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BSI
n FEATURES
Ultra Low Power/High Speed CMOS SRAM 1M X 8 bit
n DESCRIPTION
BH62UV8000
Y Wide VCC low operation voltage : 1.65V ~ 3.6V Y Ultra low power consumption : VCC = 3.0V Operation current : 5.0mA at 70ns at 25OC 1.5mA at 1MHz at 25OC Standby current : 2.5uA at 25OC VCC = 2.0V Data retention current : 2.5uA at 25OC Y High speed access time : -70 70ns at 1.8V at 85OC Y Automatic power down when chip is deselected Y Easy expansion with CE1, CE2 and OE options Y Three state outputs and TTL compatible Y Fully static operation, no clock, no refreash Y Data retention supply voltage as low as 1.0V
The BH62UV8000 is a high performance, ultra low power CMOS Static Random Access Memory organized as 1,048,576 by 8 bits and operates in a wide range of 1.65V to 3.6V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with typical operating current of 1.5mA at 1MHz at 3.6V/25OC and maximum access time of 70ns at 1.8V/85OC. Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2) and active LOW output enable (OE) and three-state output drivers. The BH62UV8000 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BH62UV8000 is available in DICE form and 48-ball BGA package.
n PRODUCT FAMILY
PRODUCT FAMILY OPERATING TEMPERATURE VCC RANGE SPEED (ns)
VCC=1.8~3.6V
POWER CONSUMPTION
STANDBY
(ICCSB1, Max)
Operating
(ICC, Max)
PKG TYPE
VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V
+0OC to +70OC BH62UV8000AI 1.65V ~ 3.6V BH62UV8000DI -25OC to +85OC
70
13uA
10uA
10mA
7mA BGA-48-0608 DICE
70
15uA
12uA
10mA
7mA
n PIN CONFIGURATIONS
1 A NC 2 OE 3 A0 4 A1 5 A2 6 CE2
n BLOCK DIAGRAM
B
NC
NC
A3
A4
CE1
NC
C
DQ0
NC
A5
A6
NC
D04
A12 A11 A10 A9 A8 A7 A6 A5 A4 A3
Address Input Buffer
10 Row Decoder
1024
Memory Array
1024 x 18192
D
VSS
DQ1
A17
A7
DQ5
VCC
DQ0 DQ1 8 Data Input Buffer 8 8
8192 Column I/O Write Driver Sense Amp 1024 Column Decoder 10 Control Address Input Buffer
E
VCC
DQ2
VSS
A16
DQ6
VSS
DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 8
F
D3
NC
A14
A15
NC
DQ7
Data Output Buffer
G
NC
NC
A12
A13
WE
NC
CE1 CE2 WE OE VCC GND
H
A18
A8
A9
A10
A11
A19
A19 A18 A17 A15 A14 A13 A16 A2 A1 A0
48-ball BGA top view
Brilliance Semiconductor, Inc. reserves the right to modify document contents without notice.
Detailed product characteristic test report is available upon request and being accepted.
R0201-BH62UV8000
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Revision 1.0 Jul. 2005
BSI
n PIN DESCRIPTIONS
BH62UV8000
Function
These 20 address inputs select one of the 1,048,576 x 8 bit in the RAM
Name
A0-A19 Address Input CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input
CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when data read from or write to the device. If either chip enable is not active, the device is deselected and is in standby power mode. The DQ pins will be in the high impedance state when the device is deselected. The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impendence state when OE is inactive. 8 bi-directional ports are used to read data from or write data into the RAM.
WE Write Enable Input
OE Output Enable Input
DQ0-DQ7 Data Input/Output Ports VCC VSS
Power Supply Ground
n TRUTH TABLE MODE
Chip De-selected (Power Down) Output Disabled Read Write
CE1
H X L L L
CE2
X L H H H
WE
X X H H L
OE
X
I/O OPERATION
High Z
VCC CURRENT
ICCSB, ICCSB1 ICC ICC ICC
X H L X High Z DOUT DIN
NOTES: H means VIH; L means VIL; X means don't care (Must be VIH or VIL state)
n ABSOLUTE MAXIMUM RATINGS
SYMBOL
VTERM TBIAS TSTG PT IOUT
(1)
n OPERATING RANGE
UNITS
V
O O
PARAMETER
Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature Power Dissipation DC Output Current
RATING
-0.5
(2)
RANG
Commercial Industrial
AMBIENT TEMPERATURE
0OC to + 70OC -25 C to + 85 C
O O
VCC
1.65V ~ 3.6V 1.65V ~ 3.6V
to 4.6V
-40 to +125 -60 to +150 1.0 20
C C
W mA
n CAPACITANCE
(1)
(TA = 25 C, f = 1.0MHz)
O
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. -2.0V in case of AC pulse width less than 30 ns R0201-BH62UV8000
SYMBOL PAMAMETER CONDITIONS MAX. UNITS
Input VIN = 0V 6 Capacitance Input/Output CIO VI/O = 0V 8 Capacitance 1. This parameter is guaranteed and not 100% tested. CIN pF pF
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Revision 1.0 Jul. 2005
BSI
n DC ELECTRICAL CHARACTERISTICS (TA = -25 C to +85 C)
PARAMETER NAME VCC VIL VIH IIL ILO VOL VOH ICC ICC1 ICCSB ICCSB1
1. 2. 3. 4. 5.
(5)
BH62UV8000
O O
PARAMETER
Power Supply Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Current Power Supply
TEST CONDITIONS
MIN.
1.65
VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V
TYP.(1)
-------4.5 5.0 1.0 1.5 -2.5 2.5
MAX.
3.6 0.4 0.8 VCC+0.3(3) 1 1 0.2 0.4 -7 10 1.5 2.0 0.5 1.0 12 15
UNITS
V V V uA uA V V mA mA mA uA
-0.3(2) 1.4 2.0 ---
VIN = 0V to VCC, CE1 = VIH or CE2 = VIL VI/O = 0V to V CC, CE1 = VIH or CE2 = VIL or OE = VIH V CC = Max, IOL = 0.1mA V CC = Max, IOL = 2.0mA V CC = Min, IOH = -0.1mA V CC = Min, IOH = -1.0mA CE1 = VIL, CE2 = VIH, IDQ = 0mA, f = FMAX(4) CE1 = VIL and CE2 = VIH, IDQ = 0mA, f = 1MHz CE1 = VIH, or CE2 = VIL, IDQ = 0mA CE1VCC-0.2V or CE20.2V, VINV CC-0.2V or VIN0.2V
VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V
-VCC-0.2 2.4 -----
Operating Power Supply Current Standby Current - TTL Standby Current - CMOS
Typical characteristics are at TA=25OC. Undershoot: -1.0V in case of pulse width less than 20 ns. Overshoot: VCC+1.0V in case of pulse width less than 20 ns. FMAX=1/tRC. ICCSB1(MAX.) is 10uA/13uA at VCC=1.8V/3.6V and TA=0OC ~ 70OC.
O O
n DATA RETENTION CHARACTERISTICS (TA = -25 C to +85 C)
SYMBOL VDR ICCDR
(3)
PARAMETER
VCC for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time
TEST CONDITIONS
CE1VCC-0.2V or CE20.2V, VINVCC-0.2V or VIN0.2V CE1VCC-0.2V or CE20.2V, VINVCC-0.2V or VIN0.2V
VCC=1.0V VCC=2.0V
MIN.
1.0 -0
TYP. (1)
-0.5 2.5 ---
MAX.
-3.0 12 ---
UNITS
V uA ns ns
tCDR tR
O
See Retention Waveform tRC (2)
1. TA=25 C. 2. tRC = Read Cycle Time. 3. ICCDR(MAX.) is 2.5uA /10uA at VCC=1.0V/2.0V and TA=0OC ~ 70OC.
n LOW VCC DATA RETENTION WAVEFORM (1) (CE1 Controlled)
Data Retention Mode
VCC
VIH
VCC
VDR1.0V
VCC
tCDR
CE1VCC - 0.2V
tR
VIH
CE1
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Revision 1.0 Jul. 2005
BSI
n LOW VCC DATA RETENTION WAVEFORM (2) (CE2 Controlled)
Data Retention Mode VCC VDR1.0V
BH62UV8000
VCC
VCC
tCDR
tR
CE20.2V
CE2
VIL
VIL
n AC TEST CONDITIONS
(Test Load and Input/Output Reference) Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level tCLZ1, tCLZ2, tOLZ, tCHZ1, tCHZ2, tOHZ, tWHZ, tOW Output Load Others VCC / 0V 1V/ns 0.5Vcc CL = 5pF+1TTL CL = 30pF+1TTL
n KEY TO SWITCHING WAVEFORMS
WAVEFORM INPUTS MUST BE STEADY MAY CHANGE FROM "H" TO "L" MAY CHANGE FROM "L" TO "H" ALL INPUT PULSES OUTPUTS MUST BE STEADY WILL BE CHANGE FROM "H" TO "L" WILL BE CHANGE FROM "L" TO "H" CHANGE : STATE UNKNOW CENTER LINE IS HIGH INPEDANCE "OFF" STATE
1 TTL Output CL(1)
VCC GND
10%
90%
90% 10%
DON'T CARE ANY CHANGE PERMITTED DOES NOT APPLY
Rise Time: 1V/ns
Fall Time: 1V/ns
1. Including jig and scope capacitance.
n AC ELECTRICAL CHARACTERISTICS (TA = -25 C to +85 C) READ CYCLE
JEDEC PARAMETER NAME PARANETER NAME CYCLE TIME : 70ns DESCRIPTION Read Cycle Time Address Access Time Chip Select Access Time Chip Select Access Time Output Enable to Output Valid Chip Select to Output Low Z Chip Select to Output Low Z Output Enable to Output Low Z Chip Select to Output High Z Chip Select to Output High Z Output Enable to Output High Z Data Hold from Address Change (CE1) (CE2) (CE1) (CE2) (CE1) (CE2) MIN. 70 ----10 10 5 ---10 TYP. ------------MAX. -70 70 70 30 ---25 25 25 -UNITS ns ns ns ns ns ns ns ns ns ns ns ns
O
O
tAVAX tAVQX tE1LQV tE2LQV tGLQV tE1LQX tE2LQX tGLQX tE1HQZ tE2HQZ tGHQZ tAVQX
tRC tAA tACS1 tACS2 tOE tCLZ1 tCLZ2 tOLZ tCHZ1 tCHZ2 tOHZ tOH
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BSI
n SWITCHING WAVEFORMS (READ CYCLE) READ CYCLE 1
(1,2,4)
BH62UV8000
tRC ADDRESS tOH DOUT
(1,3,4)
tAA
tOH
READ CYCLE 2 CE1
tACS1 CE2 tCLZ DOUT
(5)
tACS2 tCHZ1, tCHZ2
(5)
READ CYCLE 3
(1, 4)
tRC ADDRESS tAA OE tOE CE1 tCLZ1 CE2 tCLZ2 DOUT
NOTES: 1. WE is high in read Cycle. 2. Device is continuously selected when CE1 = VIL and CE2= VIH. 3. Address valid prior to or coincident with CE1 transition low and/or CE2 transition high. 4. OE = VIL. 5. Transition is measured 500mV from steady state with CL = 5pF. The parameter is guaranteed but not 100% tested.
(5)
tOH
tOLZ tACS1 tOHZ tCHZ1
(5) (1,5)
tACS2
(5)
tCHZ2
(2,5)
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BSI
n AC ELECTRICAL CHARACTERISTICS (TA = -25 C to +85 C) WRITE CYCLE
JEDEC PARAMETER NAME PARANETER NAME DESCRIPTION Write Cycle Time Address Set up Time Address Valid to End of Write Chip Select to End of Write Write Pulse Width Write Recovery Time Write Recovery Time Write to Output High Z Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active (CE1, WE) (CE2) 70 0 50 50 35 0 0 -30 0 -5
O O
BH62UV8000
CYCLE TIME : 70ns MIN. TYP. ------------MAX. -------20 --25 --
UNITS ns ns ns ns ns ns ns ns ns ns ns ns
tAVAX tAVWL tAVWH tELWH tWLWH tWHAX tE2LAX tWLQZ tDVWH tWHDX tGHQZ tWHQX
tWC tAS tAW tCW tWP tWR1 tWR2 tWHZ tDW tDH tOHZ tOW
n SWITCHING WAVEFORMS (WRITE CYCLE) WRITE CYCLE 1
(1)
tWC ADDRESS tWR1 OE tCW CE1
(5) (11) (3)
CE2
(5)
tAW WE tAS tOHZ DOUT
(4,10)
tCW
(11)
tWR2
(2)
(3)
tWP
tDH tDW DIN
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Revision 1.0 Jul. 2005
BSI
WRITE CYCLE 2
(1,6)
BH62UV8000
tWC
ADDRESS tCW
(11)
CE1
(5)
CE2
(5)
tAW WE tAS tWHZ DOUT
(4,10)
tCW
(11) (2)
tWP
tWR2
(3)
tOW tDW tDH
(8,9)
(7)
(8)
DIN
NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE1 and CE2 active and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. tWR is measured from the earlier of CE1 or WE going high or CE2 going low at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE1 is low and CE2 is high during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured 500mV from steady state with CL = 5pF. The parameter is guaranteed but not 100% tested. 11. tCW is measured from the later of CE1 going low or CE2 going high to the end of write.
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n ORDERING INFORMATION
BH62UV8000
X X Z YY
SPEED 70: 70ns
BH62UV8000
PKG MATERIAL -: Normal G: Green
GRADE I: -25oC ~ +85oC PACKAGE A: BGA-48-0608 D: DICE
Note: Brilliance Semiconductor Inc. (BSI) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments.
n PACKAGE DIMENSIONS
NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
1.4 Max.
BALL PITCH e = 0.75 D 8.0 E 6.0 N 48 D1 5.25 E1 3.75
D1
e
VIEW A
48 mini-BGA (6 x 8)
R0201-BH62UV8000
E1
8
Revision 1.0 Jul. 2005
BSI
n Revision History Revision No. 1.0 History Initial Production Version
BH62UV8000
Draft Date July 15,2005 Remark Initial
R0201-BH62UV8000
9
Revision 1.0 Jul. 2005

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