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| Philips Semiconductors Package outline Plastic surface mounted package; reverse pinning; 4 leads SOT143R D B E A X y vMA HE e bp wM B 3 4 Q A A1 c 2 b1 e1 1 Lp detail X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 max 0.1 bp 0.48 0.38 b1 0.88 0.78 c 0.15 0.09 D 3.0 2.8 E 1.4 1.2 e 1.9 e1 1.7 HE 2.5 2.1 Lp 0.55 0.25 Q 0.45 0.25 v 0.2 w 0.1 y 0.1 OUTLINE VERSION SOT143R REFERENCES IEC JEDEC JEITA SC-61AA EUROPEAN PROJECTION ISSUE DATE 99-09-13 04-11-16 SOT143R (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. 29 November 2004 1 of 1 |
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