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 IRFM250
MECHANICAL DATA Dimensions in mm (inches)
13.59 (0.535) 13.84 (0.545) 3.53 (0.139) Dia. 3.78 (0.149) 6.32 (0.249) 6.60 (0.260) 1.02 (0.040) 1.27 (0.050)
N-CHANNEL POWER MOSFET
VDSS ID(cont) RDS(on)
FEATURES
* N-CHANNEL MOSFET * HIGH VOLTAGE * INTEGRAL PROTECTION DIODE * HERMETIC ISOLATED TO-254 PACKAGE
30.35 (1.195) 31.40 (1.235) 16.89 (0.665) 17.40 (0.685) 13.59 (0.535) 13.84 (0.545)
1
2
3
20.07 (0.790) 20.32 (0.800)
200V 27.4A 0.100
0.89 (0.035) 1.14 (0.045) 3.81 (0.150) BSC
3.81 (0.150) BSC
* CERAMIC SURFACE MOUNT PACKAGE OPTION
TO-254AA - Isolated Metal Package
Pin 1 - Drain Pin 2 - Source Pin 3 - Gate
ABSOLUTE MAXIMUM RATINGS (TC = 25C unless otherwise stated)
VGS ID IDM PD IL dv / dt RJC RJA RCS TJ , TSTG TL
1) 2)
Gate - Source Voltage Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Avalanche Current , Clamped 1 Peak Diode Recovery 2 Thermal Resistance Junction - Case Thermal Resistance Junction - Ambient Thermal Resistance Case - Sink Operating Junction and Storage Temperature Range Lead Temperature (1.6mm from case for 10s)
VDD = 50V , Starting TJ = 25C , L 1mH , RG = 25 , Peak IL = 27.4A ISD 27.4A , di/dt 190A / S , VDD BVDSS , TJ 150C , Suggested RG = 2.35
Telephone (01455) 556565. Telex: 341927. Fax (01455) 552612.
@ VGS = 10V , TC = 25C @ VGS = 10V , TC = 100C @ TC = 25C
20V 27.4A 17A 110A 150W 1.2W / C 27.4A 5.5V / ns 0.83C / W 48C / W 0.21C / W typ. -55 to 150C 300C
Semelab plc.
Prelim. 9/95
IRFM250
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise stated)
Parameter
BVDSS TJ RDS(on) STATIC ELECTRICAL RATINGS Drain - Source Breakdown Voltage Breakdown Voltage Static Drain - Source On-State Resistance
2
Test Conditions
VGS = 0 ID = 1mA VGS = 10V VGS = 10V VDS = VGS
2
Min.
200
Typ.
Max.
Unit
V
ID = 1mA
BVDSS Temperature Coefficient of
Reference to 25C ID = 17A ID = 27.4A ID = 250A IDS = 27.4A VDS = 0.8BVDSS TJ = 125C VGS = 20V VGS = -20V 2 9
0.28 0.100 0.105 4 25 250 100 -100 3500 700 110 12 55 8 30 115 22 60 35 190 170 130 27.4 110
V / C V S( A nA )(
VGS(th) Gate Threshold Voltage gfs IDSS IGSS IGSS Ciss Coss Crss CDC Qg Qgs Qgd td(on) tr td(off) tf IS ISM VSD trr Qrr ton LD LS Forward Transconductance
VDS 15V VGS = 0
Zero Gate Voltage Drain Current Forward Gate - Source Leakage Reverse Gate - Source Leakage DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance Drain - Case Capacitance Total Gate Charge Gate - Source Charge Gate - Drain ("Miller") Charge Turn- On Delay Time Rise Time Turn-Off Delay Time Fall Time
VGS = 0 VDS = 25V f = 1MHz VGS = 10V ID = 27.4A VDS = 0.5BVDSS VDD = 100V ID = 27.4A RG = 2.35
pF
nC
ns
SOURCE - DRAIN DIODE CHARACTERISTICS Continuous Source Current Pulse Source Current
1
A V ns C
Diode Forward Voltage 2 Reverse Recovery Time 2 Reverse Recovery Charge Forward Turn-On Time
2
IS = 27.4A VGS = 0 IF = 27.4A
TJ = 25C TJ = 25C Negligible 8.7 8.7
1.9 950 9.0
di / dt 100A/s VDD 50V
PACKAGE CHARACTERISTICS Internal Drain Inductance Measured from 6mm down drain lead to centre of die Internal Source Inductance
Measured from 6mm down source lead to source bond pad
nH
Notes 1) Repetitive Rating - Pulse width limited by Maximum Junction Temperature 2) Pulse Test: Pulse Width 300s, 2%.
Semelab plc.
Telephone (01455) 556565. Telex: 341927. Fax (01455) 552612.
Prelim. 9/95


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