder mask opening: 300m minimum Solder stencil opening : 220m recommended xxz y ww 6/8 USBULC6-2F3 Figure 17. Flip-Chip tape and reel specifications Dot identifying Pin A1 location 4 +/- 0.1 Ordering information O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 1.07 8 +/- 0.3 1.02 xxz yww xxz yww xxz yww 0.71 4 +/- 0.1 All dimensions in mm User direction of unreeling In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Note: More information is available in the application notes: AN2348: "400 m Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" 4 Ordering information Part Number USBULC6-2F3 Marking EH Package Flip-Chip Weight 1.16 mg Base qty 5000 Delivery mode Tape and reel (7") 5 Revision history Date 15-Dec-2006 Revision 1 Initial release Changes 7/8 USBULC6-2F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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